Nikon, ASML and Carl Zeiss sign agreement to settle all litigation

发布时间：2019-01-24 00:00
作者：Ameya360
来源：网络
阅读量：1891

　　Nikon Corporation (“Nikon”) (TYO: 7731), ASML Holding N.V. (“ASML”) (NASDAQ: ASML) and Carl Zeiss SMT GmbH (“Zeiss”) have signed a Memorandum of Understanding relating to a comprehensive settlement of all legal proceedings over patents for lithography equipment and digital cameras.

　　The Memorandum of Understanding is a binding agreement that concerns all pending disputes between Nikon, ASML and Zeiss in Europe, Japan and the United States, including at the U. S. International Trade Commission. The three companies expect to execute a definitive settlement and cross-license agreement and dismiss all legal proceedings between the parties in February 2019. The terms of the Memorandum include a payment to Nikon by ASML and Zeiss of a total of EUR 150 million (approximately 19.0 billion Japanese Yen*).  Furthermore, the cross-license agreement contemplated by the Memorandum includes mutual royalty payments of 0.8% over the sales of immersion lithography systems for 10 years from the signature date of the parties’ definitive agreement.

　　* Based on an exchange rate of 1 EUR = 125 yen

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Revenue Growth in China's Semiconductor Industry Would Slow Down to 16.2% in 2019 due to Pessimistic

下一篇：Despite concern, large TFT LCD panel shipments increase

在线留言询价

相关阅读
US cancels trade planning meeting with China, source says
Trade news

US cancels trade planning meeting with China, source says

　　The White House rejected a trade planning meeting with Chinese counterparts this week due to outstanding disagreements between the two sides over the enforcement of intellectual property rules.　　Officials from the U.S. trade representative's office were set to meet with two Chinese vice ministers this week to try to resolve trade differences before the March 1 deadline, but the meeting was called off, a source familiar with the situation confirmed to CNBC's Kayla Tausche.　　Should Beijing and Washington fail to agree on a permanent solution, President Donald Trump has said he will reinforce punitive tariffs on roughly half of all Chinese exports to the U.S.　　Asked for comment, the White House told CNBC that "the teams remain in touch in preparation for high level talks with Vice Premier Liu He at the end of this month." The Treasury Department and the U.S. trade representative's office did not respond to requests for comment.　　White House economic advisor Larry Kudlow denied that an official meeting had been canceled, telling CNBC on Tuesday that no intermediate meetings had been scheduled other than the visit by Liu next week.　　One source suggested that talks may still happen over the phone, but the termination of the in-person visit signals that reaching a complete agreement beyond the basic tenants of the Group of 20 truce will be difficult. China offered to boost its imports from the U.S. for six years, officials familiar with the matter told CNBC last week, though how any such promise would be enforced remains uncertain.　　Chinese officials made the offer during negotiations in Beijing earlier in January, Bloomberg News reported. China would increase its annual import of U.S. goods by a combined value of more than $1 trillion, the officials told Bloomberg, which was the first to report on the import boost offer.　　"I would kind of characterize negotiations as generally moving in the right direction. Last week, China offered a fig leaf in lowering tariff rates and agreed to import a trillion dollars of U.S. goods by 2024," said Joseph Lupton, global economist at J.P. Morgan.　　Trade negotiations between Washington and Beijing have stretched for months amid a tit-for-tat dispute. Both countries have slapped tariffs on billions of dollars worth of each others' goods. The White House put tariffs of 10 percent on $200 billion of Chinese productsin September and at the time threatened to increase the levy to 25 percent by the start of 2019.　　The two nations late last year agreed to halt additional tariffs as they engage in new trade talks with the goal of reaching an agreement before the March deadline following Trump's meeting with Chinese President Xi Jinping in Argentina.　　"I think there's a lot of posturing going on. Trump's tweeting the China numbers are weak, they better make a deal quick," Lupton added. "I think a lot of that posturing is what's taking place here but beneath the surface both sides see a need to get some sort of deal here. It's just a matter of spinning it as a win for the two sides."
2019-01-23 00:00 阅读量：1657
Perforce Software to acquire Rogue Wave Software
Trade news

