How Cat.1 bis Technology Solves the
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How Cat.1 bis Technology Solves the "Mobility and Endurance" Challenges of Smart Devices

　　The Internet of Things (IoT) is entering its second phase — a shift from "multi-point connectivity" to "intelligent scenarios."　　Traditional smart home devices are moving beyond indoor environments into outdoor spaces that lack stable power and network access. Asset tracking is expanding from localized monitoring to global roaming, while AI-powered wearables are pushing the limits of battery technology as computing demands rise.　　To address these challenges, the global Cat.1 bis standard is emerging as a key enabler. With its streamlined integrated design, ultra-low microamp-level power consumption, and global single-SKU compatibility, Cat.1 bis provides a breakthrough solution for mobility and endurance in next-generation smart devices.　　New Battlefield for IPCs: From "Fixed Sentries" to "Mobile Detectives"　　IPCs (Internet Protocol Cameras) are evolving rapidly from traditional indoor home security systems toward mobile, portable, and multi-scenario applications. Users now demand outdoor devices that can operate in "off-grid, weak-network" environments and portable cameras capable of capturing "brilliant moments" anytime, anywhere.　　However, once IPCs go outdoors, unstable networks and limited battery capacity become major constraints. How can video transmission remain stable during movement? How can a camera stay on standby 24/7 without missing key footage or draining the battery? These challenges set extremely high standards for module size, mobility, and power management.　　To cope with fluctuating networks in mobile scenarios, the new-generation Cat.1 bis technology introduces bandwidth adaptation, which dynamically adjusts bitrate based on real-time signal quality. This significantly improves bandwidth utilization and ensures smooth video streaming even in weak network conditions.　　Meanwhile, to tackle battery anxiety, smart detection and flexible recording technologies are being deployed. A Cat.1 module can stay connected while only triggering recording upon detecting anomalies or critical events. This "microamp standby, millisecond wake-up" mechanism captures every key moment while extending standby time exponentially.　　Asset Tracking: Building a Truly Global Network　　As global supply chains expand, goods increasingly travel across continents. Traditional tracking solutions require different hardware models for each country’s frequency bands — resulting in SKU fragmentation, higher R&D costs, and complex inventory management. Furthermore, to ensure covert installation and long operating time, devices must continuously shrink in size and reduce power consumption to near-physical limits.　　The global Cat.1 bis module solves this through multi-region compatibility, enabling a single device to achieve "one hardware, worldwide connectivity." Enterprises can maintain a single SKU that meets network certification requirements across major global operators. This not only reduces management complexity and cost but also enables seamless roaming for cross-border asset tracking.　　With its compact, integrated hardware design, the next-generation module minimizes PCB footprint to meet the "ultra-compact" demands of locators. Combined with software-level power optimization, standby consumption is reduced to the microamp level — allowing even coin cell–sized devices to deliver long-term asset protection.　　AI Companions and Wearables: The Art of Balancing Performance and Efficiency　　Driven by large AI models, new categories such as AI companion dolls and senior health trackers are booming. These devices embody the “have it all” dilemma — balancing the demanding requirements of AI voice interaction for speed and mobility access, cost efficiency for mass adoption, and large batteries within compact designs to support intensive AI operations. This transformation demands multi-functional connectivity.　　Cat.1 bis perfectly meets the speed requirements for both voice interaction and data transmission, avoiding the overkill and high costs of advanced LTE modules. For AI-driven devices that frequently wake from standby, Cat.1 bis optimizes power consumption and sleep mechanisms at the software level, achieving an efficient balance between connectivity and computational efficiency. Its compact hardware design also makes wearables lighter and more comfortable, enabling truly all-day intelligent companionship.　　Conclusion: The Core Enabler of the Next IoT Evolution　　From mobile IPCs to globally connected trackers and long-lasting AI wearables, every leap in IoT devices pushes the limits of connectivity technology. The new-generation global Cat.1 bis is rising to the challenge with three core capabilities — high compatibility, cost efficiency, and intelligent adaptability (including bandwidth self-adjustment, smart sleep, and single-SKU global support).　　Cat.1 bis not only achieves unprecedented compactness and power efficiency in hardware but also establishes a unified connectivity foundation for Chinese smart manufacturing to expand globally.
