TSMC Intensifies Silicon Photonics R&D, Rumored Collaboration with <span style='color:red'>Broadcom</span> and NVIDIA
  According to a report by Economic Daily, AI is driving a massive demand for data transmission, and silicon photonics and Co-Packaged Optics (CPO) have become new focal points in the industry. TSMC is actively entering this field and is rumored to be collaborating with major customers such as Broadcom and NVIDIA to jointly develop these technologies. The earliest large orders are expected to come in the second half of next year.  TSMC has already assembled a research and development team of over 200 people, aiming to seize the business opportunities in the emerging market of ultra-high-speed computing chips based on silicon photonics, which are expected to arrive gradually starting next year.  Regarding these rumors, TSMC has stated that they do not comment on customer and product situations. However, TSMC has a high regard for silicon photonics technology. TSMC Vice President Douglas Yu recently stated publicly, “If we can provide a good silicon photonics integration system, it can address two key issues: energy efficiency and AI computing capability. This could be a paradigm shift. We may be at the beginning of a new era.”  Silicon photonics was a hot topic at the recent SEMICON Taiwan 2023 with major semiconductor giants like TSMC and ASE giving related keynote speeches. This surge in interest is mainly due to the proliferation of AI applications, which have raised questions about how to make data transmission faster and achieve signal latency reduction. The traditional method of using electricity for signal transmission no longer meets the demands, and silicon photonics, which converts electricity into faster optical transmission, has become the highly anticipated next-generation technology to enhance high-volume data transmission speeds in the industry.  Industry reports suggest that TSMC is currently collaborating with major customers like Broadcom and NVIDIA to develop new products in the field of silicon photonics and Co-Packaged Optics. The manufacturing process technology ranges from 45 nanometers to 7 nanometers, and with mass production slated for 2025. At that time, it is expected to bring new business opportunities to TSMC.  Industry sources reveal that TSMC has already organized a research and development team of approximately 200 people. In the future, silicon photonics is expected to be incorporated into CPU, GPU, and other computing processes. By changing from electronic transmission lines to faster optical transmission internally, computing capabilities are expected to increase several tens of times compared to existing processors. Currently, this technology is still in the research and academic paper stage, but the industry has high hopes that it will become a new driver of explosive growth for TSMC’s operations in the coming years.
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Release time:2023-09-11 14:52 reading:2324 Continue reading>>
<span style='color:red'>Broadcom</span> to Help Design Wave’s 7-nm AI Chip
Wave Computing has set its sights on becoming the first AI startup to develop and deploy a 7-nm AI processor in its AI systems.EE Times has learned that Wave has snagged Broadcom Inc. as an ASIC designer for the new 7-nm project. The two companies will collaborate on development of Wave’s next-generation Dataflow Processing Unit (DPU) by using Taiwan Semiconductor Manufacturing Co.’s 7-nm process node.The new 7-nm DPU — scheduled for delivery by Broadcom at an undisclosed date — will be “designed into our own AI system,” confirmed Wave’s CEO, Derek Meyer. He added that the same chip may become available to others “if there is a market demand.”“Wave is hoping to get a jump on the startup competition with a 7-nm part,” observed Kevin Krewell, principal analyst at Tirias Research. “Most startups don’t have the expertise to build a 7-nm part just yet.” He explained that Broadcom’s involvement made this possible. Broadcom, he noted, “does have more senior ASIC circuit design experience through the acquisition of LSI Logic.”Wave’s current-generation DPU is based on a 16-nm process design.“Among our peers who are designing a new breed of AI accelerators, we will be the first to have access to 7-nm physical IP — such as 56-Gbps and 112-Gbps SerDes — thanks to Broadcom,” noted Meyer. Broadcom is “instrumental to bringing this 7-nm project to fruition,” he explained, thanks to “their industry-leading design platform, productization skills, and proven 7-nm IPs.”Wave’s current-generation DPU based on 16-nm process node was designed by Wave’s employees with the help of contractors. As for the 7-nm DPU, Meyer said, “Between Broadcom and Wave, we have sketched out skills and resources that will be necessary to both front-end and back-end [of the ASIC] designs. We devised our plans for collaboration accordingly.”The joint 7-nm project has been up and running for several months. Broadcom will manage physical delivery of the 7-nm chip. Despite the complexity of 7-nm designs, Meyer said, “I am confident that Broadcom will deliver the first-time right chip.” Wave, however, declined to comment on when its 7-nm DPU will become available.What’s in the 7-nm DPU?Wave did not reveal the architecture of its 7-nm DPU, either.Meyer, however, explained that the new chip will be “based on the data flow architecture.” It will be the first DPU featuring “64-bit MIPS multithreaded CPU.” Wave acquired MIPS in