AMEYA360 explains：How many chips are included in new energy vehicles

发布时间：2023-08-31 16:39
作者：AMEYA360
来源：网络
阅读量：2274

　　New energy vehicles are an important direction for the future development of the automotive industry, and the heart of them is the automotive chip. Automotive chips are an important part of automotive electronic systems. They are responsible for collecting and processing information from various parts of the car, and then controlling various operations of the car based on this information. Below we will mainly introduce the types of automotive chips.

AMEYA360 explains：How many chips are included in new energy vehicles

　　How many chips does a car need?Over the past few decades, the application of semiconductor products in automobiles has rapidly expanded, and automotive electronics has become one of the fastest-growing market segments. According to data , the number of automotive chips required for traditional fuel vehicles is 600-700, and the number of automotive chips required for electric vehicles will increase to 1,600 per vehicle, and the demand for chips for more advanced smart cars is expected to increase to 3,000 chips per vehicle.

　　What are the major categories of automotive chips?

　　Control chipControl chip: MCU, SOC

　　The control chip (MCU), also known as “micro control unit”, is responsible for computing power and processing, and is used for engine/chassis/body control, etc., such as AI chips for autonomous driving perception and fusion. Nowadays, more and more chips are installed on cars. From power systems, to vehicle systems, to safety systems, we can see a large number of chips. MCU accounts for about 30% of the number of semiconductor devices used in a car.

　　Computing chipsComputing chips; CPU, GPU, FPGA, etc.

　　Central processing unit (CPU) chip: In cars, CPU chips are mainly used in car infotainment systems, such as car navigation, music playback, etc. This chip can handle complex computing tasks, connect to multimedia interfaces, and provide powerful processing capabilities.

　　Graphics processing unit (GPU) chip: Mainly used in Advanced Driver Assistance System (ADAS) and autonomous driving systems, used to process large amounts of video and image data for object recognition, pedestrian recognition, driving route planning, etc.

　　Power chipsPower chips: IGBT, silicon carbide, power MOSFET

　　Power semiconductors are the core of power conversion and circuit control in electronic devices. They are mainly used to change voltage and frequency, DC to AC conversion, etc. in electronic devices. In new energy vehicles, the average usage of medium and high-voltage MOSFETs per vehicle has increased to more than 200.

　　Communication chipsCommunication chips: cellular, WLAN, CAN/LIN, satellite positioning, NFC, Bluetooth, ETC, Ethernet, etc.

　　The wireless communication chip can realize the connection between the car and the Internet, provide data transmission function, and support vehicle information service, remote control, real-time navigation and other functions.

　　CAN controller chips are mainly used for internal communication in cars, such as information transfer between the engine control module and the brake control module. The CAN controller can effectively organize and manage the data flow between various systems of the vehicle, ensure the accurate transmission of information, and improve the overall operating efficiency of the vehicle.

　　Memory chipsMemory chips: DRAM, NOR FLASH, EEPROM, SRAM, NAND FLASH

　　The car’s infotainment system, navigation system, security system, etc. all require a lot of storage space, so memory chips also play an important role in the car. Common memory chips include flash memory chips, solid-state hard drive chips, etc. They can store large amounts of data and provide fast read and write speeds to ensure smooth operation of the system.

　　Power supply/analog chipPower supply/analog chip: SBC, analog front end, DC/DC, digital isolation, DC/AC

　　In a car, the power management chip is mainly responsible for the power supply of on-board electronic equipment, including starting power, lamp power, instrument panel power, etc. It can effectively manage and distribute power to ensure the normal operation of on-board electronic equipment. According to statistics, analog circuits account for 29% of automotive chips, of which 53% are signal chain chips and 47% are power management chips.

　　Driver chipDriver chip: high-side driver, low-side driver, LED/display, gate-level driver, bridge, other drivers, etc.

　　For electric vehicles, the motor control chip plays a vital role. It can control the speed and steering of the motor to ensure the stable driving of the car. At the same time, the motor control chip can also effectively manage the power of the battery, improve the efficiency of the battery, and prolong the service life of the battery.

