ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications
  ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.  In recent years, electronic devices have demanded higher density in smaller form factors at the same time. To meet this demand and achieve space savings and design flexibility, power supply ICs must be capable of stable operation even with small-capacity capacitors. However, achieving such performance with output capacitors of 1µF or less has been technically difficult.  To address this challenge, ROHM developed the “BD9xxN1 Series” LDO regulator (150mA output current) in 2022, incorporating its proprietary ultra-stable control technology, “Nano Cap™”. This innovation enables stable operation with output capacitors as small as 100nF, earning widespread adoption across numerous applications.  The newly developed BD9xxN5 Series builds on the success of the BD9xxN1 Series by increasing the output current to 500mA – more than three times higher than before – significantly broadening its suitability for applications requiring higher power. In addition, very low output voltage ripple of approximately 250mV (with load current variation of 1mA to 500mA within 1µs) is achieved with a small output capacitance of just 470nF (typical). Beyond standard small MLCCs (multi-layer ceramic capacitors) in the range of several µF and large-capacity electrolytic capacitors, it also supports ultra-small MLCCs, such as the 0603M size (0.6mm × 0.3mm), with capacities below 1µF – where stability was previously difficult to achieve. This contributes to space saving as well as greater flexibility in component selection.  Furthermore, high-precision SPICE models, “ROHM Real Model” are provided for accurate simulation and can be downloaded from the ROHM official website.  SPICE Models: BD900N5xxx-C BD933N5xxxx-C BD950N5xxxx-C  ROHM will continue to contribute to the high performance, miniaturization, and high reliability of electronic devices by further expanding its Nano Cap™ technology-equipped LDO series.  Application Examples  Automotive Equipment  ● Powertrain system power supplies for fuel injection systems (FI) and tire pressure monitoring systems (TPMS)● Body system power supplies for body control modules (BCM)● Infotainment system power supplies for clusters ad head-up displays (HUD), etc.Industrial Equipment  ● Power supplies for controllers like Programmable Logic Controllers (PLC), Remote Terminal Units (RTU), and industrial gateways● High-precision LDOs for analog loads and sensors measuring temperature, pressure, flow rate, etc.● Power supplies for monitoring and control panels in disaster prevention systems, access control systems and building automation.● Standby power supplies for Human-Machine Interfaces (HMI) and panel equipment, etc.Consumer Electronics  ● Power supplies for control boards in refrigerators, dishwashers, air conditioners, etc.● Power supplies for home appliances like thermostats and doorbells● Power supplies for constant power applications in home security and network equipment, etc.  What is Nano Cap™ Technology?  Nano Cap™ refers to ultra-stable control technology achieved by combining advanced analog expertise covering circuit design, processes, and layout utilizing ROHM’s vertically integrated production system. Stable control eliminates the problem of unstable operation related to capacitors in analog circuits, contributing to a reduction in design resources for a wide range of applications in automotive, industrial equipment, consumer, and other fields.  Terminology  Primary  In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion is referred to as the secondary.  LDO Regulator (Low Drop Out Regulator / Low Saturation Regulator)  A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.  ROHM Real Model  A high-accuracy simulation model that make it possible to also achieve a perfect match between the actual IC and simulation values utilizing ROHM’s proprietary model-based technology.
