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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G <span style='color:red'>Module</span> FG370-KR at AIoT Korea 2024

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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.

Key word：

Fibocom

Release time：2024-12-13 10:55 reading：361 Continue reading>>

NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control <span style='color:red'>Module</span>s and Zone Control Units

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NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control Modules and Zone Control Units

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).　　At time of launch, the NSE34 and NSE35 families includes 26 single-, dual- and quad-channel devices developed for operation across 11 separate load currents intervals (11 A to sub-2 A). These devices have an Rds(on) resistance range from 8 mΩ to 140 mΩ and feature industry-leading load-driving capabilities and advanced diagnostic and protection functions such as advanced over-current protection and over-voltage clamping protection.　　All devices in the two families are fully compliant with multiple automotive standards, including AEC-Q100, AEC-Q100-006, AEC-Q100-012 Grade A, ISO7637, ISO16570 and CISPR25-2021 Class 5.　　Yang WANG, Product Line Marketing Director of NOVOSENSE said: “For electric and autonomous vehicles, body domain controllers have become increasingly important, enabling smart power distribution and functional integration. Indeed, they are essential for many applications, whether in resistive loads such as a seat heater, capacitive or halogen lamp loads for surge-current handling, or inductive loads such as in wipers, solenoids and relays, where it protects against negative voltage spikes.”　　The NSE34 and NSE35 families of high-side switches are available in 14- and 16-pin HSSOP packages measuring 4.9mm x 3.9mm respectively.

Key word：

NOVOSENSE

Release time：2024-11-06 14:11 reading：622 Continue reading>>

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Murata’s Type 1SC-NTN module achieves Skylo U.S. certification for cellular and non-terrestrial network connectivity

　　Murata announced today that its Type 1SC-NTN has received Skylo U.S. certification for its dual-mode cellular and non-terrestrial network (NTN) capabilities, making it the first ultra-compact resin mold module to achieve this recognition from an NTN service provider. The product seamlessly integrates the latest Rel-17 NTN standard, enabling satellite data communication capabilities without necessitating any hardware design changes. When paired with Skylo's NTN service, it extends the reach of satellite connectivity, ensures uninterrupted communication, and delivers a new class of solution for the demanding satellite IoT market.　　Murata’s Type 1SC is the world’s smallest form factor LTE Cat M/NB-IoT module with both global regulatory and NTN certification. It supports GPS/GNSS, OpenMCU, and Integrated SIM to support the applications that are defining today’s market, such as dual-mode cellular IoT. In addition to its unmatched size, low power, and cost-efficiency, its high level of integration accelerates time to market while lowering development and deployment costs for customers. Target uses include wearable, tracking, and medical monitoring devices, as well as M2M communication, smart meters, and other size-limited IoT edge products.

Key word：

Murata

Release time：2024-10-15 13:19 reading：372 Continue reading>>

Renesas Launches Ultra-Compact Sensor <span style='color:red'>Module</span> for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

