Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Trade news

Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.

Key word：

Fibocom

Release time：2024-12-13 10:55 reading：310 Continue reading>>

Trade news

Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

Key word：

Renesas

Release time：2024-12-03 14:43 reading：277 Continue reading>>

Trade news

NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the NSM211x, a series of automotive-grade fully integrated high-bandwidth, high-isolation current sensors that both ensure precise current measurement and eliminate the need for any external isolation components.　　On display at Electronica 2024 (Stand B5.450), the automotive-grade series targets applications including OBC/DC-DC converters, PTCs, automotive motor control, charging station current detection and fuel cell systems.　　Certified to meet AEC-Q100 Grade 0 reliability standards, the series is designed to operate stably within a wide temperature range (-40 to 150°C) and addresses the needs of AC or DC current detection in automotive applications with a high isolation voltage, strong current handling capability and high reliability.　　With a -3 dB bandwidth of up to 1 MHz and a response time of 400 ns, the NSM211x series helps control systems achieve rapid loop control and overcurrent protection. The series also features a creepage distance of up to 8.2mm and isolation voltage withstand of 5,000 Vrms per UL standards, with a maximum working isolation voltage of 1,618 Vpk.　　It is available in three packaging options, SOP8, SOW16 and SOW10. These respectively have a primary side impedance of 1.2 mΩ, 0.85 mΩ/1 mΩ and an industry leading 0.27mΩ, with a continuous current handling capability of up to 100 A. Multiple product models are available for each package.　　The current sensors integrate internal temperature compensation algorithms and offline calibration to enable a high measurement accuracy (<±2% sensitivity error and <±10 mV offset error) across the full temperature range, with no need for secondary programming.　　The NSM211x series supports 3.3 V and 5 V power supply voltage as well as DC or AC current measurement with a current range of 5~200 A with options for reference voltage output, overcurrent protection output, and configurable overcurrent protection thresholds.

Key word：

novosns

Release time：2024-11-15 14:30 reading：364 Continue reading>>

Trade news

Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor with the First 006003-inch Size (0.16mm×0.08mm) Device

　　Murata Manufacturing Co. Ltd has expanded its innovative range of multilayer ceramic capacitors (MLCCs) with yet another groundbreaking addition. Exemplifying Murata’s continual commitment for minimization, it has developed the world’s first 006003-inch size (0.16 mm x 0.08 mm) MLCC. This achievement represents a volume ratio approximately 75% lower than the existing smallest product, the 008004-inch size (0.25×0.125mm).　　In recent years, as electronic devices become more sophisticated and compact, the number of electronic components installed has increased, while simultaneously the space required for installation has been reduced. As electronic devices continue to advance in intelligence, there has been a corresponding increase in the incorporation of MLCCs across all types of electronic devices, with the latest smartphones utilizing up to 1000 units. Against this background, there is a growing need for ultra-compact products that enable high-density component mounting with limited mounting space.　　Since its inception in 1944, Murata has been committed to the exploration and advancement of ceramic capacitors, nurturing its unparalleled understanding of raw materials, manufacturing processes, and production technologies. In 2014, Murata successfully brought to market the world’s first 008004-inch size (0.25×0.125mm) multilayer ceramic capacitors, which have experienced growing utilization in smartphone modules and wearable devices. The creation of this MLCC is the outcome of years of focused R&D in elemental technologies, resulting in a device that measures just 0.16mm x 0.08mm x 0.08mm (L/W/T).　　“Under our slogan 'Innovator in Electronics' we will continue to lead the electronics industry by providing innovative products and developing technologies,” said Hidetoshi Nakagawa, General Manager of Ceramic Capacitor Marketing at Murata Manufacturing Co Ltd. He continued, “This product is another world’s first in a long line of Murata’s market defining MLCCs and will significantly contribute to the future miniaturization and improvement of our customer’s electronic devices.”　　This revolutionary product will be showcased at Murata’s booth (6H104) during the CEATEC JAPAN 2024 event, scheduled to take place at Makuhari Messe in Chiba Prefecture on October 15, 2024. For further information on CEATEC 2024 and tickets visit here

Key word：

Murata

Release time：2024-09-26 11:09 reading：611 Continue reading>>

Trade news

Murata：Mass production begins for 0603M size copper electrode NTC thermistors, ideal for automotive applications