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Release time:2026-01-27 13:47 reading:285 Continue reading>>
Industry’s Highest* Rated Power! ROHM Unveils the UCR10C Series of Sintered Metal Shunt Resistors
  ROHM has developed the “UCR10C Series”, which has the industry's highest rated power for 2012-size shunt resistors (10 mΩ to 100 mΩ).  Shunt resistors are required to handle higher power for current sensing in both the automotive and industrial equipment markets. Additionally, specific requirements for high junction reliability in these markets has increased annually.  ROHM’s new products form a copper-based resistive element on an alumina substrate via sintering. By optimizing the heat dissipation structure, it achieves rated powers of 1.0W and 1.25W-double that of equivalent-sized products including thick film types and metal plate types. This enables the replacement of products with wide terminal types or larger alternatives, facilitating miniaturization and reducing the number of components required.  Furthermore, the use of a metal resistive element achieves a low TCR (0 to +60 ppm/°C). This minimizes errors due to temperature changes, enabling high-precision current sensing. Moreover, it achieves the same level of durability as the metal plate types in temperature cycle testing (-55°C / +155°C, 1000 cycles). This ensures high bonding reliability even in applications with extreme temperature fluctuations, such as automotive use, enabling stable, long-term operation.  This series is fully lead-free. No lead materials are present, even in RoHS-exempted areas, thus reducing environmental impact.  As part of its future expansion plans, ROHM has also commenced development of the 3216-size (2W) sintered metal shunt resistor, the “UCR18C Series”, further enhancing its product line-up that combines high power, high precision and high reliability.  Application Examples  Various current detection applications in automotive, industrial equipment, and consumer electronics.  Terminology  Thick Film Types  A chip resistor using a material called metal glaze as the resistive element. In addition to cost advantages, the thick film resistive element provides superior resistance to pulses and surges.  Metal Plate Types  A chip resistor using a metal plate as the resistive element. It offers superior thermal dissipation and achieves high precision through low TCR, providing performance advantages.  Wide Terminal Types  A structure where the electrodes are positioned along the long side of the chip resistor body. Compared to the common structure with electrodes along the short side, it improves heat dissipation efficiency and enables high-power handling.  TCR (Temperature Coefficient of Resistance)  An indicator showing how much a resistor's resistance value changes with temperature. A lower value means less resistance variation due to temperature fluctuations, providing more stable performance.  The TCR of the UCR10C varies depending on the resistance value. Furthermore, the listed TCR is the guaranteed value for the +25/+155°C range for the 10mΩ product.
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Release time:2026-01-22 11:30 reading:1187 Continue reading>>
GigaDevice Partners With Melchioni Electronics to Expand Business in France, Italy and the Iberian Peninsula
  GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has entered into a distribution agreement with Milan-based Melchioni Electronics.  The partnership extends GigaDevice's reach into several major European markets, with Melchioni Electronics supplying not only GigaDevice's leading Flash and MCU lines but also delivering dedicated field application engineering support. The deal covers distribution in France, Italy, Spain and Portugal, with on-the-ground presence in each of these countries.  GigaDevice delivers world-class SPI NOR Flash, SLC NAND Flash, 32-bit microcontrollers, analog, and sensor products. These technologies play a pivotal role across applications including industrial automation, automotive, consumer electronics, IoT, network communications, mobile, and PCs.  "The establishment of this partnership and the accelerated entry into the European markets are significant steps in our strategy," said Dr. Reiner Jumpertz, GigaDevice VP and General Manager in the EMEA region. "Melchioni has an exceptional reputation and is well-known for its deep engineering expertise. Their regional FAE and marketing teams perfectly support our successful growth plans in Europe.”  “This strategic agreement with GigaDevice delivers substantial value to our customer base,” stated Elisabetta Dell’Olio, Head of Technology & Suppliers Platform at Melchioni Electronics. “Our core mission is to empower enterprises with the most effective and cutting-edge technologies. By adding GigaDevice’s world-class Flash memory solutions and GD32 microcontrollers (MCUs) to our services, we are significantly elevating our offering across the automotive, industrial automation, and consumer electronics sectors.”  About Melchioni Electronics  Melchioni Electronics is a prominent company specializing in the distribution and integration of high-quality electronic solutions. With a strong reputation in the industry, Melchioni Electronics serves a diverse range of industrial sectors. The company is known for its expertise in providing electronic components and its ability to tailor customized solutions to meet the unique needs of its clients. Melchioni Electronics is committed to innovation and excellence, continually pushing the boundaries of technology to deliver cutting-edge electronic solutions to its customers. With a focus on quality, reliability, and customer satisfaction, Melchioni Electronics is a trusted partner for businesses seeking advanced electronic solutions and integration services.  About GigaDevice  GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.
