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Apple Testifies in <span style='color:red'>Q’com</span> Patent Case

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Apple Testifies in Q’com Patent Case

Qualcomm and Apple faced off in San Jose District Court Friday in the ongoing dispute over patents. An Apple executive suggested Qualcomm’s royalties were more than $10 per iPhone.Qualcomm refused to supply chips without a patent license and paid Apple “huge” royalty rebates to use its cellular baseband chips exclusively, according to testimony today by Apple’s head of procurement in San Jose district court. Attorneys for Qualcomm noted Apple used Infineon and Intel modems exclusively at different periods and evaluated several alternative suppliers.The case, brought by the U.S. Federal Trade Commission, alleges Qualcomm has used unfair licensing policies to dominate the cellular chip market for years. Witnesses include a laundry list of carriers and chip and handset makers. The trial before Judge Lucy Koh is scheduled to conclude early next month.Tony Blevins, Apple’s vice president of procurement, recalled a "watershed meeting” in late 2013 with now Qualcomm president Cristiano Amon. At the time Apple was trying to reduce the cost of Qualcomm baseband chips it was using by conducting an analysis of manufacturing costs at TSMC where both companies both made chips.Amon “finally leveled with me. He said, ‘I just came back from an investors conference and I am under intense pressure to monitize [our technology] and I will have whatever the market can bear and Apple can afford to pay this — we don’t need to talk about costs and margins.’”Blevins said he canceled the rest of his meetings for the day. “We needed to do something different or we would be in a bad place, [so] we kicked off a new project to find an alternative supplier” called Project Antique, Blevins said.The effort ultimately led to exclusive use today of cellular modems from Intel’s wireless group, which has its heritage in the Infineon group that was the sole supplier for the first two generations of iPhones, a Qualcomm attorney noted.“We made this challenge, so Qualcomm was no longer willing to sell us chips…we want both Qualcomm and Intel in the mix — competition leads to…more diligent technical schedules and innovation,” Blevins said.Qualcomm’s alleged use of a unique practice of linking patent licensing deals to chip sales is at the heart of the case. Blevins said it first came to his attention in a 2005 letter from Qualcomm in response to Apple’s request for baseband samples and specs as part of an evaluation for the original iPhone.“In substitute of samples, we got this letter” asking for a patent license first. “In 20 years in this industry I had never seen a letter like this…Our interpretation was ‘no license, no chips,’” Blevins said.Qualcomm also asked for a cross-license to Apple’s IP. “We were taken aback. We knew we would not cross license our IP back to them, we were [just] going to buy a chip,” he said.About two years ago, NXP asked Apple to sign a patent license in exchange for access to its NFC chips. “I was on vacation...and called [the NXP] CEO that day and said if they want more money put it in the hardware [price] and [we’ll see if] it's competitive. They withdrew their request for a license that day,” he said.Apple and Qualcomm struck five patent and supply agreements from 2007 to 2013. The latest ones included deals to get large rebates of royalties pad in exchange for exclusive use of Qualcomm modems.Qualcomm executives Derek Aberle and Amon both suggested Apple could get a “royalty less than $10 [per handset] only if we brought additional value to the table — if you bring me exclusivity,” Blevins said.Apple considered the reduced royalties to be still higher than those paid by its rivals, but they didn’t “gouge us…They made it very unattractive to choose another supplier…it was no longer a level playing field as it was before,” he added.Due to the exclusivity deal, Blevins cancelled plans in the works to use an Intel data-only cellular modem in an iPad Mini 2. Apple had internally agreed the design win would be a step to working Intel modems into iPhones.In a call to Hermann Eul, then Intel's general manager, “I expressed misgivings. They hadn’t don’t anything [wrong, but] we had an agreement with Qualcomm,” he said.In another meeting, the head of Qualcomm’s licensing group, Eric Reifschneider, asserted his dominance over Amon, who led the chip group, Blevins reported.“Cristiano was speaking directly to me, and Eric cut him off and said, ‘I run a division that makes two-thirds of corporate profits and you make one third, so let’s be clear who does the talking,’ I felt it was inappropriate in front of a customer to make such a statement and unfair to Cristiano,” Blevins said.Qualcomm would not agree to terms of supply agreements Apple considered standard with other suppliers, driving harder deals around patents, Belvins said. “It was uncommon for me to deal with any company’s licensing team, but with Qualcomm it became common,” he added.A Qualcomm attorney noted that in 2007-2009 agreements, Apple agreed to pay Qualcomm royalties although it did not buy its chips then. Apple continues to consider Mediatek and Samsung as alternative baseband suppliers and in the past had considered ST Ericsson and Texas Instruments as well, she noted.The FTC continued its case Friday with testimony from licensing and procurement executives from Samsung and Lenovo’s Motorola group.

