<span style='color:red'>Samsung</span> Promises 2018 Tbit NAND
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Samsung Promises 2018 Tbit NAND

　　Samsung sketched out plans for a terabit 3D-NAND chip that it will ship next year as well as dense solid-state drives using its current chips. It also said that it is sampling the Z-NAND products that it announced last year at latency levels that match or beat Intel’s 3DXP memories.　　Samsung’s Tbit NAND will support data rates up to 1.2 Gbits/second and pack four terabytes in a package that stacks 32 die. The chip will embed peripheral circuits in a new metal bonding layer at the bottom of a cell stack as one way to hit the new density level, said Kye Hyun Kyung, Samsung’s executive vice president of flash products and technology, in a talk at the company’s Silicon Valley headquarters.　　The news was part of Samsung’s keynote at the Flash Memory Summit, where some rivals described chips using 96 layers and four bits per cell. Samsung’s current 512-Gbit chips use nine vertical channels and 64 layers built in a descending stair fashion for stability, up from four channels and 48 layers in the prior generation.　　Kyung said that versions of 3D-NAND with up to four bits per cell will fill most of the industry’s non-volatile memory needs. However, he said that the Korean giant has been working since at least 2002 on versions of magnetic and phase-change memories with sub-microsecond latencies that it will eventually ship to help plug gaps between NAND and DRAM.　　Meanwhile, Samsung is sampling users including NetApp and Datera solid-state drives (SSDs) using its Z-NAND chips that deliver 15-microsecond latency. The chips use sense amps optimized solely for latency, run at data rates up to 800 Mbits/s, and target data centers running analytics and caching programs.　　Samsung is working on a second-generation Z-NAND supporting two bits per cell. They are aimed to be more affordable, although their read latency is expected to nudge up slightly.　　The Z-NAND products challenge Intel’s Optane SSDs based on its 3DXP chips and launched in March. Given the latencies of the PCI Express bus that SSDs use, the most disruptive opportunities for such chips will be in cards expected next year riding faster memory busses, said Jim Handy, market watcher with Objective Analysis (Los Gatos, California).
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Release time：2017-08-09 00:00 reading：1115 Continue reading>>
<span style='color:red'>Samsung</span> Was No. 1 in Chip Sales in Q2
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Samsung Was No. 1 in Chip Sales in Q2

　　South Korea's Samsung Electronics Co. Ltd. has unseated Intel Corp. as the world's leading semiconductor vendor, at least for one quarter.　　Samsung (Seoul) reported this week that its semiconductor division posted sales for the second quarter of 17.58 trillion won, or about $15.78 billion, besting the $14.8 billion in second quarter sales that Intel reported Thursday (July 27).　　Analysts have been saying since early this year that Samsung could rise to No. 1 in chip sales in 2017, surpassing Intel, was had led the semiconductor industry in sales every year since 1992. The booming memory chip market, which is led by Samsung, is driving growth for Samsung and other memory vendors at a faster pace than makers of logic chips.　　Market research firm IC Insights Inc. noted in May that the passing of the torch could occur in the second quarter, based on the second quarter forecasts issued by the two chip giants.　　It's unclear how long Samsung can retain the top spot in chip sales. The market for memory chips is notoriously cyclical. Growth in sales for DRAM and flash memory chips has begun to slow, and analysts forecast that a downturn in memory may be looming late next year of in 2019 as new capacity comes online and new Chinese competitors enter the fray.　　However, Bill McClean, president of IC Insights, said in an email exchange with EE Times, that Samsung is likely to grow chip sales faster than Intel on average and may well have a handle on the No. 1 spot for at least the foreseeable future.　　Given its size and product mix, Intel will most likely grow at or near the growth rate of the total semiconductor market excluding memory, roughly 5 to 6 percent per year, McClean said. "Given that there are only 3 DRAM players left and Samsung is so strong in 3D NAND flash, Samsung on average is likely to grow slightly faster than the overall market over the next few years," McClean said. “While the memory market is still cyclical and could cause Samsung to drop below Intel once again in annual sales, the trend over the long term is likely to see Samsung at the top of the ranking more often than not."　　McClean also noted that the larger chip vendors are capturing more of the overall market today than in years past, with the top 10 chip vendors holding 58 percent of the market in the first half of this year.　　Intel’s sales in 2016 represented 15.6 percent of the total semiconductor market. In 1993, Intel was the No. 1 chip vendor with 7 percent market share and in 2006 it had 11.9 percent market share, McClean said.　　"In contrast, Samsung's share was 2.8 percent in 1993, 7.4 percent in 2006 and 12.1 percent in 2016," McClean said. "So, it seems like Samsung surpassing Intel as No. 1 has more to do with Samsung gaining market share than Intel losing market share."　　Samsung's strong chip sales lifted the conglomerate's overall profit in the second quarter to 14.1 trillion won (about $12.6 billion), the highest ever quarterly profit for the nearly 80-year-old company. Nearly 60 percent of Samsung's second quarter profit came from the semiconductor division.
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Release time：2017-07-31 00:00 reading：1325 Continue reading>>
Report: <span style='color:red'>Samsung</span> Plans to Triple Foundry Market Share
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Report: Samsung Plans to Triple Foundry Market Share

