<span style='color:red'>Renesas</span>’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms
Trade news

Renesas’ New FemtoClock™ 3 Timing Solution Delivers Industry’s Lowest Power and Leading Jitter Performance of 25fs-rms

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its timing solutions portfolio with a new ultra-low 25fs-rms clock solution for wireline infrastructure, data center and industrial applications. The new FemtoClock™ 3 family includes ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling high-performance, easy-to-use, and cost-effective clock tree designs for next-generation, high-speed interconnect systems. Target applications for the new devices include telecom switches and routers, top-of-rack data center switches, medical imaging, broadcast audio & video and more.　　FemtoClock 3 devices provide industry leading phase noise and jitter required to meet the needs of 112Gbps SerDes rates, as well as next generation 224Gbps SerDes designs using commonly available 48MHz to 73MHz crystals. The highly integrated devices can generate up to four frequency domains and offer integrated LDOs (Low Drop Out regulators) with superior PSRR, reducing board complexity and cost.　　“Renesas leads the industry with best-in-class timing solutions built from decades of experience and patented technology,” said Zaher Baidas, Vice President of the Timing Division for Renesas. “FemtoClock 3 devices extend that leadership by providing multiple clock and synchronization functions in a single device with ultra-low jitter, simplifying printed circuit board design and reducing solution area and cost.”　　“FemtoClock 3 was the only timing solution that offered us the ultra-low jitter performance while maintaining low power dissipation and simplifying the PCB design and lowering solution area on our next-generation switches,” said Vincent Ho, CEO at UfiSpace. “We count on Renesas to deliver the timing solutions that enable us to deliver leading-edge products quickly and cost-effectively.”　　Key Features of the FemtoClock 3 Family　　Industry-leading 25fs-rms jitter exceeds next-generation 112Gbps and 224Gbps SerDes reference clock requirements　　Up to 4 frequency domains allow all system clocks to be generated from a single device　　Device variants with jitter attenuation, synchronization and clock generation capabilities and with 8 or 12 outputs　　Low power dissipation of 1.2W and operating a single 1.8V supply　　Integrated non-volatile memory allows for device customization in factory at no additional cost to customer　　Small 7 x 7mm 48-pin VFQFPN and 9 x 9mm 64-pin VFQFPN packages　　Compliant with ITU-T G.8262 and G.8262.1 for enhanced synchronous Ethernet　　Single chip with multiple operating modes simplifies overall clock tree　　FemtoClock 3 supports multiple operating modes, including synchronization, jitter attenuation, and clock generation. Customers can combine the new FemtoClock 3 solution with the broader ClockMatrix™, VersaClock, buffer and oscillator portfolio of timing solutions to address challenging timing needs for their high-performance wireline infrastructure and data center designs.　　FemtoClock 3 functions seamlessly in conjunction with the state-of-the-art Renesas IC Toolbox (RICBox) application, empowering users to configure and program devices on the evaluation board. Additionally, RICBox interfaces with the Renesas Lab on the Cloud platform, providing users with the capability to connect virtually to an actual laboratory setting.　　Winning Combinations　　Renesas has combined FemtoClock 3 with numerous compatible devices from its portfolio to offer Winning Combinations, including the 1600G Fixed Form Factor Switch. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.
Key word：
Release time：2024-04-19 11:28 reading：507 Continue reading>>
CG Power and Industrial Solutions Limited, <span style='color:red'>Renesas</span> and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India
Trade news

CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Key word：
Release time：2024-03-05 13:10 reading：1524 Continue reading>>
<span style='color:red'>Renesas</span>’ New Four-Channel Video Decoder for Automotive Cameras Enables Economical Surround View Applications
Trade news

