Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors

发布时间:2026-01-22 11:30
作者:AMEYA360
来源:ROHM
阅读量:1521

  ROHM has developed the “UCR10C Series”, which has the industry's highest rated power for 2012-size shunt resistors (10 mΩ to 100 mΩ).

  Shunt resistors are required to handle higher power for current sensing in both the automotive and industrial equipment markets. Additionally, specific requirements for high junction reliability in these markets has increased annually.

Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors

  ROHM’s new products form a copper-based resistive element on an alumina substrate via sintering. By optimizing the heat dissipation structure, it achieves rated powers of 1.0W and 1.25W-double that of equivalent-sized products including thick film types and metal plate types. This enables the replacement of products with wide terminal types or larger alternatives, facilitating miniaturization and reducing the number of components required.

  Furthermore, the use of a metal resistive element achieves a low TCR (0 to +60 ppm/°C). This minimizes errors due to temperature changes, enabling high-precision current sensing. Moreover, it achieves the same level of durability as the metal plate types in temperature cycle testing (-55°C / +155°C, 1000 cycles). This ensures high bonding reliability even in applications with extreme temperature fluctuations, such as automotive use, enabling stable, long-term operation.

  This series is fully lead-free. No lead materials are present, even in RoHS-exempted areas, thus reducing environmental impact.

  As part of its future expansion plans, ROHM has also commenced development of the 3216-size (2W) sintered metal shunt resistor, the “UCR18C Series”, further enhancing its product line-up that combines high power, high precision and high reliability.

  Application Examples

  Various current detection applications in automotive, industrial equipment, and consumer electronics.

  Terminology

  Thick Film Types

  A chip resistor using a material called metal glaze as the resistive element. In addition to cost advantages, the thick film resistive element provides superior resistance to pulses and surges.

  Metal Plate Types

  A chip resistor using a metal plate as the resistive element. It offers superior thermal dissipation and achieves high precision through low TCR, providing performance advantages.

  Wide Terminal Types

  A structure where the electrodes are positioned along the long side of the chip resistor body. Compared to the common structure with electrodes along the short side, it improves heat dissipation efficiency and enables high-power handling.

  TCR (Temperature Coefficient of Resistance)

  An indicator showing how much a resistor's resistance value changes with temperature. A lower value means less resistance variation due to temperature fluctuations, providing more stable performance.

  The TCR of the UCR10C varies depending on the resistance value. Furthermore, the listed TCR is the guaranteed value for the +25/+155°C range for the 10mΩ product.


