Tight Memory Supply Drives Micron's Record Sales

发布时间:2017-07-03 00:00
作者:Ameya360
来源:EE Times
阅读量:1064

  Micron Technology continues to build on a momentum that started late last year with a strong fiscal third quarter, ended June 1.

  Revenues for the quarter were a record $5.57 billion. That’s 20 percent higher compared to the previous quarter and 92 percent higher compared to the third quarter of fiscal 2016. It’s also the first quarter for new Micron president and CEO Sanjay Mehrotra, who in a statement outlining the quarterly financials said the strong operational performance with free cash flow nearly double that of the previous quarter enabled the company to retire $1 billion in debt. The results reflect Micron’s execution of its cost reduction plans and ongoing favorable industry supply and demand dynamics, he added.

  Mehrotra joined Micron in May after a long career at SanDisk prior to its sale to Western Digital last year, serving as president and CEO from 2011 to 2016. In a live webcast, Mehrotra said the company saw record revenues across all business units, driven by its technology portfolio and broad customer reach, as well as a favorable pricing environment for both NAND and DRAM. He also cited artificial intelligence (AI), machine learning and autonomous driving as strong segments as memory and storage become an increasingly strategic element in these applications.

  Micron’s compute and networking business unit saw a significant increase demand, in part due to increased enterprise demand as analytics and in-memory data processing pushed up DRAM content, while revenue from cloud customers was four times higher year over year. Micron Senior Vice President and Chief Financial Officer Ernie Maddock said success in the cloud segment can be attributed not only to the higher DRAM content demand, but company’s focused efforts to increase market penetration by addressing its needs.

  On the mobile front, Micron plans to introduce nearly 20 new 1x designs in the next 12 months, and is developing MCP and discrete NAND to address a full range of smartphones. Mehrotra said demand is strong for both value devices and higher-end smartphones. The company is currently sampling its 32-layer 3D NAND MCP and discrete eUFS and eMMC devices. “Many mobile OEM customers prefer MCPs in their design implementation to address their memory and storage requirements as MCPs provide a single source for DRAM memory and NAND storage, simplifying their system design, validation, and supply chain considerations,” he said.

  While the mobile segment was solid performer, Micron’s embedded business unit experienced record quarterly revenue in automotive, consumer / connected home, and industrial applications; the unit’s revenue was up 44 percent year over year. Mehrotra frequently referenced potential for automotive throughout the webcast, particularly autonomous vehicles. The company is maintaining a market share leadership position in automotive, he said, driven by infotainment and instrumentation systems. Voice-activated assistants and set-top boxes were big contributors on the connected home front. In the meantime, the company is in the process of transitioning its non-automotive embedded DRAM portfolio to 20n designs.

  Finally, Micron’s storage business also saw record revenue driven by a 30 percent quarter over quarter growth in SSDS, with sales to cloud and enterprise customers exceeding client sales.

  Overall, Mehrotra said Micron sees a healthy demand environment into 2018. The company’s priorities are focusing on being competitive by introducing new technology quickly, while strengthening business fundamentals. It is ramping up 64-layer 3D NAND and 1x DRAM technologies, he said, and expects to achieve meaningful output by end of fiscal 2017. The company’s third generation 3D NAND will be based on its CMOS Under Array Architecture, which allows for a smaller die and lower cost.

  Mehrotra said Micron is making progress in the cloud and enterprise markets and sees greater opportunities ahead, but it has some work to do. The company is focusing on having a mix of system level solutions in the NAND portfolio, as well as stronger controller and firmware capabilities with a roadmap for both internal and external controllers.

  Micron is forecasting a DRAM industry bit supply growth of 15 to 20 percent in calendar 2017, while NAND industry bit supply growth will be in the 30 to low 40 percent range. And although the favorable pricing environment is expected to persist into 2018, Micron cautioned that in the first half of the year its bit growth will be lower than industry average for DRAM due to its 1x transition, followed by a stronger second half.

  Jim Handy, principal analyst with Objective Analysis, said the favorable pricing environment is a big contributor to Micron’s current success. “It's mostly about the environment," Handy said. "We're in a shortage."

  It means the company is “basically printing money now,” thanks to unusually high profit margins for both DRAM and flash, he added. “Prices for flash and DRAM have both gone up, which goes against what the semiconductor market usually does,” Handy said.