Perforce Software to acquire Rogue Wave Software

　　Perforce Software, a developer of enterprise-grade DevOps-focused software solutions, is to acquire Rogue Wave Software, an independent provider of cross-platform software developer tools and embedded components.　　The new combination of Perforce and Rogue Wave is intended to deliver a full suite of solutions that will not only improve developer productivity but support DevOps at scale. This is the sixth acquisition by Perforce in the last two years since embarking on an aggressive growth strategy to expand its portfolio across the technology development lifecycle.　　Terms of the deal are not being disclosed, although the acquisition is expected to close in February of this year.　　Rogue Wave provides solutions that help enterprises to optimise their software development and build, connect, and secure applications. The company has relationships with more than 5,600 customers across industries including financial services, technology, healthcare, government, entertainment, and manufacturing. Based in Louisville, Colorado, the company has 16 offices throughout the world.　　“This transformational acquisition further expands our global footprint and broadens our offerings. Rogue Wave’s software suite strengthens Perforce’s existing static code analysis and automated test offerings, and also adds new capabilities in the areas of dynamic code analysis, API management, project visualization, developer productivity, and embedded analytics,” said Mark Ties, Perforce CEO.　　Perforce continues to build out its DevOps-focused software portfolio that looks to meet the needs of technology development teams that are challenged with multiple dimensions of scale but still must deliver products securely at a rapid pace.　　"Software development is growing increasingly complex, driving the need for platforms and solutions that can help enterprises simplify their applications and shorten cycle times. With continuously evolving customer demands, it has never been more important for enterprises to deliver high-quality products and solutions quickly," said Brian Pierce, Rogue Wave CEO.
2019-01-23 00:00 阅读量：1835
Pushing the boundaries of semiconductors
Trade news

Pushing the boundaries of semiconductors

　　Scientists from the university of Freiburg, the Sustainability Center Freiburg and the Fraunhofer-Gesellschaft have joined forces in order to explore a new material structure that may be better suited for future power electronics.　　The study, Power Electronics 2020, has led them to explore a piezoelectric semiconductor, a material with a high dielectric strength known as scandium aluminium nitride (ScAlN).　　Silicon has dominated the electronics industry. With its relatively low cost and an almost perfect crystal structure, it has become a particularly successful semiconductor material. Moreover, its bandgap allows for both a good charge carrier concentration and velocity as well as a good dielectric strength. Despite its benefits, silicon electronics is gradually reaching its physical limit. Especially with regard to the increasing demand for power density and compactness.　　The limitations of silicon technology have already been overcome by the use of gallium nitride (GaN) as a semiconductor in power electronics. GaN performs better in conditions of high voltages, high temperatures and fast switching frequencies compared to silicon. This also allows for higher energy efficiency, thereby reducing energy consumption.　　Fraunhofer IAF has been researching GaN as a semiconductor material for electronic components and systems for many years. With the help of industrial partners, the results of this work have already been put to commercial use. The Power Electronics 2020 team is now looking towards the next step, enhancing the energy efficiency and durability of next generation electronic systems once more.　　ScAlN is largely unexplored worldwide with regard of its usability in microelectronic applications. But its suitability for power electronic components has already been proven, says the team. The aim of the project is to grow lattice-matched ScAlN on a GaN layer and to use the resulting heterostructures to process transistors with high current carrying capacity.　　Functional semiconductor structures based on materials with a large bandgap, such as ScAlN and GaN, allow for transistors with very high voltages and currents. These devices reach a higher power density per chip surface as well as higher switching speeds and higher operating temperatures. This is synonymous with lower switching losses, higher energy efficiency and more compact systems. By combining both materials, the researchers want to double the maximal possible output power of our devices while at the same time significantly lowering the energy demand.　　One of the biggest challenges of the project is crystal growth because their existing structures neither growth recipes nor empirical values. The project team is looking to develop these during the next months in order to reach reproducible results and to produce layer structures that can successfully be used for power electronic applications.
2019-01-22 00:00 阅读量：1333
Trial Sheds Light on Q'comm Patent Holdings, Royalty Rates
Trade news