Key word：

Apple,Q’com

Release time：2019-01-14 00:00 reading：1117 Continue reading>>

<span style='color:red'>Q’com</span>m Winds Up Smartwatches

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Q’comm Winds Up Smartwatches

Air Products (NYSE : APD ) today announced it has been awarded by Samsung Electronics additional gaseous nitrogen and hydrogen supply to its semiconductor fab in Giheung, South Korea.Air Products, who has been supplying industrial gases to Samsung Electronics’ Giheung site since 1998, will invest in building a new air separation unit, multiple hydrogen plants, and pipelines, which are scheduled to be operational in 2020 to supply the customer’s increased demand.“We are proud to expand our longstanding relationship with Samsung Electronics and have their continued confidence in our ability to support their technological development and growth plans,” said Kyo-Yung Kim, president of Air Products Korea. “Our latest investment once again reinforces Air Products’ commitment to serving our strategic customer, as well as the broader semiconductor and electronics industries, with our safety, reliability, efficiency and excellent service.”Air Products supplies many of Samsung’s operations worldwide, including its semiconductor cluster in the north region of South Korea spanning Giheung, Hwaseong and Pyeongtaek. In Pyeongtaek, the company has been undertaking a multi-phase expansion project to support Samsung Electronics’ multibillion dollar fab.A leading integrated gases supplier, Air Products has been serving the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to most of the world’s largest technology companies. Air Products is working with these industry leaders to develop the next generation of semiconductors and displays for tablets, computers and mobile devices.

Key word：

Q’comm

Release time：2018-09-11 00:00 reading：981 Continue reading>>

Nokia, <span style='color:red'>Q’com</span>m Prep for 5G Trials

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Nokia, Q’comm Prep for 5G Trials

　　SAN JOSE, Calif. — Nokia and Qualcomm completed a lab test of a 5G New Radio connection for 10 carriers that they hope will take their systems into field trials soon. The announcement is the latest step in a marathon toward commercial 5G services stretching this month from the Winter Olympics in South Korea to the Mobile World Congress trade show in Barcelona.　　The duo showed a version of Nokia’s AirScale base station and a prototype Qualcomm handset making 5G NR links over 3.5- and 28-GHz bands at a Nokia lab in Oulu, Finland. The FPGA-based systems will provide the basis for field trials with operators this year including BT/EE, Deutsche Telekom, Elisa, KT, LGU+, NTT DOCOMO, Optus, SKT, Telia, and Vodafone Group. The companies hope that the trials lead to commercial deployments of a variety of 5G services next year in China, Europe, Korea, Japan, and the United States.　　Qualcomm and Nokia’s rival, Ericsson, staged a competing lab demo over the same bands just after the 5G NR spec was completed in December. Their partners included AT&T, NTT Docomo, Orange, SK Telecom, Verizon, and Vodafone. The effort followed a test in late November at a China Mobile lab using a prototype base station from China’s ZTE and a Qualcomm test handset.　　Later this week, South Korea will showcase a pre-standard 5G network at the Winter Olympics in Pyeongchang using gear from Intel and Samsung. Later this month, the MWC event in Spain will be about “5G going commercial — how to get the return on investment and put artificial intelligence into the networks,” said Phil Twist, an engineer-now-head-of-marketing for mobile networks at Nokia, speaking in a pre-MWC press briefing.　　Nokia will show at MWC a version of its 5G ReefShark chipset for base stations. The company designed its AirScale base stations to support a ReefShark module that upgrades them from handling 28 Gbits/second of LTE traffic to 84 Gbits/s of 5G.　　Multiple modules with the 10-nm chipsets can work together to support throughput up to the 6-Tbit/s limit of the AirScale’s backplane. Nokia claims as many as 30 customers for ReefShark, some with deployment plans this year.　　At the handset, vendors are expected to show devices supporting as many as 20 data streams using 4x4 MIMO antennas and up to five 20-MHz carriers. Such techniques will push advanced LTE and 5G beyond today’s gigabit LTE with mobile broadband services that some carriers are interested in rolling out as early as this fall.　　The push for speed could keep Qualcomm ahead of Intel, its rival in handset baseband chips. Intel announced in November plans to support CDMA and gigabit speeds in its 2018 cellular modems and up to 1.6-Gbit/s downlinks in 2019.　　In the race to 5G, the new NR spec was “the one everyone was waiting for … we have a first version of one variant running, and many more variants will come,” said Twist.　　RF chips and backhaul options also will come in many flavors. For example, Nokia is developing base station radios using three-carrier aggregation for high capacity as well as beamforming radio heads for high bandwidth. In backhaul, it is designing microwave, IP, and optical options.　　With the 5G radio standard set, the next big agenda item is network slicing. A final standard for this version of virtualized radio is still in the works, with the next big pieces due in June, said Twist.

