ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance
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ROHM’s New SiC Schottky Barrier Diodes for High Voltage xEV Systems: Featuring a Unique Package Design for Improved Insulation Resistance

　　ROHM has developed surface mount SiC Schottky barrier diodes (SBDs) that improve insulation resistance by increasing the creepage distance between terminals. The initial lineup includes eight models - SCS2xxxNHR - for automotive applications such as onboard chargers (OBCs), with plans to deploy eight models - SCS2xxxN - for industrial equipment such as FA devices and PV inverters in December 2024.　　The rapidly expanding xEV market is driving the demand for power semiconductors, among them SiC SBDs, that provide low heat generation along with high-speed switching and high-voltage capabilities in applications such as onboard chargers. Additionally, manufacturers increasingly rely on compact surface mount devices (SMDs) compatible with automated assembly equipment to boost manufacturing efficiency. Compact SMDs tend to typically feature smaller creepage distances, fact that makes high-voltage tracking prevention a critical design challenge.　　As leading SiC supplier, ROHM has been working to develop high-performance SiC SBDs that offer breakdown voltages suitable for high-voltage applications with ease of mounting. Adopting an optimized package shape, it achieves a minimum creepage distance of 5.1mm, improving insulation performance when contrasted with standard products.　　The new products utilize an original design that removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, approx. 1.3 times greater than standard products. This minimizes the possibility of tracking (creepage discharge) between terminals, eliminating the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high voltage applications. Additionally, the devices can be mounted on the same land pattern as standard and conventional TO-263 package products, allowing an easy replacement on existing circuit boards.　　Two voltage ratings are offered, 650V and 1200V, supporting 400V systems commonly used in xEVs as well as higher voltage systems expected to gain wider adoption in the future. The automotive-grade SCS2xxxNHR are AEC-Q101 qualified, ensuring they meet the high reliability standards this application sector demands.　　Going forward, ROHM will continue to develop high-voltage SBDs using SiC, contributing to low energy consumption and high efficiency requirements in automotive and industrial equipment by providing optimal power devices that meet market needs.　　Application Examples◇ Automotive applications: Onboard chargers (OBCs), DC-DC converters, etc.　　◇ Industrial Equipment: AC servo motors for industrial robots, PV inverters, power conditioners, uninterruptible power supplies (UPS), and more　　Online Sales InformationAvailability: The SCS2xxxxNHR for automotive applications are available now.　　The SCS2xxxN for industrial equipment are scheduled in December 2024.　　Pricing: $10.50/unit (samples, excluding tax)　　Online Distributors: DigiKey™, Mouser™ and Farnell™　　The products will be offered at other online distributors as they become available.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that leverage silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyCreepage Distance　　The shortest distance between two conductive elements (terminals) along the surface of the device package. In semiconductor design, insulation measures with such creepage and clearance distances must be taken to prevent electric shocks, leakage currents, and short-circuits in semiconductor products.　　Tracking (Creepage Discharge)　　A phenomenon where discharge occurs along the surface of the package (insulator) when high voltage is applied to the conductive terminals. This can create an unintended conductive path between patterns, potentially leading to dielectric breakdown of the device. Package miniaturization increases the risk of tracking by reducing creepage distance.　　Resin Potting　　The process of encapsulating the device body and the electrode connections between the device and circuit with resin, such as epoxy, to provide electrical insulation. This provides durability and weather resistance by protecting against water, dust, and other environmental conditions.　　AEC-Q101 Automotive Reliability Standard　　AEC stands for Automotive Electronics Council, a reliability standard for automotive electronic components established by major automotive manufacturers and US electronic component makers. Q101 is a standard that specifically applies to discrete semiconductor products (i.e. transistors, diodes).
