Highly Integrated PMIC Optimized for NXP Semiconductors’ i.MX 8M Applications Processors

Release time：2018-09-08
author：Ameya360
source：ROHM
reading：7712

　　ROHM authorized online sales platform

　　Ameya360 Components Supply Platform：www.ameya360.com

　　If interested kindly click here for more details:

　　http://www.ameya360.com/product/6873510

　　Contributes to longer operating time and smaller size in portables such as smart speakers

Highly Integrated PMIC Optimized for NXP Semiconductors’ i.MX 8M Applications Processors

　　ROHM today announced the availability of a programmable system power management IC (PMIC) optimized for NXP? Semiconductors’ i.MX 8M family of applications processors that excels in processing audio, video, and graphics in a wide range of applications, from home audio/video to industrial automation and mobile computing. BD71837MWV integrates all power rails required by i.MX 8M processors and system peripherals. In addition to a high-efficiency buck converter that provides a maximum conversion efficiency of 95%, most protection functions required by the system are included, making it possible to significantly reduce the development time, decrease size, and simplify system design

　　‘ROHM continues to be a valued i.MX eco system partner. BD71837MWV is a welcome choice for i.MX 8M customers who seek single-chip power solution.’ stated Mr. Leonardo Azevedo, NXP’s i.MX Senior Director of Marketing at NXP Semiconductor.

　　In recent years the emergence of IoT has allowed electronic devices such as smart speakers to interact with users through voice commands for streaming audio/video. NXP’s i.MX 8M family integrates up to 4 Arm? Cortex?-A53 and Cortex?-4 cores and offers flexible memory options along with a high-speed connectable user interface. Additional features include full 4K Ultra HD and HDR video functionality, high-fidelity audio playback, up to 20 audio channels, and support for DSD512 audio. This highly integrated design combines audio, video, and machine learning in a single platform to provide seamless connectivity and an intuitive experience.

　　

Highly Integrated PMIC Optimized for NXP Semiconductors’ i.MX 8M Applications Processors

　　The BD71837MWV leverages ROHM’s industry-leading analog power technology to achieve the ideal power supply system for driving i.MX 8M processors. Convenience, ease of use, and a rich user experience continue to drive the demand for more powerful SoC (System on Chip) solutions. However, high-performance applications processing graphics, video and audio often place conflicting demands on power supply and thermal design, calling for higher power in a smaller footprint along with high peak efficiency yet low standby power consumption (the latter driven by regulations as well as use cases such as always-on devices with voice interface).

　　The BD71837MWV was designed to address these demands while also achieving the lowest system bill of materials for power management. In addition, the compact form factor reduces the number of external components, decreasing PCB area by 45% (in the case of adopting a Type-3 one-sided PCB). Thanks to software programmability and one-time programmability (OTP), ROHM’s PMIC can be easily adapted for a wide variety of system designs.

　　Availability: June (Samples), October (OEM quantities)

　　Key Features

Highly Integrated PMIC Optimized for NXP Semiconductors’ i.MX 8M Applications Processors

　　1．All-in-one power solution optimized for i.MX 8M processors

　　The power supply circuit of the BD71837MWV, designed specifically for the power supply system of the i.MX 8M processor family, integrates an 8 buck converters, 7 LDOs, and control logic that allows it to supply power not only to the processor, but the required DDR memory as well – all from a single chip. A 1.8V/3.3V power switch for SDXC cards is also built in, along with a 32.768kHz crystal oscillator buffer and multiple protection circuits such as output short-circuit, output over-voltage/current, and thermal shutdown. Buck conversion efficiency from 83 to 95% is achieved for 0.7V to 3.3V output, and the wide input voltage range from 2.7V to 5.5V supports a variety of power sources, from batteries to USB, making them ideal for i.MX 8M applications.

　　In addition, power sequencing, SoC-PMIC control signaling, and power state transitions are automatically handled by hardware control logic. The BD71837MWV supports all i.MX 8M low-power states such as SNVS and SUSPEND, consuming only 30?A in the SNVS state and 137?A at IDLE with all but two power rails on. And communication with the host processor is performed via I2C, enabling 100/400kHz and 1MHz operation.

　　2. Compact QFN package contributes to greater space savings and smaller BOM

Highly Integrated PMIC Optimized for NXP Semiconductors’ i.MX 8M Applications Processors

　　Besides integrating all necessary power supply functions in a compact 8mm x 8mm 68-pin QFN package, the pin layout is carefully designed to ensure easy connection to NXP’s i.MX 8M processor and DDR memory, reducing design load considerably.

　　As a result, 56 fewer parts are needed compared with discrete solutions, reducing PCB area by up to 45%.

　　In addition, 2-sided mounting enable all power management functions with less than 400mm2 board size.

　　3. Customizable based on system design

　　The BD71837MWV integrates a sequencer compatible with power modes supported by i.MX 8M processors (RUN, IDLE, SUSPEND, SNVS, OFF) to provide greater application design flexibility. Furthermore, the power mode transition conditions, protection function enable/disable, and ON/OFF control and voltage for each power supply can be customized through the I2C interface and OTP (One Time Programmable ROM) for the memory type and functions required by the system, making it possible to achieve optimum performance based on application needs.

　　4．Proven solution and comprehensive support ensure fast design-in with minimal risks

　　The BD71837MWV operation has been verified with the i.MX 8M SoC, shortening development time and enabling timely product release. ROHM has prepared guidelines, reference circuits, and layouts related to peripheral applications required for design. A PMIC evaluation board is also available that allows users to verify operation in advance when evaluating the power supply block or customizing the circuit to fit the design needs.