Key word：

Nokia

Release time：2018-02-08 00:00 reading：1103 Continue reading>>

<span style='color:red'>Q’com</span>m Rejects B’com Board, But Analysts Bullish

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Q’comm Rejects B’com Board, But Analysts Bullish

　　Qualcomm officially rejected Broadcom’s proposed 11-director board, setting a showdown on the semiconductor industry’s largest merger to date for the Qualcomm annual stockholders’ meeting March 6.　　While Qualcomm remains adamantly against the deal, Wall Street analysts are already crunching the numbers. They are generally bullish on the deal and on Broadcom after a strong quarterly report earlier this month.　　In a press statement, Qualcomm said the board members proposed by Broadcom and its private equity partner, Silver Lake, “are inherently conflicted and would not bring incremental skills or expertise to the Qualcomm board.” Broadcom’s initial $70/share bid “dramatically undervalues Qualcomm and is not actionable due to its significant regulatory uncertainty, which may not be resolved for 18 months, if ever,” it added.　　In an SEC filing it proposed continuing its current board of 11 with nine outside directors including a former chairman of American Airlines, a former U.S. Ambassador to China, a former Secretary of State in Spain and chief executive of Palo Alto Networks. Qualcomm CEO Steve Mollenkopf and former CEO Paul Jacobs, who chairs the board, would continue as directors.　　If Broadcom fails to convince shareholders to vote for its proposed board, it is expected to increase its bid to $77/share, according to a December 7 note from Canaccord Genuity financial analysts. It calculated generally positive scenarios of bids at five levels ranging up to $100/share.　　The analysts estimated the combined company would generate $56 billion in revenues and $14.8 billion in profits in fiscal year 2018 if the deal includes Qualcomm’s proposed acquisition of NXP. Without NXP, it forecast 2018 combined revenues of $46 billion and profits of $13.6 billion.　　In either case, it assumed cost reductions of $750 million in 2018 and $1.5 billion in 2019. It also assumed Qualcomm would make $500 million in cuts at NXP if that deal is approved.　　“There is the potential for Broadcom to help settle licensing disputes with Apple in a more timely manner than Qualcomm might, given Broadcom’s strong relationship with Apple, and…the very strong position held by Broadcom's switching/routing chipset business with key vendors including Cisco could prove an important beachhead in the datacenter market for Qualcomm's new ARM-based server offerings,” it said.　　Separately, Morgan Stanley issued a Dec. 21 report noting among other items that Broadcom has an emerging ASIC business in machine learning it expects could be “approaching $500 million in revenue in the next 2-3 years.” Morgan Staley also acts as an advisor to Broadcom in its move to acquire Qualcomm.

