Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

发布时间:2026-02-02 16:15
作者:AMEYA360
来源:TI
阅读量:437

  Texas Instruments (TI) announced the start of production at its newest semiconductor fab in Sherman, TX, just three and a half years after breaking ground. Leaders from TI were joined by local and state elected officials to celebrate the opening of this state-of-the-art 300mm semiconductor fab in North Texas.

  The new facility, called SM1, will ramp according to customer demand, ultimately producing tens of millions of chips daily that go into nearly every electronic device— from smartphones, automotive systems, and life-saving medical devices to industrial robots, smart home appliances, and data centers.

  Why it matters

  As the largest foundational semiconductor manufacturer in the U.S., TI produces analog and embedded processing chips critical for virtually all modern electronic devices. As electronics become increasingly more prevalent in everyday life, TI is building on its nearly 100-year legacy of innovation by expanding its 300mm semiconductor manufacturing footprint. By owning and controlling its manufacturing operations, process technology and packaging, TI has greater control of its supply to support customers for decades to come, in any environment.

  "The start of production at our newest wafer fab in Sherman, TX represents what TI does best: owning every part of the manufacturing process to deliver the foundational semiconductors that are vital for nearly every type of electronic system," said Haviv Ilan, president and CEO of Texas Instruments. “As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable 300mm semiconductor manufacturing capacity at scale. We're proud to have called North Texas home for nearly a century, and excited about how TI technology will enable the technological breakthroughs of the future."

Texas Instruments begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas

Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders at TI's newest 300mm wafer fab in Sherman, Texas.TI in Sherman

  TI’s mega-site in Sherman includes future plans for up to four connected wafer fabs that will be constructed and equipped in alignment with market demand. Combined, this site will support as many as 3,000 direct jobs, along with thousands of additional jobs in support industries

  TI’s investment in Sherman is part of the company’s broader plans to invest more than $60 billion across seven semiconductor fabs in Texas and Utah, making this the largest investment in foundational semiconductor manufacturing in U.S. history. With 15 manufacturing sites around the world, TI’s internal operations build on decades of proven and reliable manufacturing expertise, providing greater control of its supply chain to get customers the products they need.


