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Murata launches vibration sensor device for predictive maintenance capable of detecting high-frequency range up to 20 kHz

　　Murata Manufacturing Co., Ltd. announces the SMD-type vibration sensor device PKGM-210D-R. Mass production has already begun.　　In the factory automation (FA) industry, maintenance has traditionally consisted of scheduled maintenance at fixed intervals and corrective maintenance after failures.　　In recent years, however, predictive maintenance, which detects early signs of failure to prevent unexpected equipment stoppages, has become increasingly important. In rotary machinery such as bearings and motors, component damage or insufficient lubrication generates minute abnormal vibrations in the high-frequency range up to 20 kHz before failures become serious. Measuring such high-frequency vibrations is challenging due to interference from noise, and detection has often relied on the experience of skilled technicians using auditory inspection.　　By combining its long-established piezoelectric ceramic vibration detection technology with advanced circuit packaging expertise, Murata has developed the PKGM-210D-R, capable of detecting vibrations up to 20 kHz, the upper limit of the audible range. This enables detection of subtle high-frequency abnormal vibrations that were previously identified only by human hearing.　　The product supports early prediction of equipment issues, helping to reduce downtime, optimize maintenance timing, extend component life, and minimize excess inventory. In addition, its compact size of 0.20 × 0.20 × 0.14 inches (5.0 × 5.0 × 3.5 mm) allows easy retrofitting to existing equipment or direct integration into motor components.　　Key features:　　Z-axis direction detection up to 20 kHz　　Compact size (0.20 × 0.20 × 0.14 inch / 5.0 × 5.0 × 3.5 mm) for easy retrofit and built-in mounting　　Built-in driver and filter circuits　　Versatile single analog output　　Built-in temperature sensor

Key word：

Murata

Release time：2026-03-19 17:06 reading：242 Continue reading>>

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ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules

　　ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack™" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.　　In high power conversion circuits, while SiC power devices contribute to higher efficiency and reliability, they can increase the workload associated with peripheral circuit and thermal design. The reference designs released by ROHM support output power levels up to the 300kW class, facilitating the adoption of SiC modules across a wide range of automotive and industrial applications.　　Three types of SiC modules compatible with these reference designs are already available for purchase through online distributors such as DigiKey and Farnell.　　About Reference Designs　　These reference designs are intended for users to utilize the publicly released design data. If you would like to obtain a reference design board or evaluation kit, please contact a sales representative or visit the contact page on ROHM’s website. (Quantities are limited.)　　Regarding Online Sales of SiC ModulesDetails of SiC modules currently available through online distributors can be found below.　　New SiC Molded Modules Now Available for Online Purchase!　　Simulation SupportWe also provide various support resources to facilitate quick evaluation and implementation of our products. ROHM’s comprehensive solutions, including simulation and thermal design support, can provide valuable assistance in component selection.　　Various design data related to the evaluation boards can be downloaded from their respective reference design page, while the product information for SiC modules compatible with the reference designs can be accessed from each product page as well.　　Additionally, the ROHM Solution Simulator, a simulation tool enabling system-level verification from the component selection stage, is available on ROHM’s website.　　HSDIP20: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelDOT-247: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelTRCDRIVE pack™: Reference Design　　Other Reference DesignsIn addition to those introduced in this release, we offer numerous reference designs that contribute to reduced design effort for users. More details are available through the link below.　　Reference Design / Application Evaluation Kit　　Related InformationNews Release (HSDIP20)　　ROHM Develops New High Power Density SiC Power ModulesNews Release (DOT-247)　　ROHM Launches 2-in-1 SiC Molded Module “DOT-247”News Release (TRCDRIVE pack™)　　ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.・TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.・LTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.

Key word：

ROHM

Release time：2026-03-18 11:35 reading：224 Continue reading>>

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MWC 2026 | Fibocom and du’s ALL-IN-ONE AI CPE Solution Reinvents Family Data Interaction with AI NAS

