SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G <span style='color:red'>Connect</span>ivity
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SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

　　SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.　　Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.　　The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.　　Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.　　With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.　　The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.
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Release time：2026-01-23 16:51 reading：391 Continue reading>>
Affordable Standard Precision Positioning GNSS Solutions for India's <span style='color:red'>Connect</span>ed Future
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Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.
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Release time：2026-01-13 14:59 reading：1242 Continue reading>>
SIMCom：Affordable Standard Precision Positioning GNSS Solutions for India's <span style='color:red'>Connect</span>ed Future
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SIMCom：Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.
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Release time：2026-01-08 15:19 reading：898 Continue reading>>
Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and <span style='color:red'>Connect</span>ed Home Applications
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Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.　　Ultra Low Power Operation for Always-Connected IoT　　Today’s IoT devices must stay always connected to improve application usability and response time, while maintaining the lowest possible power consumption to extend battery life or to meet eco-friendly regulations. Renesas’ Wi-Fi 6 MCUs offer features such as Target Wake Time (TWT), which enables extended sleep times without compromising cloud connectivity and power consumption. This is critical for applications such as environmental sensors, smart locks, thermostats, surveillance cameras, and medical monitors, where real-time control, remote diagnostics and over-the-air (OTA) updates are critical.　　Additionally, both MCU Groups are optimized for ultra-low power consumption, consuming as little as 200nA to 4µA in sleep mode and under 50µA in Delivery Traffic Indication Message (DTIM10). With the “sleepy connected” Wi-Fi functionality, these devices stay connected with minimal power draw, meeting the growing requirements of modern energy efficiency standards.　　Scalable RA MCU Architecture with Full Software Support　　Built on the Arm® Cortex®-M33 CPU core running at 160 MHz with 704 KB of SRAM, the MCUs enable engineers to develop cost-effective, standalone IoT applications using integrated communication interfaces and analog peripherals, without the need for an external MCU. Customers also have the option to design with a host MCU that can be selected from Renesas’ broad RA MCU offerings and attach the RA6W1 and RA6W2 as connectivity and networking add-ons. Both RA6W1 and RA6W2 are designed to work with Renesas’ Flexible Software Package (FSP) and e² studio integrated development environment. As the first Wi-Fi MCUs in the RA portfolio, they offer a scalable platform that supports seamless software reuse across the RA family.　　High Performance Dual-Band Wi-Fi 6 with 2.4 and 5 GHz Connectivity　　With support for both 2.4 and 5 GHz bands, both MCUs deliver superior throughput, low latency, and reduced power consumption. The dual-band capability dynamically selects the most suitable band based on real-time conditions, ensuring a stable and high-speed connection even in environments with many connected devices. Advanced features such as Orthogonal Frequency Division Multiple Access (OFDMA) and TWT boost performance and energy efficiency, making these solutions well suited for dense urban environments and battery-powered devices.　　Robust Security and Matter-Certified Interoperability　　The RA6W1 and RA6W2 devices offer advanced built-in security including AES-256 encryption, secure boot, key storage, TRNG, and XiP with on-the-fly decryption to keep data safe from unauthorized access. The RA6W1 is RED certified (Radio Equipment Directive), which makes it easier for developers to future-proof their design. Additionally, the device is Matter ready and certified with Matter 1.4, and is compatible across smart home platforms. Renesas supports both MCUs and modules through the Renesas Product Longevity Program, offering 15-year support for MCUs and 10 years for modules.　　“We’re offering our customers the flexibility to design with a standalone Wi-Fi device, a Wi-Fi/Bluetooth LE combo, or fully integrated modules depending on their needs,” said Chandana Pairla, VP of the Connectivity Solutions Division at Renesas. “These wireless solutions save power, simplify system design and lower BOM cost. With hosted or hostless implementation options, customers can confidently begin their wireless onboarding journey and seamlessly integrate into next-generation connected systems.”　　Two types of modules, Wi-Fi 6 (RRQ61001) and Wi-Fi/Bluetooth LE combo (RRQ61051) simplify design by integrating certified RF components and wireless connectivity stacks that comply with global network standards. Supported RF certification standards include the U.S. (FCC), Canada (IC), Brazil (ANATEL), Europe (CE/RED), UK (UKCA), Japan (Telec), South Korea (KCC), China (SRRC) and Taiwan (NCC). By integrating connectivity at the system level, the modules significantly reduce design effort and accelerate time to market.　　Winning Combinations　　Renesas offers “Advanced Low-Power Wireless HMI for Household Appliances” and “Automatic Pet Door & Tracking System” that combine the new Wi-Fi 6 MCU and Wi-Fi/Bluetooth LE MCU with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA6W1 MCU is now available in FCQFN and WLCSP packages, along with the RRQ61001 and RRQ61051 modules. The RA6W2 MCU (BGA package) will be available in Q1/2026. The devices are supported by the FSP, e² studio, evaluation kit and software development kit (SDK) that include flash memory, PCB trace antennas, connectors and embedded power profiler for power consumption analysis. Renesas also offers comprehensive software tools to aid system application development, as well as the Production Line Tool (PLT) for production testing of wireless MCUs.
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Release time：2025-12-12 16:28 reading：1224 Continue reading>>
Panasonic Industry Commercializes Conductive Polymer Tantalum Solid Capacitors (POSCAP) with The Industry's Lowest Profile*1 to Support High-Output Power Delivery Required for USB Type-C <span style='color:red'>Connect</span>ions
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Panasonic Industry Commercializes Conductive Polymer Tantalum Solid Capacitors (POSCAP) with The Industry's Lowest Profile*1 to Support High-Output Power Delivery Required for USB Type-C Connections