(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
Trade War Cited as TI Reports Sales Decline
  Chipmaker Texas Instruments posted its first year-over-year decline in quarterly sales in more than two years amid what company executives characterized as semiconductor cyclicality and weaker demand in China.  “We believe that after 10 quarters of year-on-year growth, the weakness we are seeing is primarily due to the semiconductor cycle,” said Rafael Lizardi, TI’s chief financial officer, in a post-earnings conference call with analysts. “In addition, the macroenvironment — including uncertainty caused by trade tensions — could impact the depth and duration of this cycle.”  Dave Pahl, vice president and head of investor relations, said that demand in China was weaker than in other regions of the world. “We are seeing signs from our customers and the channel that this weakness is primarily from increased caution due to trade tensions,” Pahl said. “We assume that this weakness is a combination of lower local end demand, as well as reduced exports, but we do not have visibility to distinguish between the two.”  Trade tensions between the U.S. and China have been escalating for over a year, with each country imposing tariffs on products exported by the other beginning last March. However, prior to TI’s quarterly report Wednesday, chip companies have generally not reported any major effects of the trade war.  TI (Dallas) reported sales of $3.72 billion for the fourth quarter of 2018, down 1% compared to the fourth quarter of 2017. The company reported a net income for the quarter of $1.24 billion, up 260% from the fourth quarter of 2017, when non-cash charges related to tax law changes adversely affected TI’s profit.  Fourth-quarter sales came in slightly below consensus analysts’ expectations of $3.75 billion. Earnings per share of $1.27 exceeded consensus analysts’ expectations of $1.24 per share.  For the full-year 2018, TI reported sales of $15.8 billion, up 5% compared to 2017. The company reported a net income for the year of $5.6 billion, up 51% compared to 2017.  TI said that it expects sales for the first quarter of this year to be between $3.34 billion and $3.62 billion, in line with analysts’ expectations.
2019-01-25 00:00 阅读量:4678
TI CEO Templeton to Step Down
Time-of-flight 3-D Sensor Sampling for Smartphone Facial ID
  Time-of-flight technology directly measures the depth and amplitude information in every pixel by using only one infrared flash light source.The modulated IR light is emitted to focus on the entire scene or subject,and the ToF imager captures the reflected light from the subject.The measured phase difference between the emitted and received light,as well as the amplitude values,yields highly reliable distance information and a grayscale image of the complete scene simultaneously.  ToF minimizes power consumption and provides fast data acquisition for real-time operation.In addition,the required depth-data processing for ToF is less demanding than for other algorithm-intensive depth-sensing technologies,including structured light and stereovision,saving additional power within the application processor,according to ToF proponents.  An inherent benefit of time-of-flight technology is the simplicity of the ToF camera module:It consists of only two key components—the imager and one flash illumination component—without the need for any mechanical baseline.The low component count enabled the small size of the module developed by Infineon and pmdtechnologies,as well a lean and fast calibration procedure for easy and robust mass production,according to the companies.The modules do not have to be recalibrated during use.  Infineon and pmdtechnologies claim that theirs are the only ToF-based depth-sensing camera modules integrated in commercially available smartphones.  The image sensor chip is produced in Dresden,Germany,and was developed in Munich and in Graz,Austria.Samples are available now,with volume production scheduled to start in the fourth quarter.Software partners including Sensible Vision Inc.and Idemia offer application software for facial detection and authentication.
2018-01-16 00:00 阅读量:2222
TI Brings DLP Pico Projectors to the Masses
  Texas Instruments’ micro-opto-electromechanical-system-based DLP, with millions of micromirrors per digital micromirror device (DMD) MOEMS chip, revolutionized digital cinema, earning the technology’s inventor an Oscar in 2015. After the 87th Academy Awards ceremony, TI began downsizing its technology for consumers. Today, TI is releasing the 0.2-inch, quarter-million-mirror DLP2000 at a price of less than $20, with an evaluation module (EVM) priced at less than $100, making it the most cost-effective pico-projector enabler to date, according to analysts. Competing units for the consumer market use as few as two raster-scanning mirrors.  “The new TI DLP LightCrafter Display 2000 is a breakthrough, since it brings the price down to a point that any developer can consider it for their applications,” said senior analyst Rosemary Abowd at PMA Research Ltd. (San Juan Capistrano, Calif.). “It’s a home run for TI in the sense that it breaks down the barriers to getting it into the hands of developers.”  TI is the leading supplier of pico-projector chips, having shipped more than 1 million units in the first half of this year, Abowd said. Most of those units shipped to China, but the devices “are also increasingly popular in the U.S., such as in the ultra-thin pico projector Moto Mod, which snaps on to the Moto Z2 Force Edition smartphone,” she said.  The DLP solution released today offers “a $19.99 DMD chip plus matching controller, power management, and driver chips,” Juan Alvarez, TI’s DLP pico products manager, told EE Times. The evaluation module, priced at $99, is the most affordable projection display EVM released to date, Alvarez said. The DMD chip, with support chips and LED engine, targets applications in the 20- to 30-lumen range. The chip undercuts the price of the previous TI generation’s least expensive model by three times and should enable consumer applications to break the $100 price barrier by Christmas 2017.  The DLP LightCrafter Display 2000 EVM provides a display with a 16 x 9 aspect ratio and 24-bit red-green-blue (RGB) resolution. It is compatible with any application processor but is plug-compatible with TI’s own BeagleBone Black development board, which uses its Sitara AM335x processors and provides software drivers and BeagleBone Black code-programming examples.  Complete modules, with a footprint measuring less than 76 x 54 millimeters, will enable applications including stand-alone pico projectors, mobile smart TVs, digital signage, smart-home projection displays, control panels, Internet of Things (IoT) displays, digital cameras, tablets, and smartphones, according to TI.  The DLP LightCrafter Display 2000 arrives with the added edge of TI’s extensive developer ecosystem, which is already using other LightCrafter Display DLPs — mated to a variety of light engines based on LEDs and lasers — to provide original equipment manufacturers with off-the-shelf projector modules for a range of applications. TI claims DLP optical engines are in volume production for a new generation of forward-projecting applications as well as for novel, back-projecting devices used to display images on non-flat surfaces as varied as contoured control panels and interactive world globes.
2017-08-03 00:00 阅读量:1520
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
型号 品牌 抢购
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。

请输入下方图片中的验证码:

验证码