Ameya360:PCB connector 1757022

发布时间:2023-01-17 14:39
作者:Ameya360
来源:网络
阅读量:1841

  PCB connector, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Female connector, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MSTB 2,5/..-ST, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: COMBICON MSTB 2,5, locking: without, mounting: without, type of packaging: packed in cardboard.

Ameya360:PCB connector 1757022

  Advantages:

  Well-known connection principle allows worldwide use

  Low temperature rise, thanks to maximum contact force

  Allows connection of two conductors


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2024-07-18 11:48 阅读量:461
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Choose appropriate shielding materials: Select suitable metal layers or shielding cover materials in PCB design to have good shielding performance while minimizing the impact on signal transmission.  Design suitable grounding structure: A good grounding structure can help reduce the shielding effect of signals and improve signal transmission quality.  Pay attention to signal adjustment: For signals that need to pass through shielding areas, signal adjustment techniques can be employed to minimize the impact of shielding effect, such as increasing signal power or adjusting signal transmission methods.  9. Thermal Expansion EffectTemperature changes may cause thermal expansion or contraction of PCB materials, affecting the dimensional stability of circuit boards and the connection status of components.  Measures to Reduce Thermal Expansion Effect:  Choose appropriate PCB materials: Selecting PCB materials with smaller coefficients of thermal expansion can reduce the impact of thermal expansion on circuits.  Design PCB layout reasonably: During PCB design, try to avoid direct connection between materials with high coefficients of thermal expansion and those with low coefficients to reduce the impact of thermal expansion.  Control soldering temperature: Control soldering temperature and time during the soldering process to avoid excessive temperature leading to solder joint failure or component displacement.  Use support structures: Adding appropriate support structures in PCB design can reduce PCB bending deformation, improving the stability and reliability of the PCB.  10. Ground Hole EffectThere are many ground holes on the PCB. When ground holes are close to signal lines or other ground holes, ground hole effect may occur, affecting the stability of signal transmission.  Measures to Reduce Ground Hole Effect:  Design ground holes reasonably: Design appropriate parameters for ground holes, such as diameter, pitch, copper foil diameter, etc., to ensure impedance matching and consistency of ground holes, reducing ground hole inductance and crosstalk effects.  Use ground hole filling: Ground hole filling techniques can be employed in PCB design to fill ground holes, reducing their impact on signal transmission and improving PCB performance stability.  Optimize layout: Plan PCB layout reasonably to minimize the number and density of ground holes, reducing their impact on circuits.  Adjust interlayer stacking: Choose PCB layer stacking methods appropriately to minimize ground holes between inner and outer layers, reducing the impact of ground hole effect.  11. Filling EffectThe filling material on the PCB may affect signal transmission. For example, differences in the dielectric constant of the filling material may cause changes in signal transmission speed or signal attenuation.  Measures to Reduce Filling Effect:  Choose filling material reasonably: Select filling materials with a dielectric constant close to that of the PCB material to reduce the impact of dielectric constant differences on signal transmission.  Control the thickness of filling material: Properly control the thickness of filling material to avoid excessive thickness, which could lengthen the signal transmission path and increase attenuation.  Optimize PCB layout: During PCB design, minimize the impact on signal transmission paths, plan filling areas reasonably, and avoid interference from filling materials on signal transmission paths.  Use low-loss filling materials: Choose filling materials with low resistance and dielectric loss to minimize attenuation and distortion during signal transmission.  12. Temperature Drift EffectTemperature changes on the PCB may cause thermal expansion or contraction of circuit board materials, thereby affecting the dimensional stability of the circuit board and the connection status of components.  Measures to Reduce Temperature Drift Effect:  Choose PCB materials reasonably: Select PCB materials with good thermal stability and dimensional stability to reduce the impact of temperature changes on the PCB.  Control soldering temperature: During the soldering process, control soldering temperature and time properly to avoid excessive soldering temperature leading to damage or breakage of components and solder joints.  Optimize PCB layout: Plan PCB layout reasonably to reduce differences in thermal expansion coefficients between components and avoid changes in the connection status of components due to temperature changes.  