Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

发布时间：2024-06-28 11:31
作者：AMEYA360
来源：Murata
阅读量：483

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.

　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.

　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.

　　Specifications

Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

（备注：文章来源于网络，信息仅供参考，不代表本网站观点，如有侵权请联系删除！）

上一篇：400mA, High Output Slew Rate: NOVOSENSE's NSOPA240x Series Cracks the Challenge of Resolvers

下一篇：ROHM Develops a Novel VCSELED™ Infrared Light Source that Combines Features of VCSELs and LEDs

在线留言询价

相关阅读
Murata SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor
Trade news

Murata SCH1633-D01 Sets a New Standard for Automotive 6DoF Sensor

　　Murata is expanding its range of innovative Six Degrees-of-Freedom devices with the introduction of the SCH1633-D01. The micro-electromechanical system (MEMS) based sensor moves the benchmark for performance, system integration, and total cost optimization. It is designed for various automotive applications, including autonomous driving (AD), advanced driver-assistance systems (ADAS), inertial navigation, vehicle stability control, and camera or headlight alignment.　　Market Demands　　With the increasing push for vehicle autonomy and safety, there is an unquestionable demand for extremely accurate sensors with comprehensive built-in safety features and a high level of integration. Likewise, complying with technical regulations like the UNECE’s headlight leveling regulation requires accurate and cost-optimized solutions – something the SCH1633-D01 has demonstrated it can achieve.　　The SCH1633-D01 is a single-package solution optimized for zonal architecture where all required subsystems, like GNSS integration, chassis control, and vehicle attitude sensing (camera and headlight alignment) can utilize its measurements. It is targeted for deployment in the central vehicle inertia measuring unit (IMU) providing a high-quality signal for all subsystems within the vehicle even in the toughest environments. This integration helps to reduce system complexity and provides a much-needed opportunity for cost optimization.　　SCH1633-D01 Features　　SCH1633-D01 is packaged in a unique 24-pin SOIC housing and uses the SafeSPI 2.0 interface with an up to 20-bit data frame for an extremely smooth and high-resolution output. The component supports various system-level time synchronization features, ensuring that the SCH1633-D01’s output can be easily harnessed across the entire vehicle. Furthermore, the extensive self-diagnostics features utilize over 200 monitoring signals to ensure the output is always trustworthy.　　The SCH1633-D01 is designed to provide a high-quality output, even in harsh temperature conditions. It features AEC-Q100 grade 1 qualification to guarantee reliable use throughout the whole component lifetime and is ISO26262 compliant with ASIL-B+ rating (up to ASIL-D via system integration) for exceptional built-in safety.　　For further information on the product’s extensive functionality, please visit its detail page here.　　Murata’s Recent 6DoF MEMS Success　　Murata’s previous generation 6DoF MEMS solution has proven to be highly successful as over 90% of autonomous miles in California alone are driven with the sensor on board. The improvements in this next-generation 6DoF devices are based on customer feedback, and they have already gained global recognition.　　The industrial counterpart SCH16T-K01, launched in January this year, has won the first prize in the Industrial & Manufacturing category of the Sensors Converge fair’s “Best of Sensors Award” competition and the SCH1633-D01 preliminary sample feedback has been remarkably positive.　　A partner of Murata, Hexagon, has been using the SCH1633-D01 in their products. Gordon Heidinger, Segment Manager, Automotive and Safety-Critical Systems at Hexagon’s Autonomy & Positioning division, remarked, “　　The SCH1633-D01 is displaying exceptional performance for a single MEMS sensor. We're pleased to promote this sensor integrated with our positioning solution”.　　Murata has also successfully demonstrated that the UNECE headlight leveling regulation can be fulfilled with the SCH1633-D01 sensor in combination with a commercially available alignment algorithm. This is a significant leap towards cost-effective regulation compliance.　　“Automotive 6DoF applications are rapidly developing, with fierce competition among manufacturers to capture a share of the market. This product offers high performance, demanded by the latest systems, while also providing a much-needed cost-saving opportunity,” said Ville Nurmiainen, General Manager of Product management at Murata Electronics Oy. He continued, “The SCH1633-D01 will give both a technological and cost down advantage to OEMs choosing to utilize the product to its full potential and will help them to further drive automotive applications forward and create safer roads for us all.”　　Preliminary samples are available now. Mass production of this exciting new solution is planned for early 2025.
2024-11-12 11:22 阅读量：447
Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity
Trade news

Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.
2024-10-15 13:19 阅读量：280
Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device
Trade news

Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device

　　Murata Manufacturing Co. Ltd has expanded its innovative range of multilayer ceramic capacitors (MLCCs) with yet another groundbreaking addition. Exemplifying Murata’s continual commitment for minimization, it has developed the world’s first 006003-inch size (0.16 mm x 0.08 mm) MLCC. This achievement represents a volume ratio approximately 75% lower than the existing smallest product, the 008004-inch size (0.25×0.125mm).　　In recent years, as electronic devices become more sophisticated and compact, the number of electronic components installed has increased, while simultaneously the space required for installation has been reduced. As electronic devices continue to advance in intelligence, there has been a corresponding increase in the incorporation of MLCCs across all types of electronic devices, with the latest smartphones utilizing up to 1000 units. Against this background, there is a growing need for ultra-compact products that enable high-density component mounting with limited mounting space.　　Since its inception in 1944, Murata has been committed to the exploration and advancement of ceramic capacitors, nurturing its unparalleled understanding of raw materials, manufacturing processes, and production technologies. In 2014, Murata successfully brought to market the world’s first 008004-inch size (0.25×0.125mm) multilayer ceramic capacitors, which have experienced growing utilization in smartphone modules and wearable devices. The creation of this MLCC is the outcome of years of focused R&D in elemental technologies, resulting in a device that measures just 0.16mm x 0.08mm x 0.08mm (L/W/T).　　“Under our slogan 'Innovator in Electronics' we will continue to lead the electronics industry by providing innovative products and developing technologies,” said Hidetoshi Nakagawa, General Manager of Ceramic Capacitor Marketing at Murata Manufacturing Co Ltd. He continued, “This product is another world’s first in a long line of Murata’s market defining MLCCs and will significantly contribute to the future miniaturization and improvement of our customer’s electronic devices.”　　This revolutionary product will be showcased at Murata’s booth (6H104) during the CEATEC JAPAN 2024 event, scheduled to take place at Makuhari Messe in Chiba Prefecture on October 15, 2024. For further information on CEATEC 2024 and tickets visit here
2024-09-26 11:09 阅读量：573
Murata：Mass production begins for 0603M size copper electrode NTC thermistors, ideal for automotive applications
Trade news

Murata：Mass production begins for 0603M size copper electrode NTC thermistors, ideal for automotive applications

　　Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has developed 0603M size (0.6 x 0.3 x 0.3 mm) copper electrode NTC thermistors “NCU03XH103F6SRL” and “NCU03XH103F60RL” (hereinafter “this product”) for markets such as the automotive market where there is a demand for high reliability electronic components. This product is an expansion of the NCU series size lineup. Mass production has already begun, and samples can also be provided.　　As advances are being made towards automated driving and IoT integration in the automotive market, circuit boards are being made with an increasingly larger number of electronic components, and in turn, higher component densities. With the increasing sophistication of ADAS*1/telematics technologies*2, there are higher loads on electronic components, amplifying the issue of component overheating. As a result, there is a heightened demand for overheating detection and temperature monitoring technologies.　　We have taken advantage of Murata’s years of processing technology development experience to create a 0603M size (0.6 x 0.3 x 0.3 mm) product that can be used for high reliability applications. Compared to Murata’s existing products (1005M size), this product has an approximately 80% lower volume and approximately 70% smaller mounting area.　　Murata will continue to expand our product lineup to meet market demand. By responding quickly to market demand, we also contribute to further improvements in circuit board component densities and downsizing of devices for high reliability applications.　　*1ADAS: Advanced Driver Assistance System　　*2Telematics technology: Devices that use communications technology installed in vehicles to collect and transmit driver and vehicle data and share information in real time. Main applications of this technology include navigation systems that collect traffic information to help drivers avoid traffic jams and voice recognition services used to operate in-car features.　　Features　　Works with automobiles and other systems that require high reliability components. Downsizing (0603M size) achieved with copper electrodes.　　Approximately 80% lower volume and approximately 70% smaller mounting area than Murata’s existing products (1005M size). Because this product has the same characteristics as our existing products, there is no need to change the circuit board design when replacing an existing product with this product. This product will also help our customers increase their component density and save space on the circuit board.　　Small in volume and capable of fast response.　　Specifications
2024-08-28 15:21 阅读量：590
热门分类
盒子，外壳，机架 电缆，电线 电路保护 连接器，互连器件 开发套件 机电产品 嵌入式解决方案 风扇，热管理 光电元件 其它 无源元件 电源 半导体 传感器，变送器 测试与测量
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
型号 品牌 抢购
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
原厂授权品牌
更多授权品牌>>
资讯排行榜
  • 周排行榜
  • 月排行榜

相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年，现 有超过3500家优质供应商，收录600万种产品型号数据，100 多万种元器件库存可供选购，产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等，为广大客户提供一站式购 销服务。