　　Products advisory hotline：sarawang@ameya360.com


（"Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal."）

Previous：The Mid-Autumn Festival Notice

Next：In-Vehicle LED,applied to different market demands

Online messageinquiry

reading
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
Trade news

ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

　　ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.　　The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices.　　GaN power devices are currently used in consumer and industrial applications such as AC adapters and server power supplies. TSMC, a leader in sustainability and green manufacturing, supports GaN technology for its potential environmental benefits in automotive applications, such as on-board chargers and inverters for electric vehicles (EVs).　　The partnership builds on ROHM and TSMC’s history of collaboration in GaN power devices. In 2023, ROHM adopted TSMC’s 650V GaN high-electron mobility transistors (HEMT), whose process is increasingly being used in consumer and industrial devices as part of ROHM's EcoGaN™ series, including the 45W AC adapter (fast charger) "C4 Duo" produced by Innergie, a brand of Delta Electronics, Inc.　　"GaN devices, capable of high-frequency operation, are highly anticipated for their contribution to miniaturization and energy savings, which can help achieve a decarbonized society. Reliable partners are crucial for implementing these innovations in society, and we are pleased to collaborate with TSMC, which possesses world-leading advanced manufacturing technology" said Katsumi Azuma, Member of the Board and Senior Managing Executive Officer at ROHM. “In addition to this partnership, by providing user-friendly GaN solutions that include control ICs to maximize GaN performance, we aim to promote the adoption of GaN in the automotive industry."　　“As we move forward with the next generations of our GaN process technology, TSMC and ROHM are extending our partnership to the development and production of GaN power devices for automotive applications,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “By combining TSMC's expertise in semiconductor manufacturing with ROHM's proficiency in power device design, we strive to push the boundaries of GaN technology and its implementation for EVs.”　　About TSMC　　TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.　　        TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan.　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
2025-04-02 15:36 reading：195
Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
Trade news

Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors

　　Mazda Motor Corporation (hereinafter “Mazda”) and ROHM Co., Ltd. (hereinafter “ROHM”) have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.　　(Left) Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of MAZDA / (Right) Katsumi Azuma, Member of the Board and Senior Managing Executive Officer of ROHM　　Since 2022, Mazda and ROHM have been advancing the joint development of inverters using silicon carbide (SiC) power semiconductors under a collaborative framework for the development and production of electric drive units. Now, they have also embarked on the development of automotive components using GaN power semiconductors, aiming to create innovative automotive components for next-generation electric vehicles.　　GaN is attracting attention as a next-generation material for power semiconductors. Compared to conventional silicon (Si) power semiconductors, GaN can reduce power conversion losses and contribute to the miniaturization of components through high-frequency operation.　　Both companies will collaborate to transform these strengths into a package that considers the entire vehicle, and into solutions that innovate in weight reduction and design. Mazda and ROHM aim to materialize the concept and unveil a demonstration model within FY2025, with practical implementation targeted for FY2027.　　“As the shift towards electrification accelerates in pursuit of carbon neutrality, we are delighted to collaborate with ROHM, which aims to create a sustainable mobility society with its outstanding semiconductor technology and advanced system solution capabilities, in the development and production of automotive components for electric vehicles” said Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of Mazda. “We are excited to work together to create a new value chain that directly connects semiconductor devices and cars. Through collaboration with partners who share our vision, Mazda will continue to deliver products filled with the 'joy of driving' that allows customers to truly enjoy driving, even in electric vehicles.”　　“We are very pleased to collaborate with Mazda, which pursues the 'joy of driving,' in the development of automotive components for electric vehicles” said Katsumi Azuma, Member of the board and Senior Managing Executive Officer of ROHM. “ROHM's EcoGaN™, capable of high-frequency operation, and the control IC that maximizes its performance are key to miniaturization and energy-saving. To implement this in society, collaboration with a wide range of companies is essential, and we have established various partnerships for the development and mass production of GaN. By collaborating with Mazda, which aims to create 'cars that coexist sustainably with the earth and society,' we will understand the requirements for GaN from the perspective of application and final product development, contributing to the spread of GaN power semiconductors and the creation of a sustainable mobility society.”　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
2025-03-31 15:46 reading：194
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers
Trade news

ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

　　ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.　　In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.　　A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.　　The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.　　While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.　　Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.　　Key Specifications　　For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers　　Sales Information        Pricing: $14.50/unit (excluding tax)　　Availability: Now (OEM quantities)　　Application Examples        • A4-sized mobile printers　　• Industrial control label printers　　• Tattoo stencil printers, etc.　　Terminology        dpi (dots per inch)　　A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).　　Thermal Printing Method　　A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.　　Thermal Transfer Printing Method　　A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
2025-03-31 15:36 reading：198
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
Trade news

ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory

　　ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.　　Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)　　Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)　　The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.　　Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.　　In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.　　ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
2025-03-24 11:32 reading：232
Popular categories
Boxes, Enclosures, Racks Cables, Wires Circuit Protection Connectors, Interconnects Development Kits Electromechanical Embedded Solutions Fans, Thermal Management Optoelectronics Others Passive Components Power Semiconductors Sensors, Transducers Test and Measurement
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
RB751G-40T2R ROHM Semiconductor
model brand To snap up
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code