Renesas’ New Four-Channel Video Decoder for Automotive Cameras Enables Economical Surround View Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the newest device in its Automotive HD Link (AHL) portfolio that enables automotive manufacturers to deliver high-definition video over low-cost cables and connectors. The new RAA279974 4-channel AHL video decoder processes four input sources simultaneously, making it an economical solution for surround-view and multi-camera applications.　　Renesas’ AHL technology uses a modulated analog signal to transmit video. The frequency is therefore 10 times lower than digital transmission solutions available in the market today (~37MHz vs. >3GHz), making it robust against noise and enabling longer transmission distances (20-30m) with unshielded twisted pair cables and standard connectors. Existing standard-definition analog video cables and connectors can also be employed. Using unshielded twisted pair cables not only reduces cost, but it is also easier to route through the vehicle and offers lighter weight for improved energy efficiency and performance. Digital links such as SerDes require heavily shielded cables and high-end connectors that cost significantly more than those for AHL and may require replacement after five to seven years.　　The RAA279974 completes the AHL family of products which consists of the RAA279971, single channel AHL video encoder and the RAA279972, a single channel AHL video decoder. The RAA279974 is an important addition to the AHL family as most OEMs want to support multiple cameras in vehicles for applications such as surround view parking assistance monitors. AHL can be paired with R-Car Automotive SoCs, RH850 MCUs, automotive PMICs, and analog components to cost-effectively implement numerous safety features in virtually any vehicle. Renesas provides multiple Winning Combinations that combine these components to enable manufacturers to quickly implement pre-tested video designs.　　“Multi-camera safety systems are quickly becoming a must-have feature for many consumers,” said Davin Lee, Vice President of the Analog & Connectivity Product Group. “The AHL system enables our automotive customers to now deliver these features in all new vehicles, including economy models.”　　AHL is robust against noise and offers excellent picture quality. There is no noticeable difference in picture quality when compared to a pure digital video image. Due to the fundamental nature of an analog signal, an AHL video transmission can withstand noise and interference. The picture may degrade slightly, but there will still be a live image to view. With a digital link, any noise/interference will result in a complete loss of picture.　　Key Features of AHL　　Supports resolutions from VGA up to 720p/60 or 1080p/30 for flexibility to implement non-standard vertical resolutions (not just the TV video standard 16:9 resolutions)　　MIPI-CSI2, BT656, & DVP inputs and outputs provide flexible interface to support a variety of image sensors　　AHL does not require compression like an Ethernet system does, so it has no latency in the video　　Requires only 27MHz crystal clock, with internal PLLs able to generate the necessary clock frequencies for higher resolutions, reducing cost　　AHL has passed BCI & CISPR25 EMC/EMI testing using UTP cables　　MIPI-CSI2 output with Virtual Channel allows 4 channels of video to be sent over a single data bus interface to the SoC (saves input ports on the SoC)　　Availability　　The four-channel RAA279974 AHL decoder samples and evaluation boards are available today. Renesas also offers the RTKA279974ZK0000BU Camera Kit Bundle evaluation system which includes four AHL cameras integrated with the RAA279971 AHL encoder. More information is available at www.renesas.com/RAA279974.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
Key word：
Release time：2024-01-25 13:21 reading：1138 Continue reading>>
Japan’s First Moon Lander Touches Down with <span style='color:red'>Renesas</span>’ Rad-Hard ICs on Board
Trade news