　　Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has developed 0603M size (0.6 x 0.3 x 0.3 mm) copper electrode NTC thermistors “NCU03XH103F6SRL” and “NCU03XH103F60RL” (hereinafter “this product”) for markets such as the automotive market where there is a demand for high reliability electronic components. This product is an expansion of the NCU series size lineup. Mass production has already begun, and samples can also be provided.　　As advances are being made towards automated driving and IoT integration in the automotive market, circuit boards are being made with an increasingly larger number of electronic components, and in turn, higher component densities. With the increasing sophistication of ADAS*1/telematics technologies*2, there are higher loads on electronic components, amplifying the issue of component overheating. As a result, there is a heightened demand for overheating detection and temperature monitoring technologies.　　We have taken advantage of Murata’s years of processing technology development experience to create a 0603M size (0.6 x 0.3 x 0.3 mm) product that can be used for high reliability applications. Compared to Murata’s existing products (1005M size), this product has an approximately 80% lower volume and approximately 70% smaller mounting area.　　Murata will continue to expand our product lineup to meet market demand. By responding quickly to market demand, we also contribute to further improvements in circuit board component densities and downsizing of devices for high reliability applications.　　*1ADAS: Advanced Driver Assistance System　　*2Telematics technology: Devices that use communications technology installed in vehicles to collect and transmit driver and vehicle data and share information in real time. Main applications of this technology include navigation systems that collect traffic information to help drivers avoid traffic jams and voice recognition services used to operate in-car features.　　Features　　Works with automobiles and other systems that require high reliability components. Downsizing (0603M size) achieved with copper electrodes.　　Approximately 80% lower volume and approximately 70% smaller mounting area than Murata’s existing products (1005M size). Because this product has the same characteristics as our existing products, there is no need to change the circuit board design when replacing an existing product with this product. This product will also help our customers increase their component density and save space on the circuit board.　　Small in volume and capable of fast response.　　Specifications

Key word：

murata

Release time：2024-08-28 15:21 reading：625 Continue reading>>

Trade news

SIMCom Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Management

　　SIMCom, a global leader in IoT communication, has proudly received the ISO/SAE 21434 certification for Automotive Cybersecurity Management from TÜV NORD, an international independent third-party testing, inspection, and certification organization. This certification marks a significant milestone in SIMCom’s commitment to advancing automotive cybersecurity and delivering top-tier solutions to the automotive industry.　　Importance of ISO/SAE 21434　　Achieving the ISO/SAE 21434 certification underscores SIMCom's ability to meet stringent cybersecurity risk management requirements across the entire product lifecycle—from conceptual design, development, and production to operation and maintenance. This critical achievement validates SIMCom's dedication to adhering to the highest standards of automotive cybersecurity. In an era of increasing vehicle connectivity, robust cybersecurity measures are paramount. The certification confirms that SIMCom’s products are designed to safeguard against evolving cyber threats, ensuring the safety and security of in-vehicle systems and communications.　　Comprehensive Automotive Solutions　　In alignment with automotive industry trends, SIMCom continues to expand its automotive product lineup, offering enhanced IoT solutions to car manufacturers and Tier 1 suppliers. This strategic expansion not only strengthens SIMCom's position in the connected vehicle industry but also underscores its commitment to providing secure and reliable products.　　SIMCom offers a complete range of automotive-grade cellular communication modules, including SIM7800X, SIM7805X, and SIM8800X and so on. Additionally, SIMCom provides smart modules, GNSS positioning modules, 5G modules and Wi-Fi & Bluetooth modules, delivering one-stop services to global car manufacturers and Tier 1 suppliers. These products are designed to meet diverse application scenarios, including in-vehicle communication, vehicle positioning, smart cockpits, and digital keys. The integration of various cybersecurity functions, such as encryption, authentication, and data integrity checks, ensures the security of in-vehicle systems and communications, preventing unauthorized access and data tampering.　　Future Outlook　　SIMCom will continue to align with market demands and industry standards, focusing on vehicle network and information security. By collaborating with industry partners, SIMCom aims to continually enrich its automotive product portfolio, offering compliant, reliable, and professional products and services. This commitment will drive the intelligent and secure development of the automotive industry chain.