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Release time:2026-01-20 15:00 reading:1234 Continue reading>>
A new choice for high-accuracy, highly compatible current sensing: NOVOSENSE launches the NSCSA21x-Q series high-precision current sense amplifiers
  NOVOSENSE has launched the NSCSA21x-Q series high-precision current sense amplifiers, offering a –2V to 28V common-mode input range, ultra-low ±5μV offset voltage, 130dB CMRR, and 200kHz bandwidth. Designed to meet the needs of new energy vehicles, server power supplies, telecom power systems, and energy storage, the NSCSA21x-Q series delivers exceptional accuracy and system stability in demanding environments.  Addressing Key Challenges in Modern Power and Automotive Systems  As automotive electrification and industrial intelligence advance, current sensing accuracy and system stability have become critical to overall performance. Traditional current sensors often face limitations in low-voltage detection, reverse connection protection, and dynamic response, impacting system reliability and efficiency. The NSCSA21x-Q series directly targets these pain points, overcoming three major challenges in precision current detection:  (1) High-Precision Motor Phase Current Sampling  Supports bidirectional current sensing in H-bridge structures. Combined with FOC algorithms, it enables ±0.5° electrical angle control for precise motor performance.  (2) Suppression of Parasitic Inductance Interference  In low-side sensing, the NSCSA21x-Q effectively mitigates “ground bounce” effects through PWM rejection, maintaining high accuracy even with small current signals. With a 130dB CMRR and only ±5μV input offset, it ensures signal integrity under severe transient conditions.  (3) Reverse Battery Protection  Withstands up to –28V reverse voltage, safeguarding the system against battery misconnection and simplifying protection circuit design.  Robust Performance Across All Operating Conditions  Breaking conventional design limits, the NSCSA21x-Q series supports a wide –2V to 28V common-mode range with built-in PWM suppression and chip-level reverse-voltage tolerance. Even under –28V reverse common-mode stress, the device quickly resumes normal operation. In rigorous transient tests (–2V to 12V step change), it achieves a <5μs recovery time and <50mV output disturbance, making it ideal for high-accuracy current detection in motor drives and solenoid control under PWM switching environments.  Precision and Stability Across Temperature Extremes  Featuring a ±5μV (typical) input offset voltage and ±0.5% maximum gain error, the NSCSA21x-Q maintains outstanding accuracy over a full –40°C to 125°C temperature range. With a temperature drift as low as 0.05μV/°C, it ensures stable measurements in harsh automotive and industrial conditions.Input Offset Voltage Distribution of NSCSA21x-Q SeriesCommon-Mode Rejection Ratio (CMRR) Distribution of NSCSA21x-Q Series  Fast Dynamic Response and Strong Transient Protection  With a 200kHz bandwidth (50V/V gain) and a 2V/μs slew rate, the NSCSA21x-Q supports fast current variation monitoring and real-time protection. Compared to mainstream alternatives, it achieves up to 3× faster transient response, meeting the needs of high-speed applications such as motor control and power protection.  Flexible Configurations with Automotive-Grade Reliability  The NSCSA21x-Q series offers four fixed gain options (50V/V, 75V/V, 100V/V, and 200V/V), covering both industrial and automotive versions. Packaged in an ultra-compact SC70-6 (2mm × 1.25mm) footprint, it's pin-compatible with industry standards, enabling smaller system size and higher design efficiency.Four Fixed-Gain Versions of the NSCSA21x-Q Series  The NSCSA21x-Q series is AEC-Q100 Grade 1 qualified, supporting –40°C to +125°C operation and ensuring long-term reliability in automotive environments.