Japan’s First Moon Lander Touches Down with Renesas’ Rad-Hard ICs on Board

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced today that its radiation-hardened (rad-hard) ICs were onboard the Smart Lander for Investigating Moon (SLIM) spacecraft that successfully touched down on the Moon’s low latitude area on January 20, Japan Standard Time.　　Operated by the Japan Aerospace Exploration Agency (JAXA), SLIM launched onboard a H-IIA rocket from the Tanegashima Space Center, Japan on September 7, 2023. The Moon landing represents a significant milestone for Japan, as it becomes only the fifth country to successfully touch down and operate a lunar lander, after Russia, the United States, China and India.　　The spacecraft landed near the Shioli Crater, in the vicinity of the Sea of Nectar region, aiming to achieve a more precise landing than previous lunar missions, which typically had precision levels of several kilometers to tens of kilometers. JAXA is currently investigating the specifics of its pinpoint landing and plans to release further information in the coming weeks. The spacecraft is engineered to achieve exceptional landing precision, due to a vision-based object detection system and its lightweight, compact design.　　This five-months long mission is intended to help the scientific community learn about the origin of the Moon. For this purpose, the spacecraft’s payload includes a multi-band spectral camera that can determine the composition of lunar rocks derived from the Moon’s mantle.　　Renesas provided a number of key components for the SLIM spacecraft’s integrated computer and electronic subsystems, which are designed to operate over a temperature range and tested to withstand total ionizing dose radiation rates as high as 300krad(Si). Among the ICs used for this mission are 3.3V and 5V RS-422 receivers, RS-422 drivers, a 16-channel analog multiplexer, a 40V rail-to-rail operational amplifier, and a 3A low-dropout voltage regulator.　　The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally optimized and highly reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability (Hi-Rel), and rad-hard space markets. Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control (TT&C).　　Deep space is a challenging environment for spaceflight and asteroid exploration systems, particularly due to the intense radiation environment encountered in nearly all mission profiles. Design, layout, certain process technologies, and manufacturing steps like burn-in and total dose testing of ICs ensure predictable performance and prevent system failure while in flight and on long duration robotic and crewed missions to other planets. 
Key word：
Release time：2024-01-24 13:48 reading：1607 Continue reading>>
<span style='color:red'>Renesas</span> Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for IoT Edge and Gateway Devices
Trade news

Renesas Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for IoT Edge and Gateway Devices

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new 64-bit general-purpose microprocessor (MPU) for IoT edge and gateway devices that consumes significantly less power.　　As the latest addition to Renesas’ RZ/G Series MPU, the RZ/G3S is designed to meet the demanding requirements of modern IoT devices, offering power consumption as low as 10µW (microwatts) in standby mode and fast startup for the Linux operating system. The new MPU comes with a PCI Express interface that enables high-speed connectivity with 5G wireless modules. Additionally, the device boasts enhanced security features such as tamper detection to ensure data security. These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.　　“Renesas’ RZ/G has seen a steady increase in adoption in the global industrial human machine interface market,” said Daryl Khoo, Vice President of Embedded Processing 1st Division at Renesas. “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets. Renesas has been aggressively expanding our connectivity portfolio in these markets through strategic acquisitions to offer advanced connectivity solutions that are power efficient at the system level and enhance data utilization."　　The RZ/G3S employs an Arm® Cortex®-A55 core as the main CPU with a maximum operating frequency of 1.1 GHz and two Cortex®-M33 cores as sub-CPUs operating at 250 MHz. Users can distribute the MPU’s workloads to sub-CPUs, allowing the device to efficiently handle tasks such as receiving data from sensors, controlling system functions and managing power systems. This reduces the workload on the main CPU, resulting in fewer components, lower costs and a smaller system size.　　Low-power Standby Mode with Fast Linux Startup　　The device’s newly added power management system is designed to reduce power consumption to extremely low levels -- less than 10 µW. The MPU also supports the DDR self-refresh function which allows to retain DRAM data, while also enabling fast Linux startup. The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices. Moreover, the device offers a standby mode that can maintain sub-CPU operation at a power level as low as 40 mW, offering the flexibility to optimize power consumption based on the specific operating requirements of each application.　　5G Connectivity Enabled by PCI Express　　The RZ/G3S is equipped with a wide range of peripheral functions including Gigabit Ethernet, CAN, USB, as well as the PCI Express interface. By connecting with 5G communication modules, the device can achieve high-speed communication at Gigahertz levels.　　High Reliability and Robust Security Functions　　Similar to other RZ/G devices, the RZ/G3S features an ECC (Error Correction Code) function in both internal memory and external DDR interface to maintain data integrity. The Verified Linux Package (VLP) based on the industrial-grade Linux software (Civil Infrastructure Platform™ (CIP) Linux) is available for the RZ/G3S. With VLP, developers receive over 10 years of maintenance support, ensuring long-term protection against security threats. The device also provides tamper detection along with secure boot, secure debug and more. RZ/G series products are already Level 2 PSA Certified from Arm and Renesas has plans to include the RZ/G3S in the future.　　“Our IAR Embedded Workbench for Arm inherently supports both MPUs and MCUs,” said Anders Holmberg, CTO at IAR. “By combining Renesas’ RZ/G3S MPU, which features a highly secure Root of Trust, with extensive security tool solutions from IAR, developers can rapidly develop high-performance, secure IoT devices and bring them to market faster."　　Winning Combinations　　Renesas has combined the new RZ/G3S MPU with optimized power management ICs and clock products to develop the “Single Board Computer Gateway”. The RZ/G3S's rich set of interfaces allows the device to connect with various sensors via USB, CAN, RS485, UART, and I2C. It also offers high performance wireless connectivity options to build a robust network for home automation or IoT applications. Its multicore design allows for real-time processing of data while being power efficient with its advanced sleep mode functions. The Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The RZ/G3S is available today. For more information on the product
Key word：
Release time：2024-01-19 11:14 reading：1651 Continue reading>>
<span style='color:red'>Renesas</span> Debuts Its Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash
Trade news

