Qualcomm Taps Samsung's 7nm EUV for 5G

发布时间：2018-02-26 00:00
作者：Ameya360
来源：Dylan McGrath
阅读量：1022

　　SAN FRANCISCO — Qualcomm said it will continue to work with longtime foundry supplier Samsung Electronics on Snapdragon 5G chipsets using Samsung's 7nm Low Power Plus (LPP) process technology with extreme ultraviolet (EUV) lithography.

　　Samsung aims to take the lead in putting long-delayed EUV into production, with plans to use it in its 7nm LPP process starting in the second half of this year. Other leading-edge chip makers-- including Intel, TSMC and Globalfoundries--are targeting EUV production sometime in 2019.

　　Qualcomm (San Diego) said using the 7nm LPP EUV process technology for Snapdragon 5G will give the chips a smaller footprint, providing handset OEMs with space to support larger batteries or slimmer designs. The process technology and design of the Snapdragon chips is expected to result in significant improvements in battery life, Qualcomm said.

　　The 7nm LPP process offers up to a 40 percent increase in area efficiency with 10 percent higher performance or up to 35 percent lower power consumption compared to the foundry's 10nm FinFET technology, Samsung said.

　　Samsung has been building chips for Qualcomm for more than 10 years. While the announcement that Qualcomm will use Samsung's 7nm LPP process technology for its 5G Snapdragon chips is hardly unexpected, the news does demonstrate that the relationship between the two companies remains strong after the Nikkei news service reported late last year that Qualcomm would move some of its modem chip production from Samsung to rival TSMC, The announcement is also a vote of confidence for EUV technology, which after decades of development finally appears poised for use in semiconductor production.

　　"This collaboration is an important milestone for our foundry business as it signifies confidence in Samsung’s leading process technology," said Charlie Bae, executive vice president of Samsung's foundry sales and marketing team, in a statement.

　　Samsung maintains that its 7LPP EUV technology involves less process complexity and will offer higher yield compared to its 10nm FinFET technology.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Mobile AI Race Unfolds at MWC

下一篇：UWB Rallies Forces in the IoT

在线留言询价

相关阅读
Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market
Trade news

Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

　　During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.　　TrendForce’s Insights:　　Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market　　Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.　　As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.　　With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.　　In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.　　Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development　　Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.　　In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.　　As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.
2023-11-07 14:45 阅读量：2046
Qualcomm Initiates Major Layoffs in China, Shanghai R&D Center Closure Rumored
Trade news

Qualcomm Initiates Major Layoffs in China, Shanghai R&D Center Closure Rumored

　　According to TechNews, the ongoing soft demand for smartphones, combined with Huawei’s launch of the Mate 60 Pro, has severely impacted Qualcomm. Reports within the Chinese industry suggest that Qualcomm is planning significant layoffs in China, with severance costs estimated to be as high as N+7.　　Based on discussions in Chinese forums and media reports, Qualcomm’s Shanghai R&D center is set to undergo substantial layoffs. This center primarily focuses on wireless-related businesses. The severance standards for permanent employees are at least N+4, which means the employee’s tenure plus an additional 4 months are considered for severance pay. As for contract employees, the severance compensation is set at N+7.　　In fact, Qualcomm announced its downsizing plan in August, with reports suggesting that Qualcomm Taiwan plans to lay off about 200 employees in October. Ths will affect personnel in product engineering, testing, and verification fields, comprising 11.8% of the total workforce. The company is also implementing cost-saving measures such as eliminating annual salary adjustments and reducing bonuses to 70%.　　This downsizing rumor has also extended to China, with reports at the time suggesting that Qualcomm China might lay off up to 40% of its workforce. The main reasons cited were sluggish demand for smartphones and Huawei’s new Kirin processor.　　Analyst Ming-Chi Kuo of TF International Securities stated that Huawei is expected to fully adopt its own designed Kirin processors in its upcoming phones next year. Qualcomm will be the major loser in this scenario, losing Huawei’s orders entirely.　　According to Kuo’s data, Huawei purchased 23 to 25 million smartphone SoCs (System on a Chip) from Qualcomm in 2022, but this number increased to 40 to 42 million in 2023. However, starting in 2024, Huawei will use its own chip designs, causing Qualcomm to not only lose orders but also face the risk of declining shipments from other Chinese brand customers due to Huawei’s increased market share.　　Kuo also expects that, influenced by Huawei’s actions, Qualcomm’s SoC shipments to Chinese smartphone brands will decrease by 50 to 60 million units next year and continue to decline in the following years.　　With a significant potential decline in performance in the Chinese market and increasing price competition towards the end of the year, Qualcomm is expected to carry out more layoffs. As of September last year, Qualcomm had approximately 51,000 employees worldwide. The company’s restructuring costs in the last quarter amounted to $285 million, with most of it being severance pay. In June of this year, the U.S. headquarters also reduced around 415 positions.
2023-09-21 16:48 阅读量：2385
Qualcomm refused modems for 2018 iPhone models: Apple
Trade news