　　On March 5 at the 2026 Mobile World Congress (MWC), Fibocom and du showcased the upgraded ALL-IN-ONE AI CPE solution featuring an enhanced AI NAS, further integrating 5G, AI and real-life scenarios. The upgrade transforms home storage from passive data retention into active intelligent management, delivering more personalized smart home experiences.　　Fibocom first introduced the ALL-IN-ONE AI CPE at NetworkX in France in October 2025, redefining the traditional 5G CPE form factor. The device integrates intelligent voice interaction, human and environmental sensing, and leverages Fibocom’s proprietary FWA AI SkyEngine to enable multi-scenario applications including smart home network management, home security, and smart home control.　　du positions AI-powered 5G CPE as a key enabler of premium fixed wireless access (FWA) services across residential, SME and enterprise markets in the UAE. By emphasizing intelligent self-optimization, ultra-low latency, high reliability and simplified deployment, du aims to deliver consistent gigabit connectivity while supporting cloud services, gaming and smart digital experiences.　　The latest upgrade significantly enhances home data management. Powered by SkyEngine computing capabilities, the built-in AI NAS allows users to quickly locate photos by entering keywords, eliminating the need to manually search large file libraries. The system can also detect duplicate photos and notify users to free up storage space efficiently.　　Natural voice interaction further simplifies the experience. Users can search content through voice commands, such as requesting “family photos from last summer at the beach,” while the AI NAS automatically categorizes photos by location, time, people and themes to generate personalized digital albums.　　All photo recognition and retrieval are processed locally through edge AI to ensure privacy and data security, supported by a physical privacy switch. The CPE also supports HDMI output, allowing users to display photos on larger screens via voice commands, enhancing shared family experiences.　　By integrating AI NAS, intelligent interaction and network optimization, the ALL-IN-ONE AI CPE continues evolving from traditional communication hardware into a full-scenario intelligent home hub, helping operators accelerate the shift toward platform-based services in the 5G FWA ecosystem.

Key word：

Fibocom

Release time：2026-03-10 16:21 reading：374 Continue reading>>

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Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA.　　In the age of software-defined vehicles (SDVs), automotive SoCs require advanced performance to run multiple applications simultaneously and must offer scalability through chiplets. They must also meet the functional safety requirements of automotive SoCs. As multi-domain SoCs powering central computing are growing larger and more complex, maintaining automotive-grade quality is becoming more difficult. With increased performance in advanced SoCs, power consumption also rises, making improvements in power efficiency and safety vital. To meet these needs, Renesas has developed the following new technologies.　　1. Chiplet architecture that supports functional safety　　To meet the functional safety requirements of automotive SoCs, Renesas has developed a new, proprietary architecture that supports ASIL D even in a chiplet configuration. By combining the standard die-to-die UCIe interface with a proprietary RegionID mechanism, the architecture prevents interference with hardware resources, even when numerous applications run simultaneously, thereby achieving Freedom from Interference (FFI).　　Conventional UCIe interfaces lack functionality to transmit RegionIDs between dies. Renesas developed a method for mapping RegionIDs into physical address space, encoding them into the UCIe region, and transmitting them. This enables safe access control through the memory management unit (MMU) and real-time cores, and meets functional safety requirements across chiplets. Additionally, by maintaining bandwidth from processors to the memory bus, the UCIe interface was confirmed through testing to achieve a high transmission speed of 51.2 GB/s, approaching the upper limit of intra-SoC transfer speeds. This technology provides both scalability and safety for high-performance automotive SoCs.　　2. Advanced AI processing capabilities and automotive-grade quality　　Automotive-grade quality is vital for SDV systems. Renesas has created a 3 nm SoC design that improves the performance of neural processing units (NPUs) for AI processing, while maintaining automotive-grade quality. In recent years, NPUs have been growing larger, with their area expanding 1.5-fold compared to previous generations. This has led to increased clock latency between shared clock sources and individual circuits. To address this problem, Renesas has redesigned the clock architecture by splitting up clock pulse generators (CPGs), which in past designs were module-level units, and placing mini-CPGs (mCPGs) at the sub-module level. This greatly reduces clock latency and meets timing requirements.　　However, multi-layer mCPGs complicate test clock synchronization, which is critical for achieving zero defects in automotive applications. Renesas has integrated test circuits into the hierarchical CPG architecture and unified the signal path for user clocks and test clocks. The new design also synchronizes upper- and lower-level mCPGs under a single clock source in test mode. This makes unified phase adjustment possible. As a result, Renesas has been able to achieve quality aligned with zero-defect expectations, even for large-scale SoCs, providing the high reliability required for next-generation SDV automotive SoCs.　　3. Advanced power control and monitoring for improved power efficiency and safety　　To achieve the high level of performance required for automotive SoCs with improved power efficiency and safety, Renesas has developed advanced power gating technology that uses over 90 power domains. It enables precise power control, from several milliwatts to several tens of watts, depending on operating conditions. Furthermore, Renesas has split power switches (PSWs) into ring PSWs and row PSWs to reduce IR drops (voltage drops) associated with increasing current density from smaller process geometries. When power is turned on, the ring PSW suppresses rush currents. Then the row PSW equalizes impedance within the domain. Together, these reduce IR drops by roughly 13% compared with conventional designs.　　To meet ASIL D functional safety standards, the dual core lock step (DCLS) configuration controls the master and checker cores with independent power switches and controllers. With this design, even if one side fails, the failure can be detected through lockstep operation. Furthermore, loopback monitoring is performed for each PSW's gate signal, so OFF states are detected when a failure occurs. A digital voltage meter (DVMON), which is highly resistant to temperature drift, is used for voltage monitoring. This improves aging tolerance by 1.4 mV. These technologies enable high-performance automotive SoCs that offer both power efficiency and safety.　　These new technologies are being used in Renesas' R-Car X5H SoC for automotive multi-domain ECUs. With R-Car X5H, users can accelerate the evolution of SDVs while ensuring safety and enabling autonomous driving, digital cockpit and more.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

