BIWIN Wins India's "The Most Extensive Range Memory Solutions Provider" Award

发布时间:2024-08-20 13:46
作者:AMEYA360
来源:BIWIN
阅读量:422

  June 28th had witnessed the successful hosting of the 16th NCN-ICT India Partner Summit 2024 at New Delhi, India. In the midst of the celebrations, BIWIN was honored with the esteemed “The Most Extensive Range Memory Solutions Provider of 2023 Award”, a reflection of its unwavering dedication to excellence and innovation.

BIWIN Wins India's "The Most Extensive Range Memory Solutions Provider" Award

  BIWIN is the Winner of “The Most Extensive Range Memory Solutions Provider of 2023”

  As an annual event that celebrates the achievements and contributions of key players in the ICT industry, the NCN-ICT Summit Awards brought together industry leaders, corporate executives, distributors, and resellers from India and abroad. It serves as a platform for industry professionals to gain insights into the latest innovations, share best practices, and explore new business opportunities.

  Through a combination of online voting and evaluations conducted by a panel of experts and judges, this accolade is a testament to BIWIN’s commitment to delivering a comprehensive range of high-performance memory solutions and pushing forward with innovation and product expansion.

  Recognized as a leader in the storage industry, BIWIN offers a comprehensive range of embedded flash-based storage solutions, including mobile phones, education devices, tablets, gaming machines, smart wearables, UAVs, action cameras, in-vehicle systems, DVR/NVRs, servers, OTT boxes, routers, and more. By providing tailored storage solutions, BIWIN supports innovation and advancement in these diverse technology areas.

  Attending on behalf of BIWIN, Rajesh Khurana, Country Manager for Consumer Business, was honored to participate in the NCN-ICT Summit & Awards Night 2024 and accept the awards. He expressed heartfelt gratitude for the industry recognition and committed to integrating purpose-driven initiatives into BIWIN’s future work. Khurana emphasized that these efforts will not only honor the awards but also elevate BIWIN to new industry heights.

  Rajesh Khurana was also privileged to be part of a renowned panel at the 16th Annual NCN-ICT Partners Summit, which was joined by top industry leaders from Geonix, Savex, Synersoft, Kaspersky and Micron. The discussion focused on the next big thing in ICT technology and examined the need for new business approaches, emerging ICT technologies, and changing business dynamics, as well as their impact on the vendor-partner ecosystem.

  As noted by Rajesh Khurana, industry projections indicate that the memory market is expected to experience continued growth in the coming years, especially with the advancement of AI technologies, big data and Internet of Things which set to drive the demand to new levels. BIWIN will also endeavor to provide improved memory solutions for customers while contributing to the industry’s future development.

