Intel, Facebook working on cheaper AI chip

发布时间：2019-01-09 00:00
作者：Ameya360
来源：ETTelecom
阅读量：2515

 Intel and Facebookare working together on a new cheaper Artificial Intelligence (AI) chip that will help companies with high workload demands.

At the CES 2019 here on Monday, Intel announced "Nervana Neural Network Processor for Inference" (NNP-I).

"This new class of chip is dedicated to accelerating inference for companies with high workload demands and is expected to go into production this year," Intel said in a statement.

Facebook is also one of Intel's development partners on the NNP-I.

Navin Shenoy, Intel Executive Vice President in the Data Centre Group, announced that the NNP-I will go into production this year.

The new "inference" AI chip would help Facebook and others deploy machine learning more efficiently and cheaply.

Intel began its AI chip development after acquiring Nervana Systems in 2016.

Intel also announced that with Alibaba, it is developing athlete tracking technology powered by AI that is aimed to be deployed at the Olympic Games 2020 and beyond.

The technology uses existing and upcoming Intel hardware and Alibaba cloud computing technology to power a cutting-edge deep learning application that extracts 3D forms of athletes in training or competition.

"This technology has incredible potential as an athlete training tool and is expected to be a game-changer for the way fans experience the Games, creating an entirely new way for broadcasters to analyse, dissect and re-examine highlights during instant replays," explained Shenoy.

Intel and Alibaba, together with partners, aim to deliver the first AI-powered 3D athlete tracking during the Olympic Games Tokyo 2020.

"We are proud to partner with Intel on the first-ever AI-powered 3D athlete tracking technology where Alibaba contributes its best-in-class cloud computing capability and algorithmic design," said Chris Tung, CMO, Alibaba Group. 

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Apple CEO Tim Cook: 'I'm very optimistic' about US-China trade talks

下一篇：Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

在线留言询价

相关阅读
Intel’s Next Gen CPU to Produce at TSMC with 3nm in First Half of Next Year
Trade news

Intel’s Next Gen CPU to Produce at TSMC with 3nm in First Half of Next Year

　　Intel’s upcoming Lunar Lake platform has entrusted TSMC with the 3nm process of its CPU. This marks TSMC’s debut as the exclusive producer for Intel’s mainstream laptop CPU, including the previously negotiated Lunar Lake GPU and high-speed I/O (PCH) chip collaborations. This move positions TSMC to handle all major chip orders for Intel’s crucial platform next year, reported by UDN News.　　Regarding this news, TSMC refrained from commenting on single customer business or market speculations on November 21st. Intel has not issued any statements either.　　Recent leaks of Lunar Lake platform internal design details from Intel have generated discussions on various foreign tech websites and among tech experts on X (formerly known as Twitter). According to the leaked information, TSMC will be responsible for producing three key chips for Intel’s Lunar Lake—CPU, GPU, and NPU—all manufactured using the 3nm process. Orders for high-speed I/O chips are expected to leverage TSMC’s 5nm production, with mass production set to kick off in the first half of next year, aligning with the anticipated resurgence of the PC market in the latter half of the year.　　While TSMC previously manufactured CPUs for Intel’s Atom platform over a decade ago, it’s crucial to note that the Atom platform was categorized as a series of ultra-low-voltage processors, not Intel’s mainstream laptop platform. In recent years, Intel has gradually outsourced internal chips, beyond CPUs, for mainstream platforms to TSMC, including the GPU and high-speed I/O chips in the earlier Meteor Lake platform—all manufactured using TSMC’s 5nm node.　　Breaking from its tradition of in-house production of mainstream platform CPUs, Intel’s decision to outsource to TSMC hints at potential future collaborations. This move opens doors to new opportunities for TSMC to handle the production of Intel’s mainstream laptop platforms.　　It’s worth noting that the Intel Lunar Lake platform is scheduled for mass production at TSMC in the first half of next year, with a launch planned for the latter half of the year, targeting mainstream laptop platforms. Unlike the previous two generations of Intel laptop platforms, Lunar Lake integrates CPU, GPU, and NPU into a system-on-chip (SoC). This SoC is then combined with a high-speed I/O chip, utilizing Intel’s Foveros advanced packaging. Finally, the DRAM LPDDR5x is integrated with the two advanced packaged chips on the same IC substrate.
2023-11-22 11:18 阅读量：1833
Intel’s CEO Envisions Over One Hundred Million AI PC Shipments in Two Years
Trade news

