UMC Appoints Co-presidents as CEO Steps Down

发布时间：2017-06-19 00:00
作者：Ameya360
来源：EE Times
阅读量：1060

　　Taiwanese foundry United Microelectronics Corp. (UMC) is taking a page from its biggest rival's playbook, naming a pair of senior executives to lead the company as co-presidents as CEO Po-Wen Yen steps down.

　　On Wednesday (June 16), UMC announced Yen's retirement and appointed Shan-Chieh Chien (SC) Chien and Jason Wang co-presidents, collectively accountable for the overall performance of UMC. They will report directly to UMC Chairman Stan Hung.

　　Chien, a 30-year veteran of semiconductor R&D, is responsible for the core manufacturing and technology aspects of UMC, including R&D and operations. Chien has been with UMC since 1989 and has held various technology and engineering positions within the company ever since.

　　Wang will focus on the business aspects of UMC, including corporate strategy and planning, sales & marketing, and customer engineering. He joined UMC as vice president of corporate marketing in 2008 and served as president of UMC-USA from 2009 to 2014. Most recently he was a senior vice president in charge of global sales and marketing.

　　In appointing two executives to lead the company, UMC is following the lead of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), its much larger rival. In 2013, TSMC named Mark Liu and C. C. Wei presidents and co-CEOs of the company reporting directly to Morris Chang. The arrangement has persisted ever since.

　　Dual leadership in company management has become more popular in recent years. EDA and IP vendor Synopsys Inc. has had two chief executives since 2012. MediaTek, a prominent Taiwanese SoC vnedor, also has two chief executives.

　　"Co-presidents Chien and Wang bring complementary experience and capabilities to enable UMC to have the best minds committed to our most critical decisions and execution ability,” Hung, UMC's chairman, said in a press statement.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：MediaTek Chooses TSMC for 7nm

下一篇：Western Digital Sues to Halt Toshiba Sale

在线留言询价

相关阅读
Ameya360:UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow
Trade news

Ameya360:UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow

　　Cadence Design Systems Inc.’s 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for United Microelectronics Corp.’s (UMC) chip stacking technologies, thereby enabling faster time to market for customers.　　UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications. Using UMC’s 40nm low power (40LP) process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation, and system analysis in a single platform.　　“Interest in 3D-IC solutions has increased notably in the past year as our customers seek ways to boost design performance without sacrificing area or cost,” said Osbert Cheng, vice president of device technology development and design support at UMC. “Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.”　　“With increasing design complexity for IoT, AI, and 5G applications, wafer-on-wafer technology automation is increasingly important for chip designers,” said Don Chan, vice president, R&D in the Digital & Signoff Group at Cadence. “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”　　The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database. The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit. Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis. The reference flow also enables system-level layout versus schematic (LVS) checking to connectivity accuracy, electric rule-checking (ERC) for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.　　In addition to the Integrity 3D-IC platform, the Cadence 3D-IC flow also includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Celsius Thermal Solver for system analysis.
2023-02-22 15:54 阅读量：1736
UMC Halts R&D Project with China Chipmaker
Trade news

UMC Halts R&D Project with China Chipmaker

Taiwan’s United Microelectronics Corp. (UMC) has shelved an R&D project with Chinese chipmaker Fujian Jinhua after the U.S. government ordered a ban on supplies of equipment to the company.The U.S. government on Monday cut off U.S. firms from supplying Fujian Jinhua following allegations that the Chinese fab stole intellectual property from U.S. semiconductor company Micron Technology. The move comes as the U.S. escalates a trade war with China that is increasingly focused on high-tech products.UMC and Jinhua started a project in May 2016 to develop technology for DRAM chips. Jinhua agreed to supply equipment and an unspecified amount of money to UMC for development of the technology at a UMC fab in Tainan, Taiwan. As part of the agreement, the partners would jointly own the technology. UMC planned to use the technology for its foundry customers and did not plan to enter DRAM production or invest in Jinhua.“We are just following the regulations set forth by the Taiwan government and the U.S. government,” UMC spokesman Richard Yu told EE Times regarding the suspended R&D project.  Taiwan’s Bureau of Foreign Trade issued a bulletin to domestic companies regarding business with Fujian Jinhua following the U.S. government ban.Yu was unable to elaborate on what technology, if any, UMC has transferred to Jinhua at this stage. He noted that the R&D project has been underway for more than two years.The U.S. Commerce Dept. said that Fujian Jinhua is nearing completion of its DRAM fab and that its technology likely originated in the U.S. The Chinese company, which has invested $5.7 billion in a 12-inch fab in Fujian Province’s Jinjiang City, is scheduled to start its first production this year.With the support of the Chinese government, several startups in the nation aim to make memory chips to reduce dependence on imports of semiconductors.UMC’s R&D work for Jinhua has been done at the 32nm node, which is several generations behind state-of-the-art technology for DRAM production. UMC developed its DRAM technology a number of years ago, Yu said.It is possible that Jinhua might eventually shrink the technology acquired from UMC, but UMC was not contracted to do further refinements, according to Yu.It is likely that Jinhua plans to use the technology to make commodity DRAM.UMC is part of a joint-venture investment with another Fujian chipmaker called United Semi in the city of Xiamen, but the Taiwan company has no equity relationship with Fujian Jinhua.
2018-11-02 00:00 阅读量：1076
UMC and Avalanche Technology partner for MRAM development and 28nm production
Trade news

