Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Trade news

ROHM has Introduced Reference Designs for Three-Phase Inverters Featuring New SiC Power Modules

　　ROHM has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter circuits featuring EcoSiC™ brand SiC molded modules "HSDIP20", "DOT-247", and "TRCDRIVE pack™" on ROHM’s website. Designers can use the data provided in these reference designs to create the drive circuit boards. When combined with ROHM's SiC modules, these designs help reduce the person-hours required for device evaluation.　　In high power conversion circuits, while SiC power devices contribute to higher efficiency and reliability, they can increase the workload associated with peripheral circuit and thermal design. The reference designs released by ROHM support output power levels up to the 300kW class, facilitating the adoption of SiC modules across a wide range of automotive and industrial applications.　　Three types of SiC modules compatible with these reference designs are already available for purchase through online distributors such as DigiKey and Farnell.　　About Reference Designs　　These reference designs are intended for users to utilize the publicly released design data. If you would like to obtain a reference design board or evaluation kit, please contact a sales representative or visit the contact page on ROHM’s website. (Quantities are limited.)　　Regarding Online Sales of SiC ModulesDetails of SiC modules currently available through online distributors can be found below.　　New SiC Molded Modules Now Available for Online Purchase!　　Simulation SupportWe also provide various support resources to facilitate quick evaluation and implementation of our products. ROHM’s comprehensive solutions, including simulation and thermal design support, can provide valuable assistance in component selection.　　Various design data related to the evaluation boards can be downloaded from their respective reference design page, while the product information for SiC modules compatible with the reference designs can be accessed from each product page as well.　　Additionally, the ROHM Solution Simulator, a simulation tool enabling system-level verification from the component selection stage, is available on ROHM’s website.　　HSDIP20: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelDOT-247: Reference Design / ROHM Solution Simulator / LTspice® Circuit ModelTRCDRIVE pack™: Reference Design　　Other Reference DesignsIn addition to those introduced in this release, we offer numerous reference designs that contribute to reduced design effort for users. More details are available through the link below.　　Reference Design / Application Evaluation Kit　　Related InformationNews Release (HSDIP20)　　ROHM Develops New High Power Density SiC Power ModulesNews Release (DOT-247)　　ROHM Launches 2-in-1 SiC Molded Module “DOT-247”News Release (TRCDRIVE pack™)　　ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.・TRCDRIVE pack™ and EcoSiC™ are trademarks or registered trademarks of ROHM Co., Ltd.・LTspice® is a registered trademark of Analog Devices, Inc.When using third-party trademarks, please adhere to the usage guidelines specified by the rights holder.

Key word：

ROHM

Release time：2026-03-18 11:35 reading：230 Continue reading>>

Trade news

BIWIN Built-in BGA SSD Plus Mini SSD Make Robots Smarter, Easier to Use, and Longer-Lasting