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Release time:2026-01-15 17:20 reading:1317 Continue reading>>
NOVOSENSE launches automotive- and industrial-grade NSCSA240-Q series current sense amplifiers to address PWM transient interference challenges
  NOVOSENSE announced the launch of its new bidirectional current sense amplifier series, NSCSA240-Q, covering both industrial and automotive versions, designed for high-voltage PWM systems in vehicles and industrial equipments. The NSCSA240-Q series integrates enhanced PWM rejection technology, supporting bidirectional current sensing with exceptional transient immunity, automotive-grade precision, and flexible configurability. Featuring an ultra-wide input common-mode range from –4V to 80V, a typical input offset voltage of ±5μV, and a 135dB DC Common-Mode Rejection Ratio (CMRR). This series effectively tackles the challenge of high-frequency transient interference in PWM systems, providing a highly reliable current monitoring solution for automotive electronic power steering (EPS), motor drive, industrial automation and other applications. The NSCSA240-Q series meets the AEC-Q100 automotive reliability standard.  Superior Transient Immunity: Reliable Performance in High-Voltage PWM Environments  In PWM systems, rapid switching can cause severe common-mode voltage fluctuations that distort output signals in conventional amplifiers. The NSCSA240-Q series achieves an AC CMRR of 90dB at 50kHz, effectively suppressing ΔV/Δt transients. Its proprietary transient suppression design reduces output disturbances by up to 80%, achieving a recovery time of less than 10μs under 80V common-mode voltage transients. With a bandwidth ranging from 450kHz to 600kHz (gain-dependent), it supports both high-speed overcurrent protection and accurate low-frequency PWM signal capture—ensuring stable, low-noise signal performance for EPS, motor drive and industrial motor control systems. The wide –4V to 80V input common-mode range offers broad dynamic capability and robust tolerance across 12V, 24V, and 48V vehicle power architectures. Furthermore, ±2000V ESD protection (HBM/CDM) enhances resistance to external electrical disturbances, ensuring overall system reliability.NSCSA240-Q Series Application Diagram  Automotive-Grade Precision: ±5μV Offset and ±0.1% Accuracy Across –40°C to 125°C  Designed to meet the increasingly stringent current measurement requirements of automotive electronics, the NSCSA240-Q series delivers exceptional measurement stability. It features a typical input offset voltage of only ±5μV (maximum ±25μV) and achieves ±0.1% accuracy over a wide temperature range (–40°C to 125°C). With a typical gain error of 0.05%, it ensures reliable and consistent current monitoring even under harsh conditions. Fully qualified to the AEC-Q100 automotive standard, the series guarantees long-term reliability in demanding in-vehicle environments.  Flexible Integration: Multiple Gain and Package Options for Design Optimization  As automotive systems trend toward miniaturization and integration, the NSCSA240-Q series is engineered for flexible and space-efficient design. It offers four fixed gain options—20V/V, 50V/V, 100V/V, and 200V/V—supporting shunt resistors ranging from 10mΩ to 0.1mΩ for flexible current detection. The series is available in two compact packages: SOIC-8 (4.9mm × 3.91mm) and TSSOP-8 (3mm × 4.4mm), allowing easy integration into space-constrained motor controller PCBs and helping designers optimize system layouts within limited board area.NSCSA240-Q Series Package
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Release time:2026-01-12 13:52 reading:819 Continue reading>>
A Comprehensive Guide to Choosing Between LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)
  Selecting the appropriate voltage regulator is critical for the stability and efficiency of various circuit systems. Among the numerous types available, LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators) are two common voltage stabilizers. This article will thoroughly explore the selection methods for LDO and DC-DC regulators, covering concepts, operating principles, characteristics, and application scenarios.  A Comprehensive Guide to Selecting LDO (Low Dropout Linear Regulators) and DC-DC (Switching Regulators)  1. LDO (Low Dropout Linear Regulator)  1.1 Concept  LDO stands for Low Dropout Regulator, typically used to regulate high input voltages to lower output voltages. It achieves stable output voltage by adjusting the conduction resistance of its internal transistor.  