　　Security chipSecurity chip: T-Box/V2X security chip, eSIM/eSAM security chip

　　Automobile information security and driving safety are the focus of consumers’ attention, so various security chips are widely used in automobiles. Such chips include identity authentication chips, data encryption chips, etc., which can protect the data security of the car and prevent illegal access and attacks.

　　Sensor chipsSensor chips: ultrasonic, image, voice, laser, millimeter wave, fingerprint, infrared, voltage, temperature, current, humidity, position, pressure, etc.

　　Sensor chips play a very important role in automobiles, including speed sensors, pressure sensors, temperature sensors, radar sensors, etc. These sensors can monitor the running status of the car in real time, provide important information to the driver, and provide necessary data support for the car’s safety system.

　　ConclusionThe trend of vehicle electrification and intelligence brings incremental demand for chips. The semiconductor value of traditional fuel vehicles is mainly concentrated in the fields of body control and chassis safety. New energy vehicles are facing electrification and intelligent upgrades, and there is an increasing demand for chips in fields such as electric drive, electric control, automatic driving, smart cockpit, data storage, and communication.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：RENESAS RX26T new lineup expansion : Suitable for Motor Control Applications

下一篇：Knowledge of electronic components: How Do Thermistors Work?

在线留言询价

相关阅读
What are AI chips What types of mainstream AI chips are there
Trade news

What are AI chips What types of mainstream AI chips are there

　　AI chips are not equivalent to GPUs (graphics processing units). Although GPUs can be used to perform some AI computing tasks, AI chips are chips that are specifically designed and optimized for artificial intelligence computing.　　First of all, the GPU was originally designed for graphics processing, and its main function is to process images, render graphics, and graphics acceleration. It features massively parallel processing units and a high-bandwidth memory system to meet image processing and computing needs. Since artificial intelligence computing also requires large-scale parallel computing, GPU has played a certain role in the field of AI.　　However, compared with traditional general-purpose processors, AI chips have some specific designs and optimizations to better meet the needs of artificial intelligence computing. Here are some key differences between AI chips and GPUs:　　1. Architecture design: AI chips are different from GPUs in architecture design. AI chips typically have dedicated hardware accelerators for performing common AI computing tasks, such as matrix operations and neural network operations. These hardware accelerators can provide higher computing performance and energy efficiency to meet the requirements of artificial intelligence computing.　　2. Computing optimization: The design of AI chips focuses on optimizing computing-intensive tasks, such as the training and reasoning of deep learning models. They usually use specific instruction sets and hardware structures to accelerate common calculations such as matrix multiplication, convolution operations, and vector operations. Compared with this, the design of GPU focuses more on graphics processing and general computing, and may not be so efficient for some AI computing tasks.　　3. Energy efficiency and power consumption: AI chips usually have high energy efficiency and low power consumption to meet the needs of large-scale AI computing and edge devices. They employ several power-saving techniques and optimization strategies to reduce power consumption while maintaining performance. In contrast, GPUs may require more power when handling complex graphics tasks.　　4. Customization and flexibility: AI chips are usually designed for specific AI application scenarios and can be customized and developed according to specific computing needs. This custom design can provide better performance and effects, while GPU is a general-purpose processor suitable for a wide range of computing tasks.　　What types of mainstream AI chips are there?　　1. Graphics Processing Unit (GPU): GPU was originally designed for graphics processing, but due to its highly parallel computing capabilities, it is gradually being used to accelerate AI computing tasks. NVIDIA’s GPUs are widely used in the field of AI computing, such as NVIDIA Tesla series and GeForce series.　　2. Application-Specific Integrated Circuit (ASIC): ASIC is a specially customized chip optimized for a specific application. In the field of AI, ASIC chips, such as Google’s Tensor Processing Unit (TPU) and Bitmain’s ASIC chips, have efficient AI computing capabilities.　　3. Field-Programmable Gate Array (FPGA): FPGA is a reconfigurable hardware platform that allows users to customize programming according to specific needs. In AI computing, FPGA can be optimized according to different neural network architectures, with flexibility and scalability.　　4. Neural Processing Unit (NPU): NPU is a chip specially designed for neural network computing tasks. They usually have a highly parallel structure and specialized instruction sets to accelerate the training and inference of neural network models. Huawei’s Kirin NPU and Asus’ Thinker series chips are common NPUs.　　5. Edge AI Chips: Edge AI chips are AI chips specially designed for edge computing devices, such as smartphones, Internet of Things devices, and drones. These chips typically feature low power consumption, high energy efficiency, and small size to suit edge devices. For example, Qualcomm’s Snapdragon series chips integrate AI acceleration.　　Leading companies and products of AI chips　　1. Huawei　　Kirin NPU: Huawei’s Kirin chip series integrates its own NPU to provide efficient AI computing capabilities. These chips are widely used in Huawei’s smartphones and other devices.　　2 NVIDIA　　GPU products: NVIDIA’s GPU series include GeForce, Quadro and Tesla, among which Tesla series GPUs are widely used in deep learning and AI computing.　　Tensor Core: NVIDIA’s Tensor Core is a hardware unit specially designed to accelerate deep learning calculations, integrated in its GPU.　　3. Google　　Tensor Processing Unit (TPU): The TPU developed by Google is an ASIC chip specially used to accelerate artificial intelligence calculations. TPUs are widely used in Google’s data centers to accelerate machine learning tasks and inference workloads.　　4. Intel　　Intel Nervana Neural Network Processor (NNP): Intel NNP is an ASIC chip designed for deep learning reasoning. It has a highly parallel architecture and optimized neural network computing power.　　5. AMD　　Radeon Instinct: AMD’s Radeon Instinct series of GPUs are designed for high-performance computing and deep learning tasks. These GPUs have powerful parallel computing capabilities and support deep learning frameworks and tools.　　6. Apple　　Apple Neural Engine: Apple has integrated Neural Engine in its A-series chips, which is a hardware accelerator dedicated to speeding up machine learning and AI tasks. It is used to support functions such as face recognition and voice recognition.
2023-09-25 15:39 阅读量：1886
What is the relationship between chips, semiconductors and integrated circuits
Trade news