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Release time：2024-11-20 14:00 reading：150 Continue reading>>
NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components
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NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the NSM211x, a series of automotive-grade fully integrated high-bandwidth, high-isolation current sensors that both ensure precise current measurement and eliminate the need for any external isolation components.　　On display at Electronica 2024 (Stand B5.450), the automotive-grade series targets applications including OBC/DC-DC converters, PTCs, automotive motor control, charging station current detection and fuel cell systems.　　Certified to meet AEC-Q100 Grade 0 reliability standards, the series is designed to operate stably within a wide temperature range (-40 to 150°C) and addresses the needs of AC or DC current detection in automotive applications with a high isolation voltage, strong current handling capability and high reliability.　　With a -3 dB bandwidth of up to 1 MHz and a response time of 400 ns, the NSM211x series helps control systems achieve rapid loop control and overcurrent protection. The series also features a creepage distance of up to 8.2mm and isolation voltage withstand of 5,000 Vrms per UL standards, with a maximum working isolation voltage of 1,618 Vpk.　　It is available in three packaging options, SOP8, SOW16 and SOW10. These respectively have a primary side impedance of 1.2 mΩ, 0.85 mΩ/1 mΩ and an industry leading 0.27mΩ, with a continuous current handling capability of up to 100 A. Multiple product models are available for each package.　　The current sensors integrate internal temperature compensation algorithms and offline calibration to enable a high measurement accuracy (<±2% sensitivity error and <±10 mV offset error) across the full temperature range, with no need for secondary programming.　　The NSM211x series supports 3.3 V and 5 V power supply voltage as well as DC or AC current measurement with a current range of 5~200 A with options for reference voltage output, overcurrent protection output, and configurable overcurrent protection thresholds.
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Release time：2024-11-15 14:30 reading：266 Continue reading>>
Murata SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor
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Murata SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor

　　Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system (MEMS) based sensor moves the benchmark for performance, system integration, and total cost optimization. It is designed for various automotive applications, including autonomous driving (AD), advanced driver-assistance systems (ADAS), inertial navigation, vehicle stability control, and camera or headlight alignment.　　Market Demands　　With the increasing push for vehicle autonomy and safety, there is an unquestionable demand for extremely accurate sensors with comprehensive built-in safety features and a high level of integration. Likewise, complying with technical regulations like the UNECE’s headlight leveling regulation requires accurate and cost-optimized solutions – something the SCH1633-D01 has demonstrated it can achieve.　　The SCH1633-D01 is a single-package solution optimized for zonal architecture where all required subsystems, like GNSS integration, chassis control, and vehicle attitude sensing (camera and headlight alignment) can utilize its measurements. It is targeted for deployment in the central vehicle inertia measuring unit (IMU) providing a high-quality signal for all subsystems within the vehicle even in the toughest environments. This integration helps to reduce system complexity and provides a much-needed opportunity for cost optimization.　　SCH1633-D01 Features　　SCH1633-D01 is packaged in a unique 24-pin SOIC housing and uses the SafeSPI 2.0 interface with an up to 20-bit data frame for an extremely smooth and high-resolution output. The component supports various system-level time synchronization features, ensuring that the SCH1633-D01’s output can be easily harnessed across the entire vehicle. Furthermore, the extensive self-diagnostics features utilize over 200 monitoring signals to ensure the output is always trustworthy.　　The SCH1633-D01 is designed to provide a high-quality output, even in harsh temperature conditions. It features AEC-Q100 grade 1 qualification to guarantee reliable use throughout the whole component lifetime and is ISO26262 compliant with ASIL-B+ rating (up to ASIL-D via system integration) for exceptional built-in safety.　　For further information on the product’s extensive functionality, please visit its detail page here.　　Murata’s Recent 6DoF MEMS Success　　Murata’s previous generation 6DoF MEMS solution has proven to be highly successful as over 90% of autonomous miles in California alone are driven with the sensor on board. The improvements in this next-generation 6DoF devices are based on customer feedback, and they have already gained global recognition.　　The industrial counterpart SCH16T-K01, launched in January this year, has won the first prize in the Industrial & Manufacturing category of the Sensors Converge fair’s “Best of Sensors Award” competition and the SCH1633-D01 preliminary sample feedback has been remarkably positive.　　A partner of Murata, Hexagon, has been using the SCH1633-D01 in their products. Gordon Heidinger, Segment Manager, Automotive and Safety-Critical Systems at Hexagon’s Autonomy & Positioning division, remarked, “　　The SCH1633-D01 is displaying exceptional performance for a single MEMS sensor. We're pleased to promote this sensor integrated with our positioning solution”.　　Murata has also successfully demonstrated that the UNECE headlight leveling regulation can be fulfilled with the SCH1633-D01 sensor in combination with a commercially available alignment algorithm. This is a significant leap towards cost-effective regulation compliance.　　“Automotive 6DoF applications are rapidly developing, with fierce competition among manufacturers to capture a share of the market. This product offers high performance, demanded by the latest systems, while also providing a much-needed cost-saving opportunity,” said Ville Nurmiainen, General Manager of Product management at Murata Electronics Oy. He continued, “The SCH1633-D01 will give both a technological and cost down advantage to OEMs choosing to utilize the product to its full potential and will help them to further drive automotive applications forward and create safer roads for us all.”　　Preliminary samples are available now. Mass production of this exciting new solution is planned for early 2025.
