Next generation automotive controller microcontroller from Renesas

Release time:2018-03-28
author:Ameya360
source:Neil Tyler
reading:2099

  Renesas Electronics has announced the sample shipment of the industry's first on-chip flash memory microcontroller (MCU) that uses a 28nm process technology.

  The RH850/E2x Series MCU incorporates up to six 400MHz CPU cores, making it the first on-chip flash memory automotive MCU to achieve the industry's highest processing performance of 9600 MIPS. The series also features a built-in flash memory of up to 16MB as well as enhanced security functions and functional safety.

  Renesas is describing the 28nm-generation automotive control MCU as a breakthrough product featuring next-generation technology that's intended to support complex automotive control. OEMs and Tier 1 manufacturers in the automotive space have started to adopt the new 28nm MCU,

  According to the company as the automotive industry looks to develop environmentally-friendly vehicles, next-generation fuel-efficient engines will require much higher processing performance in order to allow the implementation of new fuel combustion systems. High processing performance and high integration densities will be required to achieve miniaturisation and higher efficiency in the motors and inverters used in electric vehicles (EV) and plug-in hybrid electric vehicles (PHEV).

  Looking to address these requirements, and when compared to the earlier 40nm MCUs, the RH850/E2x Series of MCUs are able to achieve approximately three times the performance at the same power level. The RH850/E2x also includes enhanced sensor interfaces which are necessary for precise automotive control functions.

  The RH850/E2x Series is also equipped with up to 16MB of flash ROM and it is possible to only update certain arbitrary areas during program operation. The RH850/E2x Series comes with improved serial interfaces, including up to ten channels of CAN FD and one Ethernet channel. Security functions that support Evita Medium enable the MCUs to support safe and rapid OTA updating of the software.

  Targeting ASIL-D, the highest level of the ISO 26262 functional safety standard for automotive E/E systems, the RH850/E2x Series has adopted the dual core lock step CPU structure that is able to guarantee that the calculations performed by two CPU cores are identical. The RH850/E2x also provides up to four sets of CPU pairs, and features a variety of hardware functional safety improvements.

  In applications where a system malfunction could lead to life-endangering accidents, these features immediately detect faults should a malfunction occur and allow system safety to be maintained.

  Renesas will provide safety analysis tools that can flexibly support a wide range of use cases to implement safe systems.

  To assure scalability in the RH850/E2x Series, in addition to the 28nm flash memory MCU, Renesas has also launched a 40nm process MCU.

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.  Optimized Design to Deliver Unparalleled Power Efficiency  Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.  Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features  The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.  “Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”  Lower Bill-of-Materials Reduces Costs and Simplifies Development  Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).  A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.  Key Features of the DA14533  Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems  64KB RAM and 12KB One-Time Programmable (OTP) memory  2.4 GHz radio transceiver  Integrated low IQ buck DC-DC converter  External SPI flash  Single XTAL operation (single crystal oscillator)  Software stack qualified against Bluetooth Core 5.3  AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)  WFFCQFN 22-pin 3.5 x 3.5 mm package
2025-04-08 14:06 reading:199
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.  As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).  Renesas’ Automotive Video Signal Processing Expertise  Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.  Key Features of the RAA278830  Dual Open-LDI Input/Output  ISO 26262 Functional Safety ASIL B rating  CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path  Video Diagnostic Capabilities  Input/Output monitoring of video timing, signal integrity, and content  Flickering, flashing, occlusion, and glare detection  Spread Spectrum for lower system level EMI profile  Image enhancement engine for superior image quality  Dual host interface: I2C & SPI (configurable)  SPI-Flash based OSD as well as an embedded font based OSD  SPI boot capability (boot from SPI Flash, no MCU needed)  Supports multi-bank for fail-safe OTA updates  Space-efficient 72SCQFN, 10mm x 10mm  AEC-Q100 Grade 2 qualified  “Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
2025-04-01 14:36 reading:252
Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.  Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.  The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.  The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.  The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.  “Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”  Key Features of the Renesas USB EPR PD Solution  Battery charger supporting two to seven battery cells in series  Buck-boost voltage regulator supporting 30V input and 30V output  Renesas R3™ technology ensures minimal power loss and improved efficiency  Advanced control scheme delivers fast transient response and system performance  Robust thermal management and protection features for safety and reliability  Adaptable configurations support a wide range of applications  Built-in protection against overcharging, overheating, and voltage anomalies  Bidirectional power flow  USB-IF certified reference design reduces compliance testing time and effort  Comprehensive design support and tools  Winning Combinations  Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.  Device Availability  The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.  Renesas Power Management Leadership  A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.  About Renesas Electronics Corporation  Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.  (Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
2024-12-10 14:06 reading:968
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
  Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).  The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.  Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.  “The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”  Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.  Availability  Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.  About Renesas Electronics Corporation  Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.  (Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.  The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
2024-12-03 14:43 reading:648
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
model brand To snap up
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code