CES 2019: AMD announces new mobile processor line-up

发布时间：2019-01-08 00:00
作者：Ameya360
来源：ETTelecom
阅读量：1334

Semiconductor company AMD has unveiled latest processors for its mobility line-up, including the 2nd-generation Ryzen3000 Series Mobile, which are the world's fastest processor for ultra-thin laptops..

The semiconductor major also unveiled AMD Athlon 300 Series Mobile Processors that power mainstream notebooks with "Zen" core and optimised 7th-Gen AMD A-Series chips for the first ever AMD-powered mainstream Chromebooks at the CES 2019 here.

"Starting this quarter, gamers, creators, and enthusiasts would be able to install Radeon Software Adrenalin to bring the latest GPU features and game optimisations to all systems powered by AMD Ryzen Processors with Radeon Graphics," the company said in a statement.

The AMD Ryzen 3000 Series Mobile processors line-up includes AMD Ryzen 7 3750H with 10 GPU cores, AMD Ryzen 7 3700U, AMD Ryzen 5 3550H, AMD Ryzen 5 3500U, AMD Ryzen 3 3300U, AMD Ryzen 3 3200U and AMD Athlon 300U.

The 7th Gen AMD A-Series processors powering Chromebooks from global Original Equipment Manufacturers (OEMs) such as Acer and HP, deliver fluid web browsing and effortless everyday productivity for social media, streaming, and web gaming, the company added.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Samsung guidance shocks: fourth-quarter profit 18 percent less than market expected

下一篇：Total Consumption of Driver IC Grew by 8.4% YoY in 2018, but Growth Would Slow Down to 3% in 2019

在线留言询价

相关阅读
AMD Closes In on NVIDIA, Securing Major Deals with Oracle and IBM
Trade news

AMD Closes In on NVIDIA, Securing Major Deals with Oracle and IBM

　　As Jiwei reported, AMD, although trailing NVIDIA in AI, has recently clinched significant deals, earning the trust of two major clients, Oracle and IBM. Oracle plans to integrate AMD’s Instinct MI300X AI chips into their cloud services, complemented by HPC GPUs. Additionally, as per insights from Ming-Chi Kuo, TF International Securities analyst, IBM is set to leverage AMD’s Xilinx FPGA solutions to handle artificial intelligence workloads.　　Oracle’s extensive cloud computing infrastructure faces challenges due to a shortage of NVIDIA GPUs. Nonetheless, Oracle maintains an optimistic outlook. They aim to expand the deployment of the H100 chip by 2024 while considering AMD’s Instinct MI300X as a viable alternative. Oracle has decided to postpone the application of their in-house chips, a project with a multi-year timeline. Instead, they are shifting their focus to AMD’s high-performance AI chip, the MI300X, well-regarded for its impressive capabilities.　　Reports indicate that Oracle intends to introduce these processor chips into their infrastructure in early 2024.　　Similarly, IBM is exploring chip options beyond NVIDIA. Their new AI inference platform relies on NeuReality’s NR1 chip, manufactured on TSMC’s 7nm process. AMD plays a pivotal role in NeuReality’s AI solution by providing the essential FPGA chips. Foxconn is gearing up for AI server production using this technology in the Q4 2023.　　Guo also pointed out that, although Nvidia remains the dominant AI chip manufacturer in 2024, AMD strengthens partnerships with platform service providers/CSPs like Microsoft and Amazon while acquiring companies like Nod.ai. This positions AMD to potentially narrow the AI gap with Nvidia starting in 2025. This collaboration also affirms that AMD remains unaffected by the updated U.S. ban on shipping AI chips to China.
2023-10-24 16:33 阅读量：1900
ASRock Mini PCs Based on AMD Ryzen 7000U-Series
Trade news

