TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

Release time：2026-02-27
author：AMEYA360
source：TDK
reading：214

　　TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series,now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.

TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

　　The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.

　　With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.

　　For the B3292xU/V series, TDK offers a range of design tools and SPICE models.

　　Main applications

　　Capacitive power supplies, energy meters

　　Industrial drives

　　On-board chargers

　　EV charging

　　PV inverter

　　Main features and benefits

　　X2 class for interference (EMI) suppression

　　“Across the line” applications

　　For connections in series with the mains

　　Severe ambient conditions

　　Small dimensions

　　Good self-healing properties

　　AEC-Q200E compliant


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EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines
Trade news

EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines

　　TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.　　These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.　　The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.　　With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.　　Glossary　　EMC: electromagnetic compatibility　　Main applications　　Power circuit for different pieces of equipment: in-vehicle ECUs, power train, vehicle body control, automotive multimedia (telematics), base stations, PCs, servers, set-top box, smart grids, robots, smartphones, tablet devices, etc.　　Main features and benefits　　Compatible with large currents as high as 8 A　　Reduces components and footprint　　Highly reliable; can be used in high-temperature environments like automotive applications　　Key data
2025-05-16 13:45 reading：652
Chirp Slurped up by TDK
Trade news

Chirp Slurped up by TDK

　　BARCELONA — Chirp Microsystems, a Berkeley, California-based startup with 15 employees, which launched only a year ago at the Mobile World Congress its first high-accuracy, ultra-low-power ultrasonic sensing development platform, returned to Barcelona this week with a deal in hand to be acquired by Japan’s TDK Corp.　　TDK’s Board of Directors approved the transaction on Feb. 28, and the closing is expected in the following days.　　Chirp is hopeful that the deal with TDK will create an opportunity for the startup team to accelerate the growth of its ultrasound technology across several markets ranging from automotive and IoT to home and mobile devices.　　TDK is not revealing how much it’s paying for Chirp, mainly because the deal is small beer for a company whose revenue last year exceeded $10 billion.　　In an exclusive interview with EE Times, Michelle Kiang, Chirp’s CEO, told us, “Of course, we founded Chirp, not to sell, but to grow our own business. But last fall, when we were raising money for our series A — which was oversubscribed — we also heard of TDK’s interest.” She added, “We were open to the idea of becoming a part of a larger organization because the opportunity appears to give us the chance to live in the same ecosystem they are already in, and it could become a way for us to scale our business at a much faster pace.”　　TDK, founded in 1935, might be Japan’s best-kept secret among global electronics companies. Its best-known products, at least among consumers, are like magnetic tapes and magnetic heads.　　However, the Japanese company, which started out commercializing ferrite, has been methodically expanding in recent years, especially in the field of sensors. Most notably, TDK pulled off the acquisition of InvenSense, a $1.3 billion deal completed last May. Now a part of the TDK group, InvenSense, headed by Behrooz Abdi, has a technology portfolio consisting of Motion, Sound, and FingerPrint.　　As part of TDK’s MEMS Sensors Business Group, Chirp will become a fourth business unit focused on Ultrasonic Tracking and RangeFinding. Under the agreement, not just Chirp’s technology but its entire staff of 15 will move to TDK and must stay there for at least several years.　　Move over, IR sensors?　　Chirp’s ultrasonic sensors, which combine a MEMS ultrasonic transducer and a low-power mixed-signal SoC, offer a clear advantage in size compared to existing ultrasound sensors.　　Speaking of Chirp’s technology, Kiang explained, “Its size, cost, extremely low power consumption, and the fact that it works under any lighting conditions, including direct sunlight, will be a huge advantage when used in mobile products.”　　Aside from being used as a proximity sensor, Chirp’s ultrasonic chip poses its greatest promise as part of “an all-glass, full-screen, no-bezel display” in smartphones, Kiang previously told us. For example, she explained, “Chirp’s CH-101’s wide field-of-view allows it to measure range even when it is mounted on the top or bottom sides of the phone. Since this is the location of the microphone and speakers, it’s easy for designers to add another acoustic sensor at these locations.”　　In other words, Chirp could add its sonar-on-chip to the intensifying ToF battle in smartphones.　　Divi Gupta, vice president and general manager for Ultrasonic Tracking and Range Finding, was the man who talked TDK into acquiring Chirp. Kiang will be reporting to Gupta. He said that TDK’s expertise in materials, such as piezo and aluminum electrolytic, could help enhance the distance that Chirp’s ultrasound chip can reach.　　It is believed that Chirp’s ultrasonic sensor technology is complementary to TDK’s ultrasonic fingerprint sensor products and the company’s other conventional piezoelectric transducer products.　　Chirp can also leverage TDK’s packaging technology for small and highly robust MEMS acoustic products.　　Chirp’s sensors are further likely to find synergy with TDK’s inertial sensors and sensor fusion software libraries. For example, in VR/AR applications, Chirp’s 6-DOF controller tracking solution uses a sensor fusion algorithm to link ultrasonic ToF data with inertial sensor outputs to provide 6-DOF position and orientation in handheld controllers, said the two companies. “Combining Chirp’s ultrasonic sensing expertise with InvenSense’s expertise in inertial sensing and sensor fusion algorithms, we aim to significantly enhance this AR/VR system solution.”　　Currently, Chirp’s piezoelectric MEMS ultrasonic transducers offer long-range and low-power sensing in a micro-scale package. These products are being pitched for design into VR/AR, mobile, wearables, robotics, and drones. They can also be used in occupancy detection.　　David Almoslino, senior director, corporate marketing of MEMS Sensor Group within TDK, also added: “Chirp will be able to take advantage of TDK’s built-in distribution and channels to sell its products wider and deeper.”
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