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Renesas Launches Ultra-Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced an advanced all-in-one sensor module designed for indoor air quality monitoring. The RRH62000, the first multi-sensor air quality module from Renesas, integrates multiple sensor parameters in a compact design and accurately detects different particle sizes, volatile organic compounds, and gasses harmful to human health. With a Renesas microcontroller (MCU) on board, the module offers an intelligent sensor management solution for a growing market of air monitoring applications, including air purifiers, smoke detectors, HVAC systems, weather stations, and smart home systems. Its robust firmware also enables customer products to comply with various air quality standards around the world.　　The RRH62000 features one of the smallest footprints in its class of sensor modules, measuring only 46.6 x 34.8 x 12 mm. It packs Renesas’ RA Family MCU and seven sensor signals: the laser-based PM1/ 2.5/ 10 sensor, ZMOD4410 gas sensor, and the HS4003 humidity and temperature sensor. Together, these sensors can detect particulate matter, total volatile organic compounds (TVOC), estimated CO2, temperature, and humidity all in one system. All key components have been pre-integrated and fully calibrated at the factory, allowing developers to start their sensor system designs right out of the box.　　"Our RRH62000 module represents the next step in sensor fusion technology, which combines data from multiple sensors and turns it into comprehensive and actionable insights for environmental monitoring," said Uwe Guenther, Sr. Director, Modules and Solutions Product Line at Renesas. "We are dedicated to providing integrated sensing solutions that simplify development for customers and will continue to drive innovation in sustainable products that reduce environmental impact and enhance safety and comfort in our lives."　　Public interest in air quality and its effects on health has increased significantly since the COVID-19 pandemic. People are now more aware of how air pollutants can affect respiratory health and overall well-being. Less known is that pollutants are typically six to ten times more concentrated indoors than outdoors. These include dust, paint fumes, smoke from cooking, pollen, and particulates from HVAC filters, which can enter the respiratory system and cause lung damage, cancer, and other health problems.　　In order to meet these new challenges, Renesas’ new sensor module is equipped to monitor a broad range of air quality conditions. Using laser-based technology, which offers higher precision compared to conventional LED methods, it can monitor concentrations of PM1, PM2.5, and PM10 particulates -- particles with diameters of 0.3- to 10µm -- as well as absolute or relative TVOC measurements in different power mode settings, providing the highest level of accuracy for these pollutants. The RRH62000 delivers seven sensor outputs simultaneously, and its onboard MCU allows the system to detect surrounding air quality data in real time.　　The RRH62000 combo module comes with building standard firmware plus artificial intelligence (AI) algorithms, which lets engineers configure the sensors to conform to the requirements of various green air quality standards in public buildings, such as The Well Building Standard (WELL), Home Ventilating Institute (HVI) and RESET. With these features, for example, a school in China can use the same hardware as one in the U.S. or another location and simply update the AI-enabled firmware for its needs.　　Intelligent sensor devices, such as the Renesas RRH62000 and recently announced RRH46410 gas sensor module, can support demand-controlled ventilation, allowing HVAC systems to adjust airflow based on carbon dioxide levels and occupancy information to maintain optimal air quality and energy efficiency. Similarly, these modules use AI algorithms to predict when HVAC filters must be replaced or detect an anomaly before system failure occurs, significantly saving cost and time for system maintenance.　　Key Features of the RRH62000 All-in-One Sensor Module　　Up to 7 simultaneous sensor outputs　　Laser-based technology for accurate detection of PM1, PM2.5, PM10　　Metal oxide-based gas sensor　　Precise temperature and humidity sensor　　Absolute measurement of TVOC　　Estimated CO2 for low-cost CO2 room indication　　Ultra-compact size: 46.6 x 34.8 x 12mm to fit in many applications　　On-board MCU for smart sensor management　　Robust & Siloxane resistant　　Support I²C and UART communication　　Winning Combinations　　Renesas has combined the RRH62000 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. This includes the In-home Air Quality Monitoring System and Air Quality Monitor (PM2.5) with Secure Cloud Connection, which combine the RRH62000 with the RA6M3 and RL78/G14 MCUs, and various power devices to enable cost-efficient, compact, modular solutions for modern appliances. These Winning Combinations are technically vetted system architectures designed from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RRH62000 is available today along with the RRH62000-EVK evaluation kit. The RRH46410 and the RRH46410-EVK are also available. Please contact your local sales teams for more details. A blog about the new air quality sensor module is also available on the Renesas website.

Key word：

Renesas

Release time：2024-08-26 14:10 reading：817 Continue reading>>

Power <span style='color:red'>Module</span> : Working Principle, Structural Features, and Process

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Power Module : Working Principle, Structural Features, and Process

