NXP Semiconductors LPCXpresso55S36 Development Board-Ameya360电子元器件采购网

NXP Semiconductors LPCXpresso55S36 Development Board

发布时间：2023-09-26 15:10

作者：AMEYA360

来源：网络

阅读量：2479

　　NXP Semiconductors LPCXpresso55S36 Development Board provides a powerful, extendable platform for evaluating the LPC5536 Microcontroller (MCU). This development board features a high-speed USB debug probe based on easy firmware update options. The board is compatible with the Arduino UNO R3 and Mikroe click boards. This LPCXpresso55S36 board is lead-free and RoHS-compliant. The board is used with a wide range of development tools, including NXP MCUXpresso IDE, Keil µVision, and IAR embedded workbench.

　　FEATURES

　　High-speed USB, MCU-link debug probe with CMSIS-DAP and SEGGER J-Link protocol options

　　Hardware support for external debug probe or external debug target

　　MikroEletronika click expansion option

　　LPCXpresso-V3 expansion connectors, compatible with Arduino UNO R3

　　PMod-compatible expansion/host connector

　　BLOCK DIAGRAM

NXP Semiconductors LPCXpresso55S36 Development Board

　　LPCXPRESSO55S36 CONNECTORS, PUSH BUTTONS, AND LEDS

NXP Semiconductors LPCXpresso55S36 Development Board

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Trade news

NXP Semiconductors announces $1B bridge financing

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that on September 19, 2018 (the “Closing Date”) its subsidiaries NXP B.V and NXP Funding LLC (the “Borrowers”), the lenders party thereto and Barclays Bank Plc, as administrative agent, entered into a US$1,000,000,000 senior unsecured bridge term credit facility agreement (the “Bridge Term Credit Agreement”). On the Closing Date, an aggregate principal amount of US$1,000,000,000 of term loans (the “Term Loans”) were borrowed under the Bridge Term Credit Agreement. The Term Loans mature 364 days following the Closing Date and bear interest, at the option of the Borrowers, at either (a) a LIBOR rate plus an applicable margin of 1.5 percent or (b) a base rate plus an applicable margin of 0.5 percent.The proceeds of the Loans hereunder shall be used for general corporate purposes of the Borrower as well as to finance parts of the announced equity buy-back program.All present and future obligations of the Borrowers arising under and pursuant to the terms of the Bridge Term Credit Agreement are guaranteed pursuant to a guaranty agreement dated as of the Closing Date (the “Guaranty Agreement”) and made by NXP Semiconductors Netherlands B.V., Freescale Semiconductor Holdings V, Inc., and NXP USA, Inc., in favor of Barclays Bank Plc, as administrative agent.

2018-09-21 00:00 阅读量：3492

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