ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

Release time:2025-03-31
author:AMEYA360
source:ROHM
reading:698

  ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.

ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

  In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.

  A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.

  The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.

  While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.

  Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.

  Key Specifications

ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

  For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers

  Sales Information

        Pricing: $14.50/unit (excluding tax)

  Availability: Now (OEM quantities)

  Application Examples

        • A4-sized mobile printers

  • Industrial control label printers

  • Tattoo stencil printers, etc.

  Terminology

        dpi (dots per inch)

  A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).

  Thermal Printing Method

  A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.

  Thermal Transfer Printing Method

  A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.


("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
  ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.  The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.  In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.  This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.  The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.  What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.  Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.  The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.  Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.  Specifications  Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.  The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.  Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.  Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.
2026-04-29 10:03 reading:253
ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures
  ROHM has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers.  In recent years, the rapid proliferation of generative AI and big data processing has accelerated the deployment of high-performance servers in the industrial equipment sector. The resulting surge in power density is placing a greater strain on power infrastructure, raising concerns about localized supply shortages. While smart grids that combine renewable energy sources (i.e., solar power) with existing power supply networks are emerging as a possible solution, minimizing losses during energy conversion and storage remains a key challenge.  In the automotive sector, next-generation electric vehicles require extended cruising range and faster charging, creating demand for lower-loss inverters and higher performance onboard chargers (OBCs). Against this backdrop, the adoption of SiC devices capable of both low loss and high efficiency is increasing in high-power applications ranging from a few kilowatts to hundreds of kilowatts.  As the first semiconductor company globally, ROHM was the first in the world to begin mass production of SiC MOSFETs in 2010, contributing to reducing energy losses by implementing SiC devices over a wide range of high-power applications, including offering an early lineup of products compliant with automotive reliability standards such as AEC-Q101. Furthermore, the 4th generation SiC MOSFETs, for which sample provision began in June 2020, have been adopted globally in automotive and industrial applications. They are available across a broad product portfolio, including both discrete devices and modules, supporting the rapid market adoption of SiC technology.  The newly developed 5th Generation SiC MOSFETs achieve industry-leading low loss, driving the broader adoption of SiC technology. Through structural enhancements and manufacturing process optimization, ON resistance is reduced by approximately 30% during high temperature operation (Tj=175°C) compared to conventional 4th Generation products (under the same breakdown voltage and chip size conditions). This improvement contributes to making units smaller while increasing output power in high temperature applications such as traction inverters for xEVs.  ROHM began supporting the bare dies business with 5th Generation SiC MOSFETs in 2025 and completed development in March 2026. Furthermore, starting from July 2026, ROHM will provide samples of discrete devices and modules incorporating 5th Generation SiC MOSFETs.  Going forward, ROHM plans to expand its 5th Generation SiC MOSFET lineup with additional breakdown voltage and package options. ROHM will also continue to enhance its design tools and strengthen application support. By further promoting the implementation of SiC technology – now entering the mainstream phase – ROHM contributes to more efficient power utilization across a wide variety of high-power applications.  Application ExamplesAutomotive Systems: xEV traction inverters, onboard chargers (OBCs), DC-DC converters, electric compressors  Industrial Equipment: Power supplies for AI servers and data centers, PV inverters, ESS (Energy Storage Systems), UPS (Uninterruptible Power Supplies), eVTOL, AC servos  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops the core technologies needed to advance SiC devices completely in-house, from wafer fabrication and process development to packaging and quality control. At the same time, we have established a fully integrated production system that spans the entire manufacturing flow, solidifying our position as a leading SiC supplier.
2026-04-24 10:34 reading:274
ROHM has added New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility
  ROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x” to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes product selection easier.  In recent years, demand for high-accuracy op amps has been rapidly increasing as automotive and industrial systems become more sophisticated, demanding faster speed, better precision, and higher efficiency. In applications requiring amplification of sensor outputs, minimizing signal error and delay is essential. To meet these requirements, a well-balanced set of key characteristics is needed, including Input Offset Voltage, Noise, and Slew Rate.  These new products are high-performance op amps that offer a low input offset voltage, low noise, and high slew rate. TLRx728 features an input offset voltage of 150 μV (typ.), while the BD728x offers 1.6 mV (typ.). Both series have a noise voltage density of 12 nV/√Hz at 1kHz and a slew rate of 10 V/μs. They are therefore suitable for a wide range of precision applications, including sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems. Both series are designed to balance versatility and high performance rather than being limited to specific applications.  Rail-to-Rail input/output capability allows maximum utilization of the power supply voltage range, ensuring a wide dynamic range.  Furthermore, in addition to 1 channel, 2 channels, and 4 channels configurations, a diverse range of packages is available, enabling optimal product selection based on application and board size.  The new products are being released simultaneously except for certain part numbers (Sample Price: 1-channel: $2.0, 2-channels: $2.8, 4-channels: $4.0 per unit, excluding tax).  Application Examples  Automotive equipment, industrial equipment, and consumer electronics.  Example use case: Sensor signal processing, current detection circuits, motor driver control, power supply monitoring systems.  Terminology  Input Offset Voltage  The voltage that must be applied between the op amp’s two input terminals to force the output to zero volts.  Slew Rate  A performance metric indicating how rapidly an op amp's output voltage can change while operating in linear region.  Noise Voltage Density  Also called noise spectral density. This is noise power per square root of bandwidth of 1 Hz. The total noise power within a bandwidth of B Hz is Noise Voltage Density x √B.
2026-04-03 10:56 reading:472
ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules
  ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack™" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.  In high power conversion circuits, while SiC power devices contribute to higher efficiency and reliability, they can increase the workload associated with peripheral circuit and thermal design. The reference designs released by ROHM support output power levels up to the 300kW class, facilitating the adoption of SiC modules across a wide range of automotive and industrial applications.  Three types of SiC modules compatible with these reference designs are already available for purchase through online distributors such as DigiKey and Farnell.  About Reference Designs  These reference designs are intended for users to utilize the publicly released design data. If you would like to obtain a reference design board or evaluation kit, please contact a sales representative or visit the contact page on ROHM’s website. (Quantities are limited.)  Regarding Online Sales of SiC ModulesDetails of SiC modules currently available through online distributors can be found below.  New SiC Molded Modules Now Available for Online Purchase!  Simulation SupportWe also provide various support resources to facilitate quick evaluation and implementation of our products. ROHM’s comprehensive solutions, including simulation and thermal design support, can provide valuable assistance in component selection.  Various design data related to the evaluation boards can be downloaded from their respective reference design page, while the product information for SiC modules compatible with the reference designs can be accessed from each product page as well.  Additionally, the ROHM Solution Simulator, a simulation tool enabling system-level verification from the component selection stage, is available on ROHM’s website.  HSDIP20: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelDOT-247: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelTRCDRIVE pack™: Reference Design  Other Reference DesignsIn addition to those introduced in this release, we offer numerous reference designs that contribute to reduced design effort for users. More details are available through the link below.  Reference Design / Application Evaluation Kit  Related InformationNews Release (HSDIP20)  ROHM Develops New High Power Density SiC Power ModulesNews Release (DOT-247)  ROHM Launches 2-in-1 SiC Molded Module “DOT-247”News Release (TRCDRIVE pack™)  ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.・TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.・LTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.
2026-03-18 11:35 reading:515
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
model brand To snap up
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code