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Release time：2026-01-30 15:25 reading：231 Continue reading>>
ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications
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ROHM’s New LDO Regulators with 500mA Output Current Achieving Stable Operation Even with Ultra-small Capacitors to Expand Design Flexibility for High-current Applications

　　ROHM has developed the “BD9xxN5 Series” of LDO regulator ICs with 500mA output current, featuring its proprietary ultra-stable control technology “Nano Cap™”. This series comprises 18 products designed for 12V/24V primary power supply applications used in automotive equipment, industrial equipment, and communication infrastructure.　　In recent years, electronic devices have demanded higher density in smaller form factors at the same time. To meet this demand and achieve space savings and design flexibility, power supply ICs must be capable of stable operation even with small-capacity capacitors. However, achieving such performance with output capacitors of 1µF or less has been technically difficult.　　To address this challenge, ROHM developed the “BD9xxN1 Series” LDO regulator (150mA output current) in 2022, incorporating its proprietary ultra-stable control technology, “Nano Cap™”. This innovation enables stable operation with output capacitors as small as 100nF, earning widespread adoption across numerous applications.　　The newly developed BD9xxN5 Series builds on the success of the BD9xxN1 Series by increasing the output current to 500mA – more than three times higher than before – significantly broadening its suitability for applications requiring higher power. In addition, very low output voltage ripple of approximately 250mV (with load current variation of 1mA to 500mA within 1µs) is achieved with a small output capacitance of just 470nF (typical). Beyond standard small MLCCs (multi-layer ceramic capacitors) in the range of several µF and large-capacity electrolytic capacitors, it also supports ultra-small MLCCs, such as the 0603M size (0.6mm × 0.3mm), with capacities below 1µF – where stability was previously difficult to achieve. This contributes to space saving as well as greater flexibility in component selection.　　Furthermore, high-precision SPICE models, “ROHM Real Model” are provided for accurate simulation and can be downloaded from the ROHM official website.　　SPICE Models: BD900N5xxx-C BD933N5xxxx-C BD950N5xxxx-C　　ROHM will continue to contribute to the high performance, miniaturization, and high reliability of electronic devices by further expanding its Nano Cap™ technology-equipped LDO series.　　Application Examples　　Automotive Equipment　　● Powertrain system power supplies for fuel injection systems (FI) and tire pressure monitoring systems (TPMS)● Body system power supplies for body control modules (BCM)● Infotainment system power supplies for clusters ad head-up displays (HUD), etc.Industrial Equipment　　● Power supplies for controllers like Programmable Logic Controllers (PLC), Remote Terminal Units (RTU), and industrial gateways● High-precision LDOs for analog loads and sensors measuring temperature, pressure, flow rate, etc.● Power supplies for monitoring and control panels in disaster prevention systems, access control systems and building automation.● Standby power supplies for Human-Machine Interfaces (HMI) and panel equipment, etc.Consumer Electronics　　● Power supplies for control boards in refrigerators, dishwashers, air conditioners, etc.● Power supplies for home appliances like thermostats and doorbells● Power supplies for constant power applications in home security and network equipment, etc.　　What is Nano Cap™ Technology?　　Nano Cap™ refers to ultra-stable control technology achieved by combining advanced analog expertise covering circuit design, processes, and layout utilizing ROHM’s vertically integrated production system. Stable control eliminates the problem of unstable operation related to capacitors in analog circuits, contributing to a reduction in design resources for a wide range of applications in automotive, industrial equipment, consumer, and other fields.　　Terminology　　Primary　　In a power supply circuit, the side in charge of 1st stage conversion from a power source such as a battery is called the primary and the side responsible for 2nd stage conversion is referred to as the secondary.　　LDO Regulator (Low Drop Out Regulator / Low Saturation Regulator)　　A type of power supply IC that converts between two different DC voltage levels. Falls under the category of linear regulator (where the input/output voltages operate linearly) characterized by a small input-output voltage difference. Compared to DC-DC converter ICs (switching regulators), LDOs feature a simpler circuit configuration and lower noise.　　ROHM Real Model　　A high-accuracy simulation model that make it possible to also achieve a perfect match between the actual IC and simulation values utilizing ROHM’s proprietary model-based technology.