1.2 Working Principle  When the input voltage exceeds the output voltage, the internal transistor enters an amplified state. It dissipates excess power to regulate the output voltage, maintaining it at the set value.  1.3 Characteristics  Simple design, low noise, relatively low cost, suitable for applications requiring high precision. However, it has low efficiency and significant thermal distortion.  2. DC-DC (Switching Regulator)  2.1 Concept  DC-DC refers to a switching regulator (DC-to-DC Converter) that converts input voltage to the desired output voltage by switching the state of a switching element (e.g., MOSFET).  2.2 Working Principle  DC-DC operates by periodically turning the switching element on and off to control the output voltage magnitude, while a filter removes high-frequency noise from the output waveform.  2.3 Features  High efficiency, capable of delivering substantial output power, suitable for applications requiring large voltage drops or enhanced efficiency, but involves complex design and relatively higher cost.  3. How to Select?  3.1 Output Voltage Range  For lower output voltages, an LDO is more suitable; whereas for large voltage drops or higher output power requirements, a DC-DC converter is more appropriate.  3.2 Efficiency Requirements  When prioritizing power efficiency, especially under large voltage drops, DC-DC converters typically outperform LDOs.  3.3 System Complexity  LDOs may be preferable for simplified design and cost reduction; DC-DC converters are necessary when higher output power and efficiency are required.  3.4 Ripple and Noise  In applications sensitive to output ripple and noise, LDOs are generally more suitable than DC-DC converters because they produce lower ripple and noise.  4. Application Scenarios  4.1 LDO Application Scenarios  Applications requiring high output voltage accuracy, low output current, and strict ripple/noise specifications.  4.2 DC-DC Applications  Applications requiring large voltage drops, high output power, and high efficiency, such as mobile devices, power amplifiers, and communication equipment.  4.3 Comprehensive Considerations  In practical applications, the optimal regulator type must be selected by comprehensively evaluating system power consumption, output load conditions, stability requirements, and cost factors.  As common voltage regulators, LDOs and DC-DC converters play vital roles in electronic product design. Selecting the appropriate regulator type depends on specific application requirements, including output voltage range, efficiency demands, system complexity, and ripple noise. During the selection process, a comprehensive evaluation of all factors is necessary to ensure the circuit system operates stably, reliably, and efficiently.
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Release time:2025-12-31 17:31 reading:841 Continue reading>>
GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland
  GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has been awarded the ISO/SAE 21434 Road Vehicles Cybersecurity Engineering certification by TÜV Rheinland. In parallel, the MCAL (Microcontroller Abstraction Layer) software of GD32A7 automotive-grade MCUs successfully passed the ASPICE Capability Level 2 (CL2) assessment. These milestones demonstrate GigaDevice’s alignment with internationally recognized practices in automotive cybersecurity and software project management, reinforcing its competitiveness in the global automotive electronics market.  ISO/SAE 21434, jointly issued by ISO and SAE, defines a comprehensive cybersecurity risk-management framework that spans the entire vehicle lifecycle. As vehicles become increasingly connected and intelligent, cybersecurity has emerged as a foundational requirement for protecting user privacy and ensuring a secure, reliable mobility experience. Achieving this certification confirms that GigaDevice has established an end-to-end cybersecurity governance framework across the design, development, and mass-production phases of its automotive product portfolio—helping customers streamline compliance, accelerate program approvals, and enhance market competitiveness.  The ASPICE assessment model, governed by the German Association of the Automotive Industry (VDA), is one of the industry's most important standards for evaluating software development capability. ASPICE CL2 requires companies to adopt structured processes for project planning, monitoring, and traceability. Developed in full compliance with AUTOSAR, the GD32A7 MCAL software supports major compilers and debugging toolchains while meeting both functional-safety and cybersecurity requirements. Passing ASPICE CL2 affirms the maturity of GigaDevice’s software-development lifecycle and underscores its commitment to high-reliability automotive solutions.  