Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation

发布时间：2023-12-25 15:41
作者：AMEYA360
来源：Renesas
阅读量：2097

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched a new cloud-based development environment aimed at streamlining the software design process for automotive AI engineers. The new platform, AI Workbench, is an integrated virtual development environment that empowers automotive AI engineers to design, simulate and fine-tune their automotive software - all within the cloud.

Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation

　　With this environment, engineers can immediately begin designing automotive software by leveraging Microsoft Azure services including Azure Compute, IaaS services, Microsoft Entra ID and Azure Security. Instead of installing tools on a PC or obtaining an evaluation board, they can perform tasks such as performance evaluation, debugging and verification using simulation tools online. This approach aligns with the "Shift-Left" approach, which enables software creation and testing earlier in the design cycle, even before the actual hardware becomes available. For example, it is possible to start developing AI-enabled application software to support ADAS (Advanced Driver Assistance System) and autonomous driving for the upcoming fifth-generation R-Car System on Chip (SoC) prior to the availability of hardware samples. This environment will serve as a unified development platform for designing and testing Renesas’ scalable automotive SoCs and microcontrollers (MCUs), regardless of product type or application.

　　“We are thrilled to introduce a cloud-based virtual development and AI model performance testing environment for automotive AI engineers in collaboration with Microsoft, a leading cloud technology provider," said Mandali Khalesi, Global VP, HPC AI and Cloud Technology at Renesas. “We are committed to improving the AI development environment through new features such as continuous monitoring and analysis of software usage.”

　　“Cloud-based development is a secure and cost-effective method to address the increasing complexities of today’s embedded projects. The collaboration between Renesas and Microsoft aims to tackle this challenge and accelerate the digital transformation of the automotive industry,” said Ulrich Homann, Corporate Vice President & Distinguished Architect, Cloud + AI, Microsoft. “With Renesas’ AI Workbench, developers can now efficiently build and test software for a myriad of applications using Renesas SoCs in a cloud-based environment powered by Azure."

　　The AI Workbench includes the following four functional blocks today. Renesas plans to enhance its offering in the future with additional features such as selected functionality or customization options tailored to support various development processes.

　　Upgraded AI Compiler Toolchain

　　Renesas will upgrade its SoC AI compiler toolchain with a novel “Hybrid Compiler (HyCo)” architecture and make it available through the AI Workbench. The new HyCo architecture developed in house and kernel libraries will allow engineers to unlock broader AI model and ONNX operator coverage, beyond the coverage of existing-third party hardware accelerator compilers available on Renesas SoC such as DSPs and NPUs.

　　AI Model Performance Testing Environment

　　Renesas will provide NNPerf, an online test environment for developers to evaluate the performance of AI models running on live Renesas SoCs with an updated hybrid AI compiler. Testing will run on real hardware in Renesas’ global device farm, without the need for evaluation boards. With the ability to batch code programs, perform real-time inference tests, and compare performance across different AI models, application engineers can estimate and make decisions on tradeoffs between models, memory footprints, latency and more.

　　Software Development Environment

　　Microsoft's code editor, Visual Studio Code (VSCode) and a software development kit (SDK) from Renesas are both available in the cloud. Using the tool suite, developers can launch their development environment in the cloud in a matter of minutes. Developers can customize their independent development environment and perform all design work using just a web browser on their PC.

　　Software Evaluation/Verification Environment

　　Renesas will also provide an environment for developers to test and verify their application software using the AI models defined in the AI model performance testing tool NNPerf. This includes simulators such as SILS (Software in the Loop Simulator), and HILS (Hardware in the Loop Simulator), allowing users to verify the operation designed for their specific AI application.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：3PEAK Launches TPU25401, a Highly Integrated Auto-Grade PMIC Chip

下一篇：Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce

在线留言询价

相关阅读
Renesas Launches Ultra-Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings
Trade news

