Commercialized high precision agricultural CO2 sensors with superior long-term stability
  Murata Manufacturing Co., Ltd. (hereinafter "Murata") has commercialized "IMG-CA0012-12" (hereinafter "this product"), a case and cable type CO2 sensor. This high precision product primarily connects to environment measurement equipment in agricultural greenhouses and stably measures CO2 concentration. Through linkage with photosynthesis accelerators, this product will contribute to improving crop quality and increasing yield. Additionally, it improves energy efficiency by injecting an optimal amount of CO2 at an optimal timing. Mass production and supply for this product has begun in Hakui Murata Manufacturing.  In the field of agriculture, increased yield and quality improvement per unit area are required since there is a reduction in yield and decline in quality due to global warming as well as a drop in agricultural worker population. Technology for accelerating crop photosynthesis using CO2 application is an effective means of addressing these challenges. Furthermore, due to the recent increase in energy costs, effective CO2 application based on environmental data measurements is crucial. As a result, high-precision CO2 sensors, which offer long-term stability, require no calibration, and are resistant to malfunction, play a crucial role in photosynthesis accelerator technology.  This product is equipped with an automatic calibration function that runs on our unique calibration curve algorithm and dual wavelength (for measurement and reference) NDIR*1. Therefore, atmospheric calibration is not required. This ensures high precision and long-term stability, making it maintenance-free. Furthermore, its case and cable type design enhances user handling and ease of installation.  *1NDIR: Non-Dispersive Infrared Absorption  Specifications  CO2 sensors were installed in greenhouses and were used for a year for tomato cultivation and 2 years for rose cultivation. After use, CO2 concentration characteristics and temperature characteristics were evaluated.  It was discovered that CO2 concentration differences were minimal even when they were used for a long period of time in actual fields.  CO2 concentration characteristics  Temperature characteristics
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Release time:2025-04-02 15:44 reading:174 Continue reading>>
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
  ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.  The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices.  GaN power devices are currently used in consumer and industrial applications such as AC adapters and server power supplies. TSMC, a leader in sustainability and green manufacturing, supports GaN technology for its potential environmental benefits in automotive applications, such as on-board chargers and inverters for electric vehicles (EVs).  The partnership builds on ROHM and TSMC’s history of collaboration in GaN power devices. In 2023, ROHM adopted TSMC’s 650V GaN high-electron mobility transistors (HEMT), whose process is increasingly being used in consumer and industrial devices as part of ROHM's EcoGaN™ series, including the 45W AC adapter (fast charger) "C4 Duo" produced by Innergie, a brand of Delta Electronics, Inc.  "GaN devices, capable of high-frequency operation, are highly anticipated for their contribution to miniaturization and energy savings, which can help achieve a decarbonized society. Reliable partners are crucial for implementing these innovations in society, and we are pleased to collaborate with TSMC, which possesses world-leading advanced manufacturing technology" said Katsumi Azuma, Member of the Board and Senior Managing Executive Officer at ROHM. “In addition to this partnership, by providing user-friendly GaN solutions that include control ICs to maximize GaN performance, we aim to promote the adoption of GaN in the automotive industry."  “As we move forward with the next generations of our GaN process technology, TSMC and ROHM are extending our partnership to the development and production of GaN power devices for automotive applications,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “By combining TSMC's expertise in semiconductor manufacturing with ROHM's proficiency in power device design, we strive to push the boundaries of GaN technology and its implementation for EVs.”  About TSMC  TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.          TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan.  EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time:2025-04-02 15:36 reading:195 Continue reading>>
TAIYO YUDEN Realizes a Metal Power Inductor as Thin as 0.33 mm
  TAIYO YUDEN CO., LTD. has begun mass production of a new metal power inductor MCOIL™ LSCN series of multilayer metal power inductors, the "LSCND1005CCTR47MH" (1.0 x 0.5 x 0.33 mm; maximum height shown).  This power inductor is for use as choke coils in the power supply circuits of wearable devices, such as smartphones, AR/VR glasses, TWS devices, and smart watches. The "LSCND1005CCTR47MH" is 40% lower in height than our previous product, the "LSCNB1005EETR47MB" (1.0 x 0.5 x 0.55 mm), and realizes a metal power inductor as thin as 0.33 mm. This will contribute to the miniaturization and thickness reduction of cutting-edge electronic devices.  Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2024. Samples are available for 50 yen per unit.  Technology Background  As smartphones, AR/VR glasses, and wearable devices are equipped with higher-performance processors, more sensors, multiple cameras, and higher-capacity batteries for sophistication, electronic components used in them need to be smaller and thinner.  In particular, smartphones are requiring thinner electronic components, due to the trend towards foldable devices that combine large screens and smaller sizes, as well as the adoption of multi-layered circuit boards. On the other hand, wearable devices, such as AR/VR glasses, TWS devices, and smart watches, require smaller, lighter, and thinner components to achieve a thin profile and comfortable fit.  