  But Handy said Micron is also doing a good job of executing and controlling costs. There’s a reason why there were 28 DRAM makers in 1990s and only three today. “The dropouts weren't able to lower their cost structures quick enough,” Handy said.

  He did agree there are opportunities for DRAM ahead, especially as autonomous driving is falling to into place faster thanks to Google’s backing, which could be a boon to Micron.

  In the bigger picture, any new president will have a change of focus in mind for the company, said Handy, and Mehrotra wants to be more customer-focused and concentrate on longer-term and higher margin opportunities. “The good pricing environment is a nice thing, but whether it’s a good pricing or a bad pricing environment, all of these things will make the company stronger,” he said.

  Micron is clearly bullish on its technologies, said Handy, and is in a strong position with its 1x DRAM and 3D NAND. The company has struggled in the past to launch them in a timely fashion. But while they were third to market with 3D NAND, Handy said, "once they got into 3D NAND they executed very well."


(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
What is a memory chip?  What are the types of memory chips?
  Memory chips are the main components used for storage In the realm of computing and digital devices, and play a very important role in the entire integrated circuit market.  These chips serve as the foundation upon which our digital world operates, facilitating the storage and retrieval of information in devices ranging from smartphones and laptops to complex servers and embedded systems.  What is a memory chip?A memory chip, fundamentally an integrated circuit (IC), is a crucial electronic component designed to store, retrieve, and manage data within a digital device. These chips come in various types and configurations, each tailored to serve specific purposes within electronic systems.  What are the types of memory chips?RAM (Random Access Memory): One of the most common types of memory chips, RAM is volatile memory used by computers to temporarily store data that the CPU needs quick access to during operation. It enables swift read and write operations, facilitating multitasking and overall system performance.  ROM (Read-Only Memory): Unlike RAM, ROM is non-volatile memory, meaning it retains data even when the power is turned off. ROM is commonly used to store firmware and permanent instructions essential for booting up devices and initializing hardware components.  Flash Memory: This non-volatile memory type finds its application in devices like USB drives, Solid State Drives (SSDs), memory cards, and embedded systems. Flash memory allows for both reading and writing operations, making it suitable for storing files, applications, and operating systems.  EEPROM (Electrically Erasable Programmable Read-Only Memory): EEPROM combines the qualities of both volatile and non-volatile memory. It’s rewritable and often used in smaller capacities to store configuration settings and small amounts of essential data.  What are the applications of memory chips?The ubiquity of memory chips spans across an extensive array of applications and devices, playing a pivotal role in their functionality:  • Computers and Laptops: RAM enables quick access to data during computations, while ROM stores firmware and BIOS instructions essential for system startup.  • Smartphones and Tablets: Memory chips in these devices handle data storage for applications, media files, and the operating system, ensuring smooth multitasking and user experience.  • Digital Cameras and Camcorders: These devices utilize memory chips to store photos, videos, and settings, allowing users to capture and retain precious moments.  • Embedded Systems and IoT Devices: Memory chips facilitate the functioning of embedded systems and IoT devices, managing data crucial for their operations in various industries like healthcare, automotive, and home automation.  How to make a computer chip?The creation of a memory chip involves intricate processes conducted in specialized semiconductor fabrication plants. The process can be summarized in several key steps:  Design and Layout: Engineers meticulously design the chip’s layout, determining the arrangement and connections of transistors and circuits.  Lithography: A crucial step where the chip’s design is imprinted onto a silicon wafer using photolithography techniques.  Etching and Doping: Unwanted portions of the silicon wafer are removed, and specific regions are doped with materials to alter their conductivity and create the desired electronic components.  Layering: Multiple layers of conductive and insulating materials are deposited onto the wafer to form intricate circuitry.  Testing and Packaging: The fabricated chips undergo rigorous testing to ensure functionality and quality. Once validated, they are packaged into final products for integration into various devices.  