Key word：

SIMCom

Release time：2024-08-23 13:13 reading：494 Continue reading>>

Trade news

TAIYO YUDEN AEC-Q200 Conductive Polymer Hybrid Capacitors

　　TAIYO YUDEN AEC-Q200 Conductive Hybrid Capacitors feature a superior electrical performance with a low equivalent series resistance (ESR) rating and a high ripple current range. The capacitors are AEC-Q200 qualified for various automotive applications and vibration resistant up to 30G. The capacitors deliver a low leak current, which ensures product longevity. The AEC-Q200 Hybrid Capacitors are ideal for automotive applications, including powertrain, power steering, body control modules, battery management systems (BMS), brake systems, parking assist, infotainment, ADAS systems, and more.　　FEATURESSuperior electrical performanceLow ESRHigh ripple current≤30G guaranteed vibration resistanceLow leak currentEnsures product longevityAEC-Q200 qualified　　SPECIFICATIONS　　5mm x 5.8mm to 12.5mm x 13.5mm case sizes　　10μF to 820μF capacitance range　　6.3V to 80V rated voltage range　　-55°C to +105°C or +125°C or +135°C operating temperature range　　500mArms to 4500mArms max rated ripple current range　　Endurance　　10,000 hours at +105°C　　4000 to 6000 hours at +125°C　　4000 hours at +135°C　　APPLICATIONSAutomotivePowertrain and safetyEngine/motor systemPower steeringBody control moduleBMS systemsBrake systemsParking assist systemsInfotainmentLighting systemsAD and ADAS systemsNavigation systemsSensor systemsAirbag control units

Key word：

TAIYO YUDEN

Release time：2024-07-26 13:23 reading：904 Continue reading>>

Trade news

Advantages and Applications of Through-Hole Power Inductors

Key word：

Through-Hole Power

Release time：2024-07-24 16:44 reading：454 Continue reading>>

Trade news

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a complete space-ready reference design for the AMD Versal™ AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates key space-grade components for power management. It targets the cost-effective AI Edge with both rad-hard & rad-tolerant plastic solutions specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion.　　The new ISLVERSALDEMO3Z power management reference design is fully qualified, enabling easy integration into satellite payload architectures. It includes a PMBus interface, giving users control of fault behaviors, protection levels and output regulation voltage. The new reference design also offers telemetry readouts of internal signals for system diagnostics. It is the industry’s only space-qualified power management system with a digital wrapper to optimize information transmission. The core power solution of this reference design is easily scalable with regard to output power, optimizing customers’ investments in design and qualification over time.　　As the number of Low-Earth Orbit (LEO) satellites increases, the need for lower cost space-grade systems is growing rapidly. Customers traditionally concerned with minimizing SWaP (Size, Weight and Power consumption) are now interested in reducing cost as well (SWaP-C). Renesas’ new ISLVERSALDEMO3Z power management reference design optimally addresses all of these factors. Space-grade plastic components decrease size, weight and cost while wide-bandgap GaN FETs enable the highest efficiency power conversion.　　The new Versal AI Edge Adaptive SoC converts raw sensor data into useful information, making the XQRVE2302 ideal for anomaly and image detection applications. It has a nearly 75% smaller board area and power savings over the previous-generation XQRVC1902. It also integrates the enhanced AMD AI Engine (AIE) technology, known as AIE-ML, which has been optimized for machine learning (ML) applications. Unlike competitive offerings, it supports unlimited reprogramming.　　“We’re proud to team with AMD to deliver this advanced solution that addresses the most pressing concerns of space customers,” said Josh Broline, Sr. Director, Marketing and Applications of the HiRel Business Division at Renesas. “Along with our hallmark power management expertise, this reference design meets SWaP-C objectives, enables real-time system monitoring and control, and unlocks the power of AI.”　　“The Versal™ AI Edge XQRVE2302 Adaptive SOC delivers unprecedented features and performance for the rapidly growing space market,” said Minal Sawant, senior director, Aerospace & Defense Vertical Market, AMD. “We’re pleased that Renesas offers advanced power management functionality that enables our customers to take full advantage of this solution.”　　Renesas’ new ISLVERSALDEMO3Z power management reference design comes with power management devices that have been tested and verified to withstand exposure to high levels of radiation. These include Pulse Width Modulation (PWM) controllers, GaN FET half-bridge drivers, point-of-load (POL) regulators, and power sequencers. The devices come in small-footprint packages, so the core power rail components take up just 67 square centimeters of board area.　　Also, the ISLVERSALDEMO3Z mates seamlessly with the ISL71148VMREFEV1Z voltage monitor reference design with 14-bit resolution to accurately monitor all 11 core power rails of the Versal AI Edge Adaptive SOC. The high resolution enables reliable system health monitoring. It includes a “dual-footprint” to accommodate both space plastic and rad-hard hermetic solutions.