Renesas Debuts Its Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash

　　Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the DA14592 Bluetooth® Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash) and SoC die size (for cost), the DA14592 is very well suited to a broad range of applications including connected medical, asset tracking, human interface devices, metering, PoS readers and ‘crowd-sourced location’ (CSL) tracking.　　Continuing Renesas’ Bluetooth LE SoC leadership in lowest radio power consumption, the DA14592 utilizes a new low-power mode to offer world-class, 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current. Additionally, it supports an ultra-low hibernation current of only 90nA, extending shelf-life for end-products shipped with ‘battery connected’, and ultra-low active current at 34µA/MHz for products requiring significant application processing.　　From a solution cost perspective, the DA14592 typically only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM). Operating from only a system clock and its highly accurate on-chip RCX, this device removes the need for a sleep mode crystal in the majority of applications. Its reduced eBOM, coupled with the DA14592’s small package (offered in WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm) also presents designers with an attractively small solution footprint. The DA14592 also includes a high-precision, sigma-delta ADC, up to 32 GPIOs and unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications requiring extra memory.　　Renesas has integrated all external components required to implement a Bluetooth LE solution into the DA14592MOD module. It offers customers the fastest time-to-market and reduced overall project cost. Emphasis has been placed in the design of this module to ensure maximum design flexibility by comprehensively routing the DA14592’s functions to the outside of the module and using castellated pins for easy/low-cost module attachment during development.　　One key application Renesas is showcasing with the DA14592 and DA14592MOD is ‘Crowd-Sourced’ Locationing, a market projected to reach over US$29B in North America alone by 20311 based on Apple’s AirTag sales alone. Google recently announced plans to offer a Find My Device crowd-sourced locationing network as well. Renesas is committed to providing best-in-class reference designs with industry-leading power, eBOM and solution footprint for both mobile operating systems as soon as Google’s Find My Device network becomes available. These reference designs will not only accelerate tag designs but will also enable manufacturers of products that may be lost or stolen to easily attach the DA14592 to their existing product to render their product globally locatable utilizing billions of smartphones, thereby differentiating their products and enhancing end-customer value. Using the DA14592MOD will also remove the need for worldwide regulatory certifications, reducing development costs and further accelerating time-to-market.　　“The DA14592 and DA14592MOD extend our leadership in Bluetooth LE SoCs with our trademark low power consumption and best-in-class eBOMs,” said Davin Lee, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas. “In addition, we have listened to our customers and continue to expand our product support by offering reference designs for applications such as crowd-sourced locationing, helping our customers to more easily differentiate their products, delivering premium value while maintaining lowest costs.”　　Winning Combinations　　Renesas has combined the new DA14592 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Instrument Panel for Light Electric Vehicles. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The DA14592 is in mass production today with the DA14592MOD targeted for world-wide regulatory certifications in 2Q24.
Key word：
Release time：2024-01-19 11:13 reading：1554 Continue reading>>
<span style='color:red'>Renesas</span> Extends Tender Offer for Proposed Acquisition of Sequans
Trade news