(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
BIWIN's
  The Third GMIF2024 Innovation Summit was successfully held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. The event brought together senior executives and industry experts from renowned domestic and international companies, including the School of Integrated Circuits at Peking University, Micron, Western Digital, Solidigm, Arm, UNISOC, Intel, iFlytek, Rockchip, Silicon Motion, BIWIN, Victory Giant, Allwinner, InnoGrit, Maxio, QUANXING, Montage, Applied Materials (AMAT), Lam Research, DISCO, Skyverse, Loongson Technology, and many others. The gathering saw industry leaders engage in discussions on global storage innovation and ecosystem collaboration for shared growth in the AI era. During the summit, the GMIF2024 Annual Awards were officially unveiled, and a total of 38 key enterprises from across the industry supply chain had been honored for their outstanding contributions.  At the GMIF2024 Innovation Summit, Sam Sun, Chairman of BIWIN Storage, delivered a keynote speech titled "Integrated R&D and Packaging 2.0 Strategy: Full Industry Chain Layout Empowering Client Value Elevation". In the keynote, Mr. Sun shared BIWIN's latest strategic initiatives, technological breakthroughs, and future development over the past year. Supported by continued investment and efforts in integrated R&D and packaging, BIWIN Storage is leveraging advanced technology and full-chain collaboration to empower customers to achieve greater value and drive industry progress.  From Brand Upgrade to Global Market Expansion: Innovation-Driven and Sustained Growth  Mr. Sun first and foremost highlighted BIWIN’s significant initiative in brand upgrade in 2024. A new logo and brand slogan were unveiled: 'Infinite Storage, Unlimited Solutions'. More than a transformation of its brand image, this upgradation is an emblem to BIWIN's ongoing strategic, technological and market expansion and the demonstration of its vision to achieve continuous growth in the global storage field.  In the global market, BIWIN Storage achieved remarkable results in the first half of 2024, thanks to precise market positioning and efficient localized delivery. Its revenue surpassed 3.4 billion RMB, marking an almost 200% increase year-on-year. This growth reflects the successful implementation of the company's global expansion and localized operation strategies.  Integrated R&D and Packaging 2.0 Strategy: Building Core Competence to Drive Technological Advancement  BIWIN's "Integrated R&D and Packaging 2.0 Strategy" is regarded as a crucial initiative in its technological innovation and full-chain layout. Mr. Sun further elucidated BIWIN's investments in solutions, chip design, packaging and testing, and equipment development, and shared that with concentration on independent R&D and partnerships, BIWIN has now accumulated core strengths in these areas, and been capable of offering customers more high-efficiency and low-power solutions.  BIWIN's latest strategy not only involves a keen focus on the R&D and packaging and testing of mainstream memory, but shifts attention to more far-reaching development opportunities in high-end advanced packaging and testing technology. Powered by its dual-drive strategy, BIWIN is dedicated to further enhancing its competitiveness in the storage industry, and providing customers with innovative and cost-effective solutions.  Strategic Advanced Packaging and Testing Layout: Overcoming Industry Bottlenecks to Secure Future Advantages  In the face of the increasing technological demands and market challenges in the storage industry, BIWIN Storage is actively promoting its full-chain layout. Mr. Sun noted that, in addition to focusing on storage solution R&D, the company has also been a pioneer in establishing storage packaging capabilities in South China. By advancing its wafer-level packaging and testing layout, BIWIN has positioned itself as one of the few semiconductor storage companies capable of offering advanced packaging services.  With the adoption of cutting-edge technologies such as 3D/2.5D packaging, BIWIN Storage is able to deliver top-notch services to customers in reducing product power consumption, improving performance, and offering customized packaging and testing services for areas such as computing power. Mr. Sun emphasized that advanced packaging and testing is not only the consequence driven by market demand but is also the inevitable direction of future industry development. This layout will further solidify BIWIN Storage's leadership in the storage industry.  To accelerate the implementation of advanced packaging and testing, BIWIN Storage has chosen to establish an advanced packaging and testing factory in the Greater Bay Area. As a core hub of China's high-tech industry, the Greater Bay Area houses numerous IC design companies and innovative enterprises. However, there are still significant gaps in the packaging and testing field. BIWIN's advanced packaging and testing layout fills this gap and promotes the coordinated development of the entire industry chain.  Mr. Sun expressed that BIWIN Storage plans to launch its new plant in 2025 to provide more efficient and flexible packaging and testing services for customers in areas such as computing power. This layout will not only strengthen the company's competitiveness in the storage market but also inject new vitality into the Greater Bay Area's innovation ecosystem.  