　　Executives from South Korea's Samsung Electronics Co. Ltd. told the Reuters news service that the company has plans to triple its market share in the semiconductor foundry business and has its eyes set on the No. 2 position in that market, behind dominant player Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).　　Samsung (Seoul) earlier this year split is foundry operations from the rest of its System LSI division in a move designed to give the unit more independence and grow its market share. One knock against Samsung's foundry business has been from the start that Samsung, as a chip maker, is also a competitor to many foundry customers.　　A Monday (July 24) report by Reuters quotes E.S. Jung, head of Samsung's foundry division, saying that Samsung plans to grow its foundry market share to 25 percent from less than 10 percent today. To do this, Samsung will aggressively add customers, according to the report.　　Samsung, which is likely to pass Intel Corp. to become No. 1 in global semiconductor sales this year due to a booming memory chip market, is a technology leader in the chip manufacturing space. But in the foundry business, Samsung trails TSMC by a wide margin.　　TSMC held 59 percent market share in the pure-play foundry market for 2016, a number that has been relatively consistent in recent years, according to market research firm IC Insights. TSMC's market share in the overall foundry market — which includes integrated device manufacturers like Samsung, Intel and others — is still greater than 50 percent.
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Release time：2017-07-25 00:00 reading：1154 Continue reading>>
Memory Prices Drive <span style='color:red'>Samsung</span>'s Record Q2 Profit
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Memory Prices Drive Samsung's Record Q2 Profit

　　South Korean electronics powerhouse Samsung Electronics Co. Ltd. said Friday (July 7) it expects to record a record profit of about 14 trillion Korean won (about $12.1 billion) for the second quarter as surging memory chip prices boost the company's bottom line.　　Samsung (Seoul) said it expects its profit to increase 72 percent compared with the second quarter of 2016. The firm said sales rose to an estimated 60 trillion won (about $52 million), an increase of 18 percent compared with the year ago period.　　Memory chip prices have been on the rise since late last year as tight supply in DRAM and NAND flash memory have chip vendors scrambling to add capacity. Flash memory chips are also finding uses in more applications, such as consumer electronics and solid state drives, leading to higher consumption.　　According to DRAMeXchange, a market research firm that tracks memory chip pricing, there is no easing of DRAM and NAND undersupply on the immediate horizon. The firm predicts that DRAM average selling prices will rise another 5 percent in the third quarter, while the average selling price of NAND chips surged by 20 to 25 percent in the first quarter.　　Samsung said earlier this week that it plans to invest $18.6 billion in semiconductor and display production facilities. The company also said its newest chip fab line in Pyeongtaek, South Korea, began mass production and has shipped its first product to customers.　　Market watchers expect the surging memory prices in 2017 will enable Samsung to displace Intel Corp. from the No. 1 spot in semiconductor sales. Intel has been No. 1 in chip sales for more than two decades.
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Release time：2017-07-11 00:00 reading：1254 Continue reading>>
<span style='color:red'>Samsung</span> Targets 4nm in 2020
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Samsung Targets 4nm in 2020

