MediaTek Launches Newest Combo Chip with Wi-Fi 6 and AP+Bluetooth

发布时间：2019-01-11 00:00
作者：Ameya360
来源：CTIMES
阅读量：1037

MediaTek announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It will support a range of products including wireless access points, routers, gateways and repeaters, bringing faster and more reliable connectivity throughout the smart home.

MediaTek’s Wi-Fi 6 chips support 2x2 and 4x4 which comply with the most updated standards. The Wi-Fi 6 chip also has a flexible architecture to support updated features when the Wi-Fi 6 specification is finalized later in 2019.

“Consumers rely on our high performance connectivity portfolio to power their favorite intelligent devices, and now with support for next generation Wi-Fi 6 we deliver an even more, robust and seamless connectivity experience,” said Jerry Yu General Manager of MediaTek’s Intelligent Devices business unit. “We will continue to innovate and bring the most advanced technology and standards to consumer and enterprise markets.” MediaTek currently holds market-leading positions in powering TVs, streaming devices, smart speakers, voice assistant devices and tablets.

MediaTek also brings unique built-in solutions to its chipset along with meeting the newest Wi-Fi standard to improve the end-users experience. MediaTek connectivity technology, empowered with OFDMA, 1024QAM solves data traffic conflicts. It reschedules multi-user’s packets and provides a higher internet data rate so there is no lag while playing on-line games or streaming video.

It also delivers better concurrent performance between Wi-Fi and Bluetooth with the latest Wi-Fi 6 access point + Bluetooth combo chip to guarantee spectrum efficiency when two radios work simultaneously.

MediaTek also supports and is leading the deployment of the Wi-Fi Alliance EasyMesh standard for extended Wi-Fi coverage. MediaTek’s family of smart home chipsets will be EasyMesh compatible. The new standard extends the Wi-Fi signal for total access in the home or even into the backyard.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Moody's: China's slowing growth is pushing Beijing to launch new 'untested' policies

下一篇：NAND Flash Manufacturers to Cut Capex by 2% YoY in 2019 Due to Worsening Oversupply

在线留言询价

相关阅读
MediaTek to Win the 5G Competition by Alliance and Independent R&D
Trade news

MediaTek to Win the 5G Competition by Alliance and Independent R&D

　　The 3GPP standard conference will be held in Taipei, Taiwan, next week. To foster the local 5G supply chain in Taiwan, MediaTek, a key organizer of the conference, strove for keeping the event to be held in Taiwan with the aim of developing universal standards. Huang He-qi, general manager of the design and development department of MediaTek's communication system, pointed out that for the current situation of 5G, MediaTek will adopt the countermeasures of "wide-scale alliance and independent R&D".　　The 3rd Generation Partnership Project (3GPP) is a standard organization dedicating to the development of 5G mobile communication in the world. There are more than 200 international companies participate in and even been called the Olympia Committee of communication standards. Because the standard drafting is like a tug-of-war match, major international companies are hoping to stand in a favorable position to seize the opportunity. Huang He-qi described: "It is a kind of competition, and everybody has their own strategies in it."　　He pointed out that because each company has its technical position, therefore they will push their own technical proposals in the specifications to win its best interests. Huang explained that by pushing the proposal into a standard, in addition to being able to apply for a patent, it is also beneficial for the company to establish a technical threshold, so that competitors have no way to break through, and thus make their products more competitive.　　Facing of this situation, Huang said that MediaTek will take the countermeasure of " wide-scale alliance and independent research" strategy. But he pointed out that the forming alliance is only a short term approach, and more importantly is to build deep technology and with flexible strategies.　　MediaTek emphasizes that the development of 5G technology should not be a solo play, but needs to join hands with industrial partners to create an ecosystem.　　Huang said that the Release 15 version was released in December last year. This year, it will be adjusted for more detail. The Release 16 version is expected to be announced in March 2020. He revealed that MediaTek is also expected to launch related products in 2020 to meet customer needs.
2019-01-21 00:00 阅读量：1161
Mediatek Targets China, Snapdragon
Trade news

