Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas
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Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

　　Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas.　　The new facility, called SM1, will ramp according to customer demand, ultimately producing tens of millions of chips daily that go into nearly every electronic device— from smartphones, automotive systems, and life-saving medical devices to industrial robots, smart home appliances, and data centers.　　Why it matters　　As the largest foundational semiconductor manufacturer in the U.S., TI produces analog and embedded processing chips critical for virtually all modern electronic devices. As electronics become increasingly more prevalent in everyday life, TI is building on its nearly 100-year legacy of innovation by expanding its 300mm semiconductor manufacturing footprint. By owning and controlling its manufacturing operations, process technology and packaging, TI has greater control of its supply to support customers for decades to come, in any environment.　　"The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300mm semiconductor manufacturing capacity at scale. We're proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future."Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders at TI's newest 300mm wafer fab in Sherman, Texas.TI in Sherman　　TI’s mega-site in Sherman includes future plans for up to four connected wafer fabs that will be constructed and equipped in alignment with market demand. Combined, this site will support as many as 3,000 direct jobs, along with thousands of additional jobs in support industries　　TI’s investment in Sherman is part of the company’s broader plans to invest more than $60 billion across seven semiconductor fabs in Texas and Utah, making this the largest investment in foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites around the world, TI’s internal operations build on decades of proven and reliable manufacturing expertise, providing greater control of its supply chain to get customers the products they need.
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Release time：2026-02-02 16:15 reading：187 Continue reading>>
Fibocom Launches Global L<span style='color:red'>TE</span> Cat.1 bis Module LE271-GL
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Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

　　January 14, 2026 – Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices with single-SKU global connectivity. With compact size, global frequency coverage, low power consumption, and high compatibility, the LE271-GL offers a cost-effective 4G solution for worldwide IoT applications such as asset tracking, IP cameras, new energy systems, and consumer electronics.　　Compact Design and Global Coverage　　Measuring 17.7mm × 15.8mm, the LE271-GL is pin-to-pin compatible with Fibocom’s MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.　　High Performance and Fast Network Access　　The LE271-GL ensures quick and stable connections, achieving network registration in under 3.5 seconds. Optimized AT command response and USB enumeration improve device startup and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.　　Ultra-Low Power and Extended Battery Life　　Optimized for battery-powered applications, the LE271-GL achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.　　Rich Functionality and Strong Compatibility　　LE271-GL supports LBS + Wi-Fi scan positioning (for indoor and international use), eSIM, and single/dual-SIM configurations. It integrates USB, UART, SPI, I2C, ADC, LCD, Camera, and GPIO interfaces, and supports TTS, MQTT, HTTP, and SSL protocols for versatile IoT applications.　　Now in the engineering sample stage, Fibocom’s LE271-GL sets a new benchmark for global Cat.1 bis connectivity, enabling customers and partners worldwide to explore new opportunities in the IoT market.
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Release time：2026-01-30 15:28 reading：271 Continue reading>>
How Cat.1 bis Technology Solves the
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How Cat.1 bis Technology Solves the "Mobility and Endurance" Challenges of Smart Devices

