Ameya360:<span style='color:red'>Infineon</span> Divests HiRel DC-DC Converter Business
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Ameya360:Infineon Divests HiRel DC-DC Converter Business

　　Micross Components Inc. has entered a definitive agreement to purchase Infineon Technologies AG’s HiRel DC-DC converter business, including its hybrid and custom board-based power products. This sale will enable Infineon to extend its focus and investments on core semiconductor developments for the high-reliability market, while deemphasizing businesses that require more customized product offerings for the high-reliability industry. The deal is expected to close in the first quarter of 2023.　　“Infineon is pleased to have reached an agreement with Micross to provide a more strategic home for our HiRel DC-DC converter business,” said Bob LeFort, President of Infineon Technologies Americas. “We believe this sale is in the best interest of both companies; our customers, employees, and shareholders. This transaction enables Infineon to remain focused on the HiRel business areas that benefit from Infineon’s leading semiconductor technologies. We look forward to working with Micross to ensure a seamless transition for our customers and employees.”　　“We are pleased to have reached an agreement with Infineon on their HiRel DC-DC converter business and to have the opportunity to partner with their highly experienced team which further expands Micross’ design capabilities. We are excited about the significant proprietary power management IP that combined with their state of the art manufacturing capabilities and product portfolio leads the way for advancement of innovative solutions. We will be better positioned to produce an even wider range of high-quality products for our customers. Together, we plan to pursue a number of compelling opportunities to further realize our exciting growth prospects, all while upholding excellent quality and service to our customers,” said Vince Buffa, Chairman and CEO of Micross.　　The HiRel DC-DC converter business is a leading provider of high reliability DC-DC power conversion solutions for the toughest environments, including outer space, and will operate under the Micross Hi-Rel Products business segment. These DC-DC converter products are complete power solutions, including main power converter, control circuits, filters and housing.　　“We are dedicated to our customer and partner base, and will continue to leverage our existing resources and talent to develop innovative solutions together,” said Chris Opoczynski, Sr. Vice President and General Manager, HiRel Business Line, Infineon Technologies. “In our retained HiRel businesses, Infineon will strengthen its focus on these target applications, along with others that demand the highest reliability and highest performance. We are committed to the mission-critical space, defense, and aerospace industries.”
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Release time：2023-01-19 13:35 reading：2445 Continue reading>>
<span style='color:red'>Infineon</span> and Stellantis Ink MoU on Multi-year SiC Chip Supply
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Infineon and Stellantis Ink MoU on Multi-year SiC Chip Supply

　　Infineon and Stellantis have signed an MoU towards a potential multi-year supply cooperation for SiC semiconductors.　　Infineon Technologies AG and Stellantis have signed a non-binding memorandum of understanding (MoU) as a first step towards a potential multi-year supply cooperation for silicon carbide (SiC) semiconductors. Infineon would reserve manufacturing capacity and supply CoolSiC “bare die” chips in the second half of the decade to the direct Tier 1 suppliers of Stellantis. The potential sourcing volume and capacity reservation have a value of significantly more than €1 billion.　　“We firmly believe in electromobility and are excited to develop partnerships with leading automotive companies like Stellantis that make it a part of people’s everyday life,” said Peter Schiefer, Division President Automotive of Infineon. “Compared to traditional power technologies, silicon carbide increases the range, efficiency and performance of electric vehicles (EVs). With our leading CoolSiC technology and continuous investments in our manufacturing capacities, we are well positioned to meet the growing demand for power electronics in electromobility.”　　Infineon and Stellantis are in talks about delivering the CoolSiC Gen2p 1200V and CoolSiC Gen2p 750V chips for EVs under Stellantis brands. The unmatched performance, reliability, and quality of CoolSiC technology would allow Stellantis to build vehicles with longer ranges and lower consumption for the best user experience – and support the company in its efforts to standardize, simplify and modernize platforms.　　Infineon has a market-leading role as a high-quality and high-volume supplier to the automotive industry. Infineon is preparing for the accelerated demand of the industry with significant investments. In 2024, for example, Infineon’s new fab for SiC technologies will start manufacturing in Kulim, Malaysia. It will complement existing manufacturing capacities in Villach, Austria, following Infineon’s multi-site strategy.
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Release time：2023-01-09 11:06 reading：2309 Continue reading>>
<span style='color:red'>Infineon</span> AURIX TC4xx MCU First to be Certified to ISO/SAE 21434
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Infineon AURIX TC4xx MCU First to be Certified to ISO/SAE 21434