Qualcomm refused modems for 2018 iPhone models: Apple

　　Taking its legal battle with chip making giant Qualcomm to the next level, Apple has claimed it wanted to use Qualcomm modems in its 2018's iPhone models but the chip maker refused to sell them after being sued by the iPhone maker over its licensing practices.　　The US Federal Trade Commission(FTC) has accused Qualcomm of operating a monopoly in wireless chips, forcing companies such as Apple to work with it exclusively and charging excessive licensing fees for its technology.　　According to Apple Chief Operating Officer Jeff Williams's testimony in court during the FTC trial against Qualcomm, the latter refused to sell its 4G LTE modems to Apple because of the companies' licensing dispute, the CNET reported late on Monday.　　The chip making giant continues to provide the iPhone maker with chips for its older models, including the iPhone 7 and 7 Plus.　　"The strategy was to dual-source in 2018 as well. We were working toward doing that with Qualcomm but in the end they would not support us or sell us chips," the report quoted William as saying.　　Apple reportedly dialled Intel's CEO at the time, Brian Krzanich, to ask the company to supply all modems needed for the iPhone instead of only half the volume.　　However, Williams' comments appear to contradict testimony from Qualcomm's CEO Steven Mollenkopf.　　Mollenkopf on Friday had said on the stand that as of spring 2018, Qualcomm was still trying to win a contract supplying chips for iPhones but that it hadn't "had any new business" from Apple since its previous contracts expired, the report added.
2019-01-16 00:00 阅读量：3103
Qualcomm calls Apple CEO's settlement talk comment
Trade news

Qualcomm calls Apple CEO's settlement talk comment "misleading"

　　Qualcomm Inc on Tuesday responded to comments Apple Inc Chief Executive Tim Cook made in an interview, in which he said there had been no recent settlement talks between the iPhone maker and chip supplier in their global legal battle, calling Cook's remarks "misleading."　　The two companies are disputing comments their CEOs have made over settlement talks: Apple's chief on Tuesday said any talks ended in September 2018. In November, Qualcomm's Chief Executive Steve Mollenkopf made comments about the supplier's efforts to resolve the dispute.　　Qualcomm on Tuesday said Cook miscast Mollenkopf's remarks, which did not mention a settlement and which Qualcomm maintains are accurate.　　The war of words is unlikely to play a major role in the outcome of the legal fight between the two firms. But it signals the high stakes and deeply entrenched positions of each side, with Apple arguing in court that Qualcomm charges an unfair "tax" on its phones while Qualcomm fights to protect a patent licensing model it argues has helped bring connectivity to billions of new users through wireless networks.　　In a television interview on CNBC earlier on Tuesday, Cook responded to a question from host Jim Cramer about whether Apple would settle with Qualcomm after Qualcomm had announced legal victories against Apple in patent cases in China and Germany.　　"Look, the truth is, we haven't been in any settlement discussions with them since the third calendar quarter of last year. That is the truth. So I'm not sure where that thinking is coming from," Cook said.　　Cook's comments contrasted with those Mollenkopf made in November on CNBC.　　"We do talk as companies, and I think what you're seeing, really, are activities consistent, really, with the fourth quarter of the game, and not the first quarter," Mollenkopf told CNBC then. "We always talk about – and I've been very consistent - that this second half of and into, is when we're really on the doorstep of finding a resolution."　　In a statement, a Qualcomm spokesperson said the company stands by Mollenkopf's remarks.　　"We have been consistent for the last 18 months in making clear that we have, at various times, been in discussions with Apple about a possible resolution to our licensing dispute," a Qualcomm spokesperson said in a statement. "We have also stated clearly on several occasions that we believe it will be resolved, one way or the other, in the near future, either through a settlement or court decisions."　　The primary case in Apple and Qualcomm's legal battle goes to trial in April.　　Apple has accused Qualcomm of engaging in illegal patent licensing practices to preserve a dominant market position in so-called modem chips, which help mobile phones connect to wireless data networks. Qualcomm has argued that its practices followed decades-long tech industry norms and that Apple has not fairly compensated it for its intellectual property.
2019-01-11 00:00 阅读量：3135
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
型号 品牌 抢购
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。