To address these needs, TAIYO YUDEN has been expanding its lineup in the MCOIL™ LSCN series of multilayer metal power inductors which use metallic magnetic materials with high DC saturation characteristics, and provide superior characteristics for achieving miniaturization and thinness. With our latest upgrade, we have commercialized the "LSCND1005CCTR47MH," which achieves a thickness of 0.33 mm for a metal power inductor by utilizing the strengths of our multilayer process technology.  This product will be on display at CES 2025, which takes place from January 7, 2025 at the Las Vegas Convention Center in Las Vegas, Nevada, U.S.A.  In response to market needs, we will continue to expand and improve our product lineup with higher performance and reliability.  ■ Application  For use as choke coils for power supply circuits in wearable devices such as smartphones, AR/VR glasses, TWS devices, and smart watches.  * "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.  * The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
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Release time:2025-04-01 14:41 reading:177 Continue reading>>
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.  As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).  Renesas’ Automotive Video Signal Processing Expertise  Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.  Key Features of the RAA278830  Dual Open-LDI Input/Output  ISO 26262 Functional Safety ASIL B rating  CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path  Video Diagnostic Capabilities  Input/Output monitoring of video timing, signal integrity, and content  Flickering, flashing, occlusion, and glare detection  Spread Spectrum for lower system level EMI profile  Image enhancement engine for superior image quality  Dual host interface: I2C & SPI (configurable)  SPI-Flash based OSD as well as an embedded font based OSD  SPI boot capability (boot from SPI Flash, no MCU needed)  Supports multi-bank for fail-safe OTA updates  Space-efficient 72SCQFN, 10mm x 10mm  AEC-Q100 Grade 2 qualified  “Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
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Release time:2025-04-01 14:36 reading:190 Continue reading>>
Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
  Mazda Motor Corporation (hereinafter “Mazda”) and ROHM Co., Ltd. (hereinafter “ROHM”) have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.  (Left) Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of MAZDA / (Right) Katsumi Azuma, Member of the Board and Senior Managing Executive Officer of ROHM  Since 2022, Mazda and ROHM have been advancing the joint development of inverters using silicon carbide (SiC) power semiconductors under a collaborative framework for the development and production of electric drive units. Now, they have also embarked on the development of automotive components using GaN power semiconductors, aiming to create innovative automotive components for next-generation electric vehicles.  GaN is attracting attention as a next-generation material for power semiconductors. Compared to conventional silicon (Si) power semiconductors, GaN can reduce power conversion losses and contribute to the miniaturization of components through high-frequency operation.  Both companies will collaborate to transform these strengths into a package that considers the entire vehicle, and into solutions that innovate in weight reduction and design. Mazda and ROHM aim to materialize the concept and unveil a demonstration model within FY2025, with practical implementation targeted for FY2027.  “As the shift towards electrification accelerates in pursuit of carbon neutrality, we are delighted to collaborate with ROHM, which aims to create a sustainable mobility society with its outstanding semiconductor technology and advanced system solution capabilities, in the development and production of automotive components for electric vehicles” said Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of Mazda. “We are excited to work together to create a new value chain that directly connects semiconductor devices and cars. Through collaboration with partners who share our vision, Mazda will continue to deliver products filled with the 'joy of driving' that allows customers to truly enjoy driving, even in electric vehicles.”  “We are very pleased to collaborate with Mazda, which pursues the 'joy of driving,' in the development of automotive components for electric vehicles” said Katsumi Azuma, Member of the board and Senior Managing Executive Officer of ROHM. “ROHM's EcoGaN™, capable of high-frequency operation, and the control IC that maximizes its performance are key to miniaturization and energy-saving. To implement this in society, collaboration with a wide range of companies is essential, and we have established various partnerships for the development and mass production of GaN. By collaborating with Mazda, which aims to create 'cars that coexist sustainably with the earth and society,' we will understand the requirements for GaN from the perspective of application and final product development, contributing to the spread of GaN power semiconductors and the creation of a sustainable mobility society.”  EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time:2025-03-31 15:46 reading:194 Continue reading>>
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers
  ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.  In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.  A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.  The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.  While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.  Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.  Key Specifications  For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers  Sales Information        Pricing: $14.50/unit (excluding tax)  Availability: Now (OEM quantities)  Application Examples        • A4-sized mobile printers  • Industrial control label printers  • Tattoo stencil printers, etc.  Terminology        dpi (dots per inch)  A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).  Thermal Printing Method  A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.  Thermal Transfer Printing Method  A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time:2025-03-31 15:36 reading:198 Continue reading>>