　　Infineon is one of the first semiconductor suppliers to achieve certification under ISO/SAE 21434, the new international standard for automotive cybersecurity management systems.　　Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles. This regulation, which came into effect from July 2022, requires vehicle manufacturers to apply a security-by-design approach to their products and processes.　　To enable new vehicle sales in markets covered by the R155 regulation, the vehicle manufacturer must own a valid certificate of compliance for the cybersecurity management system (CSMS) applied to each vehicle type. To achieve certification, vehicle OEMs must implement cybersecurity practices across the supply chain to reduce the overall risk of attack throughout the vehicle lifecycle – from initial concept to end-of-life.　　To help customers achieve compliance with national and international cybersecurity regulations such as UN R155, Infineon Technologies AG is one of the first semiconductor suppliers to achieve certification under ISO/SAE 21434, the new international standard for automotive cybersecurity management systems. The certification for this standard was carried out by T?V Nord. In addition, Infineon’s upcoming AURIX TC4xx microcontroller family features a new and innovative cybersecurity architecture and is expected to achieve product certification under the ISO/SAE 21434 standard.　　Infineon’s ISO/SAE 21434-compliant CSMS applies to a wide range of Infineon products supporting automotive cybersecurity, including AURIX and PSoC microcontrollers, SEMPER Secure flash memories, and OPTIGA hardware security modules. Following industry best practices, the CSMS covers information technology, manufacturing technology, and selected regional and regulatory environments.　　Infineon’s threat monitoring system is able to actively analyze relevant vulnerability disclosures, and potential threats to Infineon security products and systems can be evaluated and mitigated based on an ISO/SAE 21434-compliant product security incident response process. Together, these ISO/SAE 21434-compliant monitoring and incident response capabilities enable Infineon and its customers to work in close cooperation to rapidly identify and mitigate product security risks in compliance with risk management programs and relevant regulations.
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Release time：2022-12-26 14:12 reading：2228 Continue reading>>
<span style='color:red'>Infineon</span> and IDEX Biometrics join forces
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Infineon and IDEX Biometrics join forces

Infineon Technologies and IDEX Biometrics, a provider of advanced fingerprint identification and authentication solutions have joined forces.The two companies are looking to integrate IDEX’ biometrics technology into platforms featuring Infineon’s secure elements and will develop a system-on-card demonstrator that runs on the latest dual-interface 16-bit security controller from Infineon.Biometric cards are expected to further reduce card fraud by introducing a simple second factor authentication. This can be used for payment transactions and applications combining payment with social services. In addition, the fingerprint authentication compresses the overall transaction times compared to a PIN authentication. This simple tap and go significantly improves the payment experience of a user.The technical challenge of contactless biometric smart cards is their sensitive power consumption profile. Infineon’s secure elements have a big advantage to enable biometrics due to an optimised power profile in non-battery supported contactless systems, and can support contactless payment transactions at significantly below 300ms, this enables a biometric payment transaction to be performed in less than one second.“We firmly believe that leveraging the expertise of Infineon and IDEX will allow us to define a sustainable path for a secure biometric ecosystem with highest performance,” said Bjoern Scharfen, Head of the Payment & Wearables at Infineon. “Biometrics are the next innovation step for contactless payment cards, providing additional security and convenience to banks and consumers,” he added. Biometric data is securely stored on the security controller embedded in the card. It is not uploaded into the cloud and so it quite literally stays in the hands of the user.The two companies are also investigating the most efficient way to integrate IDEX’s host API into biometric systems with Infineon’s secure element, to fast-track dual interface biometric cards deployments.IDEX is collaborating with major industry players to develop an open, workable ecosystem for smart card solutions that enable payment, corporate ID and access applications.“As the leading fingerprint biometrics company, we are committed to continuously growing our partner ecosystem,” explained Stan Swearingen, CEO at IDEX Biometrics. “We are delighted to collaborate closely with the highly experienced team at Infineon towards turning the biometric integration on smart cards into a seamless experience.”Biometric technology is already widely accepted in mobile telephony and will increasingly spread to smart card applications such as payment, identification and access solutions: According to market research firm ABI, the number of payment cards with biometric functionality is expected to grow from 4.5 million units in 2019 to 120 million by 2023.
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Release time：2018-11-28 00:00 reading：1455 Continue reading>>
Denso Takes Equity Stake in <span style='color:red'>Infineon</span>
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Denso Takes Equity Stake in Infineon