Key word：

Renesas

Release time：2026-02-28 15:45 reading：401 Continue reading>>

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TDK extends X2 portfolio with compact 350 V (AC) capacitors for industrial and automotive

　　TDK Corporation (TSE:6762) extends its X2 safety film capacitor portfolio with the new B3292xU/V series,now supporting higher voltages and offering compact lead spacings of 15 mm and 22.5 mm, with capacitance values from 47 nF to 1.8 µF. Rated at 350 V (AC) and robust against peak voltage pulses up to 2.5 kV(IEC 60384-14), the series is designed for interference suppression in demanding, space-constrained industrial and automotive environments in series with the mains. Typical applications are on-board chargers, EV charging systems, PV inverters, energy meters, and capacitive power supplies.　　The entire series is now available with lead spacings from 15 mm to 52.5 mm, covering capacitance values from 47 nF to 20 µF. It passed the THB (temperature, humidity, bias) test at +85 °C, 85% RH, and rated voltage for 1000 h, meeting Grade III, Test Condition B requirements. In addition, the series offers AEC-Q200 compliance, excellent self-healing properties, and a maximum operating temperature of +110 °C, ensuring durability even under severe ambient conditions.　　With their compact dimensions and high DC testing voltage (1505 V for 2 s), the B3292xU/V series provides a balanced solution of performance and size for next-generation industrial drives and automotive power electronics, supporting the growing need for efficient and space-optimized EMI suppression solutions.　　For the B3292xU/V series, TDK offers a range of design tools and SPICE models.　　Main applications　　Capacitive power supplies, energy meters　　Industrial drives　　On-board chargers　　EV charging　　PV inverter　　Main features and benefits　　X2 class for interference (EMI) suppression　　“Across the line” applications　　For connections in series with the mains　　Severe ambient conditions　　Small dimensions　　Good self-healing properties　　AEC-Q200E compliant

Key word：

TDK

Release time：2026-02-27 16:14 reading：387 Continue reading>>

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BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.

Key word：

BIWIN

Release time：2026-02-06 17:47 reading：5611 Continue reading>>

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MQ771-GL: Fibocom’s Compact Cat.M Module Enters Sampling, Driving Asset Tracking Innovation

　　Fibocom (300638.SZ | 0638.HK), a global leader in wireless communicationmodules and AI solutions, announced that its Cat.Mmodule MQ771-GL has entered the engineering sample stage. Withits ultra-compact size, low power consumption,global frequency coverage, and stable network compatibility,the MQ771-GL offers a cost-effective IoT solution for asset tracking, enablinglong battery life, high reliability, and precise positioning for large-scaleLPWA deployments.　　Dual-Mode Support for FlexibleDeployment　　The MQ771-GL supports 3GPP Release 14Cat.M1 and NB-IoT standards and is compatible with mainstream frequencybands worldwide, making it ideal for LPWA network deployments across NorthAmerica, Europe, Asia, and beyond. This global compatibility ensuresreliable connectivity for asset tracking devices and enables flexible operationeven in complex or challenging environments.　　Compact Size with Ultra-Low Power Consumption　　Leveraging advanced power managementtechnologies, the MQ771-GL supports PSM (Power Saving Mode) and eDRX (extendedDiscontinuous Reception), dramatically extending device battery life. InPSM mode, standby current drops to the microampere (μA) level, cutting powerconsumption by 75% compared with the previous generation — ideal for smartwater meters. In eDRX mode, power usage is reduced by 90%, making itsuitable for gas meters, asset trackers, and other long-term outdoor devices,enabling multi-year operation.　　The module’s 17.7mm × 15.8mm LGA package is compatible with the pin layout of Fibocom’s Cat.1 modules, supportingflexible product iteration. Its compact form factor is well-suited forspace-constrained tracking devices, simplifying integration and deployment.　　Enhanced Performance with Rich InterfaceOptions　　The MQ771-GLsupports MQTT, CoAP, LwM2M and standard interfaces like UART, I2C,and I2S, making it adaptable for diverse asset tracking terminals. Itintegrates Soft GPS for precise real-time positioning and features a hardware-levelsecurity engine for encrypted, secure communications, protecting againstunauthorized access.　　Liu Sunzhi,General Manager of Fibocom’s MTC Business Unit, commented:　　"With the MQ771-GL now entering the engineering sample stage, itsultra-compact, ultra-low-power design is set to lower development barriers forasset tracking terminals and accelerate large-scale IoT connectivity. Movingforward, we will continue to strengthen collaborative innovation with verticalindustries, driving the rapid commercialization of low-power, wide-connectivitysolutions for asset tracking and other IoT applications."