　　A power module is an electronic device used to convert one form of electrical energy into another for supply to specific electronic systems or devices. It typically comprises an input terminal for receiving the raw power source (such as AC or DC) and one or more output terminals for providing converted and regulated electrical energy. This article summarizes the working principle, structural features, process flow, selection parameters, and design considerations of power modules.　　Working Principle of Power ModuleThe working principle of a power module is based on power electronics technology and control circuitry. Its core consists of switching power devices and control circuits. The following are detailed operational steps of power module operation:　　1. Input Voltage Conversion　　The power module first receives input voltage from the power line, typically AC.　　Next, through rectification circuitry using diodes or bridge rectifiers, AC is converted into pulsating DC.　　Subsequently, filtering circuits utilize capacitors to remove the pulsation, resulting in stable DC.　　2. Output Voltage Regulation　　The converted DC enters a voltage regulation circuit for voltage regulation.　　The voltage regulation circuit operates using feedback control. Specifically, it compares the difference between the output voltage and a reference voltage and controls the regulator’s operation based on this difference.　　Through this regulation, the output voltage is maintained at the set stable value.　　3. Role of Switching Power Devices　　During the power conversion process of the power module, switching power devices (such as MOSFETs, BJTs, IGBTs, etc.) play a crucial role.　　When the switching device is conducting, the power module can convert input energy into output energy. The primary function of the switching device is to achieve intermittent energy conversion to provide the required stable voltage or current.　　When the switching device receives an input or control signal, it generates corresponding switch signals to control its state.　　4. Role of Control Circuits　　Control circuits are another important component of the power module responsible for precise regulation and stabilization.　　Feedback circuits monitor changes in output voltage or current and send feedback signals to comparators. This allows the power module to adjust output energy promptly based on the feedback signal to meet various circuit requirements.　　5. Protection Mechanisms　　Power modules typically feature various protection mechanisms such as overload protection, overvoltage protection, and short circuit protection.　　Overload protection monitors the output current and limits or cuts off the output when the current exceeds a set value.　　Overvoltage protection monitors the output voltage and automatically cuts off the output power when the voltage exceeds a set value.　　Short circuit protection similarly operates by monitoring the output current. When a short circuit is detected, it promptly cuts off the power to prevent damage.　　Structural Features of Power ModuleThe structural features of power modules are summarized as follows:　　1. Modular Design　　Power modules typically employ modular design, making the entire power system more compact and efficient. Each module has independent functionality, allowing for flexible combinations and extensions based on actual needs. This facilitates users in customizing power solutions according to specific application scenarios.　　2. High Integration　　Power modules integrate numerous electronic components and circuits internally, such as transformers, rectifiers, and filters. The optimized design of these components and circuits endows the power module with high efficiency and stability.　　3. High Reliability　　Power modules undergo rigorous production processes and quality control, resulting in high reliability. Additionally, internal redundancy design and protection circuits effectively prevent damage to the system due to abnormal conditions such as power fluctuations, overcurrent, and overvoltage.　　4. Ease of Maintenance　　Due to the modular design of power modules, when a fault occurs, users can conveniently replace the faulty module, thereby reducing maintenance costs and time. Furthermore, the modular structure facilitates upgrades and modifications to the power system.　　Process Flow of Power ModuleThe production process of power modules involves multiple steps, from material preparation to final testing and quality inspection, with each step being crucial. Below is a simplified description of the operation process of power module production:　　1. Material Preparation and Bill of Materials (BOM) Verification　　Based on the design drawings of the power module and the BOM (Bill of Materials) list, prepare the required components, PCB boards, connecting wires, insulation materials, etc.　　Check the quantity, model, and specifications of the materials to ensure accuracy.　　2. PCB Board Processing and Component Soldering　　Clean and dry the PCB board to remove surface stains and moisture.　　According to the design drawings, solder the components onto the PCB board. Pay attention to soldering temperature and time control to avoid solder joints or poor soldering.　　3. Power Circuit Connection and Insulation Processing　　Based on the circuit diagram of the power module, connect the power input and output lines.　　Insulate exposed wires and connection points to ensure safety.　　4. Functional Testing and Performance Debugging　　Conduct functional testing on the power module to check if input and output voltage and current are normal.　　Based on the test results, perform performance debugging to optimize the efficiency of the power module.　　5. Overall Assembly and Enclosure Installation　　Assemble the soldered PCB board, connecting wires, and other components into a complete power module.　　Install the enclosure of the power module to ensure reliable fastening.　　6. Final Testing and Quality Inspection　　Conduct final testing on the assembled power module, including voltage stability, ripple coefficient, load capacity, and other indicators.　　According to quality inspection standards, screen and classify the power modules to ensure product quality.　　