Key word：

Q’comm,B’com

Release time：2017-12-26 00:00 reading：1124 Continue reading>>

<span style='color:red'>Q’com</span>m Profits Dive Amid Patent Disputes

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Q’comm Profits Dive Amid Patent Disputes

　　You know when you hear as many as five executives on a quarterly conference call, times are challenging. So it was when Qualcomm Inc. reported results for the end of its fiscal 2017.　　Quarterly and annual revenues of $5.9 billion and $22.3 billion were both down 5 percent compared to 2016 results, using GAAP figures. Given the loss of licensing revenues from Apple and another unnamed customer, it was not surprising profits took a bigger dive to $200 million for the quarter and $2.5 billion for the year, down 89 percent and 57 percent from 2016, respectively.　　The forecast is for continued grim weather. The mobile chip giant expects flat revenues for its next quarter despite a 5 percent expected rise in its chip set unit sales. Overall cellular device unit sales could rise 8 percent next year, but their average selling prices may drop given a growing share are going into more cost-sensitive systems in cars, networking and the Internet of Things.　　Qualcomm’s CEO and CFO were joined on the call by two of its legal experts and its chip set group manager. They fielded several questions on a delayed merger with NXP and multiple legal disputes with Apple but provided few new details.　　Executives said they are hopeful the NXP deal will be approved soon by four regulators still reviewing it, but it might take until early 2018. They suggested they see no immediate resolution for the many legal disputes over patent licensing with Apple. Separately they provided no meaningful insights on a separate dispute with an unnamed customer that stopped paying royalties in the second quarter.　　Speaking of the multiple court cases with Apple, Qualcomm general counsel Donald Rosenberg said, “litigation of this magnitude takes a while, you can’t focus on any particular short-term event.”　　Cases Qualcomm brought against Apple with the U.S. International Trade Commission and in Germany may move more quickly than others with some results expected by mid- to late 2018. However, “until then, I don’t think you will see much of consequence in terms of an ultimate outcome, and it will play out like most complex litigation,” he added.　　Apple and Samsung are still battling over a massive patent infringement suit that goes back to 2012 that even had a hearing at the Supreme Court in 2016.　　In related issues, CEO Steve Mollenkopf said Qualcomm plans to appeal rulings of unfair licensing practices earlier this year by antitrust officials in South Korea and Taiwan. Fines from those decisions wiped $868 million and $778 million off Qualcomm’s revenues this fiscal year.　　The patent dispute with the unnamed customer has “unique issues to that licensee” and got started before Apple took legal action in January, said another Qualcomm executive. The customer will remain unnamed unless a court case is filed. Its resolution “will have its own pace [not tied to] the Apple dispute,” he said.　　Qualcomm did not comment on reports Apple may start designing its baseband processors out of future iPhones. Nor did it speak to reports that European regulators want to see concessions about its licensing practices from Qualcomm before approving the NXP merger.　　China and the EU are among four regulators yet to OK the deal, the largest proposed merger in the semiconductor industry to date. “The clock stopped in the EU, but there’s nothing surprising in that process for an acquisition of this size,” said Mollenkopf, noting executives on both sides still publicly say the $110-per-share offer is attractive.　　On the bright side, Qualcomm expects 6 percent growth in 3/4G cellular device sales in 2017 could rise to an 8 percent increase in device units next year. However, it projects flat average selling prices as more of those sales are for more cost-sensitive systems than smartphones.　　Mollenkopf said 41 operators are supporting the company’s Gbit-LTE modems now shipping or being designed into 120 products. In addition, “there’s another LTE update after Gbit” and first commercial products for 5G could ship in 2019, he added.　　“We think we will all be pleased by the speed people go to 5G,” he said.　　Korean operators hope to demo pre-standard 5G at the Winter Olympics early next year, and Verizon and AT&T are working on last-mile 5G services for 2019. However, market watchers say significant rollouts of 5G base stations are not expected until 2021.