　　Samsung Electronics Co. Ltd. Wednesday (May 24) updated its foundry technology roadmap, including detailing its second-generation FD-SOI platform, several bulk silicon FinFET processes down to 5nm and a 4nm “post FinFET” structure process set to be in risk production in 2020.　　Samsung, which formally broke its foundry operation into a separate business unit called Samsung Foundry last week, also reiterated previously announced plans to put extreme ultraviolet (EUV) lithography into production in 2018 at the 7nm node.　　”We are extremely aggressive with our roadmap, not only in planning, but in announcing what we are going to be doing in the next three to four years,” said Kelvin Low, senior director of foundry marketing at Samsung, in an interview in advance of Wednesday’s announcement.　　The most forward-looking of Samsung’s Wednesday announcements, which were unveiled at the company’s annual U.S. foundry technology forum in Santa Clara, Calif., is the company’s proprietary next-generation device architecture, which it calls multi-bridge channel FET (MBCFET). The structure is described as Samsung’s own proprietary flavor of gate-all-around FET (GAAFET) technology that uses a nanosheet device to overcome the physical scaling and performance limitations of the FinFET architecture.　　Samsung’s roadmap calls for putting MBCFET technology into risk production in 2020 in its 4nm low-power plus (LPP) process.　　Between now and 2020, Samsung plans to put in production an 8nm LPP process this year, a 7nm LPP process featuring EUV next year and 5nm and 6nm LPP processes in 2019.　　EUV, a long-promised an often pushed out lithography technology to succeed 193nm immersion lithography, finally appears to be on the verge of being inserted into production. Taiwan Semiconductor Manufacturing Co. (TSMC) and Globalfoundries, Samsung’s chief foundry competitors, have both declared their intentions to use EUV in production in 2019.　　Samsung has demonstrated the EUV power source production target of 250W in process development. According to Low, the “magic number” for productivity with EUV is 1,500 wafers per day. Samsung has already exceeded 1,000 wafers per day and has a high degree of confidence that 1,500 wafers per day is achievable, Low said.　　Kinam Kim, president of Samsung's semiconductor division, lays out the company's foundry process roadmap at the company's Foundry Forum in Santa Clara, Calif. Wednesday.　　Kinam Kim, president of Samsung's semiconductor division, lays out the company's foundry process roadmap at the company's Foundry Forum in Santa Clara, Calif. Wednesday.　　“We are confident that we are ready to bring [EUV] into production in 2018,” Low said. “This is no longer a concept roadmap item.”　　Low said that Samsung, unlike some competitors, sees the 10nm node as a “long-lead node” that will provide customers with the performance and desired power consumption on leading edge designs for a considerable period of time.　　“As long as we are able to deliver power, performance and scaling in production, we think it will be a very productive node,” Low said.　　Samsung also detailed an 18nm FD-SOI process technology targeted for risk production in 2019. The company plans to gradually expand its current 28nm FD-SOI process into a broader platform by incorporating RF and embedded MRAM options before offering its second-generation FD-SOI platform, which it says will offer a 40 percent power savings, a 20 percent performance improvement and area advantages over its predecessor.
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Release time：2017-05-24 00:00 reading：998 Continue reading>>
<span style='color:red'>Samsung</span> Poised to Become World’s Largest Semi Supplier in 2Q17
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Samsung Poised to Become World’s Largest Semi Supplier in 2Q17