Key word：

Fibocom

Release time：2026-02-06 17:41 reading：522 Continue reading>>

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Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

　　Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas.　　The new facility, called SM1, will ramp according to customer demand, ultimately producing tens of millions of chips daily that go into nearly every electronic device— from smartphones, automotive systems, and life-saving medical devices to industrial robots, smart home appliances, and data centers.　　Why it matters　　As the largest foundational semiconductor manufacturer in the U.S., TI produces analog and embedded processing chips critical for virtually all modern electronic devices. As electronics become increasingly more prevalent in everyday life, TI is building on its nearly 100-year legacy of innovation by expanding its 300mm semiconductor manufacturing footprint. By owning and controlling its manufacturing operations, process technology and packaging, TI has greater control of its supply to support customers for decades to come, in any environment.　　"The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300mm semiconductor manufacturing capacity at scale. We're proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future."Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders at TI's newest 300mm wafer fab in Sherman, Texas.TI in Sherman　　TI’s mega-site in Sherman includes future plans for up to four connected wafer fabs that will be constructed and equipped in alignment with market demand. Combined, this site will support as many as 3,000 direct jobs, along with thousands of additional jobs in support industries　　TI’s investment in Sherman is part of the company’s broader plans to invest more than $60 billion across seven semiconductor fabs in Texas and Utah, making this the largest investment in foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites around the world, TI’s internal operations build on decades of proven and reliable manufacturing expertise, providing greater control of its supply chain to get customers the products they need.

Key word：

TI

Release time：2026-02-02 16:15 reading：436 Continue reading>>

Fibocom Launches Global L<span style='color:red'>TE</span> Cat.1 bis Module LE271-GL

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Fibocom Launches Global LTE Cat.1 bis Module LE271-GL

　　January 14, 2026 – Fibocom (300638.SZ | 0638.HK), a global leader in wireless communication modules and edge AI solutions, today announced the launch of its global LTE Cat.1 bis module, LE271-GL, providing IoT devices with single-SKU global connectivity. With compact size, global frequency coverage, low power consumption, and high compatibility, the LE271-GL offers a cost-effective 4G solution for worldwide IoT applications such as asset tracking, IP cameras, new energy systems, and consumer electronics.　　Compact Design and Global Coverage　　Measuring 17.7mm × 15.8mm, the LE271-GL is pin-to-pin compatible with Fibocom’s MC661, LE270, and LE37X series, as well as other modules of similar packaging. Customers can migrate without changing PCB designs. Supporting both FDD-LTE and TDD-LTE bands, the module covers all major global frequencies under a single SKU, simplifying inventory management and reducing logistics costs for international deployment.　　High Performance and Fast Network Access　　The LE271-GL ensures quick and stable connections, achieving network registration in under 3.5 seconds. Optimized AT command response and USB enumeration improve device startup and connectivity efficiency. Its OpenCPU architecture provides flexibility for secondary development, lowering overall device costs.　　Ultra-Low Power and Extended Battery Life　　Optimized for battery-powered applications, the LE271-GL achieves microamp-level sleep current and supports DRX and other low-power modes. Interfaces including VDD_EXT and multiple GPIOs remain powered in standby, ensuring long battery life while maintaining critical functionality.　　Rich Functionality and Strong Compatibility　　LE271-GL supports LBS + Wi-Fi scan positioning (for indoor and international use), eSIM, and single/dual-SIM configurations. It integrates USB, UART, SPI, I2C, ADC, LCD, Camera, and GPIO interfaces, and supports TTS, MQTT, HTTP, and SSL protocols for versatile IoT applications.　　Now in the engineering sample stage, Fibocom’s LE271-GL sets a new benchmark for global Cat.1 bis connectivity, enabling customers and partners worldwide to explore new opportunities in the IoT market.

