ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

Release time:2024-07-11
author:AMEYA360
source:ROHM
reading:1120

  ROHM has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30W to 1kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types.

ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

  Analog controlled power supplies are commonly used in industrial robotics and semiconductor manufacturing equipment that operate in the medium power range. However, in recent years these power supplies are also required to provide a high level of reliability and precise control that make it difficult to meet market demands with analog-only configurations. On the other hand, while fully digitally controlled power supplies enable fine control and settings, they are not widely adopted in the small to medium power range due to the high power consumption and cost of the digital controller. To address this issue, ROHM developed the LogiCoA™ power solution that leverages the strengths of both analog and digital technologies. High performance low power LogiCoA™ MCUs are utilized to facilitate control of a variety of power supply topologies.

  The LogiCoA™ brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. ROHM’s LogiCoA™ power solution is the industry’s first* “analog-digital fusion control” power supply that combines a digital control block centered around the LogiCoA™ MCU with analog circuitry comprised of silicon MOSFETs and other power devices.

  In a fully digital control power supply, the functions handled by digital controllers such as high-speed CPUs or DSPs can be processed by low-bit MCUs, making it possible to achieve increased functionality that is difficult to realize with an analog control power supply at low power consumption and cost. This solution allows for the correction of performance variations in peripheral components according to the power supply circuit by storing various settings such as current and voltage values in the LogiCoA™ MCU. As a result, there is no need to consider design margins unlike with analog control power supplies, contributing to smaller power supplies that provide greater reliability. On top, as operation log data can be recorded in the MCU's nonvolatile memory, it is ideal for power supplies in industrial equipment that require logging as a backup in case of malfunction.

  The evaluation reference design REF66009 allows users to experience the LogiCoA™ power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional LogiCoA001-EVK-001 evaluation board.

  Going forward, ROHM will continue to develop LogiCoA™ MCUs to support various power supply topologies, contributing to achieving a sustainable society by making the power supply block (which accounts for the majority of power loss in applications) more energy efficient and compact.

ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

  LogiCoA™ BrandLogiCoA™ is a brand that embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. By combining the advantages of analog circuitry with those of digital control, it is possible to maximize the potential of circuit topologies, contributing to more efficient power utilization. As LogiCoA™ is a design concept that can be applied not only to the power supply field, but also to power solutions as a whole, ROHM is considering its application in future products and solutions.

ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

  Details of the LogiCoA™ Power Supply Reference DesignThe REF66009 evaluation reference design offered on ROHM's website allows users to verify the functionality of the LogiCoA™ MCU along with the basic operation of the LogiCoA™ power supply solution using a non-isolated 12V buck converter circuit. Sample software available on the reference design page makes it possible to confirm the sequence control of execution tasks and the monitoring of various parameters in the actual set using the LogiCoA001-EVK-001 reference board. For more information on the reference board, please contact a sales representative or the contact page on ROHM’s website.

ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

  Application Examples• Industrial robots

  • Semiconductor manufacturing equipment

  • Gaming applications

  Supports mounting in a wide range of general industrial equipment and consumer devices (30W to 1kW).

  About the LogiCoA™ MCUROHM is developing LogiCoA™ MCUs optimized for integrated analog-digital control such as LogiCoA™ power supply solutions. Features include a built-in 3ch analog comparator that can be linked to a timer and D/A converter that enables digital control of various parameters to support different power supply topologies.

  ■ LogiCoA™ MCU Specifications (Tentative)

  Availability: Now (LogiCoA™ MCU samples)

  TerminologyFully Digital Control Power Supply

  A power supply controlled using digital technology. High-speed CPUs and DSPs can be used to precisely monitor and control various parameters such as voltage and current, improving power supply efficiency and reliability. What’s more, functions that are difficult to perform with analog control can be achieved, such as acquiring operation log data. However, CPUs and DSPs are expensive and consume a large amount of power, which can be a bottleneck in terms of costs and energy efficiency.

  Analog Control Power Supply

  A power supply configuration consisting of analog components. This type has become mainstream for power supplies 1kW and below due to its simplicity and low power consumption. On the other hand, implementing advanced functionality such as setting arbitrary parameters and logging data is difficult, requiring fully digital control that entails high costs and power consumption.

  CPU (Central Processing Unit)

  Responsible for executing programs and processing data. Handles calculations and processing as well as carrying out instructions according to a program.

  DSP

  A device that digitizes analog signals and performs operations such as analysis, filtering, and amplification on the converted digital signals. Flexible enough for high-speed processing and various applications, it plays an important role in circuits that handle digital signals, such as audio and image processing in addition to power supplies.

