Polar Instruments and Zuken have announced a direct link between Speedstack, Polar’s PCB layer stackup design and documentation tools, and Zuken CR-8000 Design Force and DFM Center.
Users of CR-8000 Design Force can now exchange pre-layout stack-up designs seamlessly with Polar’s Speedstack for IC Packaging and PCB design. The stack-up can be validated in Zuken’s DFM Center before being released to manufacturing.
Commenting Humair Mandavia, Zuken Chief Strategy Officer, said: “The link between Speedstack and Zuken CR-8000 Design Force is a strong connection in the chain between design and fabrication. It helps ensure our customers deliver designs to market that are consistent, and with improved quality from prototype to volume production, especially for high-speed, high-density design.”
The interface communicates comprehensive material information required for complex high layer count designs, and gives Zuken customers access to Polar’s online libraries of the latest high-speed base materials. Impedance information contained within Speedstack is loaded in the CR-8000 environment, saving time consuming and error prone manual re-entry.
Martyn Gaudion, CEO at Polar Instruments, said, “Polar Speedstack is the stack-up tool of choice for many high end fabricators, value added brokers and OEM base PCB Technologists. We’ve enjoyed working closely with the team at Zuken to implement this interface between Speedstack and Design Force.”
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