Renesas Launches Ultra-Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and accurately detects different particle sizes, volatile organic compounds, and gasses harmful to human health. With a Renesas microcontroller (MCU) on board, the module offers an intelligent sensor management solution for a growing market of air monitoring applications, including air purifiers, smoke detectors, HVAC systems, weather stations, and smart home systems. Its robust firmware also enables customer products to comply with various air quality standards around the world.　　The RRH62000 features one of the smallest footprints in its class of sensor modules, measuring only 46.6 x 34.8 x 12 mm. It packs Renesas’ RA Family MCU and seven sensor signals: the laser-based PM1/ 2.5/ 10 sensor, ZMOD4410 gas sensor, and the HS4003 humidity and temperature sensor. Together, these sensors can detect particulate matter, total volatile organic compounds (TVOC), estimated CO2, temperature, and humidity all in one system. All key components have been pre-integrated and fully calibrated at the factory, allowing developers to start their sensor system designs right out of the box.　　"Our RRH62000 module represents the next step in sensor fusion technology, which combines data from multiple sensors and turns it into comprehensive and actionable insights for environmental monitoring," said Uwe Guenther, Sr. Director, Modules and Solutions Product Line at Renesas. "We are dedicated to providing integrated sensing solutions that simplify development for customers and will continue to drive innovation in sustainable products that reduce environmental impact and enhance safety and comfort in our lives."　　Public interest in air quality and its effects on health has increased significantly since the COVID-19 pandemic. People are now more aware of how air pollutants can affect respiratory health and overall well-being. Less known is that pollutants are typically six to ten times more concentrated indoors than outdoors. These include dust, paint fumes, smoke from cooking, pollen, and particulates from HVAC filters, which can enter the respiratory system and cause lung damage, cancer, and other health problems.　　In order to meet these new challenges, Renesas’ new sensor module is equipped to monitor a broad range of air quality conditions. Using laser-based technology, which offers higher precision compared to conventional LED methods, it can monitor concentrations of PM1, PM2.5, and PM10 particulates -- particles with diameters of 0.3- to 10µm -- as well as absolute or relative TVOC measurements in different power mode settings, providing the highest level of accuracy for these pollutants. The RRH62000 delivers seven sensor outputs simultaneously, and its onboard MCU allows the system to detect surrounding air quality data in real time.　　The RRH62000 combo module comes with building standard firmware plus artificial intelligence (AI) algorithms, which lets engineers configure the sensors to conform to the requirements of various green air quality standards in public buildings, such as The Well Building Standard (WELL), Home Ventilating Institute (HVI) and RESET. With these features, for example, a school in China can use the same hardware as one in the U.S. or another location and simply update the AI-enabled firmware for its needs.　　Intelligent sensor devices, such as the Renesas RRH62000 and recently announced RRH46410 gas sensor module, can support demand-controlled ventilation, allowing HVAC systems to adjust airflow based on carbon dioxide levels and occupancy information to maintain optimal air quality and energy efficiency. Similarly, these modules use AI algorithms to predict when HVAC filters must be replaced or detect an anomaly before system failure occurs, significantly saving cost and time for system maintenance.　　Key Features of the RRH62000 All-in-One Sensor Module　　Up to 7 simultaneous sensor outputs　　Laser-based technology for accurate detection of PM1, PM2.5, PM10　　Metal oxide-based gas sensor　　Precise temperature and humidity sensor　　Absolute measurement of TVOC　　Estimated CO2 for low-cost CO2 room indication　　Ultra-compact size: 46.6 x 34.8 x 12mm to fit in many applications　　On-board MCU for smart sensor management　　Robust & Siloxane resistant　　Support I²C and UART communication　　Winning Combinations　　Renesas has combined the RRH62000 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. This includes the In-home Air Quality Monitoring System and Air Quality Monitor (PM2.5) with Secure Cloud Connection, which combine the RRH62000 with the RA6M3 and RL78/G14 MCUs, and various power devices to enable cost-efficient, compact, modular solutions for modern appliances. These Winning Combinations are technically vetted system architectures designed from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RRH62000 is available today along with the RRH62000-EVK evaluation kit. The RRH46410 and the RRH46410-EVK are also available. Please contact your local sales teams for more details. A blog about the new air quality sensor module is also available on the Renesas website.
2024-08-26 14:10 阅读量：649
Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC
Trade news