Driven by new infrastructure such as 5G, AI, and the IoT, vehicles are evolving into interactive intelligent terminals. Automotive-grade chips play a central role in this transition, enabling continuous advancements in vehicle intelligence. Designed for next-generation automotive platforms, the GD32A7 series leverages the Arm® Cortex®-M7 core and offers multiple configurations, including single-core, multi-core, and lockstep architectures. With a maximum frequency of 320MHz and up to 1300 DMIPS of compute performance, the devices support 2.97V–5.5V operation and deliver stable performance across a –40°C to +125°C temperature range. The series are well suited for applications such as body electronics, intelligent cockpit systems, chassis control, and powertrain subsystems.  The GD32A71x/GD32A72x families comply with ISO 26262 ASIL B, while the GD32A74x series supports ASIL D requirements. All product lines integrate a Hardware Security Module (HSM) with TRNG, AES, HASH, ECC/RSA, and Chinese SM2/SM3/SM4 cryptographic engines, meeting the Evita Full information-security architecture and providing robust data protection for in-vehicle systems.  Wenxiong Li, Vice President of GigaDevice and General Manager of the Automotive BU, stated: “Achieving ISO/SAE 21434 certification and ASPICE CL2 capability assessment marks an important milestone in elevating our automotive-grade MCU development to higher standards of security and process maturity. GigaDevice will continue to expand the GD32 MCU automotive portfolio and deepen our collaboration with TÜV Rheinland to deliver higher-performance, higher-security products and a more complete ecosystem for our customers.”  Bin Zhao, General Manager of Industrial Services and Cybersecurity at TÜV Rheinland Greater China commented: “GigaDevice has demonstrated exceptional execution and technical competence in establishing automotive cybersecurity systems and software development processes. Obtaining ISO/SAE 21434 certification and ASPICE CL2 capability assessment provides strong validation for its entry into global automotive supply chains. We look forward to further collaboration to advance innovation and deployment in automotive electronics safety.”  GigaDevice and TÜV Rheinland also announced the establishment of a strategic partnership focused on functional safety, cybersecurity, personnel training, and certification services. The collaboration aims to integrate both parties' strengths to enhance competitiveness across automotive, industrial, and emerging markets—delivering safer and more reliable products and solutions to customers worldwide.
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Release time:2025-12-26 16:25 reading:956 Continue reading>>
Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization
  Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC, and has already begun mass production*. Murata’s proprietary design incorporates an Inner Cavity within the substrate to achieve a dielectric constant (Dk) below 2.0, dramatically reducing transmission loss.Cross-Section Image  With 6G expected to leverage the FR3 (Frequency Range 3) band—roughly 7–24 GHz—substrates with minimal transmission loss are essential to enable high-speed, high-capacity communications at high frequencies. At the same time, demand is growing for thin, space-saving flexible substrates that support free-form mechanical design to meet the ongoing miniaturization of smartphones and communication equipment. Murata has provided LCP flexible substrates with excellent high-frequency characteristics, featuring a proprietary high-performance resin that eliminates spring-back and an adhesive-free, one-shot press multilayer lamination process; building on this expertise for 6G readiness, Murata has developed and launched ULTICIRC. Conventional flexible substrates faced the challenge that making them thinner resulted in increased transmission loss, but this product incorporates an Inner Cavity structure within the substrate, achieving a dielectric constant (Dk) below 2.0, which is significantly lower than Murata's conventional products, enabling both thin profiles and ultra-low transmission loss simultaneously.  Furthermore, thanks to an adhesive-free proprietary manufacturing method and the excellent barrier properties of LCP, the Inner Cavity structure maintains high moisture resistance.  For inquiries regarding this product, please contact us.