　　With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.　　AI models are growing larger.What to do when data loading is too slow and affects decision-making?　　Devices are becoming increasingly compact, with every bit of internal space at a premium. How to balance tiny size with high-performance transmission?　　Training data keeps piling up, but memorycapacity isn’t enough and can’t be upgraded?　　Conventional embedded storage solutions (such as UFS, eMMC, M.2 SSD, MicroSD cards) are limited by trade-offs among performance, form factor, and scalability, making them insufficient for the evolving demands of humanoid robotics handling sustained high-load operation, long lifecycle, high system integration, and incremental learning.　　BIWIN BGA SSD, with its superior performance, compact form factor and excellent shock-resistance, has become one of the preferred solutions for robots; Mini SSD, positioned as an expandable storage choice with superb upgradability and flexibility, strikes a perfect balance between high performance and compact package. The combination of the built-in BGA SSD plus expandable Mini SSD constructs a new integrated storage architecture, working as a complete solution to provide stability, expandability, and systemic efficiency for intelligent robots.　　Built-in BGA SSD + External Mini SSD　　Supporting high-frequency data writes for advanced perception and decision-making　　The “brain” of a humanoid robot—the core computing motherboard—is the hardware hub for advanced perception, cognitive reasoning, and autonomous decision-making. Relying on high-performance AI computing chips, it runs multimodal large models and processes massive sensor data in real time to understand environments and plan tasks. This process demands fast and reliable storage for the operating system.　　BIWIN BGA SSD uses a PCIe 4.0 ×4 interface, delivering sequential read speeds up to 7350 MB/s and capacities up to 2TB, enabling “second-level” boot times for the OS and AI models.　　Robots operate under write-intensive workloads that far exceed typical consumer SSD applications. In some high-load systems, daily write volumes can reach 300 GB. Once the initial onboard storage (such as UFS or fixed SSD) becomes saturated, there’s no room left for ongoing data feeding and model iteration.　　Designed for effortless scalability, BIWIN Mini SSD features a SIM-card-style, slot-in design that enables a true “plug-and-play” experience. No disassembly or specialized tools are required to add up to 2 TB of high-speed storage (with higher capacities planned), ensuring long-term data accumulation, incremental learning, and intelligent evolution for robotic systems.　　While achieving extreme miniaturization and large capacity, BIWIN Mini SSD also delivers high-performance transfer rates. Equipped with a PCIe 4.0 ×2 interface, its read/write speeds reach up to 3700 MB/s and 3400 MB/s respectively, and future seamless upgrades to higher-performance versions (such as PCIe 5.0) are supported.　　SIM-card-sized, as light as 1g　　Saving device space and reducing weight　　As humanoid robots move toward practical deployment, lightweight design is not just about “shedding weight”; it’s more about simplifying mechanical structures, lowering manufacturing costs, improving mobility, and expanding application scenarios. As an essential hardware component, the size and weight of memory module directly impact overall device design.　　Both the BIWIN BGA SSD and Mini SSD feature a coin-sized footprint with an ultra-slim thickness of just 1.4 mm. The Mini SSD weighs as little as 1 g and can be directly inserted into a pre-designed socket, significantly reducing constraints on mechanical layout and overall system weight. For humanoid robots that demand high dynamic performance and extended battery life, BIWIN BGA SSD and Mini SSD deliver a “minimal physical presence” while enabling a “lightweight system design”—resulting in more compact architectures and greater motion agility.　　Dual Storage, Reshaping Industry Cooperation　　Safeguarding the Full Lifecycle Storage Needs of Robots　　Mini SSD, defined as an expandable memory solution, goes far beyond its storage function; its design concepts of modularization and standardization bring a brand-new product architecture mindset to intelligent terminal industries such as robots and notebooks.　　Manufacturer Enablement: Simplified Design, Faster Iteration　　BIWIN delivers a Mini SSD + socket solution based on a modular integration approach, enabling device manufacturers to optimize internal system layouts, reduce form-factor constraints, and develop thinner, lighter end products with clear differentiated competitiveness.　　The host-side socket offers strong compatibility across multiple capacity SKUs, requiring minimal hardware changes. This significantly lowers development effort, integration complexity, and overall system cost for device manufacturers.　　User Value: Plug-and-Play, Maximum Flexibility　　Storage expansion or replacement can be completed on-site without tools or specialized expertise. Designed for repeated, reliable insertion and removal, the solution allows end users to easily expand or swap TB-class storage, delivering a flexible and efficient storage experience.　　When paired with BIWIN’s in-house RD510 card reader (USB4.0 Type-C), users gain high-performance, portable storage for mobile productivity, content creation, and other data-intensive scenarios.　　Mini SSD has already entered mass production and is now integrated into multiple intelligent devices, including the OneXPlayer X1 Air, APEX, Super X, and GPD Win 5. It is also officially available for purchase in the consumer market.　　Since its debut, Mini SSD has been validated by several international honors, consisting of “Best Inventions of 2025” from TIME, “Best-in-Show” from Embedded World 2025, and “2026 CES Picks Awards” in the TWICE category. And BIWIN is also recognized as a winner of 2025 “China Chip” Outstanding Supporting Service Enterprise by right of this new innovation.　　Currently, BIWIN is collaborating with multiple SoC platforms and terminal brands to jointly promote Mini SSD interface specifications and ecosystem standards, accelerating its large-scale adoption in cutting-edge fields such as AI terminals and humanoid robots.