June.Meyer also indicated that Wave’s 7-nm chip will come with “new features in memory,” but he refrained from disclosing what exactly those features are.MIPS’s multithreading technology will play a key role in the new-generation DPU, according to Meyer. In Wave’s dataflow processing, “when we load, unload, and reload data for machine-learning agents, hardware multithreading architecture is effective.” MIPS’s cache coherence is another positive for Wave’s new DPU. “Because our DPU is 64-bit, it only makes sense that both MIPS and DPU talk to the same memory in 64-bit address space,” he said.Asked about Wave’s new features in memory, Krewell said, “Wave’s present chip uses Micron’s Hybrid Memory Cube. And I believe Wave will move to high-bandwidth memory (HBM) in future chips.” He added, “There’s a much better roadmap for HBM. The changing memory architecture will have an impact on the overall system architecture.”Karl Freund, senior analyst at Moor Insights & Strategy, concurred. He said, “For memory, I suspect they will abandon the Hybrid Memory Cube and adopt high-bandwidth memory, which is more cost-effective.”During the interview, Meyer boasted that the new 7-nm DPU should be able to offer 10 times the performance of the company’s current chip.“Remember, we separated the clocks from our chips” in the DPU architecture, he said. Noting that going back and forth to a host creates a bottleneck, he explained that in DPU, an embedded microcontroller loads instructions, cutting down on power and latency wasted by traditional accelerators. “We can take advantage of that capacity available for transistors on the 7-nm chip to increase the performance.”Krewell remained a little skeptical. “As to whether Wave can make a 10x leap, that’s a long reach.” He said, “It depends on how machine-learning performance is measured … and whether Derek [Meyer] was talking training or inference.” He added, “There are a lot of changes going on in inference, with lower-precision (8-bit and below) algorithms being deployed. Training performance is heavily memory-architecture- dependent.”He acknowledged, “But I don’t know the details of what Wave has planned.”
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Release time:2018-08-02 00:00 reading:3159 Continue reading>>
<span style='color:red'>Broadcom</span> to acquire CA Technologies for $18.9B in cash
Broadcom Inc. (NASDAQ: AVGO), a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, and CA Technologies (NASDAQ: CA), one of the world’s leading providers of information technology (IT) management software and solutions, today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world’s leading infrastructure technology companies.Under the terms of the agreement, which has been approved by the boards of directors of both companies, CA’s shareholders will receive $44.50 per share in cash. This represents a premium of approximately 20% to the closing price of CA common stock on July 11, 2018, the last trading day prior to the transaction announcement, and a premium of approximately 23% to CA’s volume-weighted average price (“VWAP”) for the last 30 trading days. The all-cash transaction represents an equity value of approximately $18.9 billion, and an enterprise value of approximately $18.4 billion.Hock Tan, President and Chief Executive Officer of Broadcom, said, “This transaction represents an important building block as we create one of the world’s leading infrastructure technology companies. With its sizeable installed base of customers, CA is uniquely positioned across the growing and fragmented infrastructure software market, and its mainframe and enterprise software franchises will add to our portfolio of mission critical technology businesses. We intend to continue to strengthen these franchises to meet the growing demand for infrastructure software solutions.”“We are excited to have reached this definitive agreement with Broadcom,” said Mike Gregoire, CA Technologies Chief Executive Officer. “This combination aligns our expertise in software with Broadcom’s leadership in the semiconductor industry. The benefits of this agreement extend to our shareholders who will receive a significant and immediate premium for their shares, as well as our employees who will join an organization that shares our values of innovation, collaboration and engineering excellence. We look forward to completing the transaction and ensuring a smooth transition.”The transaction is expected to drive Broadcom’s long-term Adjusted EBITDA margins above 55% and be immediately accretive to Broadcom’s non-GAAP EPS. On a combined basis, Broadcom expects to have last twelve months non-GAAP revenues of approximately $23.9 billion and last twelve months non-GAAP Adjusted EBITDA of approximately $11.6 billion.As a global leader in mainframe and enterprise software, CA’s solutions help organizations of all sizes develop, manage, and secure complex IT environments that increase productivity and enhance competitiveness. CA leverages its learnings and development expertise across its Mainframe and Enterprise Solutions businesses, resulting in cross enterprise, multi-platform support for customers. The majority of CA’s largest customers transact with CA across both its Mainframe and Enterprise Solutions portfolios. CA benefits from predictable and recurring revenues with the average duration of bookings exceeding three years. CA operates across 40 countries and currently holds more than 1,500 patents worldwide, with more than 950 patents pending.