Temperature environment control: Control temperature changes in the PCB usage environment to avoid significant temperature shocks to the PCB, thereby reducing the impact of temperature changes on PCB circuits.  13. Crystal EffectDevices such as transistors in PCB routing may be influenced by the surrounding environment, causing changes in device parameters and affecting circuit performance.  Measures to Reduce Crystal Effect:  Rational Layout: Properly plan PCB layout to avoid external interference affecting devices such as transistors and minimize electromagnetic field interference with devices.  Temperature Control: Take measures to control the operating temperature of the PCB board during design and manufacturing to reduce the influence of temperature changes on device parameters and improve circuit stability.  Choose Appropriate Devices: Select transistors and other devices with good anti-interference and stability to reduce the impact of crystal effect on the circuit.  Design Compensation Circuits: In PCB design, compensation circuits can be used to correct drift in device parameters, improving circuit performance and stability.  14. Restricted EffectThere are some restricted areas on the PCB, such as edges, power supply areas, etc., which may impose certain limitations or impacts on signal transmission or routing.  Measures to Reduce Restricted Effect:  Rational Planning of Layout: During PCB design, plan the layout reasonably to avoid placing sensitive signal lines or components near restricted areas, reducing the impact of restrictions.  Electromagnetic Shielding: For areas prone to electromagnetic interference in restricted areas, electromagnetic shielding measures can be adopted, such as placing metal shielding covers around sensitive areas to reduce the impact of external electromagnetic interference on the circuit.  Optimization of Power Supply Design: For possible power supply instability or noise issues in power supply areas, measures such as optimizing power supply design, adding filtering circuits, and reducing power supply noise can be taken to improve power supply stability and circuit performance.  Fine Routing: When routing in restricted areas, adopt fine routing methods as much as possible to reduce restrictions or elongation of signal transmission paths, improving signal transmission rate and stability.  15. Landmine EffectHidden problems or faults on PCB boards may suddenly appear during subsequent testing or use, causing unexpected impacts or damage to the circuit board.  Measures to Reduce Landmine Effect:  Strict Quality Control: During PCB production, strictly control the quality of each process to ensure that each component and circuit connection meets specifications, reducing hidden dangers.  Perfect Testing Procedures: Establish comprehensive testing and inspection procedures to conduct comprehensive testing and inspection of PCB circuits, promptly identify and repair potential problems.  Use Reliable Components: Choose components and materials with high reliability and stable quality to reduce the probability of failure and minimize the occurrence of landmine effects.  Strengthen Maintenance: Regularly maintain and upkeep produced PCB circuits, promptly identify and repair potential problems, improving circuit reliability and stability.
2024-04-30 10:11 阅读量:421
What is the difference between the package substrate and PCB
  The packaging substrate is a kind of electronic substrates that can provide electrical connection, protection, support, heat dissipation, assembly and other functions for chips and electronic components, so as to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization and high reliability.  The packaging substrate can be considered as a PCB or thin-thick film circuit substrate with higher performance or special functions. The packaging substrate plays the role of electrical interconnection and transition between the chip and the conventional printed circuit board (mostly motherboard, sub-board, backplane, etc.), and also provides protection, support, heat dissipation, assembly and other functions for the chip.  With the continuous progress and development of electronic installation technology, the boundaries of various levels of electronic installation are becoming less and less clear. The role of PCB is becoming more and more important. Higher and newer requirements are put forward for PCB and its substrate materials in terms of function and performance.  Difference between package substrate and PCB  Printed Circuit Board (PCB) refers to a circuit board that forms a copper circuit pattern on a copper clad laminate according to a predetermined design. Its main function is to connect various electronic components according to a predetermined circuit and act as an electrical connection.  The packaging substrate and PCB manufacturing principles are similar. It is the extension of PCB to high-end technology to adapt to the rapid development of electronic packaging technology. There is a certain correlation between the two. The packaging substrate is a high-end PCB.  package substrate  In electronic packaging engineering, the electronic substrate (PCB) can be used for different levels of electronic packaging (mainly used for the 2nd to 5th levels of the 1st to 3rd level packaging), but the packaging substrate is used for the 2nd and 3rd levels of the 1st and 2nd level packaging, Ordinary PCBs are used for levels 3, 4, and 5 of level 2 and level 3 packages.  