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a complete space-ready reference design for the AMD Versal™ AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates key space-grade components for power management. It targets the cost-effective AI Edge with both rad-hard & rad-tolerant plastic solutions specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion.　　The new ISLVERSALDEMO3Z power management reference design is fully qualified, enabling easy integration into satellite payload architectures. It includes a PMBus interface, giving users control of fault behaviors, protection levels and output regulation voltage. The new reference design also offers telemetry readouts of internal signals for system diagnostics. It is the industry’s only space-qualified power management system with a digital wrapper to optimize information transmission. The core power solution of this reference design is easily scalable with regard to output power, optimizing customers’ investments in design and qualification over time.　　As the number of Low-Earth Orbit (LEO) satellites increases, the need for lower cost space-grade systems is growing rapidly. Customers traditionally concerned with minimizing SWaP (Size, Weight and Power consumption) are now interested in reducing cost as well (SWaP-C). Renesas’ new ISLVERSALDEMO3Z power management reference design optimally addresses all of these factors. Space-grade plastic components decrease size, weight and cost while wide-bandgap GaN FETs enable the highest efficiency power conversion.　　The new Versal AI Edge Adaptive SoC converts raw sensor data into useful information, making the XQRVE2302 ideal for anomaly and image detection applications. It has a nearly 75% smaller board area and power savings over the previous-generation XQRVC1902. It also integrates the enhanced AMD AI Engine (AIE) technology, known as AIE-ML, which has been optimized for machine learning (ML) applications. Unlike competitive offerings, it supports unlimited reprogramming.　　“We’re proud to team with AMD to deliver this advanced solution that addresses the most pressing concerns of space customers,” said Josh Broline, Sr. Director, Marketing and Applications of the HiRel Business Division at Renesas. “Along with our hallmark power management expertise, this reference design meets SWaP-C objectives, enables real-time system monitoring and control, and unlocks the power of AI.”　　“The Versal™ AI Edge XQRVE2302 Adaptive SOC delivers unprecedented features and performance for the rapidly growing space market,” said Minal Sawant, senior director, Aerospace & Defense Vertical Market, AMD. “We’re pleased that Renesas offers advanced power management functionality that enables our customers to take full advantage of this solution.”　　Renesas’ new ISLVERSALDEMO3Z power management reference design comes with power management devices that have been tested and verified to withstand exposure to high levels of radiation. These include Pulse Width Modulation (PWM) controllers, GaN FET half-bridge drivers, point-of-load (POL) regulators, and power sequencers. The devices come in small-footprint packages, so the core power rail components take up just 67 square centimeters of board area.　　Also, the ISLVERSALDEMO3Z mates seamlessly with the ISL71148VMREFEV1Z voltage monitor reference design with 14-bit resolution to accurately monitor all 11 core power rails of the Versal AI Edge Adaptive SOC. The high resolution enables reliable system health monitoring. It includes a “dual-footprint” to accommodate both space plastic and rad-hard hermetic solutions.
2024-07-19 14:24 阅读量：684
Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software
Trade news

Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched R-Car Open Access (RoX), a development platform for software-defined vehicles (SDVs) that integrates all essential hardware, operating systems (OS), software and tools needed for automotive developers to rapidly develop next-generation vehicles with secure and continuous software updates. Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the SDV platform includes comprehensive tools for the seamless deployment of AI applications. By pre-integrating all fundamental layers required to develop SDVs, RoX drastically reduces the complexities for car OEMs and Tier 1 suppliers, saving time and money.　　The advent of SDVs represents a major step forward in automotive technology – accelerating toward more driving autonomy, electrification and connected experiences. Cars have to be aware of the 360-degree surrounding space with ASIL D levels of sensing, processing and control to deliver safety and autonomy applications. The in-cabin experiences for drivers and passengers are being revolutionized. As a result, modern electrical/electronics (E/E) architecture depends on software to control vehicle functions, manage real-time data networks across different ECU zones, and provide customer differentiation. It has become more difficult to maintain and upgrade these complex software stacks while ensuring the highest levels of safety. Renesas’ customizable solution solves these challenges by offering a cloud-native development environment and a simulation platform, supporting the software-first approach and parallel hardware and software development.　　Out-of-box Platform with Market-Ready Software Stacks　　The flexible RoX SDV platform is available in two versions. “RoX Whitebox” is an open, easily accessible software package that includes royalty-free OS and hypervisor software such as Android Automotive OS, FreeRTOS, Linux, Xen and Zephyr RTOS, as well as reference applications designed for specific domain systems. “RoX Licensed” is based on industry-proven commercial software solutions, such as QNX and Red Hat In-Vehicle Operating System, as well as AUTOSAR-compliant software and SAFERTOS®. It is pre-integrated and tested to run on Renesas’ R-Car SoCs and MCUs and includes pre-validated software stacks from STRADVISION for Advanced Driver Assistance Systems (ADAS) and Candera CGI Studio for in-vehicle infotainment (IVI), to name a few. These software solutions can be easily productized and customized or expanded depending on OEMs’ needs.　　With the RoX SDV platform, automotive system engineers can start building their software immediately using a highly integrated toolchain even before the hardware is available. This is made possible through the cloud environment and the virtual development platform, which let developers design, debug in simulation, and verify their software before deploying on live SoCs and MCUs. The virtual development platform includes the Renesas Fast Simulator (RFS) as well as partner solutions such as ASTC VLAB VDM and Synopsys Virtualizer Development Kit (VDK) to provide broad coverage of simulation speed, features and use cases.　　For seamless end-to-end AI development, RoX offers the AI Workbench to enable developers to validate and optimize their models and test their AI applications all in the cloud, either on the virtual development platform or on Renesas board farms. A wide range of AI models, automated pipelines, as well as a specific hybrid compiler toolchain (HyCo) are available to support the rapid AI deployment on the R-Car heterogeneous compute platform across generations of SoCs.　　AWS Cloud Services Now Available　　The RoX SDV platform now supports Amazon Web Services (AWS) cloud computing services as part of the AI Workbench development environment. With the Renesas R-Car SDK (Software Development Kit) containerized in the AWS cloud environment, developers can innovate and optimize their designs more efficiently. This tight integration allows them to simulate and test hardware and software combinations instantly and deploy AI applications that seamlessly run on R-Car devices.　　Scalable R-Car Gen 5 Family　　The RoX SDV platform is designed for current generation R-Car SoCs, the upcoming R-Car Gen 5 MCU/SoC Family, and future devices. The SDV platform provides car OEMs and Tier1 suppliers the flexibility to design a broad range of scalable compute solutions for ADAS, IVI, gateway and cross-domain fusion systems as well as body control, domain and zone control systems.　　Renesas’ R-Car Gen 5 is currently the only hardware architecture in the industry that can accommodate the full range of processing requirements – from zonal ECUs to high-end central compute, serving from entry-level vehicles to luxury-class models. Thanks to a new unified hardware architecture based on Arm® CPU cores, customers developing with the R-Car Gen 5 devices will be able to reuse the same software and tools across diverse E/E applications that span car models and generations, preserving their engineering investments. Renesas’ high-performance SoC products will offer both domain-specific and cross-domain solutions using application processing, large display capabilities, sensor connectivity, GPU and AI processing.　　“RoX is a significant advancement that will speed up the shift-left approach for software-defined vehicles,” said Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “Today, car OEMs and Tier1 suppliers are heavily investing in software development and maintenance. Renesas understands this challenge and is closely working with them to deliver a flexible, ready-to-deploy development solution that can be maintained throughout the vehicle’s lifespan. The RoX platform empowers our customers to design vehicles that deliver new value and bring improved safety and delightful comfort experiences to drivers and passengers.”　　“At AWS, we’re committed to helping our customers and partners accelerate development and bring innovation to drivers faster than ever before,” said Andrea Ketzer, Director of Technology Strategy, Automotive & Manufacturing at AWS. “With Renesas’ R-Car Gen 5 devices supported by the AI Workbench on AWS, customers will achieve faster and more validated simulations and the ability to develop independently of hardware. This step change in development will drive the industry forward and place software innovation at the forefront of mobility.”　　According to TechInsights, the market shift to domain, zonal and centralized architectures will translate to a growing processor market, incorporating SoCs and MCUs, worth $25.9 billion by 2031. “Being able to maintain and upgrade complex software stacks that incorporate operating systems, hypervisors and other functional software stacks will thus become an increasingly critical element of the supply chain,” said Asif Anwar, Executive Director of Automotive End Market Research at TechInsights. “By also being able to offer cloud-native environments to support a software-first approach to development and testing of the hardware, the Renesas RoX SDV platform offers a ready-built ecosystem that encompasses these elements in support of a scalable portfolio of next generation R-Car Gen 5 processors to address this sizable market.”　　Renesas’ R-Car Open Access Platform is being demonstrated at the AWS Summit Japan in Tokyo from June 20-21.　　RoX SDV Platform Partners:　　Operating System/Hypervisor Partners　　QNX　　Red Hat　　Vector AUTOSAR　　WITTENSTEIN SAFERTOS®　　Software Stack Partners　　Candera CGI Studio　　EPAM AosEdge　　Excelfore eSync　　MM Solutions　　STRADVISION SVNet　　Nullmax　　Development Tools Partners　　ASTC VLAB Works　　Synopsys Virtualizer Development Kit (VDK)　　Cloud Partners　　AWS　　Microsoft Azure　　Availability　　The R-Car Open Access Platform is available today with the option to license. Open-source OS, commercial OS, full application software stacks, virtual development, cloud infrastructure and debugging and emulation tools are available by Renesas or through partners. Additional information about the development platform is available here and information about the R-Car Gen 5 Family can be found here. Please contact your local sales teams for more details.
2024-06-20 10:53 阅读量：781
Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence
Trade news

Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence

　　TOKYO, Japan and HYDERABAD, India, June 05, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and the Indian Institute of Technology Hyderabad (IITH) have signed a three-year memorandum of understanding (MOU) for research and collaboration in the field of VLSI and embedded semiconductor systems. The engagement with IITH professors and staff will focus on R&D and academic interactions with a goal to drive innovation in India’s semiconductor industry and advance the nation’s “Make in India” strategy.　　The signing ceremony of the agreement was held on June 3, 2024 at the IITH in Telangana state between Malini Narayanamoorthi, Country Head of India and Senior Director of Engineering, Analog & Connectivity Product Group, Renesas, and Prof. B.S. Murty, Director, IITH.　　The MOU will help the IITH foster talent development in support of India’s ambition to build a self-reliant semiconductor industry while enabling Renesas to add talented employees in India through closer collaboration with the country’s educational institutions to capture huge market opportunities.　　Under the MOU, Renesas this year will begin supporting university course curriculum development, hands-on learning using Renesas development boards and various outreach programs designed to advance lab work and proof-of-concept projects. IITH engineering students will be eligible to apply for six-month Renesas internships and pursue full-time employment with the company.　　“India holds significant importance within our business operations, and we appreciate its dynamic innovation environment and strong potential for growth,” said Julie Pope, Senior Vice President and Chief Human Resources Officer, Renesas. “We are delighted to partner with IITH in its goal to be the cradle for semiconductor innovation in India. We aim to strengthen India's semiconductor product ecosystem, and support the “Make in India” objective of providing increasing semiconductor content for India and the world.”　　“Recognizing the importance of India at the forefront of the semiconductor industry in influencing the future, our collaboration with Renesas will provide a chance for our students to gain exposure and learn directly from Renesas experts about constructing products with cutting-edge technologies. IITH is pioneering several initiatives to foster talent development in Electronic System Design and Manufacturing (ESDM) sector across India. This synergistic collaboration is a booster to that effort. This is also a pathway for R&D collaboration as IITH boasts several expert faculty spanning across several departments who can co develop next generation electronic products with Renesas,” said Prof. B.S. Murty, Director, IITH. “The opportunity for employment at a leading global company is a tremendous additional benefit.”　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　About IIT Hyderabad　　Indian Institute of Technology Hyderabad (IITH) is one of the eight IITs established by the Government of India in 2008. In a short span of 15 years, the institute has become one of the top-ranked institutions in the country and has received global recognition. It has 300+ full-time faculty, 4,700+ students (60% of them being PG+PhD students), 18 Departments + 1 Centre for Interdisciplinary Programs, nearly 500+ state-of-the-art Research Facilities, and five research and entrepreneurship centres. The institute has a strong research focus with approx. Rs. 1,100+ Cr of sanctioned research funding (Rs. 250+ Cr in 2023-24). IITH has more than 10,500+ research publications with 1,60,000+ Citations, 275+ Published Patents, 3,700+ sponsored/consultancy projects with 500+ running projects, and about 190+ startups that have generated 1,100+ jobs and a revenue of Rs. 1,500+ Cr.
2024-06-12 13:37 阅读量：838
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
型号 品牌 抢购
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。