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Release time:2018-07-16 00:00 reading:3376 Continue reading>>
Wall Street Unimpressed by <span style='color:red'>Broadcom</span>'s Latest M&A Deal
<span style='color:red'>Broadcom</span> Eyes New Acquisition Targets
  Broadcom executives said the company is eyeing fresh potential targets for acquisition, just days after U.S. President Donald Trump quashed the company's proposed $117 billion hostile takeover attempt of rival Qualcomm.  "We do see potential [acquisition] targets that are consistent with our proven business model and that also can drive returns well in excess of what we would otherwise achieve buying our own stock and/or paying down debt," said Tom Krause, Broadcom's chief financial officer, in a conference call with analysts to discuss the company's fiscal first quarter financial results.  But Krause added that future acquisition targets would be much smaller than the deal for Qualcomm, which would have been the largest high-tech acquisition in history and been financed largely through bank loans.  "Our future acquisitions are much more likely to be funded with cash available on our balance sheet and without the need to flex the balance sheet much beyond our current financial policy of two times net leverage," Krause said. He added that Broadcom executives would not take comments on the Qualcomm deal or Trump's order in the Q&A portion of the analyst call.  Trump, in an order issued Monday (March 12), took the unprecedented step of prohibiting an acquisition on national security grounds prior to a deal being finalized. In fact, after Qualcomm's board unanimously rejected Broadcom offers multiple times, the fate of the acquisition bid was to be decided by the election of Qualcomm board members at Qualcomm's annual shareholder meeting.  The Qualcomm stockholder vote had been pushed back after the Committee on Foreign Investment in the United States (CFIUS) raised concerns that the acquisition of Qualcomm by Broadcom would hurt U.S. standing in 5G and pave the way for Qualcomm rivals based in China to take the lead in the space.  Analysts widely expect Broadcom to continue its acquisition spree following the Qualcomm ruling. Under CEO Hock Tan, Broadcom has grown aggressively through acquisition, including recent buys of LSI and Brocade. Broadcom as it exists today was formed through acquisition when Avago Technologies bought Broadcom Corp. in 2015 and took the name.  Also Thursday, Broadcom reported fiscal first quarter earnings and sales slightly better than most analysts expected. The company posted sales of $5.33 billion, up 10 percent from the previous quarter and up 29 percent from the first quarter of fiscal 2017.  Broadcom reported a net income of more than $6.57 billion for the first quarter, thanks largely to the significant impact of provisional income tax benefits provided by the U.S. government's recent tax code overhaul. The net income was more than 10 times the net income the company reported in the previous or year-ago quarters.  For the current quarter, Broadcom said it expects sales to decline to about $5 billion.
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Release time:2018-03-19 00:00 reading:3241 Continue reading>>
<span style='color:red'>Broadcom</span> Earnings In Focus After Qualcomm Bid Withdrawal
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Release time:2018-03-15 00:00 reading:3380 Continue reading>>
White House blocks <span style='color:red'>Broadcom</span> bid for Qualcomm
  US President, Donald Trump, has announced that the US is blocking the Singaporean chip maker Broadcom's bid for the chip manufacturer Qualcomm, citing national security concerns. The move ends what would have been the largest ever tech deal.  In what was seen as an unusual move Trump said that "there is credible evidence," that the proposed bid could lead to "action that threatens to impair the national security of the United States."  The move by the President follows a review by the Committee on Foreign Investment in the United States (Cfius) which had concluded that it was minded to refer the deal to the administration for rejection.  While Broadcom strongly disagreed with the committee's findings which suggested there were "potential national security concerns" there were also concerns, again highlighted by the committee, that investment in research at Qualcomm would be cut back should the takeover go through.  While Broadcom promised to maintain levels of research and development and not to sell off any "critical national security assets" it appears that was not enough for the US authorities.  It comes at a time of growing protectionism in the US and it was thought that allowing the purchase of a leading semiconductor company by a foreign company would weaken the position of the US, to the benefit of China.  The administration is said to have been concerned about the US losing its leading position in 5G technology which is seen as being critical to the next generation of wireless devices and technologies.