Key word：

BIWIN

Release time：2026-02-06 17:47 reading：5613 Continue reading>>

Trade news

ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications

　　ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.　　In recent years, electronic devices have demanded higher density in smaller form factors at the same time. To meet this demand and achieve space savings and design flexibility, power supply ICs must be capable of stable operation even with small-capacity capacitors. However, achieving such performance with output capacitors of 1µF or less has been technically difficult.　　To address this challenge, ROHM developed the “BD9xxN1 Series” LDO regulator (150mA output current) in 2022, incorporating its proprietary ultra-stable control technology, “Nano Cap™”. This innovation enables stable operation with output capacitors as small as 100nF, earning widespread adoption across numerous applications.　　The newly developed BD9xxN5 Series builds on the success of the BD9xxN1 Series by increasing the output current to 500mA – more than three times higher than before – significantly broadening its suitability for applications requiring higher power. In addition, very low output voltage ripple of approximately 250mV (with load current variation of 1mA to 500mA within 1µs) is achieved with a small output capacitance of just 470nF (typical). Beyond standard small MLCCs (multi-layer ceramic capacitors) in the range of several µF and large-capacity electrolytic capacitors, it also supports ultra-small MLCCs, such as the 0603M size (0.6mm × 0.3mm), with capacities below 1µF – where stability was previously difficult to achieve. This contributes to space saving as well as greater flexibility in component selection.　　Furthermore, high-precision SPICE models, “ROHM Real Model” are provided for accurate simulation and can be downloaded from the ROHM official website.　　SPICE Models: BD900N5xxx-C BD933N5xxxx-C BD950N5xxxx-C　　ROHM will continue to contribute to the high performance, miniaturization, and high reliability of electronic devices by further expanding its Nano Cap™ technology-equipped LDO series.　　Application Examples　　Automotive Equipment　　● Powertrain system power supplies for fuel injection systems (FI) and tire pressure monitoring systems (TPMS)● Body system power supplies for body control modules (BCM)● Infotainment system power supplies for clusters ad head-up displays (HUD), etc.Industrial Equipment　　● Power supplies for controllers like Programmable Logic Controllers (PLC), Remote Terminal Units (RTU), and industrial gateways● High-precision LDOs for analog loads and sensors measuring temperature, pressure, flow rate, etc.● Power supplies for monitoring and control panels in disaster prevention systems, access control systems and building automation.● Standby power supplies for Human-Machine Interfaces (HMI) and panel equipment, etc.Consumer Electronics　　● Power supplies for control boards in refrigerators, dishwashers, air conditioners, etc.● Power supplies for home appliances like thermostats and doorbells● Power supplies for constant power applications in home security and network equipment, etc.　　What is Nano Cap™ Technology?　　Nano Cap™ refers to ultra-stable control technology achieved by combining advanced analog expertise covering circuit design, processes, and layout utilizing ROHM’s vertically integrated production system. Stable control eliminates the problem of unstable operation related to capacitors in analog circuits, contributing to a reduction in design resources for a wide range of applications in automotive, industrial equipment, consumer, and other fields.　　Terminology　　Primary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion is referred to as the secondary.　　LDO Regulator (Low Drop Out Regulator / Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　ROHM Real Model　　A high-accuracy simulation model that make it possible to also achieve a perfect match between the actual IC and simulation values utilizing ROHM’s proprietary model-based technology.

Key word：

ROHM

Release time：2026-01-27 13:47 reading：447 Continue reading>>

<span style='color:red'>SI</span>MCom丨<span style='color:red'>SI</span>M8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

Trade news

SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

　　SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.　　Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.　　The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.　　Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.　　With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.　　The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.