Japanese automotive components supplier Denso Corp. grabbed a stake in German chipmaker Infineon Technologies, investing an undisclosed amount described as "the mid-double-digit million-euro amount."Denso and Infineon aim to accelerate development of new and emerging automotive technologies — including automated driving, vehicle electrification and electro-mobility — using Infineon’s intelligent sensors, microcontrollers and power semiconductors.Infineon — which currently has a market capitalization of nearly $23 billion — said the two companies have been working together for more than 10 years and that Denso wanted to underline the partnership with a small equity stake.In 2012, Infineon received a technical development award from Denso for its tire pressure sensor chip supporting built-in auto-location. The tire pressure monitoring system (TPMS) sensors measure pressure inside the tire and the pressure value is transmitted via RF to the receiving unit of the car. Auto-location means that the system automatically correlates the four received pressure signals with the appropriate four tire positions.Denso's investment comes as the company recognizes that with increased functionality in vehicles and advanced electronic control, demand for semiconductor products will grow exponentially. Next-generation vehicle systems required for widespread automated driving, electrification and connected cars are becoming more sophisticated and will feature more advanced technology. The company said it has been working with chip suppliers like Infineon to enhance in-vehicle semiconductor product development.“We would like to establish optimal semiconductor solutions for in-vehicle electronics systems through strong partnerships with semiconductor companies in order to enhance the competitiveness of automated driving and electrification systems,” said Hiroyuki Ina, Denso's senior executive director, in a press statement.Denso, headquartered in Japan's Aichi prefecture, has approximately 220 subsidiaries in 35 countries and regions.Last month, Denso announced that it is establishing a new facility at Haneda Airport in Tokyo to develop and test automated driving technologies. The facility, which is expected to be completed by June 2020, will feature a building and proving ground for mobility systems R&D. This location is part of a broader initiative led by Tokyo’s Ota City, Denso  and other entities to transform underutilized space at the airport into a hub for leading-edge technology development and mixed-use cultural facilities.Denso also established an automated driving R&D office near Shinagawa Station in Tokyo's Minato to promote collaboration and open innovation with its development partners, which include automakers, universities, research institutes and startups. This facility will include a building to develop prototypes and maintain test vehicles and also a proving ground to conduct live, in-vehicle tests.
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Release time：2018-11-27 00:00 reading：1610 Continue reading>>
<span style='color:red'>Infineon</span> Buys Cold Split Tech Startup Siltectra for $139M
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Infineon Buys Cold Split Tech Startup Siltectra for $139M