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Release time:2025-12-18 16:00 reading:518 Continue reading>>
Renesas Releases its First Wi-Fi 6 and Wi-Fi/Bluetooth LE Combo MCUs for IoT and Connected Home Applications
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.  Ultra Low Power Operation for Always-Connected IoT  Today’s IoT devices must stay always connected to improve application usability and response time, while maintaining the lowest possible power consumption to extend battery life or to meet eco-friendly regulations. Renesas’ Wi-Fi 6 MCUs offer features such as Target Wake Time (TWT), which enables extended sleep times without compromising cloud connectivity and power consumption. This is critical for applications such as environmental sensors, smart locks, thermostats, surveillance cameras, and medical monitors, where real-time control, remote diagnostics and over-the-air (OTA) updates are critical.  Additionally, both MCU Groups are optimized for ultra-low power consumption, consuming as little as 200nA to 4µA in sleep mode and under 50µA in Delivery Traffic Indication Message (DTIM10). With the “sleepy connected” Wi-Fi functionality, these devices stay connected with minimal power draw, meeting the growing requirements of modern energy efficiency standards.  Scalable RA MCU Architecture with Full Software Support  Built on the Arm® Cortex®-M33 CPU core running at 160 MHz with 704 KB of SRAM, the MCUs enable engineers to develop cost-effective, standalone IoT applications using integrated communication interfaces and analog peripherals, without the need for an external MCU. Customers also have the option to design with a host MCU that can be selected from Renesas’ broad RA MCU offerings and attach the RA6W1 and RA6W2 as connectivity and networking add-ons. Both RA6W1 and RA6W2 are designed to work with Renesas’ Flexible Software Package (FSP) and e² studio integrated development environment. As the first Wi-Fi MCUs in the RA portfolio, they offer a scalable platform that supports seamless software reuse across the RA family.  High Performance Dual-Band Wi-Fi 6 with 2.4 and 5 GHz Connectivity  With support for both 2.4 and 5 GHz bands, both MCUs deliver superior throughput, low latency, and reduced power consumption. The dual-band capability dynamically selects the most suitable band based on real-time conditions, ensuring a stable and high-speed connection even in environments with many connected devices. Advanced features such as Orthogonal Frequency Division Multiple Access (OFDMA) and TWT boost performance and energy efficiency, making these solutions well suited for dense urban environments and battery-powered devices.  Robust Security and Matter-Certified Interoperability  The RA6W1 and RA6W2 devices offer advanced built-in security including AES-256 encryption, secure boot, key storage, TRNG, and XiP with on-the-fly decryption to keep data safe from unauthorized access. The RA6W1 is RED certified (Radio Equipment Directive), which makes it easier for developers to future-proof their design. Additionally, the device is Matter ready and certified with Matter 1.4, and is compatible across smart home platforms. Renesas supports both MCUs and modules through the Renesas Product Longevity Program, offering 15-year support for MCUs and 10 years for modules.  “We’re offering our customers the flexibility to design with a standalone Wi-Fi device, a Wi-Fi/Bluetooth LE combo, or fully integrated modules depending on their needs,” said Chandana Pairla, VP of the Connectivity Solutions Division at Renesas. “These wireless solutions save power, simplify system design and lower BOM cost. With hosted or hostless implementation options, customers can confidently begin their wireless onboarding journey and seamlessly integrate into next-generation connected systems.”  Two types of modules, Wi-Fi 6 (RRQ61001) and Wi-Fi/Bluetooth LE combo (RRQ61051) simplify design by integrating certified RF components and wireless connectivity stacks that comply with global network standards. Supported RF certification standards include the U.S. (FCC), Canada (IC), Brazil (ANATEL), Europe (CE/RED), UK (UKCA), Japan (Telec), South Korea (KCC), China (SRRC) and Taiwan (NCC). By integrating connectivity at the system level, the modules significantly reduce design effort and accelerate time to market.  Winning Combinations  Renesas offers “Advanced Low-Power Wireless HMI for Household Appliances” and “Automatic Pet Door & Tracking System” that combine the new Wi-Fi 6 MCU and Wi-Fi/Bluetooth LE MCU with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.  Availability  The RA6W1 MCU is now available in FCQFN and WLCSP packages, along with the RRQ61001 and RRQ61051 modules. The RA6W2 MCU (BGA package) will be available in Q1/2026. The devices are supported by the FSP, e² studio, evaluation kit and software development kit (SDK) that include flash memory, PCB trace antennas, connectors and embedded power profiler for power consumption analysis. Renesas also offers comprehensive software tools to aid system application development, as well as the Production Line Tool (PLT) for production testing of wireless MCUs.