Key word：

SIMCom

Release time：2026-01-23 16:51 reading：549 Continue reading>>

Trade news

Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors

　　ROHM has developed the “UCR10C Series”, which has the industry's highest rated power for 2012-size shunt resistors (10 mΩ to 100 mΩ).　　Shunt resistors are required to handle higher power for current sensing in both the automotive and industrial equipment markets. Additionally, specific requirements for high junction reliability in these markets has increased annually.　　ROHM’s new products form a copper-based resistive element on an alumina substrate via sintering. By optimizing the heat dissipation structure, it achieves rated powers of 1.0W and 1.25W-double that of equivalent-sized products including thick film types and metal plate types. This enables the replacement of products with wide terminal types or larger alternatives, facilitating miniaturization and reducing the number of components required.　　Furthermore, the use of a metal resistive element achieves a low TCR (0 to +60 ppm/°C). This minimizes errors due to temperature changes, enabling high-precision current sensing. Moreover, it achieves the same level of durability as the metal plate types in temperature cycle testing (-55°C / +155°C, 1000 cycles). This ensures high bonding reliability even in applications with extreme temperature fluctuations, such as automotive use, enabling stable, long-term operation.　　This series is fully lead-free. No lead materials are present, even in RoHS-exempted areas, thus reducing environmental impact.　　As part of its future expansion plans, ROHM has also commenced development of the 3216-size (2W) sintered metal shunt resistor, the “UCR18C Series”, further enhancing its product line-up that combines high power, high precision and high reliability.　　Application Examples　　Various current detection applications in automotive, industrial equipment, and consumer electronics.　　Terminology　　Thick Film Types　　A chip resistor using a material called metal glaze as the resistive element. In addition to cost advantages, the thick film resistive element provides superior resistance to pulses and surges.　　Metal Plate Types　　A chip resistor using a metal plate as the resistive element. It offers superior thermal dissipation and achieves high precision through low TCR, providing performance advantages.　　Wide Terminal Types　　A structure where the electrodes are positioned along the long side of the chip resistor body. Compared to the common structure with electrodes along the short side, it improves heat dissipation efficiency and enables high-power handling.　　TCR (Temperature Coefficient of Resistance)　　An indicator showing how much a resistor's resistance value changes with temperature. A lower value means less resistance variation due to temperature fluctuations, providing more stable performance.　　The TCR of the UCR10C varies depending on the resistance value. Furthermore, the listed TCR is the guaranteed value for the +25/+155°C range for the 10mΩ product.

Key word：

ROHM

Release time：2026-01-22 11:30 reading：1358 Continue reading>>

Trade news

GigaDevice Successfully Lists in Hong Kong, Marking a New Phase of Global Expansion

　　GigaDevice Semiconductor Inc. (stock codes: 3986.HK; 603986.SH) was officially listed on the Main Board of the Hong Kong Stock Exchange on January 13, 2026, marking a major milestone with its dual listing in Shanghai and Hong Kong. This achievement represents a significant step forward in strengthening the company's capital base and supporting its long-term global growth strategy.　　The Hong Kong listing comes at a pivotal stage of GigaDevice’s development, as the company continues to expand its business scale and accelerate its presence in global markets. Leveraging Hong Kong’s role as an international financial hub, GigaDevice will further enhance its global capital support capabilities, strengthen connections with international customers and partners, and elevate its global brand profile.　　Founded in 2005, GigaDevice is a global leading fabless supplier dedicated to integrated circuit design. The company has built a diversified product portfolio spanning Flash memory, specialty DRAM, MCUs, analog ICs, and sensor chips. Its products are widely applied across consumer electronics, automotive electronics, industrial control, energy storage, the Internet of Things (IoT), PCs and servers, and communications markets. GigaDevice is among the few Chinese semiconductor companies to achieve global competitiveness across multiple core storage and control chip segments.The successful listing in Hong Kong underscores GigaDevice’s commitment to making international development a strategic priority. Beyond being a major corporate milestone, this listing establishes a new platform to support the company’s global operations and growth. Looking ahead, GigaDevice will continue to expand its diversified semiconductor portfolio globally, focus on long-term growth opportunities in areas such as artificial intelligence, IoT, and intelligent vehicles, and strengthen its long-term competitiveness through technology innovation, ecosystem partnerships, and brand building.