What is the relationship between chips, semiconductors and integrated circuits

　　Chips, semiconductors and integrated circuits are important concepts in the electronics field. As technology continues to develop, their application scope and influence are also expanding. So what is the relationship and difference between chips, semiconductors and integrated circuits? Let us find out together in this article.　　What is a chip?A chip, also known as a microcircuit, microchip, or integrated circuit (IC), refers to a silicon chip containing an integrated circuit. It is very small and is often part of a computer or other electronic equipment.　　Chip is the collective name for semiconductor component products. It is the carrier of integrated circuit (IC) and is divided into wafers. A silicon wafer is a small piece of silicon that contains an integrated circuit that is part of a computer or other electronic device.　　What is semiconductor?Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions and temperature measurement. For example, a diode is a device made of semiconductors. A semiconductor is a material whose conductivity can be controlled, ranging from an insulator to a conductor. Whether from the perspective of technology or economic development, the importance of semiconductors is huge.　　The core units of most electronic products, such as computers, smartphones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials.　　What is an integrated circuit?An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected, made on a small or several small semiconductor chips or dielectric substrates, and then packaged in a tube shell , becoming a microstructure with required circuit functions; all components in it have structurally formed a whole, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letters “IC” in circuits.　　The inventors of the integrated circuit are Jack Kilby (integrated circuits based on germanium (Ge)) and Robert Noyce (integrated circuits based on silicon (Si)).　　Most applications in the semiconductor industry today are silicon-based integrated circuits. This is a new type of semiconductor device developed in the late 1950s and 1960s. It is a small piece of silicon that integrates semiconductors, resistors, capacitors and other components required to form a circuit with certain functions and the connecting wires between them through semiconductor manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation. on-chip, and then solder the electronic device packaged in a tube. Its packaging shell comes in various forms such as round shell type, flat type or dual in-line type.　　Integrated circuit technology includes chip manufacturing technology and design technology, which is mainly reflected in processing equipment, processing technology, packaging and testing, mass production and design innovation capabilities.　　What is the relationship between chips, semiconductors and integrated circuits?There is a close relationship between chips, semiconductors and integrated circuits.It can be said that a semiconductor is a material, a chip is a carrier of electronic components manufactured using semiconductors, and an integrated circuit is a technology and product that integrates multiple electronic components onto a chip.　　Chip is the collective name for semiconductor component products. It is the carrier of integrated circuit (IC, integrated circuit) and is divided into wafers.　　Integrated circuits refer to active devices, passive components and their interconnections that make up a circuit and are fabricated on a semiconductor substrate or an insulating substrate to form a structurally closely connected and internally related electronic circuit. It can be divided into three main branches: semiconductor integrated circuits, film integrated circuits, and hybrid integrated circuits.　　Semiconductors are the basic materials needed to make chips and integrated circuits. A chip is a carrier made of semiconductor material on which multiple electronic components are integrated. These components can be transistors, resistors, capacitors, etc. and are used to perform various circuit functions.　　Integrated circuits are technologies and products that integrate multiple electronic components onto a single chip. By integrating these components onto a chip, complex circuit functions can be implemented in a smaller, more efficient space. The invention and development of integrated circuits has greatly improved the performance of electronic devices and played an important role in computers, communications, consumer electronics and other fields.　　Therefore, semiconductors are the basic materials for chips and integrated circuits. Chips are the carrier of integrated circuits, while integrated circuits are technologies and products that integrate multiple electronic components on a chip to achieve various functions. The relationship between them can be understood as a hierarchical relationship from materials to products.　　If you need to purchase chips, please visit AMEYA mall to consult online customer service!
2023-09-20 14:09 阅读量：2440
Packaging Chips For Cars
Trade news

