TrendForce's Comments on New iPhone Models

发布时间：2018-09-14 00:00
作者：Ameya360
来源：TrendForce
阅读量：987

As Apple unveils its new iPhone models, TrendForce has provided the following comments for your reference.

TrendForce's Comments on New iPhone Models

Apple unveiled new versions of its iPhone on Wednesday and the specs are consistent with earlier expectations of the new models, says TrendForce. While last year’s premium-priced iPhone X sparked discussion in the market, Apple again moved towards a higher price range, passing the US$1,000 threshold. TrendForce believes that the aggressive pricing point Apple has chosen seems to be challenging the upper limit of prices that consumers are willing to pay for a premium smartphone. New iPhone Xs and iPhone Xs Max feature optimized photo quality, AR experiences, and dual-SIM, but they are less likely to boost the demand significantly due to the higher-than-expected prices, because consumers still need time to adjust to the price set for the premium models.

As for iPhone XR, the more budget-friendly model, its pricing point is much lower than its OLED partners, iPhone Xs and iPhone Xs Max. Positioned as Apple’s main product this year to revive its sluggish smartphone sales, the iPhone XR with an LCD display will account for nearly 50% in the production capacity of the new iPhone series. However, this LCD model is also faced with uncertainties related to trade issues, the stronger US dollar, as well as even higher pricing outside the U.S. Therefore, it remains to be seen whether or not this LCD model could help Apple boost iPhone sales growth and profits.

Meanwhile, the prices of older versions of iPhone, including iPhone7 and iPhone 8, are adjusted downwards to US$449 and US$599 respectively, which may create higher-than-expected demand for the older models.

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The 3D information is contained in the dot-pattern image. “To run 3D applications, the same APU can use another algorithm [that] computes the depth map of the image.” He added, “The iPhone X takes advantage of the massive processing power available in the A11 chip, as structured light approaches are known to be computationally intensive. The use of a neural network is the key technology that made it possible.”　　Five sub-modules　　The teardown by Yole and System Plus Consulting has found a “complex assembly of five sub-modules” in Apple’s optical hub. They are: near-infrared camera, proximity detector (Time-of-Flight) + IR flood illuminator, RGB camera, dot-pattern illuminator, and color/ambient light sensor.　　As shown below, the IR camera, RGB camera, and dot projector are all aligned.　　NIR image sensors　　At the heart of Apple’s iPhone X’s optical hub, there is STMicroelectronics’ NIR sensor. Yole and System Plus Consulting found inside ST’s NIR sensor “the use of silicon-on-insulator (SOI) on top of deep-trench isolation (DTI).”　　The idea of DTI technology is well-known. In general, the issue with the high sensor resolutions required in today’s cameras is that pixels are forced inside the same space, creating noise, discoloration, or pixelization of neighboring sensors when capturing a photo. DTI is deployed to prevent leakage between photodiodes. Apple reportedly etched literal trenches between each one, then filled the trenches with insulating material that stops electric current.　　So, on top of DTI, why did Apple want to use SOI wafers for NIR image sensors?　　Optically speaking, Cambou explained that SOI wafers are advantageous because the insulator layer functions like a mirror. “Infrared light penetrates deeper, and it reflects back to the active layer,” he noted.　　Electrically speaking, Cambou noted, SOI improves NIR’s sensitivity largely because it’s good at minimizing leakage within the pixel. The improved sensitivity provides good image contrast.　　Contrast is important because “the structured light operation is disturbed by sunlight,” explained Cambou.　　Of course, regular CMOS image sensors or NIR sensors are “happy to have extra light if the goal is to have a better image,” said Cambou. However, light is a problem when a user tries to unlock an iPhone X under the bright sun.　　“The problem is the contrast of the projected dots of NIR light versus ambient light from the sun or any other light source,” said Cambou. “But the sun is usually the biggest problem.” Hence, it was paramount for Apple to improve NIR’s contrast by using SOI wafers.　　Asked if ST’s NIR sensors are using FD-SOI or SOI wafers, Cambou said that the research firms couldn’t tell.　　As for NIR sensors, do we know if Apple is using 850-nm or 940-nm wavelength NIR? Cambou noted, “We couldn’t determine which.” However, he speculated, “Apple most likely used 850 nm like everyone else (i.e., Intel’s RealSense, Facebook, HTC, and others), but STMicroelectronics is known for developing 940-nm SPAD proximity ranger, so it is a possibility that they intend to move to this wavelength in the future.”　　Asked about surprises unearthed by the teardown, Cambou cited the size of ST’s NIR sensor chip. It measures 25mm2, and has only 1.4 megapixels due to the large 2.8-μm pixel size. Cambou noted, “Nevertheless, in this category, this pixel is considered as ‘a small one’ compared to competitions [that] typically use 3.0 μm to 5 μm.”　　Beginning of the new era　　Yole positions the iPhone X as the beginning of a new era for 3D imaging.　　Cambou also believes that Apple is forging the future for NIR sensors. Pointing out last week’s announced acquisition of InVisage Technologies, he noted, “In my point of view, Apple wanted InVisage for NIR sensor capabilities, although there may be several ways to interpret this acquisition.”　　Cambou doesn’t believe that InVisage could match STMicroelectronics’ product in terms of performance, but it could provide a solution for miniaturization, he noted. “Face ID technology could, therefore, be scaled down for other products such as AR headsets.”　　Business implications　　On one hand, Apple’s iPhone X is creating big opportunities for SOI wafer makers like Soitec. Equally significant is that it has already triggered a meaningful comeback for STMicroelectronics. Cambou is confident that ST will be a player in the emerging ToF camera market.　　Of course, the semiconductor business is often affected by a short cycle of boom-and-bust. But ST, whose business was decimated after it lost Nokia in the mobile phone market, has “made a very elegant transition,” observed Cambou.　　ST has created different types of image sensor applications — moving from CMOS image sensors to NIR and SPAD sensors in the future — all the while leveraging its assets and home-grown underlying technologies.
2017-11-20 00:00 阅读量：1249
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