Key word：

GigaDevice

Release time：2026-01-22 11:22 reading：3512 Continue reading>>

Trade news

GigaDevice Partners With Melchioni Electronics to Expand Business in France, Italy and the Iberian Peninsula

Key word：

GigaDevice

Release time：2026-01-20 15:00 reading：1489 Continue reading>>

Trade news

A new choice for high-accuracy, highly compatible current sensing: NOVOSENSE launches the NSCSA21x-Q series high-precision current sense amplifiers

　　NOVOSENSE has launched the NSCSA21x-Q series high-precision current sense amplifiers, offering a –2V to 28V common-mode input range, ultra-low ±5μV offset voltage, 130dB CMRR, and 200kHz bandwidth. Designed to meet the needs of new energy vehicles, server power supplies, telecom power systems, and energy storage, the NSCSA21x-Q series delivers exceptional accuracy and system stability in demanding environments.　　Addressing Key Challenges in Modern Power and Automotive Systems　　As automotive electrification and industrial intelligence advance, current sensing accuracy and system stability have become critical to overall performance. Traditional current sensors often face limitations in low-voltage detection, reverse connection protection, and dynamic response, impacting system reliability and efficiency. The NSCSA21x-Q series directly targets these pain points, overcoming three major challenges in precision current detection:　　(1) High-Precision Motor Phase Current Sampling　　Supports bidirectional current sensing in H-bridge structures. Combined with FOC algorithms, it enables ±0.5° electrical angle control for precise motor performance.　　(2) Suppression of Parasitic Inductance Interference　　In low-side sensing, the NSCSA21x-Q effectively mitigates “ground bounce” effects through PWM rejection, maintaining high accuracy even with small current signals. With a 130dB CMRR and only ±5μV input offset, it ensures signal integrity under severe transient conditions.　　(3) Reverse Battery Protection　　Withstands up to –28V reverse voltage, safeguarding the system against battery misconnection and simplifying protection circuit design.　　Robust Performance Across All Operating Conditions　　Breaking conventional design limits, the NSCSA21x-Q series supports a wide –2V to 28V common-mode range with built-in PWM suppression and chip-level reverse-voltage tolerance. Even under –28V reverse common-mode stress, the device quickly resumes normal operation. In rigorous transient tests (–2V to 12V step change), it achieves a <5μs recovery time and <50mV output disturbance, making it ideal for high-accuracy current detection in motor drives and solenoid control under PWM switching environments.　　Precision and Stability Across Temperature Extremes　　Featuring a ±5μV (typical) input offset voltage and ±0.5% maximum gain error, the NSCSA21x-Q maintains outstanding accuracy over a full –40°C to 125°C temperature range. With a temperature drift as low as 0.05μV/°C, it ensures stable measurements in harsh automotive and industrial conditions.Input Offset Voltage Distribution of NSCSA21x-Q SeriesCommon-Mode Rejection Ratio (CMRR) Distribution of NSCSA21x-Q Series　　Fast Dynamic Response and Strong Transient Protection　　With a 200kHz bandwidth (50V/V gain) and a 2V/μs slew rate, the NSCSA21x-Q supports fast current variation monitoring and real-time protection. Compared to mainstream alternatives, it achieves up to 3× faster transient response, meeting the needs of high-speed applications such as motor control and power protection.　　Flexible Configurations with Automotive-Grade Reliability　　The NSCSA21x-Q series offers four fixed gain options (50V/V, 75V/V, 100V/V, and 200V/V), covering both industrial and automotive versions. Packaged in an ultra-compact SC70-6 (2mm × 1.25mm) footprint, it's pin-compatible with industry standards, enabling smaller system size and higher design efficiency.Four Fixed-Gain Versions of the NSCSA21x-Q Series　　The NSCSA21x-Q series is AEC-Q100 Grade 1 qualified, supporting –40°C to +125°C operation and ensuring long-term reliability in automotive environments.