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Release time：2026-01-27 13:47 reading：286 Continue reading>>
SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity
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SIMCom丨SIM8260 series Achieves Global Certifications, Delivering High-Performance 5G Connectivity

　　SIMCom, a global leader in IoT communication and solutions, proudly announces that its SIM8260 Series 5G modules have successfully obtained a wide range of international certifications, including CE, RCM, FCC, IC, JATE, TELEC, GCF, PTCRB, T-Mobile, Verizon, Deutsche Telekom, Orange, RoHS, REACH. These certifications demonstrate the SIM8230 series’ compliance with global standards and network requirements, ensuring smooth deployment across worldwide markets.　　Built on the Qualcomm® Snapdragon™ X62 chipset platform, the SIM8260 series are a multi-band 5G Release 16 module supporting NR, LTE-FDD, LTE-TDD, and HSPA+ in both NSA and SA modes. With its advanced capabilities, the SIM8260 series enable fast, stable, and secure mobile broadband connections for a wide range of industrial and commercial applications.　　The SIM8260 series achieve outstanding data rates across multiple network environments. On 5G Sub-6G SA, it supports download speeds of up to 2.4Gbps and upload speeds of up to 1Gbps, while in 5G Sub-6G NSA mode it can reach 3.4Gbps (DL) and 600Mbps (UL). For LTE networks, peak speeds of 1.6Gbps downlink and 200Mbps uplink are supported, and on HSPA+, the module achieves 42Mbps (DL) and 5.76Mbps (UL). These capabilities ensure stable, high-capacity communication to meet the demands of data-intensive IoT and enterprise applications.　　Beyond performance, the SIM8260 series offer robust expansion capabilities with a wide range of interfaces including PCIe, USB 3.1, and GPIO, enabling flexible integration into customer solutions, reduce development costs, and accelerate time-to-market.　　With its combination of high throughput, flexible integration, and proven security, the SIM8260 series are ideally suited for use cases such as smart manufacturing, connected vehicles, customer premises equipment (CPE), robotics, and other next-generation IoT solutions.　　The achievement of comprehensive global certifications underscores the SIM8260 series’ in large-scale international deployment. These approvals not only confirm compliance with stringent regulatory, safety, and environmental standards, but also guarantee broad operator interoperability across regions. For customers, this means accelerated product launches, reduced deployment risks, and greater confidence in global scalability.
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Release time：2026-01-23 16:51 reading：393 Continue reading>>
GigaDevice Successfully Lists in Hong Kong, Marking a New Phase of Global Expansion
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GigaDevice Successfully Lists in Hong Kong, Marking a New Phase of Global Expansion

　　GigaDevice Semiconductor Inc. (stock codes: 3986.HK; 603986.SH) was officially listed on the Main Board of the Hong Kong Stock Exchange on January 13, 2026, marking a major milestone with its dual listing in Shanghai and Hong Kong. This achievement represents a significant step forward in strengthening the company's capital base and supporting its long-term global growth strategy.　　The Hong Kong listing comes at a pivotal stage of GigaDevice’s development, as the company continues to expand its business scale and accelerate its presence in global markets. Leveraging Hong Kong’s role as an international financial hub, GigaDevice will further enhance its global capital support capabilities, strengthen connections with international customers and partners, and elevate its global brand profile.　　Founded in 2005, GigaDevice is a global leading fabless supplier dedicated to integrated circuit design. The company has built a diversified product portfolio spanning Flash memory, specialty DRAM, MCUs, analog ICs, and sensor chips. Its products are widely applied across consumer electronics, automotive electronics, industrial control, energy storage, the Internet of Things (IoT), PCs and servers, and communications markets. GigaDevice is among the few Chinese semiconductor companies to achieve global competitiveness across multiple core storage and control chip segments.The successful listing in Hong Kong underscores GigaDevice’s commitment to making international development a strategic priority. Beyond being a major corporate milestone, this listing establishes a new platform to support the company’s global operations and growth. Looking ahead, GigaDevice will continue to expand its diversified semiconductor portfolio globally, focus on long-term growth opportunities in areas such as artificial intelligence, IoT, and intelligent vehicles, and strengthen its long-term competitiveness through technology innovation, ecosystem partnerships, and brand building.