Infineon Technologies AG has acquired Dresden, Germany-based startup Siltectra to use its cold split technology to split silicon-carbide (SiC) wafers, doubling the number of chips on a wafer. The company was acquired for 124 million euros (about $139 million).Siltectra was founded in 2010 and has an IP portfolio of more than 50 patents. The startup developed a technology for splitting crystalline materials with minimal loss of material compared to common sawing technologies. This technology can also be applied to SiC, for which rapidly rising demand is expected in coming years.SiC products are already used today in very efficient and compact solar inverters. In the future, SiC will play a more and more important role in electro-mobility. The cold split technology will be industrialized at the existing Siltectra site in Dresden and at the Infineon site in Villach, Austria. The transfer to volume production is expected to be completed within the next five years.“This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well,” said Reinhard Ploss, Infineon CEO. “Our system understanding and our unique know-how on thin wafer technology will be ideally complemented by the cold split technology and the innovative capacity of Siltectra.” He said that the higher number of SiC wafers will make the ramp-up of SiC products much easier, especially to address further expansion of renewable energies and the increasing adaptation of SiC for use in the drivetrain of electric vehicles.Infineon said that the cold split technology will help to secure the supply of SiC products, especially in the long run. Over time, further applications for cold split technology might emerge, such as boule splitting or the use for materials other than silicon carbide.Early this year, Siltectra announced its patent covering an extension of its silicon-carbide process capability to split materials with sub-100-micron material loss, regardless of vendor-specific SiC crystal-growing processes. Driving down SiC material loss helps accelerate adoption of the substrate for power devices and other ICs. Until now, its cost has inhibited fast adoption. Cost reductions enabled by Siltectra’s technology could speed deployment of SiC for a broader range of applications, including EVs and 5G technology.
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Release time：2018-11-14 00:00 reading：1376 Continue reading>>
<span style='color:red'>Infineon</span> to Deliver Chips for Chinese Retailer’s IoT
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Infineon to Deliver Chips for Chinese Retailer’s IoT

Infineon Technologies will provide IoT chips to Chinese e-commerce company JD Group under a strategic partnership announced by the firms this week.An Infineon spokesperson told EE Times that JD will include Infineon’s chips in itsIoT products — for example, in cloud services, smart devices (such as smart speakers, smart TVs), and server solutions. Time-of-flight technology, radar sensors and microphones from Infineon will be used to help create a connected ecosystem. The aim of the partnership is to speed up applications in scenarios such as smart homes and assist in the continuous improvement of JD’s cloud service platform. As an underlying technology provider, Infineon will provide technical support for various aspects such as the creation of IoT devices, data connectivity, storage, and analysis.“Partnering with leading global semiconductor companies such as Infineon is of great strategic importance to JD,” said Xianglong Su, general manager of intelligent manufacturing department, electronics, and entertainment group at JD. “Whether it is the electronic component solution platform or the overall IoT ecosystem that we are committed to building, breakthroughs depend on the innovation and support of the underlying technology, ultimately translating to a more intelligent, more convenient, and more secure user experience.”Adam White, senior vice president global sales of the power management and multimarket division at Infineon Technologies (left), and Xianglong Su on signing the strategic partnership for developing smart IoT ecosystems for the Chinese online retailer.JD.com is a channel through which global brands reach Chinese consumers online, and it claims to be China’s largest online retailer. In addition to e-commerce, it has been building technology platforms for logistics, cloud computing, and smart technology. Earlier this month, it introduced its unmanned store technology for the first time overseas in Jakarta, Indonesia.Its unmanned stores, first launched in Beijing in October 2017, leverage technologies such as RFID, facial recognition, and image recognition to track retail activity. Cameras placed throughout the space recognize customers’ movement and generate heatmaps of the activity to monitor traffic flow, product selection, and customer preferences to help optimize inventory, product displays, and all facets of store management. It also now uses advanced computer vision technology to track a range of shopping behaviors. It operates 20 unmanned stores across China.
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Release time：2018-08-17 00:00 reading：1529 Continue reading>>
MoU on IoT signed by <span style='color:red'>Infineon</span> Technologies and Alibaba Cloud
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MoU on IoT signed by Infineon Technologies and Alibaba Cloud

