Infineon to Invest $1.9 Billion in New Austrian Chip Factory

发布时间：2018-05-22 00:00
作者：Ameya360
来源：Bloomberg
阅读量：1022

Infineon Technologies AG will spend 1.6 billion euros ($1.9 billion) over six years to build a new factory in Austria, in a bet on rising demand for semiconductors that go in everything from electric cars to wind turbines.

Infineon will create 400 new jobs at the new site in Villach in southern Austria, where the production of 300-millimeter thin wafers is due to start in 2021. The factory is next to an existing company facility and has the potential to generate 1.8 billion euros in yearly sales, the company said.

“Customers around the world are rushing through our doors to place orders,” said Infineon Chief Executive Officer Reinhard Ploss at an event in Vienna Friday. “Growth is underpinned by global megatrends such as climate change, demographic change and increasing digitization,” and the investment will allow the company to hold its technological leadership in the industry, he said.

The company is seeking to hire staff from around the world, and the Austrian government has agreed to expand education and research facilities in the Carinthia region to help Infineon’s growth plans. Austrian Chancellor Sebastian Kurz at the event in Vienna called the investment a “historic one and the biggest in a long long time” in the country. The government is in talks with other “major international companies” to support a re-industrialization in Europe, he said, without giving details.

Infineon, which competes with NXP Semiconductors NV and STMicroelectronics NV, is pushing into the growing market for electric cars and renewable energy that provides fresh revenue streams as demand for semiconductors used in smartphones and tablets slows. It’s part of Ploss’s bet on trends such as energy efficiency, connectivity and mobility.

In March Infineon and SAIC Motor Corp Ltd., China’s largest automaker by sales volume, revealed a new joint company to produce power modules for Chinese manufacturers of electric cars and plug-in hybrids, jointly investing at least 100 million euros ($122 million) and hiring 250 people to expand Infineon’s chip factory in Wuxi.

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：Semi Capex Forecast to Exceed $100B for the First Time in 2018

下一篇：Samsung, SK to invest W45 tril. in semiconductors

在线留言询价

相关阅读
Infineon announces completion of acquisition of GaN Systems
Trade news

Infineon announces completion of acquisition of GaN Systems

　　Infineon Technologies AG recently announced the closing of the acquisition of GaN Systems Inc. (“GaN Systems”). The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and leading-edge application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing.　　“GaN technology is paving the way for more energy-efficient and CO 2-saving solutions that support decarbonization,” said Jochen Hanebeck, CEO of Infineon. “The acquisition of GaN Systems significantly accelerates our GaN roadmap and further strengthens Infineon’s leadership in power systems through mastery of all relevant power semiconductor technologies. We welcome our new colleagues from GaN Systems to Infineon.”　　Infineon now has a total of 450 GaN experts and more than 350 GaN patent families, which expands the company’s leading position in power semiconductors and considerably speeds up time-to-market. Both companies’ complementary strengths in IP and application understanding as well as a well-filled customer project pipeline put Infineon in an excellent position to address various fast-growth applications.　　On 2 March 2023, Infineon and GaN Systems announced that the companies had signed a definitive agreement under which Infineon would acquire GaN Systems for US$830 million. The acquisition, an all-cash transaction, was funded from existing liquidity.
2023-10-27 10:48 阅读量：1241
Infineon Inks Multi-Year Power Semiconductor Supply Agreements with Hyundai and Kia
Trade news

Infineon Inks Multi-Year Power Semiconductor Supply Agreements with Hyundai and Kia