　　The Internet of Things (IoT) is entering its second phase — a shift from "multi-point connectivity" to "intelligent scenarios."　　Traditional smart home devices are moving beyond indoor environments into outdoor spaces that lack stable power and network access. Asset tracking is expanding from localized monitoring to global roaming, while AI-powered wearables are pushing the limits of battery technology as computing demands rise.　　To address these challenges, the global Cat.1 bis standard is emerging as a key enabler. With its streamlined integrated design, ultra-low microamp-level power consumption, and global single-SKU compatibility, Cat.1 bis provides a breakthrough solution for mobility and endurance in next-generation smart devices.　　New Battlefield for IPCs: From "Fixed Sentries" to "Mobile Detectives"　　IPCs (Internet Protocol Cameras) are evolving rapidly from traditional indoor home security systems toward mobile, portable, and multi-scenario applications. Users now demand outdoor devices that can operate in "off-grid, weak-network" environments and portable cameras capable of capturing "brilliant moments" anytime, anywhere.　　However, once IPCs go outdoors, unstable networks and limited battery capacity become major constraints. How can video transmission remain stable during movement? How can a camera stay on standby 24/7 without missing key footage or draining the battery? These challenges set extremely high standards for module size, mobility, and power management.　　To cope with fluctuating networks in mobile scenarios, the new-generation Cat.1 bis technology introduces bandwidth adaptation, which dynamically adjusts bitrate based on real-time signal quality. This significantly improves bandwidth utilization and ensures smooth video streaming even in weak network conditions.　　Meanwhile, to tackle battery anxiety, smart detection and flexible recording technologies are being deployed. A Cat.1 module can stay connected while only triggering recording upon detecting anomalies or critical events. This "microamp standby, millisecond wake-up" mechanism captures every key moment while extending standby time exponentially.　　Asset Tracking: Building a Truly Global Network　　As global supply chains expand, goods increasingly travel across continents. Traditional tracking solutions require different hardware models for each country’s frequency bands — resulting in SKU fragmentation, higher R&D costs, and complex inventory management. Furthermore, to ensure covert installation and long operating time, devices must continuously shrink in size and reduce power consumption to near-physical limits.　　The global Cat.1 bis module solves this through multi-region compatibility, enabling a single device to achieve "one hardware, worldwide connectivity." Enterprises can maintain a single SKU that meets network certification requirements across major global operators. This not only reduces management complexity and cost but also enables seamless roaming for cross-border asset tracking.　　With its compact, integrated hardware design, the next-generation module minimizes PCB footprint to meet the "ultra-compact" demands of locators. Combined with software-level power optimization, standby consumption is reduced to the microamp level — allowing even coin cell–sized devices to deliver long-term asset protection.　　AI Companions and Wearables: The Art of Balancing Performance and Efficiency　　Driven by large AI models, new categories such as AI companion dolls and senior health trackers are booming. These devices embody the “have it all” dilemma — balancing the demanding requirements of AI voice interaction for speed and mobility access, cost efficiency for mass adoption, and large batteries within compact designs to support intensive AI operations. This transformation demands multi-functional connectivity.　　Cat.1 bis perfectly meets the speed requirements for both voice interaction and data transmission, avoiding the overkill and high costs of advanced LTE modules. For AI-driven devices that frequently wake from standby, Cat.1 bis optimizes power consumption and sleep mechanisms at the software level, achieving an efficient balance between connectivity and computational efficiency. Its compact hardware design also makes wearables lighter and more comfortable, enabling truly all-day intelligent companionship.　　Conclusion: The Core Enabler of the Next IoT Evolution　　From mobile IPCs to globally connected trackers and long-lasting AI wearables, every leap in IoT devices pushes the limits of connectivity technology. The new-generation global Cat.1 bis is rising to the challenge with three core capabilities — high compatibility, cost efficiency, and intelligent adaptability (including bandwidth self-adjustment, smart sleep, and single-SKU global support).　　Cat.1 bis not only achieves unprecedented compactness and power efficiency in hardware but also establishes a unified connectivity foundation for Chinese smart manufacturing to expand globally.
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Release time：2026-01-30 15:25 reading：227 Continue reading>>
Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors
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Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors

　　ROHM has developed the “UCR10C Series”, which has the industry's highest rated power for 2012-size shunt resistors (10 mΩ to 100 mΩ).　　Shunt resistors are required to handle higher power for current sensing in both the automotive and industrial equipment markets. Additionally, specific requirements for high junction reliability in these markets has increased annually.　　ROHM’s new products form a copper-based resistive element on an alumina substrate via sintering. By optimizing the heat dissipation structure, it achieves rated powers of 1.0W and 1.25W-double that of equivalent-sized products including thick film types and metal plate types. This enables the replacement of products with wide terminal types or larger alternatives, facilitating miniaturization and reducing the number of components required.　　Furthermore, the use of a metal resistive element achieves a low TCR (0 to +60 ppm/°C). This minimizes errors due to temperature changes, enabling high-precision current sensing. Moreover, it achieves the same level of durability as the metal plate types in temperature cycle testing (-55°C / +155°C, 1000 cycles). This ensures high bonding reliability even in applications with extreme temperature fluctuations, such as automotive use, enabling stable, long-term operation.　　This series is fully lead-free. No lead materials are present, even in RoHS-exempted areas, thus reducing environmental impact.　　As part of its future expansion plans, ROHM has also commenced development of the 3216-size (2W) sintered metal shunt resistor, the “UCR18C Series”, further enhancing its product line-up that combines high power, high precision and high reliability.　　Application Examples　　Various current detection applications in automotive, industrial equipment, and consumer electronics.　　Terminology　　Thick Film Types　　A chip resistor using a material called metal glaze as the resistive element. In addition to cost advantages, the thick film resistive element provides superior resistance to pulses and surges.　　Metal Plate Types　　A chip resistor using a metal plate as the resistive element. It offers superior thermal dissipation and achieves high precision through low TCR, providing performance advantages.　　Wide Terminal Types　　A structure where the electrodes are positioned along the long side of the chip resistor body. Compared to the common structure with electrodes along the short side, it improves heat dissipation efficiency and enables high-power handling.　　TCR (Temperature Coefficient of Resistance)　　An indicator showing how much a resistor's resistance value changes with temperature. A lower value means less resistance variation due to temperature fluctuations, providing more stable performance.　　The TCR of the UCR10C varies depending on the resistance value. Furthermore, the listed TCR is the guaranteed value for the +25/+155°C range for the 10mΩ product.
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Release time：2026-01-22 11:30 reading：1186 Continue reading>>
Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning
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Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning

