common electronic components and their symbols

发布时间：2023-11-07 15:22
作者：AMEYA360
来源：network
阅读量：1247

　　When it comes to electronics, there are numerous components that are essential to building any functional circuit. Here are 10 common electronic components that you’re likely to encounter.

common electronic components and their symbols

　　Resistor

　　Resistor will cause a change in the flow of electrons. The smaller the resistance, the greater the flow of electrons, and vice versa. Substances with no resistance or very little resistance are called electrical conductors, or conductors for short. Substances that cannot form electric current transmission are called electrical insulators, or insulators for short.

　　In physics, resistance is used to represent the size of the conductor’s resistance to current flow. The greater the resistance of the conductor, the greater the resistance of the conductor to current flow. Different conductors generally have different resistances, and resistance is a characteristic of the conductor itself. Resistive elements are energy-dissipating elements that impede current flow.

　　Resistor symbol: Resistor is represented by “R” plus numbers in the circuit, such as: R1 represents the resistance numbered 1. The main functions of resistors in the circuit are shunting, current limiting, voltage dividing, biasing, etc.

　　Capacitor

　　Capacitance refers to the charge storage capacity under a given potential difference; denoted as C, and the international unit is farad (F). Generally speaking, charges will move under force in an electric field. When there is a medium between conductors, it will hinder the movement of charges and make charges accumulate on the conductors; the accumulation and storage of charges is caused. The most common example is two parallel metal plates. It is also commonly known as a capacitor.

　　Inductor

　　Inductance is a property of a closed circuit and a physical quantity. When the coil passes current, a magnetic field induction is formed in the coil, and the induced magnetic field will generate an induced current to resist the current passing through the coil. Inductors are inductive components made of inductive properties.

　　If the inductor is in a state where no current is flowing, it will try to block the current from flowing through it when the circuit is on; if the inductor is in a state where current is passing, it will try to maintain the current when the circuit is off. Inductors are also called chokes, reactors, and dynamic reactors.

　　Inductor symbol: Inductor is often represented by “L” plus numbers in the circuit, such as: L6 represents the Inductor numbered 6.

　　Crystal Diode

　　A crystal diode is a semiconductor two-terminal device in solid-state electronic devices. The main feature of these devices is their nonlinear current-voltage characteristics.

　　Since then, with the development of semiconductor materials and process technology, a variety of crystal diodes with various structures and functions have been developed using different semiconductor materials, doping distributions, and geometric structures. Manufacturing materials include germanium, silicon and compound semiconductors. Crystal diodes can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.

　　Crystal diode symbol: Crystal diodes are often represented by “D” plus numbers in circuits, such as: D5 represents a diode numbered 5.

　　Zener Diode

　　Zener diode is a semiconductor device with high resistance until the critical reverse breakdown voltage.

　　The Zener diode is a diode that uses the reverse breakdown state of the pn junction, and its current can change in a wide range while the voltage is basically unchanged. It is a diode that acts as a voltage regulator. The diode is a semiconductor device with high resistance up to a critical reverse breakdown voltage.

　　At this critical breakdown point, the reverse resistance decreases to a very small value, and the current increases while the voltage remains constant in this low-resistance region. Zener diodes are graded according to their breakdown voltage. Because of this characteristic, Zener diodes are mainly used as voltage regulators or voltage reference components. Zener diodes can be connected in series for use at higher voltages, and higher stable voltages can be obtained through series connection.

　　Zener diode symbol: Zener diodes are often represented by “ZD” plus numbers in the circuit, such as: ZD5 means a Zener diode numbered 5.

　　Varactor Diode

　　Varactor diodes, also known as ‘variable reactance diodes’, are made by utilizing the characteristics that the junction capacitance changes with the applied voltage when the pN junction is reverse-biased. It is used as a variable capacitor in high-frequency tuning, communication and other circuits. It is used in high-frequency circuits for automatic tuning, frequency modulation, tuning, etc., for example, as a variable capacitor in the tuning circuit of a TV receiver.

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What are the different types of electronics components packages?
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What are the different types of electronics components packages?