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Release time：2024-11-12 11:22 reading：406 Continue reading>>
BIWIN's
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BIWIN's "Integrated R&D and Packaging 2.0 Strategy"

　　The Third GMIF2024 Innovation Summit was successfully held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. The event brought together senior executives and industry experts from renowned domestic and international companies, including the School of Integrated Circuits at Peking University, Micron, Western Digital, Solidigm, Arm, UNISOC, Intel, iFlytek, Rockchip, Silicon Motion, BIWIN, Victory Giant, Allwinner, InnoGrit, Maxio, QUANXING, Montage, Applied Materials (AMAT), Lam Research, DISCO, Skyverse, Loongson Technology, and many others. The gathering saw industry leaders engage in discussions on global storage innovation and ecosystem collaboration for shared growth in the AI era. During the summit, the GMIF2024 Annual Awards were officially unveiled, and a total of 38 key enterprises from across the industry supply chain had been honored for their outstanding contributions.　　At the GMIF2024 Innovation Summit, Sam Sun, Chairman of BIWIN Storage, delivered a keynote speech titled "Integrated R&D and Packaging 2.0 Strategy: Full Industry Chain Layout Empowering Client Value Elevation". In the keynote, Mr. Sun shared BIWIN's latest strategic initiatives, technological breakthroughs, and future development over the past year. Supported by continued investment and efforts in integrated R&D and packaging, BIWIN Storage is leveraging advanced technology and full-chain collaboration to empower customers to achieve greater value and drive industry progress.　　From Brand Upgrade to Global Market Expansion: Innovation-Driven and Sustained Growth　　Mr. Sun first and foremost highlighted BIWIN’s significant initiative in brand upgrade in 2024. A new logo and brand slogan were unveiled: 'Infinite Storage, Unlimited Solutions'. More than a transformation of its brand image, this upgradation is an emblem to BIWIN's ongoing strategic, technological and market expansion and the demonstration of its vision to achieve continuous growth in the global storage field.　　In the global market, BIWIN Storage achieved remarkable results in the first half of 2024, thanks to precise market positioning and efficient localized delivery. Its revenue surpassed 3.4 billion RMB, marking an almost 200% increase year-on-year. This growth reflects the successful implementation of the company's global expansion and localized operation strategies.　　Integrated R&D and Packaging 2.0 Strategy: Building Core Competence to Drive Technological Advancement　　BIWIN's "Integrated R&D and Packaging 2.0 Strategy" is regarded as a crucial initiative in its technological innovation and full-chain layout. Mr. Sun further elucidated BIWIN's investments in solutions, chip design, packaging and testing, and equipment development, and shared that with concentration on independent R&D and partnerships, BIWIN has now accumulated core strengths in these areas, and been capable of offering customers more high-efficiency and low-power solutions.　　BIWIN's latest strategy not only involves a keen focus on the R&D and packaging and testing of mainstream memory, but shifts attention to more far-reaching development opportunities in high-end advanced packaging and testing technology. Powered by its dual-drive strategy, BIWIN is dedicated to further enhancing its competitiveness in the storage industry, and providing customers with innovative and cost-effective solutions.　　Strategic Advanced Packaging and Testing Layout: Overcoming Industry Bottlenecks to Secure Future Advantages　　In the face of the increasing technological demands and market challenges in the storage industry, BIWIN Storage is actively promoting its full-chain layout. Mr. Sun noted that, in addition to focusing on storage solution R&D, the company has also been a pioneer in establishing storage packaging capabilities in South China. By advancing its wafer-level packaging and testing layout, BIWIN has positioned itself as one of the few semiconductor storage companies capable of offering advanced packaging services.　　