　　SIMCom's GNSS Modules Now Integrated with Swift's Skylark Precise Positioning Service　　SAN FRANCISCO, CA – October 28, 2025 – Swift Navigation, a leader in precise positioning technology for mass-market applications, and SIMCom, a leading global IoT wireless modules and solutions supplier, today announced a partnership to deliver centimeter-level GNSS accuracy to high-volume robotics applications worldwide.　　The collaboration integrates Swift's Skylark™ Precise Positioning Service with SIMCom's high-performance SIM66MD and SIM66D GNSS modules.　　This powerful combination allows manufacturers and developers using these modules to easily activate centimeter-accurate satellite positioning, dramatically improving the performance, safety, and reliability of robotic lawnmowers, delivery robots, agricultural vehicles, and other autonomous systems. SIMCom's modules are renowned for their compact designs, low power consumption, and wide array of interfaces, making them ideal for seamless integration into diverse IoT and autonomous devices.　　Swift's Skylark Nx RTK, the highest-precision variant of Skylark, leverages a proprietary atmospheric model to deliver continuous 1-2 cm accuracy across vast geographic areas, including all of Western Europe. This carrier-grade network eliminates the need for developers to manage base stations or switch between multiple correction providers, simplifying the deployment of high-precision outdoor robots at scale.　　"SIMCom's commitment to high performance and versatile design in their GNSS modules aligns perfectly with Swift’s mission to make high-precision positioning accessible and scalable," said Daniel Optendrenk, Vice President of Sales and Business Development at Swift Navigation. "By integrating Skylark with the SIM66MD and SIM66D, we are directly addressing the critical need for reliable, low-cost precision in outdoor autonomous systems, giving developers the tools they need to achieve truly seamless operation."　　"The demand for high-accuracy, low-power positioning is growing across all our target segments, particularly in the emerging field of autonomous robotics," said Chunlin Zhu, GNSS Product Line Director at SIMCom. "This partnership ensures that our popular modules can immediately access Swift’s leading precise positioning network, providing a seamless path for our customers to achieve centimeter-level accuracy and gain a competitive edge in deploying fully autonomous solutions."　　Key benefits for autonomous navigation:　　● Autonomous Operation: Centimeter-level accuracy is essential for robots to execute complex tasks, such as following precise mowing patterns, planting seeds with exact spacing, or navigating narrow construction sites.　　● Safety and Geofencing: Precise localization enables reliable enforcement of virtual boundaries (geofencing), preventing robots from entering restricted zones or colliding with obstacles, which is critical for safety in public or shared spaces.　　● Improved Efficiency: Reliable 1-2 cm precision reduces path errors, minimizes overlap in coverage (e.g., in farming or lawn care), and ensures the robot consistently reaches its exact target destination, maximizing battery life and operational uptime.
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Release time：2026-01-13 17:01 reading：1290 Continue reading>>
Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future
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Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.
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Release time：2026-01-13 14:59 reading：1242 Continue reading>>
NOVOSENSE launches automotive- and industrial-grade NSCSA240-Q series current sense amplifiers to address PWM transient interference challenges
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NOVOSENSE launches automotive- and industrial-grade NSCSA240-Q series current sense amplifiers to address PWM transient interference challenges