What is the difference between a logic chip and memory chip?While both logic and memory chips are essential components of electronic systems, they serve distinct functions:  Logic Chip:  A logic chip is designed to perform computational tasks, execute instructions, and manage the flow of data within a digital device. These chips contain integrated circuits that implement logical operations, arithmetic calculations, and control functions. They are the brains of a system, carrying out operations based on instructions received from software or firmware.  Examples of logic chips include Central Processing Units (CPUs), Graphics Processing Units (GPUs), microcontrollers, and Application-Specific Integrated Circuits (ASICs). CPUs, for instance, process data, perform calculations, and execute instructions, while GPUs specialize in handling graphics-related tasks.  Memory Chip:  In contrast, a memory chip is specifically dedicated to storing and retrieving data. These chips don’t perform computational or logical operations but instead focus on holding information temporarily or permanently within a system. Memory chips are responsible for enabling the storage and retrieval of data for various purposes, such as program execution, data manipulation, or long-term storage.  Types of memory chips include Random Access Memory (RAM), Read-Only Memory (ROM), Flash Memory, and Electrically Erasable Programmable Read-Only Memory (EEPROM). RAM, for example, stores data temporarily while the system is running, allowing quick access for the CPU to carry out operations. ROM holds essential instructions and data that remain intact even when the power is turned off. Flash memory is used for non-volatile storage in devices like USB drives and SSDs, while EEPROM allows for rewritable non-volatile storage in smaller capacities.  How long does a memory chip last?  The longevity of memory chips varies based on usage, quality, and environmental factors. Under normal operating conditions, these chips can last for many years, potentially even decades. However, excessive usage, high temperatures, or voltage fluctuations may impact their lifespan.
2023-11-20 14:33 阅读量:1336
Shortage of Intel CPU to Impact Notebook Shipments, Causing Further Price Decline in the Memory Market
TrendForce has adjusted its 2018 global notebook shipments projection downwards due to the worsening shortage of Intel CPUs. Intel originally planned to begin mass production of CPUs based on its latest Whiskey Lake platform in 3Q18, when the notebook market would be in the busy sales season. However, PC-OEMs are now finding an insufficient supply of Whiskey Lake CPUs, which has disrupted vendors’ notebook shipment plans for this year’s second half. Therefore, TrendForce now estimates that this year’s total notebook shipments will drop by 0.2% YoY, and the CPU shortage may further impact the entire memory market as well.The precise reason behind the shortage of Intel CPUs is currently unclear because the problem simultaneously affects the newly arrived CPU product lines and product lines that have been in the market for some time. The affected products include the improved version of 14nm++ and product lines based on the 14nm+ Coffee Lake platform, which has been in mass production for half a year and is one of the solutions for mainstream models in the notebook market. The lack of supply for existing CPU product lines is having a significant impact on the notebook market as a whole. TrendForce estimates that the CPU supply gap in the notebook market has increased from around 5% in August to 5-10% in September. There is a possibility that the supply gap may extend to over 10% in 4Q18, and the shortage is expected to be resolved rather later in 1H19.DRAM prices to slide, with PC DRAM anticipating larger price decline due to the CPU shortageTrendForce notes that the CPU shortage is expected to impact the entire memory market as well. DRAM prices are now approaching an inflection point after climbing for nine successive quarters. DRAMeXchange, a division of TrendForce, previously estimated that the contract prices of PC DRAM products will drop by around 2% QoQ in 4Q18 as the market gradually shifts into oversupply. However, it is now possible that the price decline will become larger due the shortage of Intel CPUs and lower demand for notebooks and PC DRAM in a row.On the other hand, the impact of the CPU shortage may also expand to the NAND Flash market. The insufficient supply would cause PC OEMs’ lower expectations of notebooks demand in the upcoming busy season, thus affecting the demand for SSD in the second half of this year. Therefore, TrendForce expects the SSD price decline to be steeper in 4Q18 than in this quarter.With regard to the server market, the migration from the Grantley to the Purley platform is currently taking place. According to TrendForce’s survey, a minority of server OEMs are experiencing longer lead time in the deliveries of Purley processors. This issue will be followed up because it will affect future server shipments if it becomes more widespread. Moreover, both the NAND Flash and DRAM markets are much more vulnerable to the falling demand from the server application than from the PC or notebook application. Therefore, downward corrections of demand for server memory products will cause a steeper drop in quotations of memory products as a whole.
2018-09-13 00:00 阅读量:1233
China will take a 'long time' to catch up to memory chip rivals, industry expert says