　　In the realm of electronics, various packaging technologies cater to the diverse needs of components, ensuring functionality, compactness, and performance. These packaging methods are crucial in determining a component’s size, compatibility, and usage in different applications. Here, we delve into some of the most prevalent component packaging technologies shaping the electronic landscape:　　1. Through-Hole Technology (THT)Through-Hole Technology (THT): DIP (Dual In-line Package), SIP (Single In-line Package), TO (Transistor Outline), etc.　　Through-Hole Technology (THT) is a method used to mount and connect electronic components to a printed circuit board (PCB). In THT, leads (metal wires) extend from the electronic component and are inserted into pre-drilled holes on the PCB. Once inserted, the leads are soldered to pads on the opposite side of the board, forming a secure electrical and mechanical connection.　　Components suitable for THT include resistors, capacitors, diodes, and integrated circuit sockets, among others. THT was one of the primary assembly methods for electronic components before the rise of Surface Mount Technology (SMT), which introduced smaller and more densely packed components suitable for automated assembly.　　2. Surface Mount Technology (SMT)Surface Mount Technology (SMT): SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), LGA (Land Grid Array), BGA (Ball Grid Array), etc.　　Surface Mount Technology (SMT) is a method used in electronic assembly to mount and solder components directly onto the surface of a printed circuit board (PCB). In contrast to Through-Hole Technology (THT), which involves inserting component leads through holes in the PCB, SMT components have small metallic contacts or leads that sit directly on the board’s surface. SMT components are generally smaller and more compact than their through-hole counterparts, allowing for higher component densities and smaller PCB designs.　　SMT components include resistors, capacitors, integrated circuits (ICs), diodes, and other semiconductor devices. The process involves soldering the components to the PCB’s surface using reflow soldering, where solder paste is applied to the board, and then the components are placed on the paste. The entire assembly is heated, causing the solder to melt and create a secure connection between the component leads and the PCB pads.　　Surface Mount Technology has become the dominant method in modern electronics manufacturing due to its efficiency, miniaturization capabilities, and suitability for automated assembly processes.　　3. Ball Grid Array (BGA)　　Ball Grid Array (BGA): μBGA (Micro Ball Grid Array), CCGA (Ceramic Column Grid Array), PBGA (Plastic Ball Grid Array), etc.　　Ball Grid Array (BGA) is a type of surface mount packaging used for integrated circuits (ICs) and other semiconductor devices. It’s characterized by an array of solder balls arranged in a grid formation on the underside of the component. These solder balls serve as the connection points to the PCB.　　However, working with BGAs requires specialized equipment and techniques for both assembly and rework due to the complexity of soldering the numerous small solder balls. Nonetheless, they are widely used in various applications, especially in high-performance computing, gaming consoles, networking hardware, and consumer electronics, where space and performance are critical considerations.　　4. Chip Scale Packaging (CSP)　　Chip Scale Packaging (CSP): mCSP (micro Chip Scale Package), WLP (Wafer-Level Package), FC-CSP (Flip Chip Chip Scale Package), etc.　　Chip Scale Packaging (CSP) refers to a packaging technology for integrated circuits (ICs) where the package size closely matches the dimensions of the silicon die or chip itself. In essence, CSPs aim to minimize the footprint of the package while providing the necessary protection and connections for the chip.　　CSPs are commonly used in portable electronic devices such as smartphones, tablets, wearables, and other miniaturized gadgets. Their small form factor and efficient use of space make them ideal for applications demanding high-performance chips in constrained areas.　　5. 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Small Outline Package (SOP)　　Small Outline Package (SOP): TSOP (Thin Small Outline Package), SSOP (Shrink Small Outline Package), HSOP (Heatsink Small Outline Package), etc.　　The Small Outline Package (SOP) is a type of surface-mount technology used for integrated circuits. SOP packages are characterized by their rectangular shape with gull-wing or “J”-bend leads extending from the sides.　　These packages come in different variants, such as SOP, SOP-8, SOP-16, etc., indicating the number of leads (pins) present on the package. For instance, SOP-8 has 8 leads, while SOP-16 has 16 leads.　　SOP packages were popular in the 1980s and 1990s and remain in use for various applications, including memory chips, microcontrollers, and other ICs. 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These packages are used to encapsulate and protect integrated circuits (ICs), transistors, and other semiconductor devices.　　Ceramic packages have been widely used in applications where high reliability, ruggedness, and thermal management are critical, such as in aerospace, automotive electronics, military applications, and certain industrial settings.　　However, ceramic packaging tends to be more expensive compared to plastic or other materials, which has led to the development of alternative packaging technologies for consumer electronics. Nevertheless, for applications requiring superior thermal performance, reliability, and resilience to extreme conditions, ceramic packages remain a preferred choice.　　16. Ceramic Ball Grid Array (CBGA)　　Ceramic Ball Grid Array (CBGA): Ceramic package with a grid array of solder balls.　　A Ceramic Ball Grid Array (CBGA) is a type of packaging used for integrated circuits (ICs) and semiconductor devices. 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2023-12-14 13:40 阅读量：1447
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2023-12-01 14:42 阅读量：1877
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By using a heat sink, the operating temperature of the transistor can be reduced, thereby improving its performance and reliability.　　Sensors: Many sensors (such as temperature sensors, touch sensors, etc.) require accurate measurement of ambient temperature or pressure. Using a heat sink can help the sensor maintain stable performance, thereby improving measurement accuracy.　　Design principles and maintenance methods　　Design Principles: When designing and selecting a heat sink, the following factors need to be considered:　　(1)- Structure: The appropriate heat sink structure should be selected according to the shape and size of the electronic components.　　(2)- Materials: Appropriate materials should be selected according to the power of electronic components and the working environment. For example, aluminum and copper have better thermal conductivity, while steel has higher strength.　　(3)- Process: Mature processes should be selected to ensure the quality and reliability of the heat sink.Maintenance methods: To ensure the normal operation of the heat sink and extend its service life, here are some suggestions:　　(1)- Regular cleaning: Regularly remove dust and other impurities on the surface of the heat sink to improve its heat dissipation efficiency.　　(2)- Check fasteners: Regularly check and tighten the fasteners between the heat sink and electronic components to ensure good heat conduction.　　(3)- Replace thermal grease: When the thermal grease is found to be dry or hardened, new thermal grease should be replaced in time to ensure smooth heat conduction.　　(4)- Avoid collisions and vibrations: Try to avoid collisions and vibrations to avoid damage to the heat sink and electronic components.ConclusionIn electronic components, heat sinks play a vital role. By absorbing, conducting and dissipating the heat generated by electronic components, heat sinks help maintain the stability and reliability of electronic equipment. This article details the classification, functions and applications of heat sinks, as well as design and maintenance methods. With the continuous development of science and technology, we can foresee that more new and efficient heat dissipation technologies will be used in the field of electronic components in the future.
2023-11-02 14:58 阅读量：2079
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