　　NOVOSENSE announced the launch of its new bidirectional current sense amplifier series, NSCSA240-Q, covering both industrial and automotive versions, designed for high-voltage PWM systems in vehicles and industrial equipments. The NSCSA240-Q series integrates enhanced PWM rejection technology, supporting bidirectional current sensing with exceptional transient immunity, automotive-grade precision, and flexible configurability. Featuring an ultra-wide input common-mode range from –4V to 80V, a typical input offset voltage of ±5μV, and a 135dB DC Common-Mode Rejection Ratio (CMRR). This series effectively tackles the challenge of high-frequency transient interference in PWM systems, providing a highly reliable current monitoring solution for automotive electronic power steering (EPS), motor drive, industrial automation and other applications. The NSCSA240-Q series meets the AEC-Q100 automotive reliability standard.　　Superior Transient Immunity: Reliable Performance in High-Voltage PWM Environments　　In PWM systems, rapid switching can cause severe common-mode voltage fluctuations that distort output signals in conventional amplifiers. The NSCSA240-Q series achieves an AC CMRR of 90dB at 50kHz, effectively suppressing ΔV/Δt transients. Its proprietary transient suppression design reduces output disturbances by up to 80%, achieving a recovery time of less than 10μs under 80V common-mode voltage transients. With a bandwidth ranging from 450kHz to 600kHz (gain-dependent), it supports both high-speed overcurrent protection and accurate low-frequency PWM signal capture—ensuring stable, low-noise signal performance for EPS, motor drive and industrial motor control systems. The wide –4V to 80V input common-mode range offers broad dynamic capability and robust tolerance across 12V, 24V, and 48V vehicle power architectures. Furthermore, ±2000V ESD protection (HBM/CDM) enhances resistance to external electrical disturbances, ensuring overall system reliability.NSCSA240-Q Series Application Diagram　　Automotive-Grade Precision: ±5μV Offset and ±0.1% Accuracy Across –40°C to 125°C　　Designed to meet the increasingly stringent current measurement requirements of automotive electronics, the NSCSA240-Q series delivers exceptional measurement stability. It features a typical input offset voltage of only ±5μV (maximum ±25μV) and achieves ±0.1% accuracy over a wide temperature range (–40°C to 125°C). With a typical gain error of 0.05%, it ensures reliable and consistent current monitoring even under harsh conditions. Fully qualified to the AEC-Q100 automotive standard, the series guarantees long-term reliability in demanding in-vehicle environments.　　Flexible Integration: Multiple Gain and Package Options for Design Optimization　　As automotive systems trend toward miniaturization and integration, the NSCSA240-Q series is engineered for flexible and space-efficient design. It offers four fixed gain options—20V/V, 50V/V, 100V/V, and 200V/V—supporting shunt resistors ranging from 10mΩ to 0.1mΩ for flexible current detection. The series is available in two compact packages: SOIC-8 (4.9mm × 3.91mm) and TSSOP-8 (3mm × 4.4mm), allowing easy integration into space-constrained motor controller PCBs and helping designers optimize system layouts within limited board area.NSCSA240-Q Series Package
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Release time：2026-01-12 13:52 reading：816 Continue reading>>
TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup
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TAIYO丨Multilayer Metal Power Inductor Rated at 165°C for Automobiles 1608 Size Added to the Lineup