Packaging Chips For Cars

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle.This is true for all safety-critical applications, but for automotive in particular there are several key reasons why packaging has taken on a whole new level of interest:• Performance and low power. Advanced packaging options can reduce the bottlenecks for the flow of data, speeding up response time for critical systems, particularly accident avoidance in autonomous and driver-assisted vehicles.• Reuse and time to market. Standardized packaging, such as chiplets, can significantly reduce the amount of time it takes to bring automotive chips and features to market. Automotive OEMs have been struggling to reduce time to market for designs from as long as seven years to one or two years.• Protection. Harsh environmental conditions and an almost constant assault of vibration, electromagnetic interference and thermal extremes make packaging critical to protect the chips.This is all good news for the outsourced semiconductor assembly and testing (OSAT) packaging houses, which are churning out a number of packaging options for this market. Among those are multiple flavors of wafer-level fan-outs, embedded wafer-level ball-grid array, package-on-package, and system-in-package.To put this in perspective, automotive accounted for 9% of primary end markets last year for semiconductors, IC Insights estimates. This is a significant market in its own right, and it is growing quickly. The majority of chips produced still end up in communications or computers, but automotive several years ago was a small fraction of the overall chip market. It is growing quickly, and so is the value of the chips that are sold into this market.In the past, the automotive chip market was all about actuators and low-end microcontrollers. There are advanced designed being developed for vehicles today at 10/7nm, with plans to push that to even lower-node manufacturing processes.“It’s a huge market so far,” says Edward Fontanilla, group deputy director for technology strategy at JCET, the parent company of STATS ChipPAC. He says the total available market for OEMs in automotive was $136 billion in 2017 and will enjoy a compound annual growth rate of 13.4%, reaching $170 billion in 2022.Chips going into advanced driver-assistance systems (ADAS) and other vehicle applications alone represent a $28 billion market, according to Fontanilla. In total, 20% of automotive chips will be going into infotainment systems, while powertrain components will account for 13%, he says.Gartner forecasts the worldwide semiconductor market will grow to $451 billion this year, up 7.5% from last year’s $419 billion. Automotive will help drive demand for application-specific standard products this year, the market research firm predicts, along with graphics cards for gaming PCs, high-performance computing, and wired communications.The top suppliers of automotive chips are NXP Semiconductors, Infineon Technologies, and Renesas Electronics, he noted. They are followed by STMicroelectronics and Texas Instruments, according to Semicast Research. Rounding out the top 10 are Robert Bosch, ON Semiconductor, Microchip Technology, Toshiba, and ROHM Semiconductor, in that order.Among the OSATs providing packaging for auto chips, Amkor Technology is the market leader, with 56% share. Advanced Semiconductor Engineering (ASE) holds about 25%, while STATS ChipPAC represents less than 5%, Fontanilla says.“Although we are not yet the same as far as Amkor and ASE in terms of automotive, we are looking to the future where we can also leverage on the big customers we have,” he adds. “We’re focusing mainly on infotainment, the advanced driver-assistance systems, the body systems, electric vehicles, as well as the aftermarket segment.” JCET is also focusing on LiDAR sensors and radar. “These are the key segments we are focusing on in 2018,” he says, adding that it will take five years for ADAS and automated driving to be fully realized.The special requirements for automotive semiconductor packaging depend on the customer involved. “We are more interested on the reliability side, because we all know that zero defects are the safety concern of our user,” Fontanilla says. “Another special requirement for automotive chip packaging, of course, is the process flow of the packaging. They are different from the standard chips. Automotive is tighter in terms of process control and quality control.”Zero defects is the new bar for automotive OEMs, and that is true for the chips inside a package as well as for the package. To ensure there are no defects, automotive chip packaging has a special inspection methodology. So as with the manufacturing of automotive chips, the packaging equipment is dedicated and designated and generally kept separate from other packaging lines. Every six months, the operators and engineers involved in automotive chip packaging go through training refreshment.In addition to the ISO 26262 standard for functional safety, the ISO 16949 standard for quality management systems in the automotive industry supply chain must be met. STATS ChipPAC expects to be certified on 26262 this year, first in Singapore, then in South Korea and China.Some similarities in packaging automotive chips and other chips exist. The process flow is similar in laminate substrates and leaded packages, Fontanilla says. The bill of materials set for automotive chips is different, however, and customers are willing to pay for that. One leading customer, not identified, accounts for $7 million a month in automotive chip packaging, he notes.The next-generation automotive electronics “will be a lot of sensors — not only a hundred sensors, but more and more sensors going on,” Fontanilla adds. “The avoidance of collisions, parking systems, brake systems, everything will be automated.”Revving up designsJean-Marc Yannou, senior technical director at the ASE Europe unit of ASE Group, says the packaging of automotive chips is often similar to the packaging of chips destined for consumer applications. That’s a big change from several years ago.