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Release time：2026-01-22 11:22 reading：1282 Continue reading>>
GigaDevice Partners With Melchioni Electronics to Expand Business in France, Italy and the Iberian Peninsula
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GigaDevice Partners With Melchioni Electronics to Expand Business in France, Italy and the Iberian Peninsula

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has entered into a distribution agreement with Milan-based Melchioni Electronics.　　The partnership extends GigaDevice's reach into several major European markets, with Melchioni Electronics supplying not only GigaDevice's leading Flash and MCU lines but also delivering dedicated field application engineering support. The deal covers distribution in France, Italy, Spain and Portugal, with on-the-ground presence in each of these countries.　　GigaDevice delivers world-class SPI NOR Flash, SLC NAND Flash, 32-bit microcontrollers, analog, and sensor products. These technologies play a pivotal role across applications including industrial automation, automotive, consumer electronics, IoT, network communications, mobile, and PCs.　　"The establishment of this partnership and the accelerated entry into the European markets are significant steps in our strategy," said Dr. Reiner Jumpertz, GigaDevice VP and General Manager in the EMEA region. "Melchioni has an exceptional reputation and is well-known for its deep engineering expertise. Their regional FAE and marketing teams perfectly support our successful growth plans in Europe.”　　“This strategic agreement with GigaDevice delivers substantial value to our customer base,” stated Elisabetta Dell’Olio, Head of Technology & Suppliers Platform at Melchioni Electronics. “Our core mission is to empower enterprises with the most effective and cutting-edge technologies. By adding GigaDevice’s world-class Flash memory solutions and GD32 microcontrollers (MCUs) to our services, we are significantly elevating our offering across the automotive, industrial automation, and consumer electronics sectors.”　　About Melchioni Electronics　　Melchioni Electronics is a prominent company specializing in the distribution and integration of high-quality electronic solutions. With a strong reputation in the industry, Melchioni Electronics serves a diverse range of industrial sectors. The company is known for its expertise in providing electronic components and its ability to tailor customized solutions to meet the unique needs of its clients. Melchioni Electronics is committed to innovation and excellence, continually pushing the boundaries of technology to deliver cutting-edge electronic solutions to its customers. With a focus on quality, reliability, and customer satisfaction, Melchioni Electronics is a trusted partner for businesses seeking advanced electronic solutions and integration services.　　About GigaDevice　　GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.