Trial Sheds Light on Q'comm Patent Holdings, Royalty Rates

　　Testimony in Qualcomm’s antitrust trial Friday shined sunlight on the company’s licensing practices and thinking, dispelling some of the secrecy that has bred a climate of paranoia.　　In testimony to date, several OEMs said that they feared Qualcomm might cut off their chip supplies. They feared that they were being “gouged” by high license fees, as the head of procurement at Apple testified.　　Next month, Judge Lucy Koh will rule on whether Qualcomm’s practices and rates harmed its customers, rivals, or consumers. Whatever she decides will be challenged in cases that could roll on for years.　　The good news is that testimony is ending for mobile chip and systems companies at least some of the widespread secrecy that sadly can act as a weapon in patent licensing. Here’s a sampler of what was learned in just a few hours in court Friday:　　Qualcomm had more than 140,000 patents and applications by March 2018, growing at more than 30% annually — a clip of about 35 new patents a day. Just 20% of those patents are so-called standards-essential patents (SEPs) for cellular standards such as CDMA and LTE.　　The company currently charges smartphone makers a 5% royalty for its whole cellular patent portfolio, capped at $20/handset. For just SEPs on a singular cellular standard like LTE, it charges 3.25% with a $13/handset cap. If a handset needs more than one standard such as both 3G and LTE, the charge defaults to the 5% level.　　Qualcomm started its licensing business charging 5% on systems-wide patents for the implementation of CDMA that it pioneered with a cap of $24/handset. It lowered its fee initially to 3.25% for SEPs on LTE because rivals hold many patents, then inched it up to 3.5% as it gained an edge in advanced LTE.　　After an investigation by the Chinese government lowered Qualcomm’s royalties to 3.25% for a combination of SEPs on 3G and LTE, Qualcomm started offering that combo rate worldwide.　　How Qualcomm licenses its patents is as much an issue in the trial as the size of its fees.　　The licensing business got its start when Qualcomm built its own base stations and handsets for CDMA. It licensed operators and OEMs such as AT&T and Motorola to create a market for what was effectively the first digital cellular systems.　　CDMA promised systems that could handle 60 times more calls than analog systems of that day, potentially lowering subscriber rates a great deal. To recoup the full value of what it was offering, Qualcomm decided to split its business into selling chips and licensing patents.　　Qualcomm generally licenses smartphones only to makers rather than rival chipmakers, claiming that it’s an industry practice because “the handset is humongously more lucrative,” according to one Qualcomm licensing executive. It requires handset makers to take a patent license before it will ship even sample quantities of chips as part of a “no license, no chip” policy.　　“Putting the IP cost in the chip price wouldn’t work,” said Fabian Gonell, a senior vice president of licensing strategy for Qualcomm.　　Handset makers could buy chips from rivals and hope that, if sued, they could avoid or at least lower Qualcomm’s royalties in court. Qualcomm preferred the notion of licensing first based on fees already established in CDMA, then selling the chips.　　With separate deals, “you can tell what the IP price is, so you can tell if fair, reasonable and non-discriminatory (FRAND) issues are arising,” testified Gonell. “If you combine prices, any changes become suspect and chip prices change more than IP prices, so avoiding those arguments is a good thing.”　　The approach ensures that Qualcomm gets the fair market value for its R&D, he said. However, the rationale has a few holes.　　By not widely licensing chipmakers, rivals are left exposed to patent infringement suits. In addition, handset makers wind up paying the freight for R&D that might be better apportioned to carriers, chipmakers, or others in the cellular ecosystem. Base station makers such as Ericsson, Huawei, and Nokia who tend to design their own cellular ASICs are outside of Qualcomm’s calculus.　　So far, both Qualcomm and the U.S. Federal Trade Commission showed parts of video depositions from handset makers Apple, Blackberry, Huawei, Lenovo, LG, Samsung, and others. The FTC’s clips made it clear that the handset makers feared Qualcomm’s prowess.　　None of the OEMs contradicted the company’s clear testimony that it never cut off a customer’s chip supply. However, evidence from several emails raised the possibility of such cuts.　　Qualcomm attorneys called into question an expert for the FTC because he did not quantify harms that he alleged from its practices. But fear is a hard thing to quantify. It’s potentially a powerful weapon in negotiations in which a licensee does not know how much rivals are being charged or what exactly they are buying in a massive patent portfolio.　　Under the sunshine of open court proceedings, OEMs and rivals are beginning to see more clearly at least the outlines of what Qualcomm charges and why. It’s just a small piece of a large licensing market that largely operates in the dark.
2019-01-22 00:00 阅读量：1338
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
型号 品牌 抢购
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
BP3621 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。