With the adoption of cutting-edge technologies such as 3D/2.5D packaging, BIWIN Storage is able to deliver top-notch services to customers in reducing product power consumption, improving performance, and offering customized packaging and testing services for areas such as computing power. Mr. Sun emphasized that advanced packaging and testing is not only the consequence driven by market demand but is also the inevitable direction of future industry development. This layout will further solidify BIWIN Storage's leadership in the storage industry.　　To accelerate the implementation of advanced packaging and testing, BIWIN Storage has chosen to establish an advanced packaging and testing factory in the Greater Bay Area. As a core hub of China's high-tech industry, the Greater Bay Area houses numerous IC design companies and innovative enterprises. However, there are still significant gaps in the packaging and testing field. BIWIN's advanced packaging and testing layout fills this gap and promotes the coordinated development of the entire industry chain.　　Mr. Sun expressed that BIWIN Storage plans to launch its new plant in 2025 to provide more efficient and flexible packaging and testing services for customers in areas such as computing power. This layout will not only strengthen the company's competitiveness in the storage market but also inject new vitality into the Greater Bay Area's innovation ecosystem.　　Integrated R&D and Packaging 2.0 Strategy: Building Core Advantages to Strengthen Customer Loyalty　　In the summary of the "Integrated R&D and Packaging 2.0 Strategy", Sam Sun emphasized that the core of this strategy lies in enhancing BIWIN's core competitiveness in the storage industry through technological innovation and full-chain collaboration, while establishing closer partnerships with clients. The main advantages of this strategy are reflected in the following four aspects:　　01 Expanding Industry Coverage　　The Strategy contributes to enhancing collaboration with upstream wafer fabs to maintain control over R&D, manufacturing, and mass production, while serving a wider range of customers and expanding the industry chain through the application of advanced packaging and testing technologies.　　02 Enhancing Technological Barriers　　The Strategy contributes to strengthening technological innovation by increasing R&D investment, and participating in more high-end application scenarios, so as to gain a unique market advantage and secure a technological edge in the competitive landscape.　　03 Driving Innovation and Differentiation　　The Strategy contributes to offering products with higher bandwidth, lower power consumption to the market by developing differentiated solutions, more complex packaging processes, and advanced memory architectures, showcasing BIWIN's technological strength in the industry.　　04 Strengthening Customer Loyalty and Trust　　The Strategy contributes to providing high-quality and customized solutions, along with comprehensive technical and service support, to strengthen customer relationships and trust and achieve mutual success through deep collaboration with customers.　　Looking Ahead: Focusing on Dual-Drive Strategy to Elevate Customer Value　　In the end, Mr. Sun concluded BIWIN Storage's vision with the phrase "BIWIN, WIN-WIN". He emphasized that BIWIN Storage will continue its dual-drive strategy of storage and advanced packaging and testing to join hands with customers to seize future opportunities in the storage industry. BIWIN Storage aims to be more than just a storage product provider — it strives to be a trusted all-around partner, driving technological innovation and commercial success together with its customers.