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Release time：2026-01-20 15:00 reading：1234 Continue reading>>
GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland
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GigaDevice Achieves ISO/SAE 21434 Certification and ASPICE CL2 Assessment, Strengthening Automotive Cybersecurity Together with TÜV Rheinland

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has been awarded the ISO/SAE 21434 Road Vehicles Cybersecurity Engineering certification by TÜV Rheinland. In parallel, the MCAL (Microcontroller Abstraction Layer) software of GD32A7 automotive-grade MCUs successfully passed the ASPICE Capability Level 2 (CL2) assessment. These milestones demonstrate GigaDevice’s alignment with internationally recognized practices in automotive cybersecurity and software project management, reinforcing its competitiveness in the global automotive electronics market.　　ISO/SAE 21434, jointly issued by ISO and SAE, defines a comprehensive cybersecurity risk-management framework that spans the entire vehicle lifecycle. As vehicles become increasingly connected and intelligent, cybersecurity has emerged as a foundational requirement for protecting user privacy and ensuring a secure, reliable mobility experience. Achieving this certification confirms that GigaDevice has established an end-to-end cybersecurity governance framework across the design, development, and mass-production phases of its automotive product portfolio—helping customers streamline compliance, accelerate program approvals, and enhance market competitiveness.　　The ASPICE assessment model, governed by the German Association of the Automotive Industry (VDA), is one of the industry's most important standards for evaluating software development capability. ASPICE CL2 requires companies to adopt structured processes for project planning, monitoring, and traceability. Developed in full compliance with AUTOSAR, the GD32A7 MCAL software supports major compilers and debugging toolchains while meeting both functional-safety and cybersecurity requirements. Passing ASPICE CL2 affirms the maturity of GigaDevice’s software-development lifecycle and underscores its commitment to high-reliability automotive solutions.　　Driven by new infrastructure such as 5G, AI, and the IoT, vehicles are evolving into interactive intelligent terminals. Automotive-grade chips play a central role in this transition, enabling continuous advancements in vehicle intelligence. Designed for next-generation automotive platforms, the GD32A7 series leverages the Arm® Cortex®-M7 core and offers multiple configurations, including single-core, multi-core, and lockstep architectures. With a maximum frequency of 320MHz and up to 1300 DMIPS of compute performance, the devices support 2.97V–5.5V operation and deliver stable performance across a –40°C to +125°C temperature range. The series are well suited for applications such as body electronics, intelligent cockpit systems, chassis control, and powertrain subsystems.　　The GD32A71x/GD32A72x families comply with ISO 26262 ASIL B, while the GD32A74x series supports ASIL D requirements. All product lines integrate a Hardware Security Module (HSM) with TRNG, AES, HASH, ECC/RSA, and Chinese SM2/SM3/SM4 cryptographic engines, meeting the Evita Full information-security architecture and providing robust data protection for in-vehicle systems.　　Wenxiong Li, Vice President of GigaDevice and General Manager of the Automotive BU, stated: “Achieving ISO/SAE 21434 certification and ASPICE CL2 capability assessment marks an important milestone in elevating our automotive-grade MCU development to higher standards of security and process maturity. GigaDevice will continue to expand the GD32 MCU automotive portfolio and deepen our collaboration with TÜV Rheinland to deliver higher-performance, higher-security products and a more complete ecosystem for our customers.”　　Bin Zhao, General Manager of Industrial Services and Cybersecurity at TÜV Rheinland Greater China commented: “GigaDevice has demonstrated exceptional execution and technical competence in establishing automotive cybersecurity systems and software development processes. Obtaining ISO/SAE 21434 certification and ASPICE CL2 capability assessment provides strong validation for its entry into global automotive supply chains. We look forward to further collaboration to advance innovation and deployment in automotive electronics safety.”　　GigaDevice and TÜV Rheinland also announced the establishment of a strategic partnership focused on functional safety, cybersecurity, personnel training, and certification services. The collaboration aims to integrate both parties' strengths to enhance competitiveness across automotive, industrial, and emerging markets—delivering safer and more reliable products and solutions to customers worldwide.