7. Packaging and Warehouse Entry　　Package the qualified power modules, indicating model, specifications, quantity, etc.　　Store the packaged power modules in the warehouse, awaiting shipment or subsequent use.　　Selection Parameters of Power ModuleDuring the process of selecting power modules, it is essential to consider a series of key parameters to ensure that the chosen power module can meet specific application requirements. Below is a detailed consideration of these parameters:　　1. Input Voltage Range　　Firstly, it is necessary to determine the input voltage range of the power module, i.e., the range within which it can operate normally. This depends on the power supply situation in the application, such as battery-powered or AC grid-powered. Ensure that the selected module can adapt to the existing input voltage and maintain stability during voltage fluctuations.　　2. Output Voltage and Current　　The output voltage and current of the power module are critical parameters to meet load requirements. Depending on the power consumption and characteristics of the load, choose appropriate output voltage and current levels. Also, consider whether the current output capacity of the power module is sufficient to handle the startup impact of the load and the current requirements during normal operation.　　3. Efficiency and Power Consumption　　Efficiency is the ability of the power module to convert electrical energy, i.e., the ratio of output power to input power. High efficiency means less energy loss and lower heat generation. Additionally, pay attention to the module’s power consumption, especially during standby or light load, to optimize energy use.　　4. Ripple and Noise　　Ripple refers to the AC component in the output voltage, while noise is the interference signal generated by the power module. These parameters are crucial for sensitive applications such as signal processing or measurement equipment. Therefore, when selecting, ensure that the ripple and noise levels of the selected module are below the system’s acceptable threshold.　　5. Temperature Range　　The operating temperature range of the power module is also a factor to consider. In extreme temperature environments, the performance and reliability of the module may be affected. Therefore, choose a module that can operate stably within the temperature range of the application.　　6. Reliability and Lifespan　　The reliability and expected lifespan of the power module are important indicators for assessing its long-term performance. When choosing, consider the module’s MTBF (Mean Time Between Failures) and the manufacturer’s provided warranty period.　　7. Size and Packaging　　The size and packaging of the power module are also factors to consider during the selection process. Ensure that the selected module can fit within the space constraints of the application and is easy to integrate into existing systems.　　8. Certification and Compliance　　The selected power module should comply with relevant safety standards and regulatory requirements, such as UL, CE, etc. This helps ensure the safety and compliance of the power module.　　9. Cost　　Last but equally important is cost consideration. While meeting all performance requirements, strive to choose a cost-effective power module to optimize the overall cost-effectiveness of the system.　　During the design and use of power modules, the following operational issues should be noted:I. Design Phase Considerations1. Clarify Requirements and Specifications　　Before designing the power module, clarify the system’s requirements for power, including voltage, current, power, efficiency, and other specifications.　　Fully consider the working environment of the module, such as temperature, humidity, vibration, and other factors that may affect the performance of the power supply.　　2. Select Appropriate Topology　　Choose the appropriate power supply topology according to the requirements, such as linear power supply, switching power supply, etc., to achieve high efficiency, stability, and reliability.　　3. Optimize Circuit Layout and Wiring　　Reasonably layout circuit components to reduce interference and losses.　　Adopt the principle of wide and short wiring to reduce resistance and inductance, thereby improving power supply efficiency.　　4. Redundancy and Protection Design　　Consider redundancy design for the power module to improve system reliability and stability.　　Design overvoltage, overcurrent, overheating, and other protection measures to prevent module damage or safety accidents.　　5. Electromagnetic Compatibility (EMC) Design　　Consider the electromagnetic compatibility of the power module and use filtering, shielding, and other technologies to reduce interference with other devices.　　II. Considerations During Use1. Proper Installation and Connection　　Follow the manufacturer’s installation guide to ensure the power module is installed correctly and securely fixed.　　Carefully inspect the connections of input and output terminals to ensure good contact, no looseness, or short circuits.　　2. Adjust Parameters Reasonably　　According to actual needs, set the voltage, current, and other parameters of the power module reasonably to avoid overloading or underloading.　　Regularly check parameter settings to ensure consistency with actual requirements.　　3. Monitoring and Maintenance　　Regularly conduct status checks on the power module, including monitoring parameters such as voltage, current, and temperature.　　If any abnormal conditions are detected, take timely measures to address them, such as cleaning dust or replacing damaged components.　　4. Heat Dissipation and Working Environment　　Pay attention to the impact of electromagnetic interference and mechanical vibration in the working environment on the power module and take corresponding measures for protection.　　5. Training and Operational Standards　　Provide training for personnel using the power module to ensure they understand the working principle, operation methods, and safety precautions of the module.　　Establish operational standards to ensure that personnel operate in accordance with the standards, avoiding problems caused by improper operation.