Key word：

Renesas

Release time：2024-07-19 14:24 reading：815 Continue reading>>

Trade news

ROHM Offers LogiCoA™: the Industry's First* Analog-Digital Fusion Control Power Supply Solution

　　ROHM has established LogiCoA™, a power supply solution for small to medium power industrial and consumer equipment (30W to 1kW class). It provides the same functionality as fully digital control power supplies at low power consumption and cost equivalent to analog power types.　　Analog controlled power supplies are commonly used in industrial robotics and semiconductor manufacturing equipment that operate in the medium power range. However, in recent years these power supplies are also required to provide a high level of reliability and precise control that make it difficult to meet market demands with analog-only configurations. On the other hand, while fully digitally controlled power supplies enable fine control and settings, they are not widely adopted in the small to medium power range due to the high power consumption and cost of the digital controller. To address this issue, ROHM developed the LogiCoA™ power solution that leverages the strengths of both analog and digital technologies. High performance low power LogiCoA™ MCUs are utilized to facilitate control of a variety of power supply topologies.　　The LogiCoA™ brand embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. ROHM’s LogiCoA™ power solution is the industry’s first* “analog-digital fusion control” power supply that combines a digital control block centered around the LogiCoA™ MCU with analog circuitry comprised of silicon MOSFETs and other power devices.　　In a fully digital control power supply, the functions handled by digital controllers such as high-speed CPUs or DSPs can be processed by low-bit MCUs, making it possible to achieve increased functionality that is difficult to realize with an analog control power supply at low power consumption and cost. This solution allows for the correction of performance variations in peripheral components according to the power supply circuit by storing various settings such as current and voltage values in the LogiCoA™ MCU. As a result, there is no need to consider design margins unlike with analog control power supplies, contributing to smaller power supplies that provide greater reliability. On top, as operation log data can be recorded in the MCU's nonvolatile memory, it is ideal for power supplies in industrial equipment that require logging as a backup in case of malfunction.　　The evaluation reference design REF66009 allows users to experience the LogiCoA™ power supply solution in a non-isolated buck converter circuit. Various tools necessary for evaluation are also offered, including circuit diagrams, PCB layouts, parts lists, sample software, and support documents, while actual device evaluation is possible using the optional LogiCoA001-EVK-001 evaluation board.　　Going forward, ROHM will continue to develop LogiCoA™ MCUs to support various power supply topologies, contributing to achieving a sustainable society by making the power supply block (which accounts for the majority of power loss in applications) more energy efficient and compact.　　LogiCoA™ BrandLogiCoA™ is a brand that embodies a design philosophy of fusing digital elements to maximize the performance of analog circuits. By combining the advantages of analog circuitry with those of digital control, it is possible to maximize the potential of circuit topologies, contributing to more efficient power utilization. As LogiCoA™ is a design concept that can be applied not only to the power supply field, but also to power solutions as a whole, ROHM is considering its application in future products and solutions.　　Details of the LogiCoA™ Power Supply Reference DesignThe REF66009 evaluation reference design offered on ROHM's website allows users to verify the functionality of the LogiCoA™ MCU along with the basic operation of the LogiCoA™ power supply solution using a non-isolated 12V buck converter circuit. Sample software available on the reference design page makes it possible to confirm the sequence control of execution tasks and the monitoring of various parameters in the actual set using the LogiCoA001-EVK-001 reference board. For more information on the reference board, please contact a sales representative or the contact page on ROHM’s website.　　Application Examples• Industrial robots　　• Semiconductor manufacturing equipment　　• Gaming applications　　Supports mounting in a wide range of general industrial equipment and consumer devices (30W to 1kW).　　About the LogiCoA™ MCUROHM is developing LogiCoA™ MCUs optimized for integrated analog-digital control such as LogiCoA™ power supply solutions. Features include a built-in 3ch analog comparator that can be linked to a timer and D/A converter that enables digital control of various parameters to support different power supply topologies.　　■ LogiCoA™ MCU Specifications (Tentative)　　Availability: Now (LogiCoA™ MCU samples)　　TerminologyFully Digital Control Power Supply　　A power supply controlled using digital technology. High-speed CPUs and DSPs can be used to precisely monitor and control various parameters such as voltage and current, improving power supply efficiency and reliability. What’s more, functions that are difficult to perform with analog control can be achieved, such as acquiring operation log data. However, CPUs and DSPs are expensive and consume a large amount of power, which can be a bottleneck in terms of costs and energy efficiency.　　Analog Control Power Supply　　A power supply configuration consisting of analog components. This type has become mainstream for power supplies 1kW and below due to its simplicity and low power consumption. On the other hand, implementing advanced functionality such as setting arbitrary parameters and logging data is difficult, requiring fully digital control that entails high costs and power consumption.　　CPU (Central Processing Unit)　　Responsible for executing programs and processing data. Handles calculations and processing as well as carrying out instructions according to a program.　　DSP　　A device that digitizes analog signals and performs operations such as analysis, filtering, and amplification on the converted digital signals. Flexible enough for high-speed processing and various applications, it plays an important role in circuits that handle digital signals, such as audio and image processing in addition to power supplies.

Key word：

ROHM

Release time：2024-07-11 13:22 reading：507 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
BP3621	ROHM Semiconductor

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email