Infineon Technologies and Alibaba Cloud Computing Company have signed a memorandum of understanding (MoU) for the joint promotion of Internet of Things (IoT) applications within the fields of smart life and smart industry. As a result, the duo will facilitate the digital upgrade of Chinese enterprises and cities.Infineon says it will rely on its own core technology and service advantages in the field of IoT to collaborate with Alibaba Cloud on its IoT operating system, AliOS Things, and provide technical services. Additionally, with the acceleration of the IoT application process, new requirements are also placed on system security.As part of this collaboration, the two parties will further explore the planning, implementation and security standards of the IoT, which they say will enable SMEs and individuals to deploy and access Alibaba Cloud in a low-cost, highly reliable manner. This will allow the participants to share in the development dividend of the IoT, while protecting them from losses caused by security risks. The two companies also plan to collaborate on e-commerce channels.Based on this, both parties will make use of Alibaba Cloud's integration capabilities and experiences in IoT and work together to create advanced and secure IoT solutions. This will help upgrade and transform the smart digitalisation of SMEs, allowing them to manage the entire production process through digital means.
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Release time：2018-08-03 00:00 reading：1646 Continue reading>>
<span style='color:red'>Infineon</span> to Invest $1.9 Billion in New Austrian Chip Factory
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Infineon to Invest $1.9 Billion in New Austrian Chip Factory

Infineon Technologies AG will spend 1.6 billion euros ($1.9 billion) over six years to build a new factory in Austria, in a bet on rising demand for semiconductors that go in everything from electric cars to wind turbines.Infineon will create 400 new jobs at the new site in Villach in southern Austria, where the production of 300-millimeter thin wafers is due to start in 2021. The factory is next to an existing company facility and has the potential to generate 1.8 billion euros in yearly sales, the company said.“Customers around the world are rushing through our doors to place orders,” said Infineon Chief Executive Officer Reinhard Ploss at an event in Vienna Friday. “Growth is underpinned by global megatrends such as climate change, demographic change and increasing digitization,” and the investment will allow the company to hold its technological leadership in the industry, he said.The company is seeking to hire staff from around the world, and the Austrian government has agreed to expand education and research facilities in the Carinthia region to help Infineon’s growth plans. Austrian Chancellor Sebastian Kurz at the event in Vienna called the investment a “historic one and the biggest in a long long time” in the country. The government is in talks with other “major international companies” to support a re-industrialization in Europe, he said, without giving details.Infineon, which competes with NXP Semiconductors NV and STMicroelectronics NV, is pushing into the growing market for electric cars and renewable energy that provides fresh revenue streams as demand for semiconductors used in smartphones and tablets slows. It’s part of Ploss’s bet on trends such as energy efficiency, connectivity and mobility.In March Infineon and SAIC Motor Corp Ltd., China’s largest automaker by sales volume, revealed a new joint company to produce power modules for Chinese manufacturers of electric cars and plug-in hybrids, jointly investing at least 100 million euros ($122 million) and hiring 250 people to expand Infineon’s chip factory in Wuxi.
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Release time：2018-05-22 00:00 reading：1508 Continue reading>>
<span style='color:red'>Infineon</span> to Spend $1.9 Billion on New 300-mm Power Semi Fab
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Infineon to Spend $1.9 Billion on New 300-mm Power Semi Fab

Aiming to address growing demand for power semiconductors, Infineon Technologies AG announced today an investment of around €1.6 billion (about $1.88 billion) over six years on a new 60,000-square-meter fab.The fully automated 300-mm fab will be located in Villach, Austria, alongside Infineon's existing production facility. It is expected to begin production in 2021.  Reinhard Ploss, Infineon's CEO, said through a statement that global megatrends such as climate change, demographic change and increasing digitization are driving an increase in demand for power semiconductors. "Electric vehicles, connected and battery-powered devices, data centers or power generation from renewable sources require efficient and reliable power semiconductors," Ploss said.Visualization shows Infineon’s new power semiconductor fab in Villach, Austria.Source: InfineonVillach is Infineon's competence center for power semiconductors. Manufacturing of power semiconductors on 300-millimeter wafers was developed in Villach and then expanded into another fab in Dresden, Infineon's main location for Infineon's front-end wafer processing.Infineon said the new Villach fab would create about 400 new jobs and begin construction in the first half of next year.Infineon is the world's largest provider of power semiconductors with global market share of about 18.5 percent, according to market research firm IHS Markit.
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Release time：2018-05-21 00:00 reading：1576 Continue reading>>

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