　　Infineon, Hyundai, and Kia announced on October 18 that they have signed a multi-year agreement for the supply of SiC (Silicon Carbide) and Si (Silicon) power semiconductor modules and chips.　　Under this agreement, Infineon will supply SiC and Si power components to Hyundai and Kia until 2030, and in return, Hyundai and Kia will support Infineon’s production capacity and reserves.　　The demand for SiC power devices has surged with the growing popularity of new energy vehicles, and as a prominent industry leader, Infineon has embarked on numerous collaborations this year.　　Infineon and Resonac　　In January, Infineon declared a new multi-year supply and cooperation agreement with Resonac Co., Ltd. (formerly Showa Denko K.K.). According to this agreement, Resonac will provide Infineon with SiC materials for producing SiC semiconductor components, including 6-inch and 8-inch wafers. Initially focused on 6-inch wafers, Resonac will later supply 8-inch SiC wafers to support Infineon’s transition to 8-inch wafers. As part of the agreement, Infineon will also provide Resonac with SiC material technology-related intellectual property.　　Infineon and TanKeBlue, SICC　　In May, Infineon signed long-term agreements with TanKeBlue and SICC to ensure a more competitive and substantial supply of silicon carbide materials. These two suppliers will primarily provide Infineon with 6-inch silicon carbide substrates and offer 8-inch silicon carbide materials, aiding Infineon in transitioning to 8-inch SiC wafers. The agreements also encompass silicon carbide ingots, as Infineon had previously invested nearly 1 billion RMB in acquiring a laser-based wafer technology enterprise, aiming to enhance the utilization of silicon carbide substrates and device cost competitiveness.　　Notably, both TanKeBlue and SICC will account for a double-digit percentage of Infineon’s long-term demand volume.　　Infineon and Foxconn　　In the same month, according to the Foxconn’s official website, Infineon and Foxconn have signed a memorandum of cooperation to establish a long-term partnership in the field of electric vehicles. Under this agreement, the two companies will focus on the adoption of silicon carbide technology in high-power applications for electric vehicles, such as traction inverters, on-board chargers, and DC converters. They also plan to jointly establish a system application center in Taiwan to expand their collaboration further.　　Infineon and Schweizer Electronic　　Additionally, Infineon is collaborating with Schweizer Electronic to develop an innovative solution aimed at directly embedding Infineon’s 1200V CoolSiC™ chips into PCB boards. This move seeks to significantly enhance the driving range of electric vehicles while reducing the overall system cost.　　Infineon and Infypower　　In September, Infineon announced a partnership with Shenzhen Infypower (INFY) to provide the industry-leading 1200V CoolSiC™ MOSFET power semiconductor devices, boosting the efficiency of electric vehicle charging stations.　　In line with their goal of capturing a 30% share of the global SiC market by 2030, Infineon revealed plans to invest up to 5 billion euros over the next five years to construct the world’s largest 8-inch SiC power semiconductor facility in Malaysia.
2023-10-20 13:27 阅读量：1582
AMEYA360：Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board
Trade news

AMEYA360：Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board

　　Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board is designed to demonstrate the CoolSiC MOSFET module and Silicon-On-Insulator (SOI) gate driver technology for motor drives. This eval board is powered by a 6ED2231S12T 1200V, a three-phase gate driver.       The EVAL-6ED2231S12TM1 board features an EasyPACK 1B CoolSiC MOSFET 1200V module, one three-phase SOI gate driver IC, and an M1 connector. This eval board supports over current protection, Fault reporting, automatic Fault clear, and Enable function on the same pin (RFE). Typical applications include ceiling fans, Heating Ventilation and Air Conditioning (HVAC), industrial motor drives and controls, motor control and drives, and residential heat pumps.　　FEATURES　　1200V SOI technology　　5000W maximum motor power　　200V minimum and 800V maximum supply voltage　　Best-in-class minus VS performance　　Withstands negative 100V with repeating 700ns pulse widths　　Integrated, ultra-fast, and low RDSON bootstrap diode　　IO+ 350mA and IO- 650mA output current　　Over current protection (ITRIP ±5% reference)　　Integrated 360ns dead-time　　Independent under-voltage lockout for VCC and VBS　　3.3V, 5V, and 15V input logic compatible　　Fault reporting, automatic Fault clear, and Enable function on same pin (RFE)　　2.5kV HBM ESD and 25V VCC capable　　SOIC-28 with 4 pins removed for high clearance DSO-24 package　　APPLICATIONS　　Ceiling fan - motor control and drive solutions　　Heating Ventilation and Air Conditioning (HVAC)　　Industrial motor drives and controls　　Motor control and drives　　Residential heat pumps
2023-03-28 14:59 阅读量：1813
Ameya360:Infineon’s WBG catch-up with GAN Systems acquisition
Trade news