(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
  ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.  The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.  In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.  This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.  The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.  What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.  Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.  The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.  Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.  Specifications  Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.  The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.  Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.  Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.
2026-04-29 10:03 阅读量:250
ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures
  ROHM has developed the latest device of its EcoSiC™ series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems – such as traction inverters for electric vehicles (xEVs) – as well as power supplies for AI servers and industrial equipment such as data centers.  In recent years, the rapid proliferation of generative AI and big data processing has accelerated the deployment of high-performance servers in the industrial equipment sector. The resulting surge in power density is placing a greater strain on power infrastructure, raising concerns about localized supply shortages. While smart grids that combine renewable energy sources (i.e., solar power) with existing power supply networks are emerging as a possible solution, minimizing losses during energy conversion and storage remains a key challenge.  In the automotive sector, next-generation electric vehicles require extended cruising range and faster charging, creating demand for lower-loss inverters and higher performance onboard chargers (OBCs). Against this backdrop, the adoption of SiC devices capable of both low loss and high efficiency is increasing in high-power applications ranging from a few kilowatts to hundreds of kilowatts.  As the first semiconductor company globally, ROHM was the first in the world to begin mass production of SiC MOSFETs in 2010, contributing to reducing energy losses by implementing SiC devices over a wide range of high-power applications, including offering an early lineup of products compliant with automotive reliability standards such as AEC-Q101. Furthermore, the 4th generation SiC MOSFETs, for which sample provision began in June 2020, have been adopted globally in automotive and industrial applications. They are available across a broad product portfolio, including both discrete devices and modules, supporting the rapid market adoption of SiC technology.  The newly developed 5th Generation SiC MOSFETs achieve industry-leading low loss, driving the broader adoption of SiC technology. Through structural enhancements and manufacturing process optimization, ON resistance is reduced by approximately 30% during high temperature operation (Tj=175°C) compared to conventional 4th Generation products (under the same breakdown voltage and chip size conditions). This improvement contributes to making units smaller while increasing output power in high temperature applications such as traction inverters for xEVs.  ROHM began supporting the bare dies business with 5th Generation SiC MOSFETs in 2025 and completed development in March 2026. Furthermore, starting from July 2026, ROHM will provide samples of discrete devices and modules incorporating 5th Generation SiC MOSFETs.  Going forward, ROHM plans to expand its 5th Generation SiC MOSFET lineup with additional breakdown voltage and package options. ROHM will also continue to enhance its design tools and strengthen application support. By further promoting the implementation of SiC technology – now entering the mainstream phase – ROHM contributes to more efficient power utilization across a wide variety of high-power applications.  Application ExamplesAutomotive Systems: xEV traction inverters, onboard chargers (OBCs), DC-DC converters, electric compressors  Industrial Equipment: Power supplies for AI servers and data centers, PV inverters, ESS (Energy Storage Systems), UPS (Uninterruptible Power Supplies), eVTOL, AC servos  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops the core technologies needed to advance SiC devices completely in-house, from wafer fabrication and process development to packaging and quality control. At the same time, we have established a fully integrated production system that spans the entire manufacturing flow, solidifying our position as a leading SiC supplier.
2026-04-24 10:34 阅读量:273
ROHM has added New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility
  ROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x” to its lineup. These are suitable for a wide range of applications including automotive, industrial, and consumer systems. A broad lineup also makes product selection easier.  In recent years, demand for high-accuracy op amps has been rapidly increasing as automotive and industrial systems become more sophisticated, demanding faster speed, better precision, and higher efficiency. In applications requiring amplification of sensor outputs, minimizing signal error and delay is essential. To meet these requirements, a well-balanced set of key characteristics is needed, including Input Offset Voltage, Noise, and Slew Rate.  These new products are high-performance op amps that offer a low input offset voltage, low noise, and high slew rate. TLRx728 features an input offset voltage of 150 μV (typ.), while the BD728x offers 1.6 mV (typ.). Both series have a noise voltage density of 12 nV/√Hz at 1kHz and a slew rate of 10 V/μs. They are therefore suitable for a wide range of precision applications, including sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems. Both series are designed to balance versatility and high performance rather than being limited to specific applications.  Rail-to-Rail input/output capability allows maximum utilization of the power supply voltage range, ensuring a wide dynamic range.  Furthermore, in addition to 1 channel, 2 channels, and 4 channels configurations, a diverse range of packages is available, enabling optimal product selection based on application and board size.  The new products are being released simultaneously except for certain part numbers (Sample Price: 1-channel: $2.0, 2-channels: $2.8, 4-channels: $4.0 per unit, excluding tax).  Application Examples  Automotive equipment, industrial equipment, and consumer electronics.  Example use case: Sensor signal processing, current detection circuits, motor driver control, power supply monitoring systems.  Terminology  Input Offset Voltage  The voltage that must be applied between the op amp’s two input terminals to force the output to zero volts.  Slew Rate  A performance metric indicating how rapidly an op amp's output voltage can change while operating in linear region.  Noise Voltage Density  Also called noise spectral density. This is noise power per square root of bandwidth of 1 Hz. The total noise power within a bandwidth of B Hz is Noise Voltage Density x √B.
2026-04-03 10:56 阅读量:472
ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules
  ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack™" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.  In high power conversion circuits, while SiC power devices contribute to higher efficiency and reliability, they can increase the workload associated with peripheral circuit and thermal design. The reference designs released by ROHM support output power levels up to the 300kW class, facilitating the adoption of SiC modules across a wide range of automotive and industrial applications.  Three types of SiC modules compatible with these reference designs are already available for purchase through online distributors such as DigiKey and Farnell.  About Reference Designs  These reference designs are intended for users to utilize the publicly released design data. If you would like to obtain a reference design board or evaluation kit, please contact a sales representative or visit the contact page on ROHM’s website. (Quantities are limited.)  Regarding Online Sales of SiC ModulesDetails of SiC modules currently available through online distributors can be found below.  New SiC Molded Modules Now Available for Online Purchase!  Simulation SupportWe also provide various support resources to facilitate quick evaluation and implementation of our products. ROHM’s comprehensive solutions, including simulation and thermal design support, can provide valuable assistance in component selection.  Various design data related to the evaluation boards can be downloaded from their respective reference design page, while the product information for SiC modules compatible with the reference designs can be accessed from each product page as well.  Additionally, the ROHM Solution Simulator, a simulation tool enabling system-level verification from the component selection stage, is available on ROHM’s website.  HSDIP20: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelDOT-247: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelTRCDRIVE pack™: Reference Design  Other Reference DesignsIn addition to those introduced in this release, we offer numerous reference designs that contribute to reduced design effort for users. More details are available through the link below.  Reference Design / Application Evaluation Kit  Related InformationNews Release (HSDIP20)  ROHM Develops New High Power Density SiC Power ModulesNews Release (DOT-247)  ROHM Launches 2-in-1 SiC Molded Module “DOT-247”News Release (TRCDRIVE pack™)  ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters  EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.・TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.・LTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.
2026-03-18 11:35 阅读量:513
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
型号 品牌 抢购
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。

请输入下方图片中的验证码:

验证码