ASRock Mini PCs Based on AMD Ryzen 7000U-Series

　　ASRock Industrial has launched the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen 7000U-Series APUs with up to 8 Zen 3+ cores.　　Featuring maximum dual DDR5 4800MHz memory up to 64GB, the 4X4 BOX 7000/D5 Series bring about performance enhancement through unleashing higher standards of power, speed, and energy efficiency. Now poised with enriched IOs and expansions, the Series also provide quad-display outputs of up to 8K outstanding graphics with one HDMI 2.1, three DisplayPort 1.4a, and five USB ports, including two USB4 for versatile connectivity. Moreover, dual storages with one SATA 3.0, one M.2 Key M, plus dual LAN ports up to 2.5 Gigabit, Wi-Fi 6E, and Bluetooth 5.2 are supported for reliable communications.　　The unleashed features make this Series the leading choice for a wide range of top-notch applications such as gaming, entertainment, content creation, office productivity, business, and AIoT use cases.　　AMD Ryzen 7000 U-Series APUs and the first DDR5 support　　Powered by AMD Ryzen 7 7735Uand Ryzen 5 7535U, ASRock Industrial presents the 4X4 BOX 7000/D5 Series selections: 4X4 BOX-7735U/D5 and 4X4 BOX-7535U/D5. Featuring up to 8 Zen 3+ cores and next-generation AMD Radeon Graphics, the Series guarantee optimal power, speed, and performance upgrades.　　The 4X4 BOX 7000/D5 Series showcase the very first dual-channel DDR5 4800MHz SO-DIMM memory up to 64GB with new features that unleash effortless multitasking abilities for higher performance, lower power consumption, and more robust data integrity for future computing.　　Quad-display up to 8K, USB4, and dual LAN up to 2.5G　　The 4X4 BOX 7000/D5 Series support dual Realtek LAN ports up to 2.5 Gigabit and one 1 Gigabit with DASH function for remote management, plus Intel? Wi-Fi 6E support of 6GHz band and Bluetooth 5.2 to enable smooth real-time communications. For connections, the Series are equipped with two USB4 (Type C), one USB 3.2 Gen 2 (Type A), and two USB 2.0.　　With quad-display outputs up to 8K and integrated AMD Radeon Graphics, the Series support one HDMI 2.1 holding up to 7680×4320@60Hz and three DisplayPort 1.4a (two from Type C) holding 4096×2160@60Hz for you to enjoy uncompromised graphics. In addition, the expansion of dual storages support one SATA 3.0 and one M.2 Key M (2242/2260/2280) with PCIe Gen4 x4. There is also TPM 2.0 onboard for enhanced security support of Windows 11 upgrade, plus VESA mounting to easily mount your Mini PC and save space.　　The Series unleash incredible speed and power in the compact size of 110.0 x 117.5 x 47.85mm with fanned barebone, making them exceptionally easy to be carried around.　　Unleashed new potentials　　The new 4X4 BOX 7000/D5 Series powered by AMD Ryzen 7000U-Series APUs are here to unleash the advanced potentials in power and speed that you have been waiting for. Featuring next-generation DDR5 4800MHz memory, USB4 in conjunction with up to 8K quad-display, dual LANs up to 2.5G, Wi-Fi 6E, and dual storages support.　　This time, the compact Mini PCs provide greater energy efficiency for reduced environmental impact and operation costs, higher power, and faster speed in high-end gaming, content creation, office productivity, business, and AIoT applications.
2023-02-09 15:40 阅读量：2878
AMD Discusses Future of High-performance and Adaptive Computing at CES 2023
Trade news

AMD Discusses Future of High-performance and Adaptive Computing at CES 2023

　　AMD Chair and CEO Dr. Lisa Su detailed the significant role high-performance and adaptive computing plays in creating solutions to the world’s most important challenges during her live keynote at CES 2023.　　“It is an honor to kick off CES 2023 and highlight all the ways AMD is pushing the envelope in high-performance and adaptive computing to help solve the world’s most important challenges,” said Dr. Su. “Together with our partners, we highlighted how AMD technology is advancing what is possible in AI, hybrid work, gaming, healthcare, aerospace and sustainable computing. We also launched multiple new mobile, gaming and AI chips that will make 2023 an exciting year for AMD and the industry.”　　AMD Product Innovation at CES 2023　　AMD announced new mobile and desktop processors to serve every type of user, from casual gamers and content creators to professionals and hybrid workers, along with new graphics solutions to bring the power of high-performance gaming to mobile.　　The AMD Ryzen 7000X3D Series processors with AMD 3D V-Cache technology, the fastest gaming processors in the world2.　　AMD Radeon RX 7000 Series Graphics for Laptops based on the AMD RDNA 3 architecture offering exceptional energy efficiency and performance to power 1080p gaming at ultra settings and advanced content creation applications on next-generation premium laptops.　　Dr. Su also shared the company’s latest advances to enable pervasive AI, including previewing new products to broaden its AI product portfolio from edge to cloud.　　AMD adaptable computing and AI technology powers the world’s most important medical solutions, enabling faster diagnoses and drug discoveries and better patient care. At CES, AMD announced the AMD Vitis Medical Imaging libraries to bring premium medical imaging products to market faster by reducing development times. These software libraries accelerate premium medical imaging on AMD Versal SoC devices with AI Engines to deliver healthcare providers and their patients high-quality, low-latency imaging.　　Finally, AMD adaptive computing solutions help satellites and spacecraft compute data and leverage pervasive AI to derive insights. During the keynote, Dr. Su shared how AMD FPGAs and adaptive SoCs are helping to shape the future of space exploration, powering recent space missions from Mars Curiosity and Perseverance to the recently launched Artemis moon mission.
2023-01-11 13:50 阅读量：3000
AMD Takes Center Stage at CES
Trade news