　　Intel could yield the #1 position it has held since 1993.　　After nearly a quarter of a century, the semiconductor industry could see a new #1 supplier in 2Q17.  If memory market prices continue to hold or increase through 2Q17 and the balance of this year, Samsung could charge into the top spot and displace Intel, which has held the #1 ranking since 1993.  Using the mid range sales guidance set by Intel for 2Q17, and a modest, yet typical, 2Q sales increase of 7.5% for Samsung, the South Korean supplier would unseat Intel as the world’s leading semiconductor supplier in 2Q17 (Figure 1).  If achieved, this would mark a milestone achievement not only for Samsung, specifically, but for all other competing semiconductor producers who have tried for years to supplant Intel as the world’s largest supplier.  In 1Q16, Intel’s sales were 40% greater than Samsung’s, but in just over a year’s time, that lead may be erased and Intel may find itself trailing in quarterly sales. 　　Samsung’s big increase in sales has been driven by an amazing rise in DRAM and NAND flash average selling prices (Figure 2).  IC Insights expects that the tremendous gains in DRAM and NAND flash pricing experienced through 2016 and into the first quarter of 2017 will begin to cool in the second half of the year, but there remains solid upside potential to IC Insights’ current forecast of 39% growth for the 2017 DRAM market and 25% growth in the NAND flash market. 　　As shown in Figure 3, Intel has been locked in as the world’s top semiconductor manufacturer since 1993 when it introduced its x486 processor and soon thereafter, its revolutionary Pentium processor, which sent sales of personal computers soaring to new heights. 　　Over the past 24 years, some companies have narrowed the sales gap between themselves and Intel, but never have they surpassed the MPU giant.  If memory prices don’t tank in the second half of this year, it’s quite possible that Samsung could displace Intel in full-year semiconductor sales results as well.  Presently, both companies are headed for about $60.0 billion in 2017 semiconductor sales.
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Release time：2017-05-15 00:00 reading：1014 Continue reading>>
<span style='color:red'>Samsung</span> Could Pass Intel in Chip Sales
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Samsung Could Pass Intel in Chip Sales

　　Thanks to surging memory chip prices, South Korea's Samsung Electronics Co. Ltd. could knock Intel Corp. from its familiar perch atop the chip vendor sales leaders as soon as this quarter, according to market research firm IC Insights Inc.　　Samsung, the industry leader in memory chip sales, is benefiting from a precipitous rise in average selling prices (ASPs) for DRAM and NAND flash. According to IC Insights, DRAM ASPs in the first quarter of this year were 45 percent greater than in the first quarter of 2016, while NAND ASPs increased 40 percent over the same period.　　If Intel's second quarter sales come in around the midpoint of the company's guidance, about $14.4 billion, Samsung could unseat Intel in the second quarter with a modest yet typical increase of 7.5 percent in chip sales from $13.9 billion in the first quarter, IC Insights noted.　　Intel has been No. 1 in semiconductor sales since 1993. If memory prices hold firm through 2017, Samsung could also displace Intel as the chip sales leader for the full year, IC Insights said. Both companies are currently on pace to sell about $60 billion in semiconductors this year, the firm said.　　"With the memory market still cyclical, this could indeed be a one year event," said Bill McClean, IC Insights president, in an email exchange with EE Times.　　IC Insights (Scottsdale, Ariz.) predicts that memory chip prices will begin to cool in the second half of 2017. However, the firm is still projecting that the DRAM market will grow 39 percent this year and the NAND market will grow 25 percent. IC Insights also believes that the memory chip market may grow even faster than the firm has projected.　　But McClean noted that memory chip vendors are dramatically increasing their capital expenditures this year to add capacity in light of the memory boom, a situation that can quickly lead to overcapacity and a rapid deflation of ASPs. Samsung spent $4.3 billion on semiconductor capex in the first quarter alone and is likely to spend more than $15 billion for the full year, a 30 percent increase over 2016. Meanwhile, rival SK Hynix plans to increase its capex by 16 percent this year, McClean said.　　"When they catch up in capacity, memory prices could retreat quite quickly," McClean said.
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Release time：2017-05-01 00:00 reading：1085 Continue reading>>

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