　　Panasonic Industry Co., Ltd., a Panasonic Group company, announced  that it will begin commercial production of its two models of Conductive Polymer Tantalum Solid Capacitors (POSCAP), 50TQT33M and 63TQT22M. These capacitors are incorporated into power circuits used for information and communication equipment, including laptops and tablets. They offer an ultra-high withstand voltage and high capacitance in a body with the industry’s lowest profile of 3 mm, supporting high-output power delivery through USB Type-C connectors. Mass production for these models is planned to start in December 2025.　　These capacitors are ideal for voltage stabilization and noise reduction in power supplies compliant with USB Power Delivery (USB-PD)[1] 3.1. While previous USB-C connectors supplied up to 100 W (20 V/5 A), USB-PD 3.1 expands this to 240 W (48 V/5 A). This enables widespread use of USB-C connectors for high-speed data transfer and rapid charging, and is expected to further expand applications to larger equipment requiring high power output, such as displays.　　On the other hand, information and communication equipment such as laptops are increasingly required to be thinner and more compact. Capacitors therefore must combine an ultra-high withstand voltage, high capacitance, and a low profile in order to fit into limited space. Panasonic Industry began mass production of Conductive Polymer Tantalum Solid Capacitors (POSCAP) in 1997 and, as an industry leader, has continuously delivered first-of-their-kind products. Leveraging proprietary powder molding technology and film formation technologies, the company has newly developed two models that achieve both an ultra-high withstand voltage and high capacitance in a package with the industry's lowest profile of 3 mm.　　Through these unique device technologies, Panasonic Industry will continue to contribute to enhancing the functionality of electronic equipment, including laptops, while also reducing the environmental impact through smaller, lighter devices and lower material usage.　　Key features:　　1. Achieves both an ultra-high withstand voltage and high capacitance*2 to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry*1—enabled by proprietary powder molding and film formation technologies　　2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V　　3. Contributes to reduced material usage lower environmental impact through low-profile design　　*1 As of September 18, 2025, Conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V and capacitance of 22 μF or higher (Panasonic Industry data)　　*2 USB-Power Delivery 3.1 (180 W/240 W output) compliant high-capacitance conductive polymer tantalum solid capacitors with rated voltages of 50 V and 63 V, and a capacitance of 22 μF or higherDetailed features:　　1. Achieves both an ultra-high withstand voltage and high capacitance to support high-output USB Type-C power delivery, in a 3 mm profile—the lowest in the industry—enabled by proprietary powder molding and film formation technologies　　To achieve capacitor performance required for USB-PD 3.1 power supplies in a low-profile body, both high capacitance and a high withstand voltage must be ensured, despite their trade-off relationship. High-capacitance tantalum powder is necessary for electrode materials, but its fine particle size makes molding difficult, creating challenges for stable production. Forming a uniform dielectric film on the surface of the electrodes is important for enhancing the withstand voltage. However, since electrodes made with high-capacitance tantalum powder contain extremely small internal pores, dielectric oxide films tend to develop imperfections.　　Panasonic Industry overcame these challenges by establishing proprietary technology to mold high-capacitance tantalum powder with uniform density, and by optimizing the film deposition process to create flawless dielectric films. This enabled the development of two new models that combine an ultra-high withstand voltage and high capacitance, meeting the USB-C high-output power delivery requirements in a 3 mm low-profile package.Cross-sectional view of POSCAP and enlarged view of the inside of the electrode body　　2. Lineup of USB-PD 3.1-compliant models rated at 50 V and 63 V　　Until now, Panasonic Industry’s POSCAP lineup extended only up to 35 V, with no models compatible with USB-PD 3.1, which extends the rated voltage specification to 36 V (180 W) and 48 V (240 W). The two new models, rated at 50 V and 63 V, each achieve a high capacitance of 22 μF or higher in a package with the industry's lowest profile of 3 mm. The full lineup provides flexibility to meet diverse applications and equipment specifications.　　3. Contributes to reduced material usage lower environmental impact through low-profile design　　Compared to the industry standard size*3, the new models reduce volume by 25%, contributing to a lower environmental impact through reduced material usage.　　*3 Comparison with the industry standard size (7.3 mm × 4.3 mm × 4 mm) of conductive polymer tantalum solid capacitors used in USB-PD 3.1 compliant power suppliesApplications:　　Voltage stabilization and noise reduction of USB-PD 3.1-compliant power supplies for laptops, displays, and peripheral equipment　　Arc discharge[2] countermeasures for USB-PD 3.1-compliant connectors　　Specifications:　　Life: 2,000 hours at 105°C; guaranteed operating temperature range: -55°C to 105°C　　Ripple current[3]: 100 kHz, 105°C　　ESR[4]: 100 kHz, 20°C　　*4 Product dimensional tolerance:　　Length (L): ±0.3 mm; Width (W): ±0.2 mm; Height (H): ±0.2 mmTerm descriptions:　　[1] USB-PD　　The power delivery standards established by the standard-setting organization USB Implementers Forum, Inc. (USB-IF). With the launch of USB-PD 3.1 in 2021, USB Type-C cables and connectors can now deliver up to 240 W of power, supporting a wide range of applications—from smartphones and laptops to larger equipment such as monitors.　　[2] Arc discharge　　An electric spark or discharge phenomenon that occurs when a high current flows at low voltage in electrical circuits.　　[3] Ripple current　　When a voltage fluctuation is applied to a capacitor, a corresponding charging or discharging current flows through the capacitor. The current applied to this capacitor is referred to as a ripple current. The higher the ripple current, the higher the allowable current.　　[4] ESR (Equivalent Series Resistance)　　Represents the value of an internal resistance component that can cause heat generation. Capacitors with lower ESR allow higher ripple currents and provide excellent noise absorption.
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Release time：2025-11-06 15:35 reading：831 Continue reading>>
Murata Launches iSIM IoT Module with Built-In Global <span style='color:red'>Connect</span>ivity from 1NCE
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Murata Launches iSIM IoT Module with Built-In Global Connectivity from 1NCE