UMC and Avalanche Technology partner for MRAM development and 28nm production

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a global semiconductor foundry, and Avalanche Technology, Inc., the next generation STT-MRAM (Spin Transfer Torque Magnetic RAM) leader, today announced that they have entered a partnership for joint development and production of MRAM to replace embedded flash. UMC will also make this technology available to other companies through licensing with Avalanche Technology Inc.Under the terms of the agreement, UMC will provide embedded non-volatile MRAM blocks based on UMC’s 28nm CMOS manufacturing process. This will enable customers to integrate low latency, very high performance and low power embedded MRAM memory blocks into MCUs and SoCs, targeting the Internet of Things, wearable, consumer, industrial and automotive electronics markets.The two companies are also considering to expand the cooperation beyond 28nm, as Avalanche Technology’s CMOS compatibility and scalability to advanced process nodes enables integration of unified memory (non-volatile as well as SRAM) blocks into next generation highly integrated MCUs and SoCs. This allows system designers to maintain the same architecture and software ecosystem without a redesign.“We’re excited to team with a world leader in semiconductor manufacturing such as UMC to bring this outstanding technology to market,” said Petro Estakhri, CEO and co-founder of Avalanche Technology.“UMC is continuously introducing enhanced process offerings to bring added competitive benefits to our customers,” said G C Hung, vice president of Advanced Technology Development at UMC. “With embedded NVM becoming more prevalent in today’s IC designs, we have developed a strong portfolio of robust eNVM process solutions for high growth sectors such as emerging consumer and automotive applications. We are happy to cooperate with Avalanche Technology for 28nm MRAM, and we look forward to ramping this process to production for UMC customers.”
2018-08-07 00:00 阅读量：2287
UMC Board Approves 100% Acquisition of MIFS Fab from Fujitsu
Trade news

UMC Board Approves 100% Acquisition of MIFS Fab from Fujitsu

United Microelectronics Corporation announced that its Board of Directors has approved for the company to fully acquire Mie Fujitsu Semiconductor Limited (MIFS), a 12-inch wafer foundry based in Mie, Japan, from Fujitsu Semiconductor Limited (Fujitsu Semiconductor). Based on the net value of MIFS on March 31, 2018, the purchase value will be no more than ¥ JPN 57.63 billion. UMC currently owns 15.9% of MIFS shares. Under the terms of the agreement, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MIFS a wholly-owned subsidiary.UMC’s Board of Directors also approved plans for the company to apply with the China Securities Regulatory Commission for UMC’s mainland operations to be listed on the Shanghai Stock Exchange as an A-list offering. HeJian Technology (Suzhou) Co. will represent UMC’s China businesses, which include HeJian’s 8” fab, United Semi and its 12” fab in Xiamen and Shandong-based UDS, which provides IC design support services.Jason Wang, co-president of UMC said, “UMC is experiencing high demand from mature 12" processes. With new applications in 5G, IoT, automotive and AI requiring these technologies, we anticipate the market conditions driving this demand to remain strong. With existing 300mm fabs in Taiwan, China and Singapore, Japan-based MIFS will help customers further diversify their manufacturing risk with a robust production base to ensure business continuity while enhancing UMC’s worldwide service quality. We are excited that the strong partnership between UMC and Fujitsu Semiconductor will enable us to achieve further growth and provide customers with higher value through the acquisition of MIFS.”Co-president Wang continued, “An A-share listing on the Shanghai Stock Exchange for our HeJian-led China subsidiaries provides an ideal path for UMC to quickly capitalize on the rapid growth of China’s semiconductor market and facilitate long-term development. The raised capital would be allocated towards reinvestment in UMC’s successful China operations in order to provide customers with a complete, integrated IC manufacturing solution from chip design to manufacturing, which will help expand our market share and further increase production scale, technical quality, and overall competitiveness.”Listing of A-shares to provide a more diversified source of local funds improves the company’s financial structure and strengthens the company's asset and capital positions, while allowing more capital to remain in Taiwan. As part of the listing, UMC can also attract and retain top local talent through implementation of an Employee Stock Ownership Program (ESOP).The revenue of HeJian constitutes about 11% of UMC’s consolidated revenue, while the number of new shares planned for issue will also be around 11% of the total shares outstanding. UMC will remain the majority shareholder possessing approximately 87% of HeJian’s equity, with no meaningful dilution to the rights and interests of the parent company.Co-president Wang added, “UMC has always been committed to expanding its operating scale, strengthening customer competitiveness and enhancing shareholder value through globally diversified manufacturing. The Board of Directors’ approval to fully acquire MIFS from Fujitsu and publicly listing our China operations on the local stock exchange will help drive UMC’s long-term development and achieve global synergies that will strengthen the company's manufacturing competitiveness, while maintaining our established base in Taiwan.”
2018-07-03 00:00 阅读量：2292
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
型号 品牌 抢购
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。

请输入下方图片中的验证码：

验证码