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Release time：2024-11-08 13:45 reading：288 Continue reading>>
GigaDevice GD32F30x Software Test Library (STL) Achieves TÜV Rheinland IEC 61508 Functional Safety Certification
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GigaDevice GD32F30x Software Test Library (STL) Achieves TÜV Rheinland IEC 61508 Functional Safety Certification

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies announced that its GD32F30x Software Test Library (STL) has received IEC 61508 SC3 (SIL 2/SIL 3) functional safety certification from TÜV Rheinland. This certification follows the earlier certification of the GD32H7 Software Test Library (STL), demonstrating that GigaDevice has established a comprehensive presence in the field of functional safety. The company now offers software test libraries for both high-performance Arm® Cortex®-M7 core MCUs and mainstream Arm® Cortex®-M4 core MCUs, providing users with a broader range of product options for industrial applications. These achievements highlight GigaDevice’s commitment to product safety and reliability, as well as its expertise and advancements in the field of functional safety.　　The GD32F30x STL software test library is designed to ensure the safe operation of the GD32F30x series MCUs. It monitors the status of core units such as the internal CPU/DPU, FPU, and MPU, and conducts regular checks on memory like SRAM and Flash to quickly identify random hardware faults. Upon detecting a fault, the GD32F30x Software Test Library (STL) immediately triggers a preset safety response mechanism, placing the MCU in a safe state, thereby mitigating potential risks and providing users with time to address and rectify system failures. Additionally, it offers comprehensive documentation, including FMEDA and safety manuals, to ensure that the product meets specific safety requirements throughout the design, development, and production processes.　　Vincent Li, GigaDevice CTO and General Manager of MCU BU, stated: "As industrial automation and intelligence continue to evolve, the importance of functional safety becomes increasingly evident. The consecutive IEC 61508 SC3 (SIL 2/SIL 3) functional safety certifications for the GD32H7 STL and GD32F30x STL demonstrate that GigaDevice has established a mature management system in the functional safety field. This is crucial for enhancing the overall competitiveness of our GD32 MCU products and enabling users to develop products that meet functional safety standards in a shorter timeframe. Meanwhile, the certification process for the GD32 MCU software test library based on the Arm® Cortex® M33 core is also progressing concurrently. We will continue to align with international standards and drive technological advancements and product upgrades.”　　Bin Zhao, General Manager Cybersecurity & Functional Safety Greater China of TÜV Rheinland stated: Congratulations to GigaDevice for once again obtaining TÜV Rheinland's STL functional safety certification! GigaDevice's steadfast commitment to functional safety reflects its dedication to stringent safety standards, which we highly commend. In the future, we will continue to uphold professional technical requirements, adhere to rigorous certification processes, and deepen our collaboration to support GigaDevice in achieving further breakthroughs in the field of functional safety.”　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety production certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.
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Release time：2024-11-07 14:00 reading：323 Continue reading>>
NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control Modules and Zone Control Units
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NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control Modules and Zone Control Units

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).　　At time of launch, the NSE34 and NSE35 families includes 26 single-, dual- and quad-channel devices developed for operation across 11 separate load currents intervals (11 A to sub-2 A). These devices have an Rds(on) resistance range from 8 mΩ to 140 mΩ and feature industry-leading load-driving capabilities and advanced diagnostic and protection functions such as advanced over-current protection and over-voltage clamping protection.　　All devices in the two families are fully compliant with multiple automotive standards, including AEC-Q100, AEC-Q100-006, AEC-Q100-012 Grade A, ISO7637, ISO16570 and CISPR25-2021 Class 5.　　Yang WANG, Product Line Marketing Director of NOVOSENSE said: “For electric and autonomous vehicles, body domain controllers have become increasingly important, enabling smart power distribution and functional integration. Indeed, they are essential for many applications, whether in resistive loads such as a seat heater, capacitive or halogen lamp loads for surge-current handling, or inductive loads such as in wipers, solenoids and relays, where it protects against negative voltage spikes.”　　The NSE34 and NSE35 families of high-side switches are available in 14- and 16-pin HSSOP packages measuring 4.9mm x 3.9mm respectively.