　　Murata today introduced a new iSIM-compatible LPWA module, the Type 1SC, pre-integrated with out-of-the-box connectivity from 1NCE, one of the world’s fastest-growing IoT companies. The collaboration delivers simplified, scalable global connectivity, making it easier to launch and manage low-power IoT devices. Optimized for low-power, low-data applications, the solution comes bundled with 50 MB of data and optional top-ups, enabling rapid, cost-effective deployment for applications such as asset tracking, fleet management, and healthcare monitoring. Supporting both LTE-M and NB-IoT, the module offers broad compatibility across networks in 173 countries.　　By embedding 1NCE’s cloud-based connectivity directly into the module, Murata eliminates the need for separate SIM provisioning, streamlining the design and manufacturing process for compact, energy-efficient devices. The result is a faster, more reliable path to market. Additionally, with over 30 million devices managed across 23,000+ customers, its platform simplifies lifetime IoT connectivity – bringing seamless integration, global reach, and built-in scalability to the next generation of connected products.　　“Murata’s Type 1SC module represents our commitment to driving innovation in the IoT space,” said Hiro Hyogo, Senior Manager, Corporate Technology and Innovation at Murata Americas. “By having connectivity pre-installed on our modules, we’re reducing the complexities and costs associated with global IoT deployments while ensuring strong security and performance.”　　"IoT will be dominated by software players, which is why Murata chose and trusted in 1NCE," said Fabian Kochem, Head of Global Product Strategy at 1NCE. “The supply chain of IoT is bloated, but our two companies save our customers time and money.”
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Release time：2025-08-13 15:33 reading：818 Continue reading>>
Simcom：E7025 R3 High-Performance, Cost-Effective NB-IoT <span style='color:red'>Connect</span>ivity
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Simcom：E7025 R3 High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
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Release time：2024-12-25 11:39 reading：1006 Continue reading>>
SIM8230: Advanced and Flexible 5G <span style='color:red'>Connect</span>ivity for Demanding IoT Applications
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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
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Release time：2024-12-19 10:34 reading：953 Continue reading>>
E7025 R3: High-Performance, Cost-Effective NB-IoT <span style='color:red'>Connect</span>ivity
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E7025 R3: High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
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Release time：2024-12-18 11:00 reading：6992 Continue reading>>
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.
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Release time：2024-10-15 13:19 reading：782 Continue reading>>

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AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

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