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Release time:2025-12-12 16:28 reading:1223 Continue reading>>
ROHM launches wide SOA MOSFET for AI servers in compact 5×6mm package
  ROHM has developed the 100V power MOSFET - RS7P200BM - achieving industry-leading SOA in a 5060-size (5.0mm × 6.0mm) package. This product is ideal for hot-swap circuits in AI servers using 48V power supplies as well as for industrial power supplies requiring battery protection.  The rapid evolution and widespread adoption of AI technologies have increased the demand for stable operation and improved power efficiency in servers equipped with generative AI and high-performance GPUs. Particularly in hot-swap circuits, power MOSFETs with wide SOA are essential to handle inrush current and overload conditions, ensuring stable operation. Furthermore, within data centers and AI servers, the transition towards 48V power supplies, which offer superior power conversion efficiency, is progressing against a backdrop of energy conservation. This necessitates the development of high-voltage, high-efficiency power supply circuits capable of meeting these demands.  Therefore, ROHM has expanded its line-up of 100V power MOSFETs ideal for hot-swap circuits in AI servers to meet market demand. The new RS7P200BM adopts a compact DFN5060-8S (5060 size) package, enabling even higher density mounting compared to the AI server power MOSFET ‘RY7P250BM’ in the DFN8080-8S (8.0mm × 8.0mm size) package, which ROHM has released in May 2025.  The new product achieves a low on-resistance (RDS(on)) of 4.0mΩ (conditions: VGS=10V, ID=50A, Ta=25°C) while maintaining wide SOA of 7.5A at a pulse width of 10ms and 25A at 1ms under operating conditions of VDS=48V. This balance of low on-resistance and wide SOA, typically a trade-off relationship, helps suppress heat generation during operation, thereby improving server power supply efficiency, reducing cooling load, and lowering electricity costs.  Mass production of the new product began in September 2025 (sample price: $5.5/unit, excluding tax).  ROHM will continue to expand its product lineup for 48V power supplies, which are increasingly adopted in applications such as AI servers. By providing highly efficient and reliable solutions, we will contribute to reducing power loss and cooling loads in data centers, as well as enhancing the high reliability and energy efficiency of server systems.  Application Examples  •48V system AI servers and data center power hot-swap circuits  •48V system industrial power supplies (forklifts, power tools, robots, fan motors, etc.)  •Battery-powered industrial equipment such as AGVs (Automated Guided Vehicles)  •UPS, emergency power systems (battery backup units)  EcoMOS™ Brand  EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector. Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.  ・EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.  Terminology  SOA(Safe Operating Area)  The voltage and current range within which a device can operate safely without damage. Operation beyond this safe operating area may cause thermal runaway or damage; therefore, consideration of the SOA is essential, particularly in applications where inrush current or overcurrent may occur.  Hot-swap circuit  The complete circuitry supports the hot-swap function, which enables the removal or insertion of components while the device's power supply remains active. Comprising MOSFETs, protective elements, and connectors, it suppresses inrush currents occurring during component insertion and provides overcurrent protection, thereby ensuring the safe operation of the system and connected components.  Inrush Current  The high current exceeds the rated current value that flows momentarily when switching on electronic equipment. Controlling this prevents damage to devices and stabilizes the system by reducing the load on components within the power supply circuit.  On-resistance(RDS(on))  The resistance value between the drain and source terminals when the MOSFET is in operation (on). The lower the value, the less power loss occurs during operation.
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Release time:2025-11-28 17:28 reading:1035 Continue reading>>

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