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Release time:2018-03-14 00:00 reading:1108 Continue reading>>
Intel Reportedly Mulls <span style='color:red'>Broadcom</span> Bid
  Intel is considering several acquisition possibilities in response to Broadcom's $117 billion bid for Qualcomm, including the possibility it may make a bid for Broadcom, according to a Wall Street Journal report.  The report, published March 9, cites anonymous sources. It says that Intel has been working with advisors since late last year to formulate an acquisition strategy to offset Broadcom's bid, which if ultimately successful would further redraw a semiconductor industry landscape already undergoing drastic changes as a result of a wave of mega-consolidation over the past few years.  Intel was not immediately available for comment on the Wall Street Journal report. Publicly traded firms rarely comment on potential acquisition targets.  Intel last year finished second in global semiconductor sales with revenue of $62.8 billion. Based largely on the strength of the memory chip market in 2017, South Korea's Samsung Electronics knocked Intel from the No. 1 sales spot it had occupied since 1992.  Intel, which still service the bulk of its revenue from PC processors, has for years been moving to diversify as the PC market has declined. Intel has, largely through acquisition, had some success penetrating newer markets such as the Internet of Things, connected cars, data centers, and baseband modem processors — where Qualcomm remains the dominant player.  The Wall Street Journal article, which characterizes an Intel bid for Broadcom as the most dramatic of a number of acquisitions Intel is considering, maintains that Intel is concerned that the acquisition of Qualcomm by Broadcom would create a powerhouse in both smartphones and data centers, two areas where Intel hopes to grow. The article noted that any attempt by Intel to acquire Broadcom is likely to face heavy scrutiny by antitrust regulators throughout the world.  Broadcom's bid to acquire Qualcomm — which has been rejected multiple times by Qualcomm's board of directors — faces longer odds after its raised concerns among the Committee for Foreign Investment in the United States (CFIUS), a multi-agency U.S. government panel that reviews potential acquisitions for U.S. national security implications. CFIUS said in a letter dated March 5that the acquisition could threaten the U.S. position in wireless communications standards, patents, and products — potentially to the benefit of China.  In response to CFIUS concerns, Broadcom said last week it would invest to make the U.S. a leader in 5G technology, pledging to create a 1.5 billion fund with a focus on innovation to train and educate the next generation of RF engineers in the U.S. Broadcom also said it would not sell any critical national security assets to any foreign companies.  Qualcomm stockholders were to vote last week on whether to elect a slate of Broadcom nominees to Qualcomm's board, which would presumably favor the $117 billion offer from Broadcom that Qualcomm's board has rejected multiple times. However, at the request of CFIUS, the proxy vote by Qualcomm stockholders was pushed to April 5.
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Release time:2018-03-13 00:00 reading:3390 Continue reading>>
 <span style='color:red'>Broadcom</span> Moves to Assuage U.S. Fear Overs Qualcomm Bid
  Broadcom moved to assuage U.S. government concerns over its attempt to acquire rival Qualcomm, saying it was committed to investing to make the U.S. a global leader in 5G technology.  In an open letter to U.S. Congress posted Friday (March 9), Broadcom President and CEO Hock Tan said Broadcom was pledging to create a new $1.5 billion fund with a focus on innovation to train and educate the next generation of RF engineers in the U.S. Tan also said that Broadcom would not sell any critical national security assets to any foreign companies.  Broadcom is in the midst of an attempt to acquire Qualcomm for $117 billion, despite the fact that Qualcomm's board of directors has rejected that bid and others before it. Broadcom has nominated six nominees to Qualcomm's board of directors in a proxy fight that could determine the fate of the acquisition attempt.  Qualcomm stockholders were to elect board members this week,but the vote was pushed to April 5 after the Committee on Foreign Investment in the U.S. (CFIUS) — a multi-agency body that reviews potential acquisitions for national security risks — objected to the deal. CFIUS said in a letter dated March 5 that the acquisition could threaten the U.S. position in wireless communications standards, patents, and products — potentially to the benefit of China.  With the letter, CFIUS ordered Qualcomm to delay its proxy vote by at least 30 days.  In his later dated Friday, Tan called any notion that Broadcom would slash funding or cede leadership in 5G to another company unfounded.  "We have a proven track record of investing in and growing core franchises," Tan said. "In the case of 5G cellular, this will be 5G cellular."  Tan went on to say that Broadcom is "fully committed to making the United States the global leader in 5G by focusing resources and strengthening leadership in this area." He also promised that Broadcom would work closely with the U.S. government "as we drive to achieve and sustain this global leadership in 5G and beyond."  Qualcomm, meanwhile, announced that it eliminated the position of executive director of its board of directors. Jeffrey W. Henderson, a Qualcomm director since 2016, was promoted to independent chairman of the board.  Former Qualcomm CEO Paul Jacobs, who has held the position of executive chairman since he stepped down as CEO in 2014, remains on the board, Qualcomm said.  Tom Horton, lead director of Qualcomm's board, said in a press statement that the board "believes having an independent director as chairman at this important juncture in Qualcomm’s history is in the best interest of the company and our stockholders."
