MediaTek Goes Back to ASIC

发布时间:2018-02-27 00:00
作者:Ameya360
来源:Junko Yoshida
阅读量:1023

  BARCELONA — MediaTek is going back into the ASIC business.

  In a one-on-one interview with EE Times at the Mobile World Congress, Joe Chen, president of MediaTek, told us that the Taiwan consumer chip giant has big plans to provide “premier ASIC design services” to system vendors in consumer, communication and computing markets.

  “MediaTek has been known as an ASSP company for a long time,” said Chen, “but we now see growth opportunities by becoming an ASIC company.”

  But hang on. Didn’t most chip companies ditch the ASIC business model in favor of a “platform-based” ASSP business? Unless you know up front that your ASIC customer’s product will sweep the consumers in certain market segment off their feet, it’s hard to justify the cost of ASIC designs.

  Chen acknowledged, “Yes, true, over the last 20 years, the ASIC market has shrunk.”  But he quickly added, “We think the industry has also changed a lot over time.”

  Consider, for example, Apple or Samsung in the smartphone business. Both have succeeded with their internally-designed proprietary chip solutions that differentiate their end products, Chen said.

  Other large system vendors, too, are looking for “unique” solutions of their own, he said. However, as Chen pointed out, many system companies have either lost — or have not kept up — their internal ASIC expertise.

  Sizable ASIC business

  Around 2015, MediaTek began noticing changes in the air, as big customers began to demand unique solutions for their systems. In addition to ASICs that MediaTek developed for game consoles for Sony and Microsoft, Chen said, “By 2017, we’ve reached a milestone by winning a sizeable ASIC business in the consumer space.”

  In 2018, MediaTek is poised to expand its ASIC business further by wooing customers in the communication segment. Chen, however, is neither naming the names of his ASIC customers nor disclosing specific product categories for which the company is designing ASICs.

  In recent years, the global electronics market has gone through substantial transformations. First, as Chen explained, big wins have been limited to a handful of system companies, who have won by developing their own captive solutions. Second, a host of M&A activities in recent years among global semiconductor companies has decreased the number of chip suppliers. The merged companies are bigger, but are not necessarily growing by creating new business models.

  MediaTek is among a few survivors in the global chip industry with a plan for growing more organically, including its stated goal of moving back into the ASIC service business.

  Asked who offer ASIC services these days, Chen said that there are companies such as Faraday Technology and GUC, both based in Taiwan, offering SoC design services.

  Chen hopes to come into the market by delivering much differentiated ASIC services. “We will go far beyond ‘place and route’ provided by Faraday or GUC,” he said.

  As Chen sees the outlook, MediaTek has two factors going for its ASIC ambitions. “First, we have a broad-range IP portfolio… cutting-edge IPs in everything from communications, computing and connectivity to multimedia, other peripherals and RF,” Chen noted.

  Second, “In ASIC business, your customers need to trust you,” he added. “For a big ASIC solution, you need a partner who has good reputation.” Chen believes that MediaTek has earned that reputation.

  MediaTek has a team of ASIC designers separate from the company’s ASSP product development teams. ASIC business requires separate culture and methodologies, Chen explained.