Mediatek Targets China, Snapdragon

Mediatek announced its next-generation smartphone SoC just one week after archrival Qualcomm did the same. The Helio P90 falls short of the Snapdragon 855 in many respects but is likely to provide fierce competition a notch below flagship handsets, especially among China’s cost-conscious OEMs.Made in a 12-nm node, the P90 sports two Cortex-75 cores running at up to 2.2 GHz and six A55 cores at 2.0 GHz. By contrast, the 7-nm Snapdragon 855 uses four large cores, one running up to 2.84 GHz and three at 2.42 GHz, and four of the A55 cores at 1.80 GHz.Mediatek switched from a 4 × 4 configuration in its former P70, in which it ran A73 and A53 cores at 2.1 and 2.2 GHz, respectively, apparently not wringing much speed gains out of the 12-nm process. The use of a 2 × 6 configuration signals a strategy focused more on power efficiency.In connectivity, the P90 supports LTE Category 13 with 3× carrier aggregation (CA) up from Cat 7 with 2× CA, claiming downloads at up to 600 Mbits/s. It also supports 802.11ac Wi-Fi with 2 × 2 MIMO.For its part, the Snapdragon 855 integrates a Category 20 LTE modem supporting 7× carrier aggregation and two flavors of Wi-Fi — the 60-GHz 802.11ay and the pre-standard .11ax, both claiming to be capable of 10-Gbit/s data rates. In addition, Qualcomm pitches the 855 with its separate 5G modem, powering first-generation 5G handsets from Samsung and OnePlus early next year in sub-6-GHz and millimeter-wave bands.Mediatek has an M70 standalone 5G modem, but “we’re not certain how widely it will be made available commercially … we’re looking at going directly to an integrated SoC product rather than a standalone modem and focus on sub-6 GHz, aiming for customer products launching in late 2019 or early 2020,” said Russ Mestechkin, senior director of sales and business development at Mediatek.“Our focus is to commercialize our SoC for mainstream handsets at $500+ as opposed to ultra-premium models at $1,000+,” he added.Mediatek won sockets in the 2016 and 2017 models of China’s rising handset makers, but Qualcomm has been regaining ground with them this year. It’s a pitched battle in which Mediatek is “starting to win back share with Xiaomi and Vivo … Oppo and Vivo are also using its P50 in mid- to high-end products, which will bear fruit in 4Q18,” said Phil Solis, who tracks handset SoCs at International Data Corp.When it comes to 5G, “I expect they will gain back some market share by 1H20, but they are far behind” he said. “In the meantime, Mediatek will focus on its growth areas of smart speakers, TVs, IoT devices, and other consumer products for their processors and connectivity.”Both Mediatek and Qualcomm made AI acceleration a focus in multiple blocks of their latest chips.For the P90, Mediatek doubled the size of the so-called APU in the P70, which includes multiply-accumulate arrays for running machine-learning jobs. It also added a proprietary AI accelerator. The two blocks, combined with a PowerVR GM 9446 GPU running at 970 MHz, deliver 1,127 GMACs/s with software optimizations still ahead.The number falls far short of the 7 Tera tensor operations/s on 8-bit integer jobs that Qualcomm claims for its 855. But both sides agree that the benchmarks are less telling than performance on actual AI workloads, which vary widely.The Helio P90 beat the Snapdragon 845 and others on one AI benchmark. Click to enlarge. (Source: Mediatek)Mediatek is focusing on deep-learning applications such as face detection, object and scene identification, and accelerating augmented and virtual reality. Its NeuroPilot software can dynamically assign AI jobs and supports third-party frameworks, said the company without listing which ones.The P90 can drive dual 24- and 16-MP cameras or one 48-MP camera with video capture at up to 30 fps. It includes dedicated blocks to speed face recognition as well as accelerators for processing 3D depth maps, multi-frame noise reduction, and lens correction.
2018-12-14 00:00 阅读量：1116
MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality
Trade news

MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality

Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers. With a vision to further enhance manufacturing excellence, MediaTek has implemented Silicondash to further improve overall operational efficiency, yield management, quality control and IC-level traceability.The Silicondash Big Data platform uses embedded expertise, algorithms, analytical engines, machine learning techniques for data preparation, automated analytics and decision-making. Silicondash cloud-based technologies and collaborative features ensure effective collaboration with supply chain partners so that issues can be detected early and appropriate actions are taken swiftly.Qualtera EVP Marketing and Asia Business Operations, Paul Simon comments, “We have been collaborating with MediaTek since November 2017 and I am delighted to see that the Silicondash platform is now in high volume production handling analytics and IC level traceability across the manufacturing volume of MediaTek’s supply chain. The platform’s mix of real-time data collection, stream computing and big data analytics engines provides a host of high speed data visualizations, analytics and modeling capabilities giving semiconductor manufacturers and their supply chain partners the opportunity to improve operational KPIs, yields and product quality”
2018-12-11 00:00 阅读量：1294
MediaTek Introduces New Helio A Series Chipset Family for Mid-Market Affordable Smartphones
Trade news

MediaTek Introduces New Helio A Series Chipset Family for Mid-Market Affordable Smartphones

MediaTek today unveiled its Helio A series, expanding its Helio family of feature-packed and power-efficient chipsets with the company's new Helio A22 system-on-chip (SoC). MediaTek's commitment to continuing to "change everything" can be seen throughout the "Advanced" Helio A series and its mission to power more innovative and more capable smartphones designed to meet the demands of today's mid-market consumer.The Helio A series is optimized for devices that offer a great value without sacrificing modern capabilities and features. MediaTek's new Helio A22, the first chipset in its Helio A Series, is set to redefine what consumers can expect and demand in their smart devices."The Helio A Series continues our vision of a mobile marketplace that is accessible to everyone, where high-end features are not limited to high-end devices. As we've seen, mid-market growth continues to explode and there continues to be consumer interest in powerful and quality devices that offer them the best value," said TL Lee, General Manager of MediaTek's Wireless Communication business unit at MediaTek. "With Helio A22, device makers can bring to market innovative devices that provide consumers unparalleled mobile experiences in the mid-range, including incredible performance, long battery life and advanced photography and AI enhancements."The Helio A22 is built with advanced 12nm FinFET fabrication technology to deliver high performance with greater power efficiency. Equipped with MediaTek's CorePilot technology, the chipset optimizes power for each task to extend device battery life, enabling users to do more with their devices for longer. Helio A22 also has AI features to take advantage of the MediaTek NeuroPilot software development kit (SDK) extensions and third-party AI applications.MediaTek's Helio A22 offers exceptional camera capabilities, taking photography to the next level with AI enhancements. The chipset supports up to 13+8 megapixels dual-camera setups at 30 frames per second (FPS) and a single camera operating mode of up to 21 megapixels. Device makers can create stunning, large-screen devices with the Helio A22's 20:9 HD+ display support.The chipset supports the latest AI frameworks, including Google Android Neural Networks API (Android NNAPI), so developers can seamlessly build AI applications for Helio A22-powered devices.Advanced connectivity is at the heart of the Helio A22 with an innovative RF design for Bluetooth and Wi-Fi co-existence. The chipset both Cat-4 and Cat-7 4G LTE performance for fast connectivity and packs a dual 4G SIM with VoLTE and ViLTE. Also A22 supports both LPDDR3 and the newer, faster LPDDR4 for more customer design flexibility.The Helio A22's GNSS location enhancements enable 57 percent faster TTFF, a 10 percent improvement in accuracy and up to 24 percent lower power operation compared to previous generation chipsets. With 802.11 ac Wi-Fi, MediaTek's Helio A22 offers higher bandwidth and throughput, resulting in improved online gaming, multimedia and communications experiences for users. Also, the chipset supports BT5.0 for longer transport distance and higher speeds suitable for smart home devices.The Helio A Series is in volume production now with the availability of the Helio A22-powered Xiaomi Redmi 6A in China.
2018-07-18 00:00 阅读量：1107
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
型号 品牌 抢购
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。