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Release time:2018-03-12 00:00 reading:3268 Continue reading>>
<span style='color:red'>Broadcom</span> Bid Gets U.S. Scrutiny
  A letter from a U.S. government agency casts a shadow over Broadcom’s hostile takeover bid for Qualcomm, saying that it “could pose a risk to the national security of the United States.”  The letter from the Committee on Foreign Investment in the U.S. (CFIUS) lays out a case why the acquisition could threaten the U.S. position in wireless communications standards, patents, and products — potentially to the benefit of China. It was dated March 5 and addressed to attorneys from both companies.  The letter came along with an order from CFIUS. It requires Qualcomm to delay by 30 days a shareholder meeting on a proxy vote on rival board candidates. In addition, it prevents either company from “taking any action” toward the merger while an investigation is in progress.  The order also requires Broadcom to give CFIUS five days of written notice before taking any action on the move of its headquarters to the U.S. In addition, it orders both companies to provide weekly updates of their actions to comply with the order.  In early November, Broadcom CEO Hock Tan met with President Trump to announce that the company’s headquarters will move from Singapore to the U.S., a process that Broadcom later said could be complete by May 6. However, Qualcomm submitted a request for review of the acquisition to CFIUS on Jan. 29.  That letter triggered “multiple phone calls, emails, and meetings” with CFIUS and representatives of the two companies. Indeed, while the two companies were undergoing a heated public battle for the hearts and minds of investors, they also were engaged in an equally intense battle to make their case with the inter-agency group of regulators.  “As a result of these communications … CFIUS has come to believe that Broadcom’s successful takeover attempt of Qualcomm … could pose a risk to the national security of the United States,” said Aimen N. Mir, a deputy assistant secretary with the Department of Treasury who signed the letter.  The letter lays out a case that, in part, points to concerns about China as well as risks associated with “Broadcom’s relationships with [unnamed] third-party foreign entities.”  CFIUS will conduct an investigation, at least part of which will remain classified. The unclassified aspects that the letter detailed included concerns that the U.S. could lose standing in 5G cellular technology and standards and a supply of trusted semiconductors to classified Department of Defense programs.  “A weakening of Qualcomm’s position would leave an opening for China to expand its influence in the 5G standards-setting process … For example, Huawei has increased its R&D expenditures and owns about 10% of essential 5G patents,” although the U.S. still dominates in 5G patents, it said.  The letter cited long-standing concerns about the security of Huawei and ZTE as telecom equipment providers. It also noted Broadcom’s practice of spending more on acquiring companies than on internal R&D.  Broadcom has lined up $106 billion in debt financing to cover the acquisition, “the largest corporate acquisition loan on record,” it said, adding that this would put intense pressure on Broadcom to trim R&D expenses.  The letter also cited Broadcom’s unspecified plans for changing Qualcomm’s licensing practices that have come under fire from regulators around the world as well as Apple, one of Qualcomm’s largest customers.  In terms of products, “Qualcomm currently holds active sole source classified prime contracts” with the Department of Defense, it said.  The CFIUS investigation aims to explore all of these issues. Just what conclusion it will reach and whether President Trump will weigh in remains to be seen.  Broadcom pledged to keep the U.S. a leader in 5G cellular in a response it released Wednesday to the CFIUS letter. The company noted its longstanding investments in core communications technologies such as its leading Ethernet switches.  To reassure U.S. government concerns about losing dominance in wireless technology to China, Broadcom also pledged to create a new $1.5 billion fund to train and educate engineers in the U.S. In addition, Broadcom said it “is in every important respect an American company,” and called Qualcomm’s patent licensing practices “predatory and anticompetitive.”  Some Wall Street stock analysts characterized Qualcomm’s effort to spark a CFIUS investigation as a delay tactic, giving it time to win China’s approval of its bid for NXP and stave off a Broadcom acquisition. But Broadcom is not likely to give up its bid and shareholders are likely to approve it, said three analysts in research notes provided to EE Times by Broadcom.  The dispute comes at a time when Trump has already launched a volley in what some say could be a trade war against rivals such as China over aluminum and steel. Meanwhile, China’s government is raising tens of billions to expand its semiconductor industry, and it is poised to waive term limits for its president, Xi Jinping.  For now, the biggest proposed acquisition in semiconductor history has more than investors to win over.
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Release time:2018-03-08 00:00 reading:1228 Continue reading>>

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