“Technology needed to be mature for a good five years before it would be adopted in the past,” says Yannou. “The timeframe is shortening now. And we don’t need to change the materials.”One issue in manufacturing was motor contamination, which eventually led to reliability problems, Yannou notes. Corrosion could result.Packaging serves a vital role here, and it will become even more important as chips are relied upon to avoid accidents at high speed. But ask two people what kind of package is best for this market and you will likely end up with multiple answers. All of them can play a role — leadframes, laminates, packaging using wire bonding for the interconnections, and flip-chip packages.Fan-out wafer-level packaging and system-in-package technology are also finding their way into advanced automotive electronics. Automotive manufacturers and Tier 1 suppliers are shying away from SiP, at least for now, due to the higher packaging cost. SiP can be complicated for those companies, although they are becoming attracted to the “increasingly compact” nature of SiP, Yannou says.The kinds of components going into cars include microcontrollers, sensors, radar chips, Internet protocol chips, and sensor-based electronics. “Automotive chip packaging is one of the fastest growing markets for us,” Yannou says. It now represents about 10% of the semiconductor packaging market, with a growth rate of 10% to 15% a year.This isn’t just more chips, though. It’s more chips that have to work correctly, and packaging is a key component of that, says Prasad Dhond, vice president and general manager of automotive at Amkor Technology.“The ‘multiplier effect’ is a big challenge in automotive semiconductor reliability,” he notes. “This is where a 1 part per million failure at the component level will translate to a 1% defect rate in the vehicle. For the highest reliability, we need zero defects. Packaging has a big role to play in achieving zero defects in automotive applications.”Some of that is being driven by standards, which are not ordinarily associated with packaging. “ISO 26262 is related to functional safety and bulk of the compliance falls on chip and system designers. We support customers who have ISO 26262-compliant solutions by supplying supporting documentation as needed. We also help customers meet other automotive reliability standards, such as AEC-Q100 and AEC-Q006. We are developing automotive material sets and process flows to help our customers drive toward zero defects.”Amkor offers 40 different package families to its automotive customers, at 11 automotive production facilities, all but one of which are in the Asia-Pacific region. The company has been active in packaging auto chips for more than four decades. Between Amkor and J-Devices, the auto chip packaging business represents more than $1 billion in annual revenue.Dhond points to three main requirements to be a successful automotive OSAT:• Quality systems based on automotive standards. This includes automotive certifications such as IATF16949 and compliance with AIAG (Automotive Industry Action Group) standards such as FMEA, SPC, APQP.• Tighter manufacturing controls, enhanced material sets, and additional process steps.• Capability to make significant capital outlays, manage a high-quality supply chain, and support production for a long period of time (10 to 15 years).Some in-cabin and aftermarket automotive applications (AEC-Q100 Grade 3) have the same reliability requirements as commercial-grade applications.“These components could use commercial-grade packaging materials and process flows, but still need enhanced automotive controls on the factory floor,” he says. “Overall, the automotive packaging market is about $10 billion, and growing faster than the overall packaging market. Electrification and ADAS are key trends driving this increase. Most automotive applications are using wire-bond packaging today, but they are moving to advanced packaging to support greater integration and lower parasitics. Traditionally, integrated device manufacturers have kept automotive packaging internal, but we see more of an outsourcing trend as demand increases. Also, fabless suppliers are becoming key players in the automotive market, giving tailwinds to the OSAT business.”On the fast trackThe automotive chip packaging market is on a fast track, with technology enabling advanced driver-assistance systems leading ultimately to automated driving. The OSAT contractors are deeply involved in the field, although some vendors of automotive chips are keeping their packaging work on the inside.That could change as this market begins to spike, and as complexity and time-to-market demands begin ratcheting up with increasing levels of driver assistance and autonomy. And so will the demands on the packaging houses to protect electronics that will work for extended periods of time under the worst conditions imaginable.
2018-05-08 00:00 阅读量：1336
Scientists integrate opitcal components into chips designs
Trade news