Even as China doubles down on its efforts to dominate the memory chip industry, its domestic companies continue to lag behind the global competition, an industry executive told CNBC on Thursday.The semiconductor industry has been around for decades, but it is poised for another round of growth due to the emergence of new technologies like artificial intelligence and the fifth-generation of mobile networks, according to Lung Chu, president of SEMI China."There's a lot of opportunities in semiconductor," Chu told CNBC's Eunice Yoon at the Morgan Stanley Technology, Media and Telecom Conference in Beijing.In 2014, the Chinese government issued guidelines for the development of China's semiconductor industry through innovation and investments, he explained. "There's evidence that money has been put in but I think it will take a long time for China to catch up with the global leaders."SEMI is a global association for the semiconductor industry, and is present in countries such as the United States, China and South Korea.Last year, global semiconductor revenue topped $400 billion, according to research firms Gartner and IHS Markit. The latter said worldwide revenue grew 21.7 percent and reached $429.1 billion in 2017. The industry is dominated by the likes of Samsung Electronics, Intel, SK Hynix, and Qualcomm.Chu said China was responsible for more than half of the global consumption in the chip industry, yet Chinese local suppliers meet only about 13 percent of the domestic demand. According to Chu, that means Beijing has a massive trade deficit in this space."That's a major concern for the government, for the economy, but it's also a great opportunity for local companies to get into the (integrated circuits) business," he said. "That's the driving force as to why China wants to do more."As part of its Made in China 2025 goals, Beijing wants to have have locally produced chips used in smartphones to make up about 40 percent of the domestic market by 2025, in a move to cut down its reliance on imports. The country's dependency on foreign chips was highlighted when the United States imposed a supplier ban on Chinese telecommunications equipment maker ZTE, which crippled its business.China has raised multiple funds for semiconductor development since 2014, with contributions from government-backed enterprises and industry players to push local companies to develop their own chips that can rival the global competition, according to various reports. Beijing's involvement in the development of its semiconductor industry has been one of the main complaints from the U.S. over China's technology practices.Amid the ongoing trade war between China and the U.S., Chu said many companies in the semiconductor space are worried about investing in the Chinese market."However, because the market is here, the customer is here, the China strategy has to be part of the global strategy or the corporate strategy," he said.
2018-08-31 00:00 阅读量:1127
Memory ICs to Account for 53% of Total 2018 Semi Capex
IC Insights forecasts total semiconductor capital expenditures will rise to $102.0 billion this year, marking the first time that the industry has spent more than $100 billion on capital expenditures in one year.  The $102.0 billion spending level represents a 9% increase over $93.3 billion spent in 2017, which was a 38% surge over 2016.Figure 1 shows that more than half of industry capital spending is forecast for memory production—primarily DRAM and flash memory—including upgrades to existing wafer fab lines and brand new manufacturing facilities. Collectively, memory is forecast to account for 53% of semiconductor capital expenditures this year.  The share of capital spending for memory devices has increase substantially in six years, nearly doubling from 27% ($14.7 billion) in 2013 to a forecast of 53% ($54.0 billion) of total industry capex in 2018, which amounts to a 2013-2018 CAGR of 30%.Figure 1Of the major product categories shown, DRAM/SRAM is forecast to show the largest increase in spending, but flash memory is expected to account for the largest share of capex spending this year (Figure 2).  Capital spending for the DRAM/SRAM segment is forecast to show a 41% surge in 2018 after a strong 82% increase in 2017.  Capital spending for flash memory is forecast to rise 13% in 2018 after a 91% increase in 2017.Figure 2After two years of big increases in capital expenditures, a major question looming is whether high levels of spending will lead to overcapacity and a softening of prices.  Historical precedent in the memory market shows that too much spending usually leads to overcapacity and subsequent pricing weakness.  With Samsung, SK Hynix, Micron, Intel, Toshiba/Western Digital/SanDisk, and XMC/Yangtze River Storage Technology all planning to significantly ramp up 3D NAND flash capacity over the next couple of years (and new Chinese memory startup companies entering the market), IC Insights believes that the future risk for overshooting 3D NAND flash market demand is high and growing.
2018-08-30 00:00 阅读量:962
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
型号 品牌 抢购
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。