Murata Type 2FR Hostless Tri-Radio Module
     Murata Electronics Type 2FR Hostless Wi-Fi® 6 + BLUETOOTH® LE 5.4 / 802.15.4 Tri-Radio Module is highly integrated while based on the NXP RW612 Wireless MCU. The Type 2FR wireless module delivers class-leading integration, efficiency, and multiple radio capabilities in a 12mm x 11mm package.The Murata Type 2FR supports dual-band Wi-Fi 6, Bluetooth Low Energy (LE) 5.4, IEEE 802.15.4, and ethernet. This versatility provides seamless connectivity and operational efficiency. Additionally, it supports Matter Network over Wi-Fi, Thread, and ethernet, simplifying device interoperability and management.FEATURESNXP RW612 inside260MHz Arm® Cortex® -M33Supports IEEE 802.11a/b/g/n/ac/ax specification with dual-band 2.4GHz and 5GHz Wi-Fi 6SISO with 20MHz channels; up to MCS9 data ratesSupports Bluetooth specification version 5.4Supports IEEE 802.15.41.2MB SRAM; 16MB Flash; External PSRAM interface for system memory expansion up to 128MB64 GPIOs, FlexSPI, SDIO 3.0, Ethernet, USB, USART, I2C, SPI, I2S, PCM, ACOMP, DAC, ADC, JTAGRF signal from pin padTemperature range of -40°C to 85°C12.0mm x 11.0mm x 1.55mm (maximum) dimensionsMSL 3Surface-mount typeRoHS compliantAPPLICATIONSSmart homeBlood pressure monitorFitness equipmentGaming accessoriesGlucometerHome security and surveillanceIn-home energy displayMajor home appliancesMulti-radio hub/smart device gateway for internet connectivitySmall and medium appliancesSmart power socket and light switchWeighing scaleIndustrialBuilding securityLightingPoint of Sale (POS) terminals
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Release time:2025-03-24 13:52 reading:187 Continue reading>>
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
  ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.  Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)  Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)  The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.  Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.  In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.  ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
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Release time:2025-03-24 11:32 reading:232 Continue reading>>
ROHM selected for CDP’s A List for Climate Change and Water Security
  ROHM Co., Ltd. has been recognized for leadership in corporate sustainability by CDP (Carbon Disclosure Project), an international environmental non-profit organization, securing a place on its prestigious ‘2024 A List’ for tackling both climate change and water security.  This is the first time to be included in the Climate Change A list, the highest rating, for ROHM, as well as the fourth consecutive year to secure a position on the Water Security A list.  CDP is an international environmental non-profit organization that operates a global environmental disclosure system for companies and municipalities. It conducts environmental information surveys and publishes data regarding Climate Change and Water Security. The survey is fully aligned with the TCFD, and its scores are widely used for decision-making regarding investments and purchasing in a sustainable and resilient net-zero economy. In 2024, more than 700 signatory financial institutions requested disclosure of data on environmental impacts, risks, and opportunities through the CDP platform, with a record number of nearly 24,800 companies responding. The survey employs an eight-tier evaluation scale with levels ranging from Leadership level (A, A-) to Management level (B, B-), Recognition level (C, C-), and Disclosure level (D, D-), based on criteria such as comprehensiveness of disclosure, identification and management of environmental risks, and ambitious target setting.        Environmental Management at ROHM  In the Environmental Vision 2050, ROHM has committed to achieving virtually zero greenhouse gas emissions and maximizing resource recycling to eliminate waste from all its business activities.  ・Water Resource Management  ROHM has set a target to increase the proportion of water recovery and reuse by at least 5.5% by FY2030 (compared to FY2019), and is making efforts to reuse water resources and reduce factory wastewater by globally managing water withdrawal, wastewater, and water usage. In addition to addressing risks such as flooding, ROHM has implemented a business continuity management system, which predicts potential risks, and made production continuity plans for each site. ROHM is also taking ongoing measures, such as constructing new production buildings based on flood countermeasures.  In 2024, ROHM received an independent verification of its water withdrawal and wastewater volume data in order to disclose information to society with higher transparency and reliability.  ・Climate Change Measures  ROHM has set a target to reduce greenhouse gas emissions (Scope 1 and 2) by at least 50.5% byFY2030 (compared to FY2018), and is working globally to introduce environmentally-friendly equipment and reduce usage through energy conversion. In 2024, ROHM has expanded independent verification to achieve a 100% verification rate for its internally calculated greenhouse gas emissions (Scope 1 and 2). Additionally, ROHM has introduced an Internal Carbon Pricing (ICP) system to promote decarbonized management.  Furthermore, ROHM has announced a plan to source 100% of the electricity used in all domestic and international business activities from renewable energy by FY2050. Several sites, including major overseas production plants, are already operating with 100% renewable energy. As of FY2023, ROHM has achieved a 43% adoption rate and plans to increase this to 65% by FY2030.  Encouraged by the evaluation results, ROHM will continue promoting CSR activities and addressing social issues to achieve a sustainable society and become a company that meets the expectations of its stakeholders.
