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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support

Key word：

BIWIN

Release time：2024-12-23 15:51 reading：233 Continue reading>>

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ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.

Key word：

ROHM

Release time：2024-12-20 13:56 reading：245 Continue reading>>

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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.

Key word：

simcom

Release time：2024-12-19 10:34 reading：154 Continue reading>>

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E7025 R3: High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.

Key word：

simcom

Release time：2024-12-18 11:00 reading：167 Continue reading>>

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GigaDevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified for ISO 26262 ASIL D

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announced its GD25/55 SPI NOR Flash Automotive-Grade Product Family has received ISO 26262:2018 ASIL D Automotive Functional Safety certification from SGS, the world's leading Testing, Inspection and Certification company. This achievement not only strongly validates the outstanding safety performance and reliability of the GD25/55 SPI NOR Flash product in demanding automotive applications but also further solidifies the company's leadership position in the SPI NOR Flash field.　　With the exponential growth in the number of automotive electronics and electrical components, the demand for safety is becoming increasingly critical. As the internationally recognized standard for automotive functional safety, ISO 26262 aims to reduce the risks associated with automotive electronics and electrical systems and ensure the safety performance of vehicles. Under the ISO 26262 framework, the ASIL (Automotive Safety Integrity Level) classification system divides functional safety into four levels, ranging from A (lowest) to D (highest). Level D represents the highest level of safety, meaning that development processes at this level are subject to the most stringent requirements.　　GigaDevice has always maintained a focus on precision and excellence in the automotive electronics field, with product quality at the core of its business development. In terms of quality management, the company’s automotive-grade Flash aims for a 0 PPM defect rate, continuously driving quality improvements and earning widespread trust from customers. To date, global shipments have surpassed 200 million units. In terms of functional safety, GigaDevice has strengthened its process systems and personnel management, continuously enhancing its functional safety management capabilities. After achieving ISO 26262 ASIL D process certification in 2023, the company’s automotive-grade SPI NOR Flash has now also received ASIL D functional safety certification. This demonstrates that GigaDevice has established a rigorous development process for automotive-grade chips, and based on this foundation, has developed the mature capability to design products that meet functional safety standards.　　The GD25/55 SPI NOR Flash Automotive-Grade Product Family strictly adheres to the AEC-Q100 Grade 1 standard and is manufactured using 55nm/45nm process technology. It supports operating voltages of 3V, 1.8V, and a range from 1.65V to 3.6V, with capacities ranging from 2Mb to 2Gb, fully meeting the code storage requirements of automotive electronics. In terms of read/write performance, it offers single-channel, dual-channel, quad-channel, and octal-channel communication modes, with data throughput rates of up to 400MB/s, ensuring efficient data transmission. The product also boasts 100,000 erase/write cycles and a data retention period of up to 20 years. For enhanced safety, products with capacities of 64Mb and above feature built-in ECC algorithms and CRC check functions, improving reliability and extending the product's lifespan.　　Currently, GD25/55 SPI NOR Flash Automotive-Grade Product Family are widely used by numerous domestic and international automakers and Tier 1 suppliers, serving key automotive electronics applications across a range of fields including In-Vehicle Infotainment, Intelligent Cockpits, Connected Car Systems, Advanced Driver Assistance Systems (ADAS), Autonomous Driving, Battery Management System, Domain Controllers, Central Computing, Central Gateways, and Zone Control Systems.　　Ruwei Su, GigaDevice Vice President and General Manager of Flash BU, stated: “As a critical medium for storing key code in automotive electronics, the functional safety of NOR Flash is essential to ensure the reliability and integrity of data in extreme environments, directly impacting the safety and stable operation of vehicles. GigaDevice GD25/55 SPI NOR Flash Automotive-Grade Product Family has obtained the ISO 26262:2018 ASIL D automotive functional safety certification, which fully demonstrates the company's strong capabilities in automotive-grade chip design. Moving forward, GigaDevice will continue to uphold high standards of automotive functional safety, strictly adhere to relevant process specifications, and provide global customers with more high-quality, highly reliable automotive-grade storage products.”

Key word：

GigaDevice

Release time：2024-12-17 16:03 reading：173 Continue reading>>

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NOVOSENSE's NCA1044-Q1 CAN Transceiver Successfully Passes the IBEE/FTZ-Zwickau EMC Certification