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Release time：2024-11-06 14:11 reading：341 Continue reading>>
ROHM at electronica 2024: Empowering Growth, Inspiring Innovation
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ROHM at electronica 2024: Empowering Growth, Inspiring Innovation

　　Willich/Munich, Germany, October 10th, 2024 – ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.　　At booth C3-520, ROHM will showcase its advanced power and analog technologies designed to enhance power density, efficiency, and reliability in both automotive and industrial applications. These advancements are crucial for addressing the increasing demands of modern electronic systems, particularly in the context of sustainability and innovation.　　Under the theme "Empowering Growth, Inspiring Innovation," ROHM will highlight via its various demo application stations in “tree style” how its high-quality semiconductor technologies contribute to solving critical social and ecological challenges. The focus will be on driving sustainability in electronic design and innovation, which aligns with the growing emphasis on creating environmentally responsible solutions within the industry.　　At electronica 2024, the exhibition space has been greatly expanded and the number of items on display has been increased to 30 – more than three times compared to the previous show.　　The latest solutions will be exhibited under the three themes of “for E-Mobility”, “for Automotive”, and “for Industrial”.　　For E-Mobility　　・TRCDRIVE pack™ with 2-in-1 SiC Molded Module to improve the efficiency of traction inverters　　・New EcoIGBT™ products for electric compressors　　・New EcoSiC™ Schottky Barrier Diodes for onboard chargers　　For Automotive　　・New configurable PMIC with supporting functional safety features for application processors, SoCs and FPGAs　　・LED Driver ICs for Exterior Lighting / Head Lamps　　・Advanced solutions on the ADAS cockpit demo　　For Industrial Equipment　　・Industrial AC-DC PWM Controller ICs – support a wide range of power transistors from Si MOSFETs and IGBTs to SiC MOSFETs　　・The EcoGaN™ family of 150V and 650V class GaN HEMTs in several EVKs　　・Latest R&D project on Terahertz　　In addition to product showcases, ROHM is committed to fostering technical exchange and collaboration at electronica 2024. "For us, electronica is more than just a showcase – it’s an opportunity to forge new connections, strengthen existing partnerships, and reunite with industry peers," says Wolfram Harnack, President of ROHM Semiconductor Europe. "We are excited to welcome our guests to Munich as we work together to shape the future of electronics."　　For a sneak peek at which highlights ROHM will present during electronica 2024, visit our event preview page: https://www.rohm.com/electronica　　TRCDRIVE pack™, EcoIGBT™, EcoSiC™ and EcoGaN™ are trademarks or registered trademarks of ROHM Co., Ltd.
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Release time：2024-11-05 15:56 reading：297 Continue reading>>
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.
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Release time：2024-10-15 13:19 reading：278 Continue reading>>
ROHM’s New PWM Controller ICs with SOP Package for Power Supply in a Wide Variety of Industrial Applications
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ROHM’s New PWM Controller ICs with SOP Package for Power Supply in a Wide Variety of Industrial Applications

　　ROHM has developed external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supply in various industrial applications. Mass production has begun for four variants designed to drive a wide range of power semiconductors: the BD28C55FJ-LB for low-voltage MOSFETs, BD28C54FJ-LB for medium- to high-voltage MOSFETs, BD28C57LFJ-LB for IGBTs, and BD28C57HFJ-LB for SiC MOSFETs.　　Although the global semiconductor shortage is beginning to ease, the supply of semiconductor components for power supplies in industrial applications continues to lag behind demand. This is particularly true for PWM controller ICs, where the limited number of manufacturers has resulted in chronic shortages, leading to numerous requests for product development.　　In response, ROHM has developed PWM controller ICs that address the ongoing supply issue by meeting the industrial market’s stringent package and performance requirements. Depending upon the input AC voltage range of the application, a wide variety of semiconductors are used for power supply circuit. Each of these semiconductors demand different undervoltage lock out levels to prevent thermal runaway in case of supply/gate voltage drop. To solve this issue, ROHM has developed 4 variants with different undervoltage lock out levels.　　