Ameya360:Infineon’s WBG catch-up with GAN Systems acquisition

　　At a dinner held during CES 2023 in January, I had the opportunity to talk to a senior Infineon executive sitting next to me about the company’s widely talked about acquisition ambitions for this year expressed in a statement. The rationale was that while the semiconductor industry is going through a downward cycle, it’s a good window of opportunity to acquire strategic assets at a good price.　　A few days later, when I sat with GAN Systems CEO Jim Witham to get a sense of what’s new and latest in gallium nitride (GaN) semiconductor technology, what I found most striking was his remark about how quickly this market has emerged over the past decade or so. “If you go back five years, people were asking when GaN will happen, and now while GaN devices has established themselves in the market, it’s a little late to join the GaN party,” Witham said. Now it’s really about market penetration, he added.　　At that moment, I instantly began thinking about large power semiconductor players and what they will do to address this market reality. One company that came to mind was Microchip, which acquired Microsemi in 2018 to get hold of silicon carbide (SiC) assets. Very good timing, indeed.　　Another supplier of wide bandgap (WBG) semiconductors, UnitedSiC, was acquired by Qorvo in 2021. But what about other big analog and power semiconductor suppliers? What also came to mind was Infineon’s failed attempt to acquire Cree’s SiC business, Wolfspeed, back in 2017. Cree later named itself on its most successful brand, Wolfspeed, and its SiC business has rapidly grown since then.　　Figure 1 GaN semiconductors facilitate higher power density, higher energy efficiency, and smaller device form factor. Source: Infineon Technologies　　Well, Infineon Technologies has answered the call by snapping GAN Systems for $830 million. Industry watchers believe this could trigger a consolidation wave around the emerging WBG semiconductor industry. Besides Ottawa, Canada-based GAN Systems, other GaN semiconductor specialists include Cambridge GaN Devices, Efficient Power Conversion (EPC), Navitas Semiconductor, Transphorm, and Vanguard International Semiconductor.　　Acquisition merits　　While we’ve seen several SiC-centric acquisitions in recent years, Infineon’s deal marks the first major GaN asset purchase. And, given GaN’s crucial significance in power electronics, it’s very likely that it won’t be the last.　　For Infineon, the number one power semiconductors business in terms of market share, it’s also critical that it fills the GaN missing link in its power semiconductors portfolio. Though not a prolific acquisition player, Infineon has made two highly successful deals in recent years. First, in 2014, it bought power semiconductor pioneer International Rectifier to bolster its automotive offerings. The acquisition also brought Infineon some GaN technology assets as an add-on to this deal.　　Next, in 2019, Infineon acquired Cypress Semiconductor to further boost its portfolio for the automotive markets. Both deals—International Rectifier and Cypress—have gone well for Infineon. So, given Infineon’s track record and prevailing market conditions, the GAN Systems purchase looks like a timely call.　　Figure 2 GaN semiconductors have been incorporated into Canoo’s on-board charger (OBC) to convert AC power from the wall receptacle into the DC power that charges the EV battery. Source: GAN Systems　　Besides strengthening Infineon’s GaN technology roadmap, it provides the German chipmaker timely access to applications such as mobile charging, data center power supplies, residential solar inverters, and on-board chargers (OBCs) for electric vehicles (EVs). As GAN Systems chief Witham points out, the deal will also combine Infineon’s in-house manufacturing with GaN Systems’ foundry corridors. TSMC is GAN Systems’ manufacturing partner.　　Here, it’s important to note that in February 2022, Infineon announced to double down on WBG manufacturing by investing more than €2 billion in a new front-end fab in Kulim, Malaysia. The first wafers will leave the fab in the second half of 2024, complementing Infineon’s existing WBG manufacturing capacities in its fab at Villach, Austria.　　End of another chip startup story　　It’s the end of the road for the Canadian startup founded in Ottawa in 2006. Girvan Patterson and John Roberts co-founded GaN Systems after seeing GaN as an opportunity and growth venue in the power industry, especially in data centers, industrial motors, and mobile chargers. Ottawa, the Canadian capital, had a research facility, National Research Council (NRC), which gave the upstart a small GaN fab to acquire fast learning cycles. “That’s why we could develop working GaN transistors fast enough,” Witham told EDN at CES 2023.　　Figure 3 GaN Systems, based in Ottawa, has more than 200 employees.　　GaN Systems has been a success story in the rapidly emerging WBG semiconductors arena. GaN semiconductors are now being targeted at a wide range of power applications due to their smaller form factor and energy-saving credentials enabled by higher power density and energy efficiency. According to market research firm Yole, the GaN revenue for power applications is expected to grow by 56% CAGR to approximately $2 billion by 2027.　　GaN Systems claims it’s the only GaN semiconductors company with a production program for automotive. At CES 2023, it displayed an OBC from Canoo and a DC-DC converter from Vitesco for EVs. The adoption of GaN devices in EVs is at a tipping point, as Infineon CEO Jochen Hanebeck acknowledged in the press release announcing this acquisition.
2023-03-07 13:21 阅读量：515
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
型号 品牌 抢购
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。