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Release time：2025-12-26 16:25 reading：956 Continue reading>>
Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization
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Murata Launches World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate, Achieving Dk below 2.0, Contributing to 6G Realization

　　Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC, and has already begun mass production*. Murata’s proprietary design incorporates an Inner Cavity within the substrate to achieve a dielectric constant (Dk) below 2.0, dramatically reducing transmission loss.Cross-Section Image　　With 6G expected to leverage the FR3 (Frequency Range 3) band—roughly 7–24 GHz—substrates with minimal transmission loss are essential to enable high-speed, high-capacity communications at high frequencies. At the same time, demand is growing for thin, space-saving flexible substrates that support free-form mechanical design to meet the ongoing miniaturization of smartphones and communication equipment. Murata has provided LCP flexible substrates with excellent high-frequency characteristics, featuring a proprietary high-performance resin that eliminates spring-back and an adhesive-free, one-shot press multilayer lamination process; building on this expertise for 6G readiness, Murata has developed and launched ULTICIRC. Conventional flexible substrates faced the challenge that making them thinner resulted in increased transmission loss, but this product incorporates an Inner Cavity structure within the substrate, achieving a dielectric constant (Dk) below 2.0, which is significantly lower than Murata's conventional products, enabling both thin profiles and ultra-low transmission loss simultaneously.　　Furthermore, thanks to an adhesive-free proprietary manufacturing method and the excellent barrier properties of LCP, the Inner Cavity structure maintains high moisture resistance.　　For inquiries regarding this product, please contact us.
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Release time：2025-12-18 16:00 reading：523 Continue reading>>
GigaDevice Launches GD25NX Series xSPI NOR Flash with Dual-Voltage Design Optimized for high-speed, low-power 1.2 V SoC applications
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GigaDevice Launches GD25NX Series xSPI NOR Flash with Dual-Voltage Design Optimized for high-speed, low-power 1.2 V SoC applications

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced the launch of its new generation of high-performance dual-voltage xSPI NOR Flash products – the GD25NX series. Featuring a 1.8 V core and 1.2 V I/O design, the GD25NX series connects directly to 1.2 V system on chips (SoCs) without an external booster circuit, significantly reducing system power consumption and BOM cost.　　Building on the success of the 1.2 V I/O GD25NF and GD25NE series, the new GD25NX further extends GigaDevice's expertise in dual-voltage Flash design. With high-speed data transfer performance and outstanding reliability, the GD25NX series is ideal for demanding applications such as wearables, data centers, edge AI, and automotive electronics that require exceptional stability, responsiveness, and power efficiency.　　The GD25NX xSPI NOR Flash supports an octal SPI interface with a maximum clock frequency of 200 MHz in both single transfer rate (STR) and double transfer rate (DTR) modes, delivering data throughput of up to 400 MB/s. It achieves a typical page program time of 0.12 ms and a sector erase time of 27 ms, offering 30% faster programming speed and 10% shorter erase time compared with conventional 1.8 V octal Flash products.　　To safeguard data reliability, the GD25NX series integrates error correction code (ECC) algorithms and cyclic redundancy check (CRC) verification to enhance data integrity and extend product lifespan. In addition, the series supports a data strobe (DQS) functionality to ensure signal integrity in high-speed system designs, meeting the stringent data transfer stability requirements of SoCs use on data center and automotive applications.　　Built on an innovative 1.2 V I/O architecture, the GD25NX series delivers outstanding performance while maintaining exceptional power efficiency. At a frequency of 200 MHz, the device achieves read currents as low as 16 mA in Octal I/O STR mode and 24 mA in Octal I/O DTR mode. Compared with the conventional 1.8 V Octal I/O SPI NOR Flash devices, the 1.2 V I/O design reduces read power consumption by up to 50%, significantly improving system energy efficiency while sustaining high-speed operation—an ideal choice for power-sensitive applications.　　"The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash," stated by Ruwei Su, GigaDevice Vice President and General Manager of Flash BU. "Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers. Moving forward, GigaDevice will continue to expand its dual-voltage portfolio with broader density and package options to help customers build the next generation of efficient and reliable low-power storage solutions."　　The GD25NX series is available in 64 Mb and 128 Mb densities, meeting diverse storage needs across various applications. These devices are supported on TFBGA24 8×6 mm (5×5 ball array) and WLCSP (4×6 ball array) packages. Samples of the 128 Mb GD25NX128J are now available for customer evaluation, while the 64 Mb GD25NX64J samples are currently being prepared. For detailed technical information or pricing inquiries, please contact your local authorized GigaDevice sales representative.