The new products feature an input voltage range of 6.9V to 28.0V, circuit current up to 2.0mA, maximum startup current of 75µA, and a maximum duty cycle of 50%, offered in the standard SOP-J8 package (equivalent to the JEDEC SOIC8). The products are pin to pin compatible to standard products commonly used in power supply circuits, thus reducing re-design and modification efforts. All variants are equipped with a self-recovery-type undervoltage lockout function (UVLO) with voltage hysteresis. This significantly improves application reliability by reducing the threshold voltage error to ±5%, compared to the typical ±10% of standard products.　　At the same time, these ICs are designated for long-term supply, thus ensuring continuous operation of long-life industrial equipment. Going forward, the lineup will be further expanded to include products suitable to drive high-voltage MOSFETs and GaN devices. More variants to support a maximum duty cycle of 100% are also being planned.　　Application ExamplesIndustrial equipment: AC-DC power supplies, motor drive inverters, and other AC-powered devices　　Product Information　　Applicable Part Nos: BD28C54FJ-LB, BD28C55FJ-LB, BD28C57HFJ-LB, BD28C57LFJ-LB　　TerminologyPWM Control Type　　Short for Pulse Width Modulation, a method for controlling power using semiconductors. The output power is controlled by varying the ratio of ON and OFF times within a fixed cycle.　　Duty Cycle　　The proportion of ON and OFF times as percentage of the switching period is known as ON- and OFF-duty cycle, respectively. It is common to refer to the ON-time ratio as the duty cycle. Duty Cycle (%) = Pulse Width (t) / Period (T).　　Self-Recovery Undervoltage Lockout Function (UVLO) with Voltage Hysteresis　　This function safety stops IC operation before the circuit inside the IC becomes abnormal when the input voltage drops below a threshold. For self-recovery types, the IC can become unstable by repeatedly stopping and starting near the threshold voltage, so a protection circuit with hysteresis is used to create a voltage difference between the stop and restart points.
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Release time：2024-10-08 14:42 reading：486 Continue reading>>
Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device
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Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device

　　Murata Manufacturing Co. Ltd has expanded its innovative range of multilayer ceramic capacitors (MLCCs) with yet another groundbreaking addition. Exemplifying Murata’s continual commitment for minimization, it has developed the world’s first 006003-inch size (0.16 mm x 0.08 mm) MLCC. This achievement represents a volume ratio approximately 75% lower than the existing smallest product, the 008004-inch size (0.25×0.125mm).　　In recent years, as electronic devices become more sophisticated and compact, the number of electronic components installed has increased, while simultaneously the space required for installation has been reduced. As electronic devices continue to advance in intelligence, there has been a corresponding increase in the incorporation of MLCCs across all types of electronic devices, with the latest smartphones utilizing up to 1000 units. Against this background, there is a growing need for ultra-compact products that enable high-density component mounting with limited mounting space.　　Since its inception in 1944, Murata has been committed to the exploration and advancement of ceramic capacitors, nurturing its unparalleled understanding of raw materials, manufacturing processes, and production technologies. In 2014, Murata successfully brought to market the world’s first 008004-inch size (0.25×0.125mm) multilayer ceramic capacitors, which have experienced growing utilization in smartphone modules and wearable devices. The creation of this MLCC is the outcome of years of focused R&D in elemental technologies, resulting in a device that measures just 0.16mm x 0.08mm x 0.08mm (L/W/T).　　“Under our slogan 'Innovator in Electronics' we will continue to lead the electronics industry by providing innovative products and developing technologies,” said Hidetoshi Nakagawa, General Manager of Ceramic Capacitor Marketing at Murata Manufacturing Co Ltd. He continued, “This product is another world’s first in a long line of Murata’s market defining MLCCs and will significantly contribute to the future miniaturization and improvement of our customer’s electronic devices.”　　This revolutionary product will be showcased at Murata’s booth (6H104) during the CEATEC JAPAN 2024 event, scheduled to take place at Makuhari Messe in Chiba Prefecture on October 15, 2024. For further information on CEATEC 2024 and tickets visit here
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Release time：2024-09-26 11:09 reading：550 Continue reading>>

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AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.