(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
MediaTek to Win the 5G Competition by Alliance and Independent R&D
  The 3GPP standard conference will be held in Taipei, Taiwan, next week. To foster the local 5G supply chain in Taiwan, MediaTek, a key organizer of the conference, strove for keeping the event to be held in Taiwan with the aim of developing universal standards. Huang He-qi, general manager of the design and development department of MediaTek's communication system, pointed out that for the current situation of 5G, MediaTek will adopt the countermeasures of "wide-scale alliance and independent R&D".  The 3rd Generation Partnership Project (3GPP) is a standard organization dedicating to the development of 5G mobile communication in the world. There are more than 200 international companies participate in and even been called the Olympia Committee of communication standards. Because the standard drafting is like a tug-of-war match, major international companies are hoping to stand in a favorable position to seize the opportunity. Huang He-qi described: "It is a kind of competition, and everybody has their own strategies in it."  He pointed out that because each company has its technical position, therefore they will push their own technical proposals in the specifications to win its best interests. Huang explained that by pushing the proposal into a standard, in addition to being able to apply for a patent, it is also beneficial for the company to establish a technical threshold, so that competitors have no way to break through, and thus make their products more competitive.  Facing of this situation, Huang said that MediaTek will take the countermeasure of " wide-scale alliance and independent research" strategy. But he pointed out that the forming alliance is only a short term approach, and more importantly is to build deep technology and with flexible strategies.  MediaTek emphasizes that the development of 5G technology should not be a solo play, but needs to join hands with industrial partners to create an ecosystem.  Huang said that the Release 15 version was released in December last year. This year, it will be adjusted for more detail. The Release 16 version is expected to be announced in March 2020. He revealed that MediaTek is also expected to launch related products in 2020 to meet customer needs.
2019-01-21 00:00 阅读量:1154
MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth
MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.MediaTek’s Wi-Fi 6 chips support 2x2 and 4x4 which comply with the most updated standards. The Wi-Fi 6 chip also has a flexible architecture to support updated features when the Wi-Fi 6 specification is finalized later in 2019.“Consumers rely on our high performance connectivity portfolio to power their favorite intelligent devices, and now with support for next generation Wi-Fi 6 we deliver an even more, robust and seamless connectivity experience,” said Jerry Yu General Manager of MediaTek’s Intelligent Devices business unit. “We will continue to innovate and bring the most advanced technology and standards to consumer and enterprise markets.” MediaTek currently holds market-leading positions in powering TVs, streaming devices, smart speakers, voice assistant devices and tablets.MediaTek also brings unique built-in solutions to its chipset along with meeting the newest Wi-Fi standard to improve the end-users experience. MediaTek connectivity technology, empowered with OFDMA, 1024QAM solves data traffic conflicts. It reschedules multi-user’s packets and provides a higher internet data rate so there is no lag while playing on-line games or streaming video.It also delivers better concurrent performance between Wi-Fi and Bluetooth with the latest Wi-Fi 6 access point + Bluetooth combo chip to guarantee spectrum efficiency when two radios work simultaneously.MediaTek also supports and is leading the deployment of the Wi-Fi Alliance EasyMesh standard for extended Wi-Fi coverage. MediaTek’s family of smart home chipsets will be EasyMesh compatible. The new standard extends the Wi-Fi signal for total access in the home or even into the backyard.
2019-01-11 00:00 阅读量:1031
Mediatek Targets China, Snapdragon
Mediatek announced its next-generation smartphone SoC just one week after archrival Qualcomm did the same. The Helio P90 falls short of the Snapdragon 855 in many respects but is likely to provide fierce competition a notch below flagship handsets, especially among China’s cost-conscious OEMs.Made in a 12-nm node, the P90 sports two Cortex-75 cores running at up to 2.2 GHz and six A55 cores at 2.0 GHz. By contrast, the 7-nm Snapdragon 855 uses four large cores, one running up to 2.84 GHz and three at 2.42 GHz, and four of the A55 cores at 1.80 GHz.Mediatek switched from a 4 × 4 configuration in its former P70, in which it ran A73 and A53 cores at 2.1 and 2.2 GHz, respectively, apparently not wringing much speed gains out of the 12-nm process. The use of a 2 × 6 configuration signals a strategy focused more on power efficiency.In connectivity, the P90 supports LTE Category 13 with 3× carrier aggregation (CA) up from Cat 7 with 2× CA, claiming downloads at up to 600 Mbits/s. It also supports 802.11ac Wi-Fi with 2 × 2 MIMO.For its part, the Snapdragon 855 integrates a Category 20 LTE modem supporting 7× carrier aggregation and two flavors of Wi-Fi — the 60-GHz 802.11ay and the pre-standard .11ax, both claiming to be capable of 10-Gbit/s data rates. In addition, Qualcomm pitches the 855 with its separate 5G modem, powering first-generation 5G handsets from Samsung and OnePlus early next year in sub-6-GHz and millimeter-wave bands.Mediatek has an M70 standalone 5G modem, but “we’re not certain how widely it will be made available commercially … we’re looking at going directly to an integrated SoC product rather than a standalone modem and focus on sub-6 GHz, aiming for customer products launching in late 2019 or early 2020,” said Russ Mestechkin, senior director of sales and business development at Mediatek.“Our focus is to commercialize our SoC for mainstream handsets at $500+ as opposed to ultra-premium models at $1,000+,” he added.Mediatek won sockets in the 2016 and 2017 models of China’s rising handset makers, but Qualcomm has been regaining ground with them this year. It’s a pitched battle in which Mediatek is “starting to win back share with Xiaomi and Vivo … Oppo and Vivo are also using its P50 in mid- to high-end products, which will bear fruit in 4Q18,” said Phil Solis, who tracks handset SoCs at International Data Corp.When it comes to 5G, “I expect they will gain back some market share by 1H20, but they are far behind” he said. “In the meantime, Mediatek will focus on its growth areas of smart speakers, TVs, IoT devices, and other consumer products for their processors and connectivity.”Both Mediatek and Qualcomm made AI acceleration a focus in multiple blocks of their latest chips.For the P90, Mediatek doubled the size of the so-called APU in the P70, which includes multiply-accumulate arrays for running machine-learning jobs. It also added a proprietary AI accelerator. The two blocks, combined with a PowerVR GM 9446 GPU running at 970 MHz, deliver 1,127 GMACs/s with software optimizations still ahead.The number falls far short of the 7 Tera tensor operations/s on 8-bit integer jobs that Qualcomm claims for its 855. But both sides agree that the benchmarks are less telling than performance on actual AI workloads, which vary widely.The Helio P90 beat the Snapdragon 845 and others on one AI benchmark. Click to enlarge. (Source: Mediatek)Mediatek is focusing on deep-learning applications such as face detection, object and scene identification, and accelerating augmented and virtual reality. Its NeuroPilot software can dynamically assign AI jobs and supports third-party frameworks, said the company without listing which ones.The P90 can drive dual 24- and 16-MP cameras or one 48-MP camera with video capture at up to 30 fps. It includes dedicated blocks to speed face recognition as well as accelerators for processing 3D depth maps, multi-frame noise reduction, and lens correction.
2018-12-14 00:00 阅读量:1113
MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality
Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers. With a vision to further enhance manufacturing excellence, MediaTek has implemented Silicondash to further improve overall operational efficiency, yield management, quality control and IC-level traceability.The Silicondash Big Data platform uses embedded expertise, algorithms, analytical engines, machine learning techniques for data preparation, automated analytics and decision-making. Silicondash cloud-based technologies and collaborative features ensure effective collaboration with supply chain partners so that issues can be detected early and appropriate actions are taken swiftly.Qualtera EVP Marketing and Asia Business Operations, Paul Simon comments, “We have been collaborating with MediaTek since November 2017 and I am delighted to see that the Silicondash platform is now in high volume production handling analytics and IC level traceability across the manufacturing volume of MediaTek’s supply chain. The platform’s mix of real-time data collection, stream computing and big data analytics engines provides a host of high speed data visualizations, analytics and modeling capabilities giving semiconductor manufacturers and their supply chain partners the opportunity to improve operational KPIs, yields and product quality”
2018-12-11 00:00 阅读量:1287
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
型号 品牌 抢购
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。