Scientists integrate opitcal components into chips designs

A group of researchers from MIT, the University of California at Berkeley and Boston University have developed a technique for assembling on-chip optics and electronic separately, which enables the use of more modern transistor technologies.The technique can be used by existing manufacturing processes and according to Amir Atabaki, one of the research scientists involved in the project, "The most promising thing about this work is that you can optimise your photonics independently from your electronics."Moving from electrical communication to optical communication is an attractive proposition for chip manufacturers because it could significantly increase chips' speed and reduce power consumption, an increasingly important advantage as chips' transistor count continues to rise:The integration of optical - or "photonic" - and electronic components on the same chip reduces power consumption. The optical communications devices currently on the market tend to consume too much power and generate too much heat to be integrated into an electronic chip such as a microprocessor.Atabaki and his colleagues have used a more space-efficient modulator design, based on a photonic device called a ring resonator."We have access to photonic architectures that you can't normally use without integrated electronics," Atabaki explains. "For example, today there is no commercial optical transceiver that uses optical resonators, because you need considerable electronics capability to control and stabilize that resonator."In addition to millions of transistors for executing computations, the researchers' new chip includes all the components necessary for optical communication: modulators; waveguides, which steer light across the chip; resonators, which separate out different wavelengths of light, each of which can carry different data; and photodetectors, which translate incoming light signals back into electrical signals.Silicon must be fabricated on top of a layer of glass to yield useful optical components. The difference between the refractive indices of the silicon and the glass is what confines light to the silicon optical components.Earlier work on integrated photonics involved a process called wafer bonding, in which a single, large crystal of silicon is fused to a layer of glass deposited atop a separate chip. The new work, in enabling the direct deposition of silicon on top of glass, uses polysilicon, which consists of many small crystals of silicon.Single-crystal silicon is useful for both optics and electronics, but in polysilicon, there's a trade-off between optical and electrical efficiency. Large-crystal polysilicon is efficient at conducting electricity, but the large crystals tend to scatter light, lowering the optical efficiency. Small-crystal polysilicon scatters light less, but it's not as good a conductor.Using the manufacturing facilities at SUNY-Albany's Colleges for Nanoscale Sciences and Engineering, the researchers tried out a series of recipes for polysilicon deposition, varying the type of raw silicon used, processing temperatures and times, until they found one that offered a good trade-off between electronic and optical properties."I think we must have gone through more than 50 silicon wafers before finding a material that was just right," Atabaki said.
2018-04-23 00:00 阅读量：1180
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
型号 品牌 抢购
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。