AMD Takes Center Stage at CES

AMD President and CEO Lisa Su took to the stage at CES to give what some analysts suggested was the most important appearance by AMD at a tradeshow since a keynote at the now-defunct Comdex by then-CEO Hector Ruiz in 2002. She did not disappoint.Su announced that the Radeon VII GPU would be available starting next month and that its second-generation Ryzen mobile processors would begin showing up in ultrathin and gaming laptops by the end of the first quarter. Su also teased AMD's third-generation Ryzen desktop processor and its second-generation EPYC server processor, both of which are implemented in 7nm and will be available starting later this year.Analysts were enthusiastic about the announcements made by Su Wednesday in the first CES keynote by AMD since 2009, though at least some of the news had been revealed previously. Last November at an event in San Francisco, AMD first announced the 7nm Radeon 7 GPU and the 7nm server processor, which is codenamed "Rome" and based on AMD's Zen 2 x86 microarchitecture. The second-generation Ryzen mobile processors were announced by AMD on Sunday, prior to the start of CES.But Su provided more details Wednesday on all three chips."I think this was a landmark event for AMD," said Kevin Krewell, a principal analyst at Tirias Research. "It was quite dramatic for AMD to usurp the leadership role from Intel."Indeed, with 7nm silicon available next month, AMD will beat both Intel and Nvidia to the most advanced technology node. And by returning to the CES keynote stage, AMD also upstaged its rival, which lost its most coveted CES keynote spot this year to LG Electronics. (Intel, which has yet to replace CEO Brian Krzanich after he abruptly resigned in June, instead held a press conference event Monday).AMD President and CEO Lisa Su shows a 7nm Radeon VII graphics card. (Source: CES)Radeon VII, built on AMD's second-generation Vega architecture, boasts twice the memory and memory bandwidth compared to AMD's current top-of-the-line Radeon. It also improves gaming performance by up to 29% and offers up to 36% better content creation performance compared to the incumbent, AMD said.The device features 60 compute units (or 3,840 stream processors) running at up to 1.8GHz. It also has 16GB of HBM2 memory and 1 TB/s memory bandwidth."We really believe at the high end enthusiast market, you need great hardware," said Su, who devoted most of her 90-minute keynote to the gaming sector.She stressed that gaming requires cutting edge technology and brings people closer together. "Gamers love great technology and they provide us great feedback," Su said.The second-generation mobile Ryzen processors, AMD's Ryzen 3000 Series, are designed for both ultrathin and gaming laptops. The initial 3000 Series chips feature two or four cores with eight or four threads and boost performance of up to 4.0GHz. They will be available in laptops starting later in the first quarter and throughout the rest of the year from the likes of Acer, ASUS, Dell, HP, Huawei, Lenovo and Samsung.Perhaps most notable about the Ryzen 3000 Series is that the devices enable up to 12 hours of general productivity and 10 hours of video playback battery life, according to AMD."If it can actually provide 12 hours of 'productivity battery life" — not fake MobileMark or video playback — this would be big," Moorhead said. "It would be longer than any other notebook. I am looking forward to the reviews and testing myself."Details on the third-generation Ryzen desktop processors remain sketchy. Su showed an early version of the 7nm device going head-to-head with a top-of-the-line Intel Core i9 processor. The third-generation Ryzen desktop processors are based on AMD's Zen 2 microarchitecture and are expected to be the first PC processors to support PCIe 4.0 connectivity. Su said they would be introduced in mid-2019."As a desktop processor, it will absolutely set the bar" in performance, features, and power efficiency, Su said.Su also showed the Rome 7nm datacenter CPU, which is also based on the Zen 2 microarchitecture. She showed a demonstration pitting a pre-production EPYC Rome processor against two high-end Intel Xeon Platinum 8180 processors, with the EPYC processor showing about 15% greater performance.Among other things, Su said the second-generation EPYC offers four times the floating point performance and twice the computing performance per socket compared to its predecessor. "I will go so far as to say we believe it is the best server processor the world has ever seen," Su said."AMD has achieved phenomenal performance with Zen 2, something that we haven't seen in the x86 architecture for the past decade," said Jim McGregor, principal analyst at Tirias Research. "We finally have competition in PCs and servers from top to bottom. This bodes well for the future in products from both AMD and Intel."Speaking generally about the importance of high-performance computing at the beginning of the keynote, Su said the dramatic increases in the number of connected devices and data generated by them demand dramatic innovation to keep pace, particularly with Moore's Law scaling slowing to a comparative crawl."We are absolutely determined to drive high-performance computing innovation at the bleeding edge," Su said. "This is our job one."
2019-01-10 00:00 阅读量：1338
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
型号 品牌 抢购
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。