Jiangsu Runic Technology Co., Ltd Honored with China IC Design Achievement Award & Selected in China Fabless100 List

　　On March 29th, the award ceremony of "2024 China IC Design Achievement Award" organized by ASPENCORE was held in Zhangjiang Science Hall, Shanghai. Jiangsu Runic RS50XX series of low noise, high accuracy and ultra-low temperature-drift precision voltage references were awarded the Best Amplifier/Data Converter/Isolator of the Year in China IC Design Achievement Award.

　　Jiangsu Runic Technology Co., Ltd has been listed as one of the "Top 10 Analog Signal Chain Companies" for two consecutive years.

　　Jiangsu Runic Technology Co., Ltd as China's high-performance, high-quality analog/mixed-signal IC R&D and sales of high-tech semiconductor design company has been selected for two consecutive years in the China Fabless100 list of Top 10 analog signal chain companies, fully demonstrates Runic in the analog signal chain market area of technical strength and competitive advantage, and has been widely recognized by the industry.

　　The China IC Design Fabless 100 list is based on quantitative mathematical models, corporate public information, vendor questionnaires, and first-hand interviews by a team of AspenCore analysts, who carefully select the companies with the strongest overall strength and growth potential in China's IC design industry; the Top 10 companies are selected according to the category (each company is categorized into one category only); and the criteria for selecting the Top 10 companies in each category are as follows The selection criteria for each category of Top 10 companies are as follows:

　　Companies headquartered in mainland China and Hong Kong/Macau, but excluding Taiwan enterprises

　　Fabless companies only, IDM companies with fabs are excluded from screening

　　Self-developed and designed chip products have been mass-produced and have been put into commercial use or entered the supply chain of mainstream OEMs.

　　Owns a number of patents for Invention Technology, and has strong chip R&D and application design capabilities