　　NOVOSENSE announced that its newly launched NCA1044-Q1, an automotive-grade CAN transceiver, had received the EMC certification test reports from IBEE/FTZ-Zwickau, a prestigious European testing organization. NCA1044-Q1 successfully passed all test items. NOVOSENSE now can provide the test report to support automakers in streamlining their system certification process and accelerating their product launches.　　CAN transceivers are commonly used in automotive CAN bus networks typically for critical control and diagnostics functions, such as battery, motor control, electronic control, braking, steering, and airbag systems. These applications are prone to various sources of electromagnetic interference (EMI), including battery, motor and electronic control systems for EVs, engine, frequency converter and wireless communication devices. Such disturbances can adversely affect data transmission, leading to signal errors or system failures, and even compromised system safety.　　In addition, due to the long distance of CAN bus wiring in automotive systems, CAN transceivers can easily radiate noise through the CAN bus acting as an antenna. This can result in radiated emission and conducted emission from modules or the entire system that exceed the requirements for vehicle. Therefore, CAN transceivers that provide good electromagnetic compatibility (EMC) performance are essential for ensuring system reliability.　　Full compliance with IBEE/FTZ-Zwickau certification　　Given the critical role of CAN transceiver's EMC performance in automotive safety, countries or regions have established stringent automotive EMC standards and certification procedures for automakers to follow. For example, both the SAE J2962 standard and the European IBEE/FTZ-Zwickau certification set clear requirements for the EMC performance of automotive electronics.　　The IBEE/FTZ-Zwickau certification is carried out according to the IEC 62228-3 standard. Compared with SAE J2962, IEC 62228-3 excludes the effects of peripheral circuits, focuses more on the EMC property of the CAN transceiver itself, and specifies higher performance level requirements. The IEC 62228-3 standard is also extensively adopted by automakers outside of Europe. The IBEE/FTZ-Zwickau certification includes four tests: Emission RF Disturbances, Immunity RF Disturbances, Immunity Transients, and Immunity ESD. NCA1044-Q1 from NOVOSENSE successfully passed all four tests.　　Industry-leading interference immunity　　NCA1044-Q1 features an ingenious circuit design that addresses the issue of output signal errors caused by abnormal high-voltage interference affecting its output circuit. This enhances its EMC performance, helping customers substantially reduce their EMC design complexity, simplify peripheral components, and lower costs.　　Furthermore, NCA1044-Q1 boasts industry-leading interference immunity. According to IEC 62228-3, when external RF noise at different frequency bands couples to the CAN bus, a higher pass-through power indicates stronger interference immunity. This means a lower risk of errors in the system.　　Even without the use of a common-mode inductor filter on the bus, NCA1044-Q1 from NOVOSENSE can still meet the highest power requirements specified in the standard (as shown in Figure-1 and Table-2). Although this test is typically not required at the application level, NCA1044-Q1 still successfully passed the test. This capability helps users reduce peripheral circuits, lower costs, and enhance system robustness.　　Packages and selection　　NCA1044-Q1 is now in mass production and is available in SOP8 and DFN8 packages. Compliant with the AEC-Q100 Grade 1 requirements, it operates in a wide temperature range from -40°C to 125°C, and provides over-temperature protection. NCA1044-Q1 also supports TXD dominant timeout function and remote wake-up in standby mode.

Key word：

NOVOSENSE

Release time：2024-12-16 17:06 reading：288 Continue reading>>

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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.

Key word：

Fibocom

Release time：2024-12-13 10:55 reading：306 Continue reading>>

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Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions

　　Shenzhen,China – November 25th 2024 – Fibocom (Stock code: 300638), a global leading provider of wireless communication modules and solutions, today debuts the ready-to-market 5G RedCap plus Wi-Fi 5/6 solution developed from the 5G RedCap module FG131, which is positioned to accelerate the commercialization of 5G FWA in the form of CPE, mobile hot-spot, and USB dongle, etc., satisfying the diverse market demands.　　According to a report updated in September 2024, GSA has identified 143 operators in 61 countries and territories worldwide that have been investing in public 5G SA networks through trials, planned or actual deployments. With the implementation of 5G SA network infrastructure, 5G-enabled FWA shipments became mainstream, reaching 10.2 million in 2023. The growth of 5G FWA CPE shipments is expected to accelerate further, accounting for 42% of shipments in 2024 compared with 34% in 2023, according to the CPE Vendor Survey released by GSA in August 2024.The launch of Fibocom’s ready-to-market 5G RedCap plus Wi-Fi 5/6 solution is the ideal 5G lightweight solution accelerating the migration from 4G FWA to 5G FWA, elevating the Quality-of-Service with faster network connection, more-agile network slices services and reliability in 5G SA network environment.　　Key takeaways　　Advanced 5G RedCap plus Wi-Fi 6 (AX3600): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm WCN6856, reaching maximum 3600Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-160MHz@5/6GHz dual-band concurrently and the support of 4K QAM for enhanced data transmission efficiency.　　Medium 5G RedCap plus Wi-Fi 6 (AX1800): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm QCA2064, reaching maximum 1800Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-80MHz@5/6GHz dual-band concurrently.　　Entry-level 5G RedCap plus Wi-Fi 5: The FG131 5G RedCap module integrates with a Wi-Fi module developed from the Qualcomm QCA6174 through a serial port, delivers maximum 867Mbps speed with the support of dual-band 2.4GHz and 5GHz simultaneously.　　Leveraging 5G SA network coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The Fibocom5G RedCap module FG131 offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 223Mbps downlink and 123Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios. Apart from the hardware optimization, FG131also supports the OpenCPU and OpenWRT software features and an abundant of rich interfaces to realize the flexible and easy integration of FWA devices.

Key word：

Fibocom

Release time：2024-12-11 13:26 reading：206 Continue reading>>

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Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.　　The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.　　The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.　　“Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”　　Key Features of the Renesas USB EPR PD Solution　　Battery charger supporting two to seven battery cells in series　　Buck-boost voltage regulator supporting 30V input and 30V output　　Renesas R3™ technology ensures minimal power loss and improved efficiency　　Advanced control scheme delivers fast transient response and system performance　　Robust thermal management and protection features for safety and reliability　　Adaptable configurations support a wide range of applications　　Built-in protection against overcharging, overheating, and voltage anomalies　　Bidirectional power flow　　USB-IF certified reference design reduces compliance testing time and effort　　Comprehensive design support and tools　　Winning Combinations　　Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Device Availability　　The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　(Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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Release time：2024-12-10 14:06 reading：338 Continue reading>>

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Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

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Release time：2024-12-03 14:43 reading：266 Continue reading>>

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