However, they all provide functions such as interconnection, protection, support, heat dissipation, and assembly for electronic components to achieve multi-pin, reduce the volume of packaged products, improve electrical performance and heat dissipation, ultra-high density or multi-chip modularization, and high reliability for the purpose.  The process and reasons for the separation of the package substrate from the PCB  After the 1980s, with the wide application of new materials and new equipment, integrated circuit design and manufacturing technology developed rapidly in accordance with “Moore’s Law”, tiny and sensitive semiconductor components came out, large-scale integrated circuits and ultra-large-scale integrated circuits appeared, and high-density multilayer packaging substrates emerged as the times require, which separates integrated circuit packaging substrates from ordinary printed circuit boards. A proprietary manufacturing technology for integrated circuit packaging substrates then formed.  At present, among the mainstream products of conventional PCB boards, products with a line width/line spacing of 50μm/50μm belong to high-end PCB products. However, this technology still cannot meet the technical requirements of the current mainstream chip packaging. In the field of packaging substrate manufacturing, products with a line width/line spacing of 25μm/25μm have become more common, which reflects that packaging substrate manufacturing is more advanced in technology than conventional PCB manufacturing.  There are two fundamental reasons for the separation of packaging substrates from conventional printed circuit boards: on the one hand, because the development speed of PCB boards is lower than that of chips, it is difficult to directly connect chips and PCB boards. On the other hand, the cost of the PCB board refinement is much higher than the cost of interconnecting the PCB and the chip through the packaging substrate.  Main structure and production technology of package substrate  At present, there is no unified classification standard in the packaging substrate industry. Packaging substrate is usually classified according to the substrate material and manufacturing technology applicable to substrate manufacturing.  According to different substrate materials, packaging substrates can be divided into inorganic packaging substrates and organic packaging substrates. Inorganic packaging substrates mainly include: ceramic-based packaging substrates and glass-based packaging substrates. Organic packaging substrates mainly include: phenolic packaging substrates, polyester packaging substrates, and epoxy resin packaging substrates.  Organic Package Substrate  According to the different manufacturing methods of the packaging substrate, the packaging substrate can be divided into a core packaging substrate and a new coreless packaging substrate.  Core and coreless packaging substrates  The core package substrate is mainly divided into two parts in structure, the middle part is the core board, and the upper and lower parts are laminated boards. The production technology of the core packaging substrate is based on the high-density interconnection (HDI) printed circuit board production technology and its improved technology.  Core and coreless packaging substrates  A coreless substrate refers to a packaging substrate with a core board removed. The fabrication of the new coreless package substrate mainly produces interlayer conductive structures—copper pillars—by bottom-up electrodeposition technology. It only uses an insulating layer (Build-up Layer) and a copper layer to achieve high-density wiring through a semi-additive (SemiAdditive Process, abbreviated as SAP) build-up process.  Advantages and disadvantages of coreless packaging substrates  Advantages  Thinning;  The electrical transmission path is reduced, the AC impedance is further reduced, and its signal line effectively avoids the return loss generated by the PTH (copper plated through hole) on the traditional core substrate, which reduces the inductance of the power system loop and improves the transmission. characteristics, especially frequency characteristics;  The direct transmission of signals can be realized, because all circuit layers can be used as signal layers, which can improve the freedom of wiring, realize high-density wiring, and reduce the limitation of C4 layout;  Except for some processes, the original production equipment can be used, and the process steps are reduced.  Disadvantages  Without core board as support, it is easy to warp and deform in the manufacture of coreless substrates, which is the most common and biggest problem at present;  Laminate shattering is prone to occur;  Some new equipment for coreless substrates for semiconductor packaging needs to be introduced. Therefore, the challenges of coreless substrates for semiconductor packaging mainly lie in materials and processes.
2024-03-14 17:12 阅读量:716
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