Key word：

Fibocom

Release time：2026-01-30 15:28 reading：536 Continue reading>>

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How Cat.1 bis Technology Solves the "Mobility and Endurance" Challenges of Smart Devices

　　The Internet of Things (IoT) is entering its second phase — a shift from "multi-point connectivity" to "intelligent scenarios."　　Traditional smart home devices are moving beyond indoor environments into outdoor spaces that lack stable power and network access. Asset tracking is expanding from localized monitoring to global roaming, while AI-powered wearables are pushing the limits of battery technology as computing demands rise.　　To address these challenges, the global Cat.1 bis standard is emerging as a key enabler. With its streamlined integrated design, ultra-low microamp-level power consumption, and global single-SKU compatibility, Cat.1 bis provides a breakthrough solution for mobility and endurance in next-generation smart devices.　　New Battlefield for IPCs: From "Fixed Sentries" to "Mobile Detectives"　　IPCs (Internet Protocol Cameras) are evolving rapidly from traditional indoor home security systems toward mobile, portable, and multi-scenario applications. Users now demand outdoor devices that can operate in "off-grid, weak-network" environments and portable cameras capable of capturing "brilliant moments" anytime, anywhere.　　However, once IPCs go outdoors, unstable networks and limited battery capacity become major constraints. How can video transmission remain stable during movement? How can a camera stay on standby 24/7 without missing key footage or draining the battery? These challenges set extremely high standards for module size, mobility, and power management.　　To cope with fluctuating networks in mobile scenarios, the new-generation Cat.1 bis technology introduces bandwidth adaptation, which dynamically adjusts bitrate based on real-time signal quality. This significantly improves bandwidth utilization and ensures smooth video streaming even in weak network conditions.　　Meanwhile, to tackle battery anxiety, smart detection and flexible recording technologies are being deployed. A Cat.1 module can stay connected while only triggering recording upon detecting anomalies or critical events. This "microamp standby, millisecond wake-up" mechanism captures every key moment while extending standby time exponentially.　　Asset Tracking: Building a Truly Global Network　　As global supply chains expand, goods increasingly travel across continents. Traditional tracking solutions require different hardware models for each country’s frequency bands — resulting in SKU fragmentation, higher R&D costs, and complex inventory management. Furthermore, to ensure covert installation and long operating time, devices must continuously shrink in size and reduce power consumption to near-physical limits.　　The global Cat.1 bis module solves this through multi-region compatibility, enabling a single device to achieve "one hardware, worldwide connectivity." Enterprises can maintain a single SKU that meets network certification requirements across major global operators. This not only reduces management complexity and cost but also enables seamless roaming for cross-border asset tracking.　　With its compact, integrated hardware design, the next-generation module minimizes PCB footprint to meet the "ultra-compact" demands of locators. Combined with software-level power optimization, standby consumption is reduced to the microamp level — allowing even coin cell–sized devices to deliver long-term asset protection.　　AI Companions and Wearables: The Art of Balancing Performance and Efficiency　　Driven by large AI models, new categories such as AI companion dolls and senior health trackers are booming. These devices embody the “have it all” dilemma — balancing the demanding requirements of AI voice interaction for speed and mobility access, cost efficiency for mass adoption, and large batteries within compact designs to support intensive AI operations. This transformation demands multi-functional connectivity.　　Cat.1 bis perfectly meets the speed requirements for both voice interaction and data transmission, avoiding the overkill and high costs of advanced LTE modules. For AI-driven devices that frequently wake from standby, Cat.1 bis optimizes power consumption and sleep mechanisms at the software level, achieving an efficient balance between connectivity and computational efficiency. Its compact hardware design also makes wearables lighter and more comfortable, enabling truly all-day intelligent companionship.　　Conclusion: The Core Enabler of the Next IoT Evolution　　From mobile IPCs to globally connected trackers and long-lasting AI wearables, every leap in IoT devices pushes the limits of connectivity technology. The new-generation global Cat.1 bis is rising to the challenge with three core capabilities — high compatibility, cost efficiency, and intelligent adaptability (including bandwidth self-adjustment, smart sleep, and single-SKU global support).　　Cat.1 bis not only achieves unprecedented compactness and power efficiency in hardware but also establishes a unified connectivity foundation for Chinese smart manufacturing to expand globally.

Key word：

Cat.1

Release time：2026-01-30 15:25 reading：481 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
BP3621	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics

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