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
  ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.  The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.  In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.  This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.  The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.  What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.  Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.  The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.  Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.  Specifications  Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.  The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.  Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.  Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.
2026-04-29 10:03 reading:251
ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures
  ROHM has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers.  In recent years, the rapid proliferation of generative AI and big data processing has accelerated the deployment of high-performance servers in the industrial equipment sector. The resulting surge in power density is placing a greater strain on power infrastructure, raising concerns about localized supply shortages. While smart grids that combine renewable energy sources (i.e., solar power) with existing power supply networks are emerging as a possible solution, minimizing losses during energy conversion and storage remains a key challenge.  In the automotive sector, next-generation electric vehicles require extended cruising range and faster charging, creating demand for lower-loss inverters and higher performance onboard chargers (OBCs). Against this backdrop, the adoption of SiC devices capable of both low loss and high efficiency is increasing in high-power applications ranging from a few kilowatts to hundreds of kilowatts.  As the first semiconductor company globally, ROHM was the first in the world to begin mass production of SiC MOSFETs in 2010, contributing to reducing energy losses by implementing SiC devices over a wide range of high-power applications, including offering an early lineup of products compliant with automotive reliability standards such as AEC-Q101. Furthermore, the 4th generation SiC MOSFETs, for which sample provision began in June 2020, have been adopted globally in automotive and industrial applications. They are available across a broad product portfolio, including both discrete devices and modules, supporting the rapid market adoption of SiC technology.  The newly developed 5th Generation SiC MOSFETs achieve industry-leading low loss, driving the broader adoption of SiC technology. Through structural enhancements and manufacturing process optimization, ON resistance is reduced by approximately 30% during high temperature operation (Tj=175°C) compared to conventional 4th Generation products (under the same breakdown voltage and chip size conditions). This improvement contributes to making units smaller while increasing output power in high temperature applications such as traction inverters for xEVs.  ROHM began supporting the bare dies business with 5th Generation SiC MOSFETs in 2025 and completed development in March 2026. Furthermore, starting from July 2026, ROHM will provide samples of discrete devices and modules incorporating 5th Generation SiC MOSFETs.  Going forward, ROHM plans to expand its 5th Generation SiC MOSFET lineup with additional breakdown voltage and package options. ROHM will also continue to enhance its design tools and strengthen application support. By further promoting the implementation of SiC technology – now entering the mainstream phase – ROHM contributes to more efficient power utilization across a wide variety of high-power applications.  Application ExamplesAutomotive Systems: xEV traction inverters, onboard chargers (OBCs), DC-DC converters, electric compressors  Industrial Equipment: Power supplies for AI servers and data centers, PV inverters, ESS (Energy Storage Systems), UPS (Uninterruptible Power Supplies), eVTOL, AC servos  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops the core technologies needed to advance SiC devices completely in-house, from wafer fabrication and process development to packaging and quality control. At the same time, we have established a fully integrated production system that spans the entire manufacturing flow, solidifying our position as a leading SiC supplier.
2026-04-24 10:34 reading:274
ROHM has added New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility
  ROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x” to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes product selection easier.  In recent years, demand for high-accuracy op amps has been rapidly increasing as automotive and industrial systems become more sophisticated, demanding faster speed, better precision, and higher efficiency. In applications requiring amplification of sensor outputs, minimizing signal error and delay is essential. To meet these requirements, a well-balanced set of key characteristics is needed, including Input Offset Voltage, Noise, and Slew Rate.  These new products are high-performance op amps that offer a low input offset voltage, low noise, and high slew rate. TLRx728 features an input offset voltage of 150 μV (typ.), while the BD728x offers 1.6 mV (typ.). Both series have a noise voltage density of 12 nV/√Hz at 1kHz and a slew rate of 10 V/μs. They are therefore suitable for a wide range of precision applications, including sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems. Both series are designed to balance versatility and high performance rather than being limited to specific applications.  Rail-to-Rail input/output capability allows maximum utilization of the power supply voltage range, ensuring a wide dynamic range.  Furthermore, in addition to 1 channel, 2 channels, and 4 channels configurations, a diverse range of packages is available, enabling optimal product selection based on application and board size.  The new products are being released simultaneously except for certain part numbers (Sample Price: 1-channel: $2.0, 2-channels: $2.8, 4-channels: $4.0 per unit, excluding tax).  Application Examples  Automotive equipment, industrial equipment, and consumer electronics.  Example use case: Sensor signal processing, current detection circuits, motor driver control, power supply monitoring systems.  Terminology  Input Offset Voltage  The voltage that must be applied between the op amp’s two input terminals to force the output to zero volts.  Slew Rate  A performance metric indicating how rapidly an op amp's output voltage can change while operating in linear region.  Noise Voltage Density  Also called noise spectral density. This is noise power per square root of bandwidth of 1 Hz. The total noise power within a bandwidth of B Hz is Noise Voltage Density x √B.
2026-04-03 10:56 reading:472
ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules
  ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack™" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.  In high power conversion circuits, while SiC power devices contribute to higher efficiency and reliability, they can increase the workload associated with peripheral circuit and thermal design. The reference designs released by ROHM support output power levels up to the 300kW class, facilitating the adoption of SiC modules across a wide range of automotive and industrial applications.  Three types of SiC modules compatible with these reference designs are already available for purchase through online distributors such as DigiKey and Farnell.  About Reference Designs  These reference designs are intended for users to utilize the publicly released design data. If you would like to obtain a reference design board or evaluation kit, please contact a sales representative or visit the contact page on ROHM’s website. (Quantities are limited.)  Regarding Online Sales of SiC ModulesDetails of SiC modules currently available through online distributors can be found below.  New SiC Molded Modules Now Available for Online Purchase!  Simulation SupportWe also provide various support resources to facilitate quick evaluation and implementation of our products. ROHM’s comprehensive solutions, including simulation and thermal design support, can provide valuable assistance in component selection.  Various design data related to the evaluation boards can be downloaded from their respective reference design page, while the product information for SiC modules compatible with the reference designs can be accessed from each product page as well.  Additionally, the ROHM Solution Simulator, a simulation tool enabling system-level verification from the component selection stage, is available on ROHM’s website.  HSDIP20: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelDOT-247: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelTRCDRIVE pack™: Reference Design  Other Reference DesignsIn addition to those introduced in this release, we offer numerous reference designs that contribute to reduced design effort for users. More details are available through the link below.  Reference Design / Application Evaluation Kit  Related InformationNews Release (HSDIP20)  ROHM Develops New High Power Density SiC Power ModulesNews Release (DOT-247)  ROHM Launches 2-in-1 SiC Molded Module “DOT-247”News Release (TRCDRIVE pack™)  ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.・TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.・LTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.
2026-03-18 11:35 reading:515
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code