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Release time：2025-12-15 15:57 reading：1142 Continue reading>>
ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability
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ROHM launches SiC MOSFETs in TOLL package that achieves both miniaturization and high-power capability

　　ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional packages (TO-263-7L) with equivalent voltage ratings and on-resistance, these new packages offer approximately 39% improved thermal performance. This enables high-power handling despite their compact size and low profile. It is ideal for industrial equipment such as server power supplies and ESS (Energy Storage Systems) where the power density is increasing, and low-profile components are required to enable miniaturized product design.　　In applications like AI servers and compact PV inverters, the trend toward higher power ratings is occurring simultaneously with the contradictory demand for miniaturization, requiring power MOSFETs to achieve higher power density. Particularly in totem pole PFC circuits for slim power supplies, often called “the pizza box type,” stringent requirements demand thicknesses of 4mm or less for discrete semiconductors.　　ROHM's new product addresses these needs by reducing component footprint by approximately 26% and achieving a low profile of 2.3mm thickness – roughly half that of conventional packaged products. Furthermore, while most standard TOLL package products are limited by a drain-source rated voltage of 650V, ROHM's new products support up to 750V. This allows for lower gate resistance and increased safety margin for surge voltages, contributing to reduced switching losses.　　The lineup consists of six models with on-resistance ranging from 13mΩ to 65mΩ, with mass production started in September 2025 (sample price: $37.0/unit, tax excluded). 　　Product Lineup　　Application Examples　　・Industrial equipment: Power supplies for AI servers and data centers, PV inverters, ESS (energy storage systems)　　・Consumer equipment: General power supplies　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.• EcoSiC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Totem Pole PFC Circuit　　A highly efficient power factor correction circuit configuration that reduces diode losses by using MOSFETs as rectifier elements. The adoption of SiC MOSFETs enables high voltage withstand capability, high efficiency, and high-temperature operation for the power supply.
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Release time：2025-12-04 17:10 reading：1060 Continue reading>>
Murata develops integrated passive device for Semtech’s SX126X family
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Murata develops integrated passive device for Semtech’s SX126X family

　　Murata Manufacturing Co., Ltd. has developed a new integrated passive device (IPD) for use with the Semtech LoRa Connect™ SX126x family, which includes the SX1261, SX1262, and LLCC68 products. Using a proprietary low-temperature co-fired ceramic (LTCC) process, Murata has successfully replaced a series of discrete matching components of the SX1261/2 reference design with a single 2.00mm x 1.25mm size LTCC component.　　The IPD enables SX1261/2 radio designers to optimize for both size and performance using two dedicated parts. The LFB21892MDZ7F957 is optimized for US and European ISM bands, delivering the full output power for the US FCC bands. The LFB21892MDZ7F821 is optimized for Eurocentric designs that need to maximize the efficiency performance.　　“The Murata IPD offers the most efficient development path to realizing the full performance of the SX1261/2, featuring a miniaturized form factor that can significantly reduce board space,” says Arthur Kiang, Product Manager, RF Components, Murata. “The reduction in the number of matching components enables lower material costs and simplifies the design process, leading to shorter lead times. This integration also lowers the probability of soldering and manufacturing issues, as there is only one component to monitor in production.”　　“Semtech’s LoRa Connect™ SX126x family has become the trusted choice for LoRaWAN® networks and long-range IoT connectivity in applications from smart metering to industrial sensing,” says Carlo Tinella, product marketing director of wireless and sensing products at Semtech. “Murata’s IPD solution demonstrates the strength of our LoRa® ecosystem, helping radio engineers accelerate development while optimizing for both miniaturization and regulatory compliance. This partnership streamlines the path from design to deployment for millions of IoT devices being deployed globally.”　　Product samples are currently available, with mass production of the IPD commencing shortly.
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Release time：2025-11-28 17:33 reading：524 Continue reading>>

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