Integrated R&D and Packaging 2.0 Strategy: Building Core Advantages to Strengthen Customer Loyalty  In the summary of the "Integrated R&D and Packaging 2.0 Strategy", Sam Sun emphasized that the core of this strategy lies in enhancing BIWIN's core competitiveness in the storage industry through technological innovation and full-chain collaboration, while establishing closer partnerships with clients. The main advantages of this strategy are reflected in the following four aspects:  01 Expanding Industry Coverage  The Strategy contributes to enhancing collaboration with upstream wafer fabs to maintain control over R&D, manufacturing, and mass production, while serving a wider range of customers and expanding the industry chain through the application of advanced packaging and testing technologies.  02 Enhancing Technological Barriers  The Strategy contributes to strengthening technological innovation by increasing R&D investment, and participating in more high-end application scenarios, so as to gain a unique market advantage and secure a technological edge in the competitive landscape.  03 Driving Innovation and Differentiation  The Strategy contributes to offering products with higher bandwidth, lower power consumption to the market by developing differentiated solutions, more complex packaging processes, and advanced memory architectures, showcasing BIWIN's technological strength in the industry.  04 Strengthening Customer Loyalty and Trust  The Strategy contributes to providing high-quality and customized solutions, along with comprehensive technical and service support, to strengthen customer relationships and trust and achieve mutual success through deep collaboration with customers.  Looking Ahead: Focusing on Dual-Drive Strategy to Elevate Customer Value  In the end, Mr. Sun concluded BIWIN Storage's vision with the phrase "BIWIN, WIN-WIN". He emphasized that BIWIN Storage will continue its dual-drive strategy of storage and advanced packaging and testing to join hands with customers to seize future opportunities in the storage industry. BIWIN Storage aims to be more than just a storage product provider — it strives to be a trusted all-around partner, driving technological innovation and commercial success together with its customers.
2024-11-08 13:45 阅读量:275
BIWIN Secures Fastest Growing Flash Storage & Manufacturer Brand Title at DT Awards 2023
  BIWIN, a distinguished player in the flash storage industry, clinches the prestigious "Fastest Growing Flash Storage & Manufacturer Brand" award at the 15th Digital Terminal (DT) Awards 2023. The ceremony, held at Hotel The Suryaa in New Delhi, underscores BIWIN's pivotal role in the fiercely competitive Indian ICT sector.  Accepting the award on behalf of BIWIN, Rajesh Khurana, Country Manager for Consumer Business in India, emphasized BIWIN's commitment to innovation, excellence, and utmost customer satisfaction.  The DT Awards, recognized as India's premier tech honor, gathered over 250 industry leaders and celebrated achievements across more than 110 categories. BIWIN's triumph in this category is a testament to BIWIN's unwavering dedication to delivering cutting-edge and relevant flash storage solutions to the Indian market. This success is fueled by BIWIN's distinctive design and an unwavering commitment to quality.  The award not only acknowledges BIWIN's current standing as a key player in the flash storage industry but also propels BIWIN forward as an innovator committed to shaping the digital landscape. BIWIN continues to push boundaries in the flash storage sector, fueled by the recognition bestowed upon them at the 15th DT Awards.  BIWIN's vision extends beyond this award, focusing on advancing technology solutions to shape the digital future. As a recipient of this esteemed accolade, BIWIN remains dedicated to spearheading innovation and excellence in the dynamic realm of flash storage.  The Digital Terminal Awards, recognized as a premier accolade in the Indian ICT industry, annually celebrates the contributions of tech brands to the digital landscape. It stands as a testament to BIWIN's commitment to driving innovation and excellence in the ever-evolving tech sector.
2024-01-26 13:50 阅读量:1862
BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility
  BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.  The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.  The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.  The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.
2024-01-26 13:44 阅读量:1884
BIWIN Automotive Storage Solutions: Driving Innovation in Car Electronics
  BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a national high-tech enterprise and a national-level specialized and innovative Little Giants enterprise. The company has received strategic investments from the National Integrated Circuit Industry Investment Fund.  BIWIN tightly integrates its operations around the semiconductor memory industry chain, establishing an integrated business model for research and development with packaging and testing. BIWIN possesses core competencies in storage medium characteristic research, firmware algorithm development, chip packaging and testing, test research and development, and global brand operations. BIWIN actively expands into technical domains such as IC design, advanced packaging and testing, and chip testing equipment development.  In 2018, BIWIN achieved IATF 16949:2016 certification for automotive quality management systems--an affirmation of the company's prowess in standardized management, quality control, and technological ingenuity. Recently, BIWIN Huizhou Manufacturing Center of Advanced Packaging and Testing accomplished IATF 16949:2016 certification for the automotive industry quality management systems.  Specializing in advanced packaging and testing, BIWIN demonstrates proficiency in automotive-grade chip testing, supporting both its parent company's automotive-grade chip business and its independent automotive-grade testing outsourcing ventures. The successful IATF 16949:2016 certification holds paramount significance for the company, symbolizing implementing an intelligent management system, establishing automotive-grade quality control and process capabilities, and delivering premium products and services to customers.  Developed by the International Automotive Task Force (IATF) in collaboration with the International Organization for Standardization (ISO) based on ISO 9001:2015, IATF 16949:2016 aims to improve customer satisfaction by ensuring consistent production of high-quality automotive products. It is crucial for automotive companies, including manufacturers, suppliers, and service providers, as it not only indicates compliance with industry-specific quality standards but also encourages the adoption of best practices across the entire supply chain. Obtaining IATF 16949:2016 certification signifies a company's commitment to meeting the highest quality standards. Many globally renowned automotive manufacturers now mandate that their suppliers obtain IATF 16949:2016 certification  Capitalizing on its integrated advantage in research and development, and packaging and testing, BIWIN is strategically expanding its presence in the automotive storage market. Starting from the definition phase, the company meticulously controls each stage of the process according to automotive-grade requirements, including IC design, storage algorithm and firmware development, hardware design, packaging manufacturing, product testing, and safety certification. Tailoring its approach to the specific demands of in-vehicle applications, BIWIN has introduced highly reliable, competitive, and secure automotive-grade storage solutions and services, ensuring a safe driving experience.  Continued Research and Development  Benefiting from years of technical accumulation and experience, BIWIN consistently increases its investment in the research and development of automotive-grade storage. In the field of automotive-grade NAND Flash medium analysis, the company has acquired the capability to analyze storage medium characteristics under automotive-grade conditions, including cross-temperature performance, data retention, read and write interference, and lifespan. In the realm of automotive-grade storage firmware development, BIWIN has mastered reliability protection algorithms such as data loss prevention and data recovery under automotive-grade scenarios, as well as lifespan extension algorithms like wear leveling and write amplification control.  Advanced Packaging and Testing  In the packaging domain, BIWIN excels in the design and simulation of packaging for automotive-grade storage products, along with automotive-grade packaging and testing process capabilities and quality control. In testing, leveraging the rich testing experience and self-developed chip testing equipment and algorithms, the company has established capabilities for high-temperature, ambient-temperature, and low-temperature testing of automotive-grade products, as well as dynamic aging testing. BIWIN can also conduct characteristic analysis and prediction of defective outlier samples based on big data, ensuring automotive-grade yield rates and PPM targets.  Additionally, BIWIN has set up laboratories for design simulation, signal analysis, system verification, reliability testing, material analysis, failure analysis, and more, to comprehensively meet product design and validation needs, continuously forging high-reliability and superior-quality products.  Comprehensive Layout  Presently, the company has launched a series of automotive storage products, including eMMC, UFS, LPDDR, BGA SSD, and SSD, widely applied in automotive information and entertainment systems, advanced driver assistance systems, intelligent cockpit systems, dashcams, panoramic monitoring systems, automotive dashboards, in-vehicle wireless terminals, rail transportation, and more. These products have entered the supply chain systems of leading automotive manufacturers and Tier 1 automotive component suppliers.  In the future, BIWIN will actively deploy and implement integrated R&D and testing 2.0, continuously advancing research and production in automotive-grade storage. Leveraging its profound technical expertise and practical experience in automotive-grade storage, BIWIN will actively deepen cooperation with renowned domestic and international automotive manufacturers. By fully harnessing the strengths and characteristics of all parties involved and achieving deep integration, BIWIN seeks to jointly promote and build a robust brand service, contributing to the rapid development of the automotive industry.
2023-12-28 17:34 阅读量:2279
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
型号 品牌 抢购
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。