Key word：

Working Principle

Release time：2024-08-22 13:33 reading：387 Continue reading>>

Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless <span style='color:red'>Module</span>s

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Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless Modules

　　Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi® 6 Dual Band 2.4GHz to 5GHz and BLUETOOTH® 5.4® Modules are wireless radio modules with integrated Bluetooth BDR/EDR/Low Energy (LE). These modules are designed for highly integrated and cost-effective applications requiring high data rates and low power consumption. The PAN9019/PAN9019A features integrated power management, a dual-core CPU, 802.11i security standard support, and high-speed data interfaces. The modules provide a combination of Wi-Fi, Bluetooth, and 802.15.4 wireless connectivity, allowing for high throughput applications and enhanced flexibility. Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi 6 Dual Band 2.4GHz to 5GHz and Bluetooth 5.4 Modules are available in an M.2 form factor for use with host processors as an evaluation tool using an M.2 Key E socket.FEATURES　　Dual-band 2.4GHz to 5GHz 802.11a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module　　Supports WPA3 security　　Secured boot and firmware　　802.11e quality of service supported for multimedia application　　IEEE 802.11ax, 1x1 spatial stream with up to 600Mbps data rate　　OFDMA (UL/DL) and MU-MIMO (UL/DL)　　Bluetooth 5.4 (LE and long range)　　WCI-2- and 5-wire PTA coexistence interfaces　　SDIO 3.0, high-speed UART, and SPI2 for host processor connection general interfaces　　OS driver support for RTOS, Linux, and Android　　Available in M.2 form for evaluation with host processor using an M.2 Key E socket　　SPECIFICATIONS　　PAN9019　　NXP IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside　　PAN9019A　　NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside　　15.3mm x 12mm x 2.5mm SMT package size　　-98dBm Rx sensitivity at IEEE 802.11b　　IEEE 802.11ax 20MHz, 40MHz, 80MHz channel bandwidth　　1.8V to 3.3V power supply range　　-40°C to +85°C operating temperature range　　BLOCK DIAGRAM　　PRODUCT OVERVIEW

Key word：

Panasonic

Release time：2024-07-15 14:05 reading：653 Continue reading>>

Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis <span style='color:red'>Module</span> MC610-GL at MWC Shanghai 2024

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Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.

Key word：

Fibocom

Release time：2024-07-03 13:57 reading：485 Continue reading>>

Trade news

Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications

Key word：

Murata

Release time：2024-06-28 11:31 reading：519 Continue reading>>

ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded <span style='color:red'>Module</span>: Significantly Reduces the Size of xEV Inverters

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ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters

　　ROHM has developed four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1x4, two of 1,200V-rated: BSTxxxD12P4A1x1) optimized for xEV (electric vehicles) traction inverters. TRCDRIVE pack™ supports up to 300kW and features high power density and a unique terminal configuration - help solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours.　　As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack™.　　A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack™ reduces size by utilizing a unique structure that maximizes heat dissipation area. On top, ROHM’s 4th Generation SiC MOSFETs with low ON resistance are built in - resulting in an industry-leading power density 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs.　　The modules are also equipped with control signal terminals using press fit pins enabling easy connection by simply pushing the gate driver board from the top, reducing installation time considerably. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.　　Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules. To obtain samples, please contact a sales representative or visit the contact page on ROHM’s website.　　Product LineupTRCDRIVE pack™ is scheduled to be launched by March 2025 with a lineup of 12 models in different package sizes (Small / Large) and mounting patterns (TIM: heat dissipation sheet / Ag sinter). In addition, ROHM is developing a 6-in-1 product with built-in heat sink that is expected to facilitate rapid traction inverter design and model rollout tailored to a variety of design specifications.　　☆: Under Development　　AQG 324 is a qualification standard for automotive power modules established by ECPE (European Center for Power Electronics).　　European automakers are required to comply with this standard when considering adoption.　　Application Examples・ Automotive traction inverters　　Sales InformationAvailability: June 2024 (OEM quantities)　　Pricing: $550/unit (samples, excluding tax)　　Comprehensive Support ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of TRCDRIVE pack™ products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation in similar conditions as practical inverter circuits.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyTraction Inverter　　Traction motors in electric cars are driven by 3-phase AC power with a phase shift of 120°. Traction inverters convert direct current supplied from the battery into 3-phase alternating current.　　2-in-1　　To convert DC into 3-phase AC, one high-side and one low-side MOSFET are required per phase for switching. A 2-in-1 configuration combines both of these MOSFETs into a single module.

Key word：

ROHM

Release time：2024-06-19 14:57 reading：570 Continue reading>>

Nidec to Expand Its Production Capacity for Water-cooling <span style='color:red'>Module</span>s

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Nidec to Expand Its Production Capacity for Water-cooling Modules

　　Nidec Corporation (TSE: 6594; OTC US: NJDCY) (“Nidec” or the “Company”) today announced that it will enhance its CDU (Coolant Distribution Unit) production line in Thailand, the Company’s manufacturing base for water-cooling modules for servers, to increase the factory’s monthly CDU production capacity from 200 to 2,000 units by June 2024.　　Nidec’s water-cooling module　　The CDU production capacity expansion is in response to the adoption by Supermicro, an American AI server manufacturer. The jointly developed with Supermicro 100 to 250 kW products will be manufactured at the Ayutthaya Plant in Thailand, where the existing line has been expanded.　　So far, the fan-based air-cooling method has mainly been employed for computing servers in data centers, research institutes, and other similar facilities. However, in AI, the market expected to grow going forward, semiconductor-based arithmetic units (CPUs and GPUs) that utilize AI to process learning information with big data generate significantly more heat than their predecessors. Thus, as the air-cooling method, which relies on air-conditioning equipment, is insufficient to cool a myriad of servers lined up in a building. This is why the water-cooling system, whose cooling capability is far superior to the air-cooling system’s, is expected to become indispensable in the future.　　As the water-cooling module market is forecast to continue its growth, Nidec intends to expand its monthly CDU production capacity to more than 3,000 units in the future, while expecting the size of related products’ markets to be 10 billion yen in FY2023, and more than 80 billion yen in FY2024.　　Nidec’s cooling systems employ a liquid-to-liquid method, where cooling modules installed in each server supply cooling water via metal pipes to directly cool each server’s computing devices. The systems comprise a CDU (coolant distribution unit), a cooling water distributor; a CDM (coolant distribution manifold), a cooling water piping; and an LCM (liquid cooling module), a water-cooling module.　　The aforementioned product features the redundancy of its pumps, electricity sources, circuit substrates, and other important units, which are all in pairs to improve the system’s reliability. Additionally, those units are replaceable even during maintenance, without stopping its cooling system, to keep the server operating (a hot-swap functionality).　　To contribute to the development of the world’s AI, Nidec stays committed to working as a comprehensive thermal solution manufacturer to provide products that perfectly reflect people’s needs. By offering proposals a step ahead of the competition, and with an enhanced lineup of its high-reliability products, Nidec presses ahead to become a market leader.

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Nidec

Release time：2024-04-22 14:27 reading：1051 Continue reading>>

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