Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

发布时间：2023-09-12 10:52
作者：AMEYA360
来源：Fibocom
阅读量：3233

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.

Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.

　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.

　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.

　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.

　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：TOP 10 MCU companies in China

下一篇：Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations

在线留言询价

相关阅读
Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024
Trade news

Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.
2024-07-03 13:57 阅读量：421
Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024
Trade news

Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."
2024-06-18 16:12 阅读量：582
Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, IoT to Empower Industry Transformation
Trade news

Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, IoT to Empower Industry Transformation

　　The wave of intelligence is revolutionizing industries globally, with 5G, AI, and IoT playing key roles in this trend. During Computex 2024, Fibocom CEO - Tiger Ying shared his insights during the tradeshow.　　Fibocom, as China's first stock-listed wireless communication modules and solutions provider (stock code: 300638), has continuously employed innovative thinking and strategic market positioning in recent years. CEO Tiger Ying pointed out that, regardless of the technological or application aspects, in facing the transformative effects brought by these three major technologies, the company is well-prepared and ready to assist clients in seizing vast smart business opportunities.　　Remain Industry-Focused and is Confident to Accelerate 5G Deployment　　In the realm of 5G, this communication standard garnered significant market attention upon its release. The industry believes that 5G'sfeatures such as high speed, low latency, and large-scale connectivity not only enhance user experiences in the consumer sector but also serve as a crucial driver for deepening communication technology applications across industries.　　While the development of 5G has not been as fast as initially expected, communication giant Ericsson predicted in its 2023 report that the golden crossover period between 4G and 5G would be delayed until 2028.However, Tiger Ying pointed out that from the perspective of technical standards' development speed, this delay is still within a normal cycle.　　He mentioned that 5G's current development is focused on Enhanced Mobile Broadband (eMBB), Massive Machine Type Communications (mMTC), and Ultra-Reliable Low Latency Communications (URLLC). However, large-scale commercialization has not been achieved. This trend also highlights the versatility of 5G IoT architecture and applications.　　With the acceleration of 5G Advanced, it will truly replace4G as the mainstream technology for IoT applications and successfully drive market development within five years.　　Fibocom has responded to the trend of 5G development by formulating product strategies and solutions, actively expanding into different market sectors. Tiger Ying stated that the company's primary task is to promote the large-scale commercialization process of eMBB.　　They have already launched a diverse range of product portfolios. This includes the RedCap module, closely following the development of 5G technology and fully advancing the implementation of commercial plans.　　In terms of application areas, Fibocom is focused on industrial intelligence and smart cities, primarily because these two major application scenarios have diverse demands for 5G technology. For instance, in machine vision, which integrates edge computing with 5G's high bandwidth and low latency capabilities, it has been widely used in industrial quality inspection, promoting the development of industrial automation and intelligence.　　In response, Fibocom provides a complete product portfolio, such as the 5G smart module SC171 with computing power up to 12TOPS, to meet specific demands in application scenarios. In addition, endpoint devices with AI capabilities will also become a driving force in accelerating industrial intelligence processes.　　Fibocom has invested significant research and development resources in these products, aiming to integrate 5G and on-device AI technologies, thus strengthening the company's core competitiveness in industrial intelligence and smart city domains.　　Strengthening Edge AI Performance to Optimize Overall Cost-effectiveness　　AI has become a recent global industrial focus, and Fibocom's AI strategy centers on edge computing and the AI endpoint device solutions mentioned above. Since AI computing power can significantly increase the cost of endpoint devices, leading to reluctance from enterprises with implementation needs, cost control is crucial.　　Tiger Ying pointed out that the solution to this problem varies depending on the AI architecture. Devices using an offline AI architecture require precise control of edge computing power to balance cost and effectiveness, while devices using an online AI architecture require strong communication capabilities to avoid affecting user experience due to communication delays.　　Tiger Ying further stated that Fibocom has integrated the above two solutions into one through long-term research and development. The company has invested in smart module development, leveraging the computational efficiency and heterogeneous algorithm capabilities of modules to assist clients in rapidly deploying AI-capable terminal devices and optimizing costs.　　Its product portfolio includes 5G data modems, SoC 5G solutions based on Linux, and Android, and built-in AI computing capabilities. He mentioned that while AI may slightly increase device costs, its excellent performance leads to overall cost optimization considering macroscopic aspects such as user experience and value creation.　　He also mentioned that Fibocom has constructed heterogeneous computing on the network, enabling the scheduling of CPU, GPU, NPU, and DSP processor performance as needed. In addition, Fibocom has developed its toolchain and integrated it with heterogeneous algorithms, RTK, high-precision positioning, and other functions into firmware.　　Its products based on Linux, Android, and Windows architectures can meet the needs of different industry customers. Looking ahead, Fibocom will focus on areas such as robotic lawnmowers, low-speed autonomous vehicles, PCs, and robotic development platforms, providing deeper vertical domain solutions.　　Enhancing π-shaped Capabilities to Meet Three Major IoT Demands　　Regarding IoT, Tiger Ying pointed out that although the IoT architecture and concept have been around for over a decade and have become increasingly widespread in recent years, practical constraints mean that adoption varies across industries. To accelerate IoT adoption, several key factors are necessary.　　First is the ability to apply AI capability to IoT devices, as AI significantly impacts data collection costs and processing quality. IoT leveraging AI will be more readily accepted by enterprises, thus speeding up adoption in specific fields.　　Second is security design, which has become a major focus in IoT in recent years. Only IoT architectures that can ensure data integrity and privacy protection will be able to deploy in vertical markets.　　Lastly, communication technology is crucial. Advanced technologies like 5G-Advanced (5.5G) and Non-terrestrial Networks (NTN) ensure that communication coverage is no longer a weak point, broadening the scope of IoT applications.　　Fibocom has introduced corresponding products to address AI, data privacy, and satellite communications needs. In terms of AI, the company's 5G smart module SC171 and SC151 series are suitable for various 5G smart terminal devices.　　For security, blockchain technology was deployed on 4G networks and commercialized. On the satellite communications front, Fibocom released NTN-supported communication modules in 2023.　　Moving forward, the company plans to integrate these technologies and products, working with ecosystem partners to focus on specific vertical solutions, providing customers with high-quality and high-performance IoT solutions.　　Fibocom consistently prioritizes intelligence in product innovation. Tiger Ying stated that this will continue to be the foundation for future development, with a market-driven approach to introducing cross-domain AI solutions.　　He emphasized that while the market previously demanded "T-shaped" capabilities combining vertical telecommunication expertise to serve the horizontal industries, the AI era requires an additional vertical capability—AI specialization. Through "π-shaped" capabilities, which integrate horizontal and dual vertical expertise, Fibocom aims to create high-performance IoT architectures tailored to customers' needs.　　The company is progressively enhancing these "π-shaped" capabilities. It will continue to collaborate with ecosystem partners, integrating 5G, AI, and IoT technologies to help clients seize smart business opportunities.
2024-06-06 11:47 阅读量：791
Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024
Trade news

Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

　　Nuremberg, Germany – April 10th, 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, in collaboration with Qualcomm Technologies Inc., a global leading semiconductor company, is proud to announce the launch of their cutting-edge Linux-based edge AI solutions which integrates a series of Qualcomm Technologies-powered Fibocom smart modules.　　This new series of solutions utilize a wide array of Fibocom’s smart modules SC171, SC171L, SC138, and SC126 series that are developed based on the Qualcomm® QCM6490/QCS6490, Qualcomm® QCM5430/QCS5430, Qualcomm® QCM6125, and Qualcomm® QCM2290 processors from Qualcomm Technologies with integrated Linux system, will unleash the peak performance of Linux-based industrial applications with robust connectivity and scalable operating system compatibility, and also accelerate the integration of advanced 5G, edge AI across emerging industries like robotics. With the expansion of digitalized industries, Fibocom will intensify the Linux-focused embedded computing intelligence, and leverage expertise in edge AI inclusion to help industry customers realize responsive decision-making, real-time communication and ultra-reliable system interoperability in industrial automation, smart manufacturing, smart retailing through the partnership.　　At the “heart” of Industry 4.0, interoperability is crucial for operators to get insights into the equipment’s performance in the field. This groundbreaking series solutions is poised to advance the industrial applications that demand wireless connection, high-integration expertise with design-in Linux operating system for easy integration, and long-term product lifecycle optimization. By adopting Linux-supported Fibocom’s smart modules, Linux engineers around the world have the ability to develop industrial devices such as industrial PCs (IPCs), edge AI workstations, smart POS terminals, and industrial routers with higher efficiency as well as potent multimedia processing capabilities.　　Harnessing the interoperability of the Linux operating system, industry-focused customers catered to the benefits below:　　· Utilizing the stability and reliability of the Linux system, the Linux-based edge AI solutions integrated with Qualcomm Technologies-powered smart modules ease the concerns of diverse system integration to industrial control systems and enable the 24/7 data transmission and management of industrial equipment with minimum risk of malfunction and downtime.　　· The Linux-based Edge AI Solutions are highly flexible and customizable compatible with industrial standards, and can be widely deployed in industrial PCs (IPCs), industrial cameras, edge AI workstations, smart POS terminals, and robotics.　　· Inherently beneficial from the robust feature and open-source nature of the Linux operating system, the solutions allow equipment manufacturers to safeguard product development and management with long-term upgradable support through the entire lifecycle.　　Fibocom Unveils Intelligent Lawn Mower Robotic Solution with Linux-based Smart Module SC171 Integrated　　The lawn mower robotic solution is a highly integrated solution equipped with Fibocom smart module SC171 and edge AI algorithm, empowering lawn mowers with unparalleled capabilities in environmental perception, precise positioning, map construction, path planning, autonomous obstacle avoidance, and seamless wireless connectivity. The revolutionary lawnmower robotic solution enables the autonomous navigation of the lawn mower without using boundary cables, significantly transforming the lawn mower industry. The core of this robotic solution lies in the AI-based lawn recognition algorithm, equipped with outdoor cameras, to achieve accurate detection and efficient planning of the lawn boundaries. It is worth mentioning that the solution also includes responsive obstacle avoidance and automatic recharging, in addition to the mapping function and an “edge-cutting mode” to facilitate precise mowing even at the sidelines. By deploying the solution, it will enhance the operational efficiency of the lawnmowers and reduce the time-to-market of lawnmower’s massive deployment in the global marketplace.　　"We are proud to collaborate with Fibocom to help them develop these Linux-based edge AI solutions for industrial applications," said Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. "By utilizing Fibocom's smart modules and Qualcomm Technologies’ powerful processors, Fibocom are enabling the integration of advanced edge AI technologies, empowering industries with responsive decision-making and real-time communication capabilities."　　“We have a clear vision for the edge AI-enabled future, and with the collaboration with Qualcomm Technologies, we will continue building the Linux-based edge AI-driven core solution for industrial-focused markets,” said Ralph Zhao, VP of MC BU at Fibocom. “The first landed implementation in the robotic industry has infused confidence into the utilization of both Fibocom and Qualcomm Technologies’ strength to empower an intelligent, future-promising digitalized world.­­”
2024-04-16 11:14 阅读量：587
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
型号 品牌 抢购
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。