Renesas Extends Tender Offer for Proposed Acquisition of Sequans

　　Renesas Electronics Corporation (TSE: 6723, “Renesas”) and Sequans Communications S.A. (NYSE: SQNS, “Sequans”) today announced that Renesas has extended the expiration date of its tender offer to acquire all of the outstanding ordinary shares of Sequans for $0.7575 per ordinary share and American Depositary Shares (“ADSs”) of Sequans for $3.03 per ADS (each ADS representing four ordinary shares) in cash, without interest and less any applicable withholding taxes.　　The tender offer, which was previously scheduled to expire at one minute after 11:59 P.M., New York City time, on January 5, 2024, has been extended until one minute after 11:59 P.M., New York City time, on January 22, 2024, unless the tender offer is further extended or earlier terminated. The tender offer was extended to allow additional time for the satisfaction of the remaining closing conditions of the tender offer, including, but not limited to, regulatory approvals (other than the previously announced CFIUS approval, NSIA approval and Taiwan merger control approval) and the valid tender of ordinary shares and ADSs of Sequans representing – together with ordinary shares and ADSs of Sequans beneficially owned by Renesas, if any – at least 90% of the fully diluted ordinary shares of Sequans.　　The Bank of New York Mellon, the Tender Agent for the tender offer, has advised Renesas that as of 6 p.m., New York City time, on January 4, 2024, approximately 116,333,513 ordinary shares of Sequans (including ordinary shares represented by ADSs), representing approximately 41.9% of the fully diluted ordinary shares of Sequans, have been validly tendered and not properly withdrawn pursuant to the tender offer. Holders that have previously tendered their shares do not need to re-tender their shares or take any other action in response to this extension.　　The tender offer is being made pursuant to the Offer to Purchase, dated September 11, 2023 (as it may be amended or supplemented from time to time, the “Offer to Purchase”), the related Ordinary Share Acceptance Form, ADS Letter of Transmittal and certain other offer documents (together with any amendments or supplements thereto), copies of which are attached to the combined Tender Offer Statement and Rule 13e-3 Transaction Statement filed under cover of Schedule TO by Renesas and Renesas Electronics Europe GmbH with the U.S. Securities and Exchange Commission (the “SEC”) on September 11, 2023, as amended.
Key word：
Release time：2024-01-15 15:51 reading：1153 Continue reading>>
<span style='color:red'>Renesas</span> to Acquire Transphorm to Expand its Power Portfolio with GaN Technology
Trade news

Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology

　　Renesas Electronics Corporation (“Renesas,” TSE: 6723), a premier supplier of advanced semiconductor solutions, and Transphorm, Inc. (“Transphorm,” Nasdaq: TGAN), a global leader in robust gallium nitride (“GaN”) power semiconductors, today announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm’s common stock for $5.10 per share in cash, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months. The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters.　　Demand for highly efficient power systems is increasing as building blocks for carbon neutrality. To address this trend, an industry-wide transition toward wide bandgap (“WBG”) materials, represented by silicon carbide (“SiC”) and GaN, is also being seen. These advanced materials allow a broader range of voltage and switching frequency than conventional silicon-based devices. To build on this momentum, Renesas has announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.　　Renesas now aims to further expand its WBG portfolio with Transphorm’s expertise in GaN, an emerging material that enables higher switching frequency, lower power losses, and smaller form factors. These benefits empower customers’ systems with greater efficiency, smaller and lighter composition, and lower overall cost. As such, demand for GaN is predicted to grow by more than 50 percent annually, according to an industry study. Renesas will implement Transphorm’s auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications.　　“Transphorm is a company uniquely led by a seasoned team rooted in GaN power and with origins from the University of California at Santa Barbara,” said Hidetoshi Shibata, CEO of Renesas. “The addition of Transphorm’s GaN technology builds on our momentum in IGBT and SiC. It will fuel and expand our power portfolio as a key pillar of growth, offering our customers the full ability to choose their optimal power solutions.”　　“Combined with Renesas’ world-wide footprint, breadth of solution offerings and customer relationships, we are excited to pave the way for industry-wide adoption of WBG materials and set the stage for significant growth. This transaction will also allow us to offer further expanded services to our customers and deliver significant immediate cash value to our stockholders,” said Dr. Primit Parikh, Co-founder, President and CEO of Transphorm and Dr. Umesh Mishra, Co-founder and CTO of Transphorm. “Additionally, it will provide a strong platform for our exceptional team to further Transphorm’s leading GaN technology and products.”　　Transaction Details　　The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. Concurrently with the execution of the definitive agreement, KKR Phorm Investors L.P., which holds approximately 38.6% of Transphorm’s outstanding common stock, has entered into a customary voting agreement with Renesas to vote in favor of the transaction.　　The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Key word：
Release time：2024-01-15 15:48 reading：1592 Continue reading>>
<span style='color:red'>Renesas</span> Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation
Trade news

Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched a new cloud-based development environment aimed at streamlining the software design process for automotive AI engineers. The new platform, AI Workbench, is an integrated virtual development environment that empowers automotive AI engineers to design, simulate and fine-tune their automotive software - all within the cloud.　　With this environment, engineers can immediately begin designing automotive software by leveraging Microsoft Azure services including Azure Compute, IaaS services, Microsoft Entra ID and Azure Security. Instead of installing tools on a PC or obtaining an evaluation board, they can perform tasks such as performance evaluation, debugging and verification using simulation tools online. This approach aligns with the "Shift-Left" approach, which enables software creation and testing earlier in the design cycle, even before the actual hardware becomes available. For example, it is possible to start developing AI-enabled application software to support ADAS (Advanced Driver Assistance System) and autonomous driving for the upcoming fifth-generation R-Car System on Chip (SoC) prior to the availability of hardware samples. This environment will serve as a unified development platform for designing and testing Renesas’ scalable automotive SoCs and microcontrollers (MCUs), regardless of product type or application.　　“We are thrilled to introduce a cloud-based virtual development and AI model performance testing environment for automotive AI engineers in collaboration with Microsoft, a leading cloud technology provider," said Mandali Khalesi, Global VP, HPC AI and Cloud Technology at Renesas. “We are committed to improving the AI development environment through new features such as continuous monitoring and analysis of software usage.”　　“Cloud-based development is a secure and cost-effective method to address the increasing complexities of today’s embedded projects. The collaboration between Renesas and Microsoft aims to tackle this challenge and accelerate the digital transformation of the automotive industry,” said Ulrich Homann, Corporate Vice President & Distinguished Architect, Cloud + AI, Microsoft. “With Renesas’ AI Workbench, developers can now efficiently build and test software for a myriad of applications using Renesas SoCs in a cloud-based environment powered by Azure."　　The AI Workbench includes the following four functional blocks today. Renesas plans to enhance its offering in the future with additional features such as selected functionality or customization options tailored to support various development processes.　　Upgraded AI Compiler Toolchain　　Renesas will upgrade its SoC AI compiler toolchain with a novel “Hybrid Compiler (HyCo)” architecture and make it available through the AI Workbench. The new HyCo architecture developed in house and kernel libraries will allow engineers to unlock broader AI model and ONNX operator coverage, beyond the coverage of existing-third party hardware accelerator compilers available on Renesas SoC such as DSPs and NPUs.　　AI Model Performance Testing Environment　　Renesas will provide NNPerf, an online test environment for developers to evaluate the performance of AI models running on live Renesas SoCs with an updated hybrid AI compiler. Testing will run on real hardware in Renesas’ global device farm, without the need for evaluation boards. With the ability to batch code programs, perform real-time inference tests, and compare performance across different AI models, application engineers can estimate and make decisions on tradeoffs between models, memory footprints, latency and more.　　Software Development Environment　　Microsoft's code editor, Visual Studio Code (VSCode) and a software development kit (SDK) from Renesas are both available in the cloud. Using the tool suite, developers can launch their development environment in the cloud in a matter of minutes. Developers can customize their independent development environment and perform all design work using just a web browser on their PC.　　Software Evaluation/Verification Environment　　Renesas will also provide an environment for developers to test and verify their application software using the AI models defined in the AI model performance testing tool NNPerf. This includes simulators such as SILS (Software in the Loop Simulator), and HILS (Hardware in the Loop Simulator), allowing users to verify the operation designed for their specific AI application.
Key word：
Release time：2023-12-25 15:41 reading：1933 Continue reading>>
<span style='color:red'>Renesas</span> Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition
Trade news

Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition

　　TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced today that it has designed and tested a 32-bit CPU core based on the open-standard RISC-V instruction set architecture (ISA). Renesas is among the first in the industry to independently develop a CPU core for the 32-bit general-purpose RISC-V market, providing an open and flexible platform for IoT, consumer electronics, healthcare and industrial systems. The new RISC-V CPU core will complement Renesas’ existing IP portfolio of 32-bit microcontrollers (MCUs), including the proprietary RX Family and the RA Family based on the Arm® Cortex®-M architecture.　　RISC-V is an open ISA which is quickly gaining popularity in the semiconductor industry, due to its flexibility, scalability, power efficiency and open ecosystem. While many MCU providers have recently created joint investment alliances to accelerate their development of RISC-V products, Renesas has already developed a new RISC-V core on its own. This versatile CPU can serve as a main application controller, a complementary secondary core in SoCs, on-chip subsystems, or even in deeply embedded ASSPs. This positions Renesas as a leader in the emerging RISC-V market, following previous introductions of its 32-bit voice-control and motor-control ASSP devices, as well as the RZ/Five 64-bit general purpose microprocessors (MPUs), which were built on CPU cores developed by Andes Technology Corp.　　“Renesas takes pride in offering embedded processing solutions for the broadest range of customers and applications,” said Daryl Khoo, Vice President of the IoT Platform Division at Renesas. “This new core extends our leadership in the RISC-V market and uniquely positions us to deliver more solutions that accommodate a diverse range of requirements.”　　“We congratulate Renesas on achieving its recent milestone in 32-bit RISC-V MCU architecture development,” said Calista Redmond, CEO at RISC-V International. “This achievement exemplifies how RISC-V ecosystem partners, such as Renesas, are rapidly advancing RISC-V innovation. Our RISC-V community now spans 70 countries with more than 4,000 members, and we eagerly anticipate further innovations emerging from this dynamic, expanding market.”　　The Renesas RISC-V CPU achieves an impressive 3.27 CoreMark/MHz performance, outperforming similar architectures on the market. It includes extensions to improve performance, while reducing code size.　　Renesas is sampling devices based on the new core to select customers, with plans to launch its first RISC-V-based MCU and associated development tools in Q1 2024. Details of the new MCU will be published at that time. More information about RISC-V solutions is available at: renesas.com/risc-v. A blog article about the new RISC-V CPU is available here.　　Renesas MCU Leadership　　The world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 200 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm, Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Key word：
Release time：2023-12-08 17:06 reading：2160 Continue reading>>

Turn to

/ 6

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.