Intel’s CEO Envisions Over One Hundred Million AI PC Shipments in Two Years

　　On November 7th, Intel held its “Intel Innovation Taipei 2023 Technology Forum”, with CEO Pat Gelsinger highlighting the healthy state of PC inventory. He also expressed optimism about the injection of several more years of innovative applications and evolution in PCs through AI.　　Intel Aims to Ship over One Hundred Million AI PC within the Next Two Years　　Gelsinger expressed that the PC inventory has reached a healthy level, and he is optimistic about the future growth of AI PCs, which are equipped with AI processors or possess AI computing capabilities. He anticipates that AI will be a crucial turning point for the PC industry.　　Additionally, Gelsinger stated that the server industry may have seemed uneventful in recent years, but with the accelerated development of AI, it has become more exciting. AI is becoming ubiquitous, transitioning from the training phase to the deployment phase, and various platforms will revolve around AI.　　Gelsinger expressed his strong confidence in Intel’s position in the AI PC market, expecting to ship over one hundred million units within two years.　　Intel’s Ambitious Expansion in Semiconductor Foundry Landscape　　Intel is actively promoting its IDM 2.0 strategy, with expectations from the industry that the company, beyond its brand business, has advanced packaging capabilities to support semiconductor foundry operations. In the future, Intel is poised to compete with rivals such as TSMC and Samsung.　　Gelsinger noted that some have viewed Intel’s plan of achieving five technical nodes in four years as “an ambitious endeavor.” However, he emphasized that Intel remains committed to its original goal of advancing five process nodes within four years.　　The company’s foundry business has received positive responses from numerous potential customers, and while it may take three to four years for significant expansion, the advanced packaging aspect may only require two to three quarters to get on track.　　This transformation marks a significant shift for the company, setting new standards in the industry. Intel is making steady progress in its four-year plan to advance five nodes, and Moore’s Law will continue to extend. The construction of Intel’s new factories is also ongoing.　　According to Intel’s roadmap, Intel 7 and Intel 4 are already completed, Intel 3 is set for mass production in the latter half of this year, and Intel 20A and 18A are expected to enter mass production in the first and second halves of next year, respectively.
2023-11-08 16:10 阅读量：1431
Israel Approves $185 Million Grant for Intel Fab
Trade news

Israel Approves $185 Million Grant for Intel Fab

The Israeli parliamentary finance committee approved a $185 million grant to Intel in return for meeting job creation targets and local contract guarantees.Last May, Intel announced it would spend $5 billion over two years to upgrade its Fab 28 in Kiryat Gat, Israel, from 22nm to 10nm production technology.Israel's grant is conditional on Intel meeting its already announced commitment to hire 250 new staff at the fab, and on awarding contracts worth around $560 million to local suppliers.Earlier this month, Ann Kelleher, Intel’s senior vice president and general manager of manufacturing and operations, said the company was planning for manufacturing site expansions in Oregon, Ireland and Israel, with multi-year construction activities expected to start in 2019.In a blog post, Kelleher said, “Having additional fab space at-the-ready will help us respond more quickly to upticks in the market and enables us to reduce our time to increased supply by up to roughly 60%. In the weeks and months ahead, we will be working through discussions and permitting with local governments and communities.”Kelleher said it was part of the company’s strategy to prepare the company’s global manufacturing network for flexibility and responsiveness to demand. As part of this, the company is spending to expand its 14nm manufacturing capacity, made progress on the previously announced schedule for the Fab 42 fit-out in Arizona, and located development of a new generation of storage and memory technology at its manufacturing plant in New Mexico.Kelleher also said that Intel would also supplement its own manufacturing capability with selective use of foundries for certain technologies "where it makes sense for the business." The company had already been doing this but will do so more as it aims to address a broader set of customers beyond the PC and into a $300 billion market for silicon in cars, phones, and artificial intelligence (AI) based products.
2019-01-04 00:00 阅读量：1309
Intel, Samsung Describe Embedded MRAM Technologie
Trade news

Intel, Samsung Describe Embedded MRAM Technologie

The world’s two largest semiconductor companies both presented new technologies for embedded MRAM in logic chip manufacturing processes last week at the 64th International Electron Devices Meeting (IEDM) here.Intel (Santa Clara, California) described the key features of spin-transfer torque (STT)-MRAM–based non-volatile memory into its 22FFL process, calling it “the first FinFET-based MRAM technology.” Describing the technology as “production-ready,” Intel did not name any foundry customers for the process, but multiple sources said that it is already being used in products now shipping.Samsung (Seoul), meanwhile, described STT — MRAM in a 28-nm FDSOI platform. STT-MRAM is regarded as the best MRAM technology in terms of scalability, shape dependence, and magnetic scalability.MRAM technology has been in development since the 1990s but has yet to achieve widespread commercial success. “I think it’s time we show something manufacturable and something commercial,” said Yoon Jong Song, a principal engineer in Samsung’s R&D center and the lead author of the company’s IEDM paper.In addition to being seen as a promising candidate for standalone devices to replace memory chip stalwarts DRAM and NAND flash — which are facing serious scaling challenges as the industry moves to smaller nodes — MRAM, which is a non-volatile memory, is appealing as an embedded technology replacement for flash and embedded SRAM because of its fast read/write times, high endurance, and strong retention. Embedded MRAM is considered especially promising for applications such as internet-of-things (IoT) devices.An electron microscope image showing the cross-section of the MTJ array, which is embedded between Metal 2 and Metal 4 in Intel’s 22-nm FinFET logic process. (Source: IEDM/Intel)Globalfoundries has, since last year, been offering embedded MRAM on its 22FDX 22-nm FD-SOI process. But Jim Handy, principal analyst with Objective Analysis, said that he is not aware of any commercial products shipping the Globalfoundries’ embedded MRAM technology.“The reason why nobody has picked it up is because of the fact that they would have to add new materials,” he said.But embedded MRAM is gaining greater consideration as manufacturing costs come down and other memory technologies face scalability challenges. “The big deal is that, with new process technologies, the size of the SRAM cell isn’t shrinking with the rest of the process, so MRAM becomes increasingly appealing,” said Handy.In its paper, Intel said that its embedded MRAM technology achieves 10-year retention at 200°Celsius and endurance of more than 106 switching cycles. The technology uses a 216 × 225 mm 1T-1R memory cell.Samsung, meanwhile, described its 8-Mb MRAM with endurance of 106 cycles and retention of 10 years.Song said that the Samsung technology will be initially available for IoT applications, adding that the reliability has to improve before it can be used in automotive and industrial applications. “We have successfully transferred the technology from lab to fab and will be moving it to market in the near future.”
2018-12-13 00:00 阅读量：2500
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
型号 品牌 抢购
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。