Key word：

NOVOSENSE

Release time：2026-01-15 17:20 reading：1602 Continue reading>>

Swift Navigation and <span style='color:red'>SI</span>MCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning

Trade news

Swift Navigation and SIMCom Fuel Mass Market Outdoor Autonomy with Reliable, Affordable Centimeter-Accurate Positioning

　　SIMCom's GNSS Modules Now Integrated with Swift's Skylark Precise Positioning Service　　SAN FRANCISCO, CA – October 28, 2025 – Swift Navigation, a leader in precise positioning technology for mass-market applications, and SIMCom, a leading global IoT wireless modules and solutions supplier, today announced a partnership to deliver centimeter-level GNSS accuracy to high-volume robotics applications worldwide.　　The collaboration integrates Swift's Skylark™ Precise Positioning Service with SIMCom's high-performance SIM66MD and SIM66D GNSS modules.　　This powerful combination allows manufacturers and developers using these modules to easily activate centimeter-accurate satellite positioning, dramatically improving the performance, safety, and reliability of robotic lawnmowers, delivery robots, agricultural vehicles, and other autonomous systems. SIMCom's modules are renowned for their compact designs, low power consumption, and wide array of interfaces, making them ideal for seamless integration into diverse IoT and autonomous devices.　　Swift's Skylark Nx RTK, the highest-precision variant of Skylark, leverages a proprietary atmospheric model to deliver continuous 1-2 cm accuracy across vast geographic areas, including all of Western Europe. This carrier-grade network eliminates the need for developers to manage base stations or switch between multiple correction providers, simplifying the deployment of high-precision outdoor robots at scale.　　"SIMCom's commitment to high performance and versatile design in their GNSS modules aligns perfectly with Swift’s mission to make high-precision positioning accessible and scalable," said Daniel Optendrenk, Vice President of Sales and Business Development at Swift Navigation. "By integrating Skylark with the SIM66MD and SIM66D, we are directly addressing the critical need for reliable, low-cost precision in outdoor autonomous systems, giving developers the tools they need to achieve truly seamless operation."　　"The demand for high-accuracy, low-power positioning is growing across all our target segments, particularly in the emerging field of autonomous robotics," said Chunlin Zhu, GNSS Product Line Director at SIMCom. "This partnership ensures that our popular modules can immediately access Swift’s leading precise positioning network, providing a seamless path for our customers to achieve centimeter-level accuracy and gain a competitive edge in deploying fully autonomous solutions."　　Key benefits for autonomous navigation:　　● Autonomous Operation: Centimeter-level accuracy is essential for robots to execute complex tasks, such as following precise mowing patterns, planting seeds with exact spacing, or navigating narrow construction sites.　　● Safety and Geofencing: Precise localization enables reliable enforcement of virtual boundaries (geofencing), preventing robots from entering restricted zones or colliding with obstacles, which is critical for safety in public or shared spaces.　　● Improved Efficiency: Reliable 1-2 cm precision reduces path errors, minimizes overlap in coverage (e.g., in farming or lawn care), and ensures the robot consistently reaches its exact target destination, maximizing battery life and operational uptime.

Key word：

SIMCom

Release time：2026-01-13 17:01 reading：1460 Continue reading>>

Trade news

Affordable Standard Precision Positioning GNSS Solutions for India's Connected Future

　　India's fast-growing digital ecosystem is fueling the need for reliable, and efficient positioning technologies across transportation, logistics, industrial IoT, and connected vehicles. To address these demands, SIMCom introduces the SIM66MD, a standard precision dual-band GNSS module that combines exceptional accuracy with compact design and low power consumption.　　Supporting multiple global navigation systems — GPS, GLONASS, BeiDou, Galileo, and QZSS — along with Navigation with Indian Constellation (NavIC), the SIM66MD ensures stable positioning across Indian regions. Its L1 + L5 dual-band capability enhances signal quality and reduces interference, delivering faster Time-to-First-Fix and improved reliability even in dense urban areas or challenging terrains.　　Compact in design at just 10.1 × 9.7 × 2.4 mm and weighing only 0.5 g, the SIM66MD adopts an LCC package that allows flexible integration into various devices. It features an integrated low-noise amplifier and supports AGNSS, DGPS (RTCM) to achieve meter-level accuracy with optimized power efficiency.　　With its balance of performance, precision, and cost-effectiveness, the SIM66MD empowers a wide range of IoT applications in India — from shared mobility to asset tracking and industrial automation. It delivers the accuracy and reliability developers need to build connected tracking solutions at scale.

Key word：

GigaDevice

Release time：2026-01-13 14:59 reading：1479 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments

model	brand	To snap up
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email