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Release time:2025-03-21 13:52 reading:268 Continue reading>>
Introduction to PCB Manufacturing Machines : Types
  In the ever-evolving world of electronics, Printed Circuit Boards (PCBs) are the unsung heroes that form the backbone of most electronic devices. From smartphones to industrial machinery, PCBs provide the essential connections between various components, ensuring that signals are transmitted effectively and reliably. As demand for electronic devices continues to surge, the need for efficient, high-quality PCB manufacturing has never been greater. This is where PCB manufacturing machines come into play.  These machines are pivotal in the production process, transforming raw materials into complex circuit boards that meet stringent specifications. In this introduction, we will explore the different types of PCB manufacturing machines and highlight some of the key players in the industry.  Types of PCB Manufacturing Machines  1. PCB Fabrication MachinesPCB fabrication is the process of creating the physical circuit board from a design. This involves several key steps, each facilitated by specific types of machines:  – Photoplotters: These are used to create photomasks for PCB production. A photomask is a plate with patterns that will be transferred onto the PCB’s surface. Photoplotters use high-precision imaging technology to ensure accurate pattern reproduction.  – Drilling Machines: Once the PCB pattern is applied, drilling machines create holes for components and vias. These machines are equipped with high-speed spindles and precision control systems to ensure that holes are drilled accurately and efficiently.  – Etching Machines: After drilling, the PCB is subjected to an etching process to remove unwanted copper and leave behind the circuit pattern. Etching machines use chemical solutions or abrasive materials to strip away excess copper while preserving the desired circuitry.  – Laminators: Laminating machines are used to bond multiple layers of PCBs together. This process involves applying heat and pressure to laminate the layers into a single, multi-layer board. Laminators ensure that the layers are aligned correctly and that the adhesive bonds are strong.  – Solder Mask and Silkscreen Printers: Solder masks are applied to prevent solder from bridging between circuit paths, while silkscreen printers add labels and markings to the PCB. These machines use advanced printing technologies to apply precise coatings and markings.  2. PCB Assembly MachinesOnce the PCB is fabricated, it needs to be assembled with electronic components. This step involves several specialized machines:  – Pick and Place Machines: These are crucial for the assembly process. Pick and place machines automatically position and place components onto the PCB. They use high-speed cameras and advanced algorithms to ensure components are placed accurately and efficiently.  – Soldering Machines: There are various types of soldering machines used in PCB assembly. Wave soldering machines apply solder to the entire PCB at once, while reflow soldering machines use heat to melt solder paste and create precise solder joints. Selective soldering machines target specific areas for soldering, reducing the risk of damage to sensitive components.  – Inspection Machines: Quality control is essential in PCB manufacturing. Automated Optical Inspection (AOI) machines use cameras and image processing to detect defects such as soldering errors, missing components, or alignment issues. X-ray inspection machines can inspect internal layers and connections that are not visible externally.  3. PCB Testing MachinesTesting is a crucial step to ensure the functionality and reliability of the PCBs. Testing machines include:  – In-Circuit Testers (ICT): These machines test the electrical connections and functionality of the PCB by probing each point and checking for continuity, shorts, and other electrical faults.  – Functional Testers: Functional testers simulate the PCB’s operating environment to ensure that it performs as expected. These testers are used to evaluate the board’s overall functionality and identify any operational issues.
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Release time:2025-03-21 13:32 reading:201 Continue reading>>

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