　　TAIYO YUDEN CO., LTD. has commercialized 14 items, including the multilayer metal power inductor MCOIL™ "LACNF1608KKT1R0MAB" (1.6 x 0.8 x 1.0 mm, maximum height shown), which complies with the "AEC-Q200" certification reliability test standard for passive automotive components.　　The new product is approximately 49% smaller than our previous product, the "LACNF2012KKT1R0MAB" (2.0 x 1.25 x 1.0 mm), and can contribute to the miniaturization and higher performance of power supply circuits installed in automobiles.　　These products are used as choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2025. Samples are available for 50 yen per unit.　　Background　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller in order to arrange devices in highly dense configurations and integrate them into single modules. Furthermore, since ECUs are increasingly being installed in engine compartments--a high temperature environment--on-board electronic components must be able to withstand high temperatures.　　In response, TAIYO YUDEN has added a new 1608 size to its MCOIL™ LACN series of multilayer metal power inductors, which boast the advantages of being smaller and thinner, and having an operating temperature range of -55°C to +165°C. Our proprietary metal materials are bonded to each other by an oxide film using heat treatment, ensuring insulation and providing high heat resistance and thermal conductivity. Thanks to these features, the product exhibits stable characteristics, is able to withstand high temperatures, and achieves high reliability, even in devices used in harsh temperature environments such as automotive applications.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　■Application　　Choke coils in DC-DC converters used in automotive engine control systems such as ECUs, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters　　* Derating of rated current is necessary depending on the ambient temperature.　　Please see our website below for detailed specifications.　　LACN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?cid=L&u=M&Seri=LACN_A&SR2=LM%2CMP　　LCCN series　　https://ds.yuden.co.jp/TYCOMPAS/ut/specificationSearcher?SR6-L=AP2&Ind=1000.0%3A1500.0&Current_Srch=%3A1.9&pg=1&pn=L*CNF&cid=L&u=M　　* "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
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Release time：2026-01-08 15:22 reading：635 Continue reading>>
SIMCom：Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future
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SIMCom：Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.
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Release time：2026-01-08 15:19 reading：898 Continue reading>>
Murata：SCH16T-K20 High-Precision 6-Axis IMU for Robotics and Camera Systems
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Murata：SCH16T-K20 High-Precision 6-Axis IMU for Robotics and Camera Systems

　　Murata Manufacturing Co., Ltd. has announced the expansion of its SCH16T series of high-performance inertial measurement units (IMUs) with the introduction of the SCH16T-K20, targeting industrial, prosumer, and consumer markets worldwide. Designed for OEMs in robotics, drones, and camera systems, as well as IMU module manufacturers and system integrators requiring safety-critical IMUs, the SCH16T-K20 delivers market-leading precision, mechanical robustness, and reliability.　　In demanding inertial measurement applications such as dead-reckoning navigation as well as drone and camera stabilization, small measurement errors can accumulate over time leading to unpredictable measurement results. In these applications, key IMU parameters such as noise density, offset bias drift, and vibration rectification ultimately limit the end-application performance and achievable response speed. Murata improves all the key areas with the new SCH16T-K20, which features a brand-new MEMS accelerometer and improved gyroscope temperature calibration.　　The SCH16T-K20 is a 6 axis IMU with a typical gyroscope noise density of 0.0004 (°/s)/√Hz, gyroscope bias instability of 0.3 °/h, and accelerometer noise density as low as 33 µg/√Hz. Like all other SCH16T products, the SCH16T-K20 has a wide operating temperature range from -40 °C to +110 °C, a supply voltage of 3.0–3.6 V, and I/O voltage of 1.7–3.6 V, and a compact size of 0.46 × 0.53 × 0.11 inch (11.8 × 13.4 × 2.9 mm).　　The driver behind the SCH16T-K20 accelerometer performance improvement is the brand-new accelerometer MEMS based on Murata’s proven 3D MEMS technology. The new MEMS uses a double-differential measurement principle, familiar from current SCA3400 and legacy SCA103T series sensors. The double differential measurement enables SCH16T-K20’s market leading low noise density, as well as thermal and lifetime stability.　　The SCH16T-K20 also includes an enhanced version of the market-leading low-noise SCH16T gyroscope, now tuned specifically for the -40 °C to +85 °C temperature range to enable low offset bias shift across that range. All SCH16T series products are carefully validated with a test set based on AEC-Q100 operating temperature Grade 1 (-40 °C to +125 °C) standards*, ensuring reliable operation over a wide temperature window. The series sensors include market-leading self-diagnostic features, making them suitable for safety-critical applications. Murata’s unique MEMS stands out in the competitive IMU market for its exceptional mechanical resilience to shocks and vibration rectification. The series’ robust design and reliability contribute to longer device lifespans and reduced waste.　　The SCH16T-K20 becomes the highest-performing variant in the SCH16T lineup while maintaining pin-to-pin and software compatibility. This compatibility makes integration of different SCH16T variants easy for OEMs and module designers. Mass production of the SCH16T-K20 is scheduled to begin in the first half of 2026. Murata will continue developing sensor solutions aligned with evolving market demands, contributing to safer, more sustainable, and higher-performing technologies across industrial and consumer markets.
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Release time：2025-12-26 16:09 reading：909 Continue reading>>

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