Key word：

Q’comm,Patent Disputes

Release time：2017-11-03 00:00 reading：2334 Continue reading>>

Apple Watch Packs <span style='color:red'>Q’com</span>m LTE

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Apple Watch Packs Q’comm LTE

　　Qualcomm supplied the LTE modem in the Apple Watch Series 3 as well as a handful of other wireless chips, according to a teardown from TechInsights. The latest watch appears to continue to push the boundaries of system-in-package design, packing a dozen major chips and dozens of discretes.　　The new watch uses the same size SiP as the existing device. However, the Series 3 clearly packs more components, TechInsights said.　　TechInsights found the Qualcomm MDM9635M, a Snapdragon X7 LTE modem in the 42mm sport band model A1861 with GPS + cellular it opened up. The same LTE chip appeared in the iPhone 6S/6S Plus, the Samsung Galaxy S6 Edge and other handsets. The modem was mated in a package-on-package with a Samsung K4P1G324EH DRAM in the watch.　　Initial reviews found problems using LTE on the device, Apple’s first watch with cellular connectivity. However, Apple issued an update of its WatchOS said to have eliminated the problems.　　Apple and Qualcomm are embroiled in a handful of patent infringement disputes including investigations at the U.S. International Trade Commission, particularly around baseband modems. Nevertheless, Apple continues to use the Qualcomm parts both in handsets and watches despite threats of injunctions and Apple’s decision to discontinue paying Qualcomm royalties while court cases are in progress.　　Among other wireless chips, TechInsights said the watch contains a Qualcomm PMD9645 PMIC and a WTR3925 RF transceiver. Several other chip vendors also won wireless sockets.　　TechInsights preliminary report identified an Apple/Dialog PMIC, an Avago AFEM-8069 front-end module, and a Skyworks SKY 78198 power amplifier. At least one other power amp is believed to be in the design.　　Toshiba scored a win supplying 16 GBytes of NAND flash in the watch with four die marked FPV7_32G. SK Hynix supplied a DRAM believed to be packaged with Apple’s latest application processor, a dual-core device.　　The Apple-designed application processor in the new watch is slightly larger than the one in the existing device at 7.74mm x 6.25mm, compared to 7.29mm x 6.25mm. What TechInsights believes is the new W2 custom Bluetooth chip, however, measures 2.61mm x 2.50mm, significantly smaller than the W1 in the Series 2 at 3.23mm x 4.42mm.　　TechInsights found a 32-bit STMicro ST33G1M2 MCU on the backside of the SiP near RF components. Analog Devices continued to supply two capacitive touch chips — a touch screen controller and a AD7149 sensor controller also used in the Series 2 watch.　　Broadcom supplied a wireless charging chip, the same one found in a teardown of the iPhone 8. NXP continued to provide NFC support with the same PN80V NFC module used in the iPhone 8.　　Separately, IHS Markit estimated the bill of materials on the iPhone 8 Plus with 64 GBytes memory at $288.08, higher than any previous versions of the company’s smartphones. The iPhone 8 BoM is $247.51, it said. The rising costs are due to a mix of new features, more memory and slower than normal declines in chip prices, particularly in memory, it added.

Key word：

Apple Watch,Q’comm,LTE

Release time：2017-10-10 00:00 reading：1807 Continue reading>>

Trade news

iPhone 8 Still Packs Q’Comm, NXP

　　Apple continues to use a mix of Qualcomm and Intel LTE modems in its iPhone 8,according to early teardown reports.Broadcom gained an expected design win for a wireless charging chip,NXP hung on to its socket for near-field communications(NFC),and one analyst said that Skyworks may have slightly increased its content in the handset.　　Overall,the iPhone 8 is an incremental step for Apple.The$999 iPhone X,which represents a bigger leap,will not ship until November.At press time,TechInsights was still working on a teardown of an iPhone 8 Plus and an Apple Watch 3.　　A representative from TechInsights said,“The iPhone 8 Plus A1897 model[that]we purchased is an Intel-based phone.We see Intel’s Baseband Processor(Modem)PMB9948.We suspect that this is the Intel XMM7480 modem.”It is expected to publish its resultsonline herein the next day or so.　　TechInsights helped identify chips iniFixit’s teardown of an iPhone 8purchased in Australia.They included on the front side of the L-shaped motherboard:An Apple 339S00434 A11 Bionic SoC stacked with an SK Hynix H9HKNNNBRMMUUR 2-GB LPDDR4 RAMA Qualcomm MDM9655 Snapdragon X16 LTE modemA Skyworks SkyOne SKY78140An Avago 8072JD130A P215 730N71T believed to be an envelope tracking ICA Skyworks 77366-17 quad-band GSM power amplifier moduleAn NXP 80V18 secure NFC moduleAnd on the card’s backside:A Wi-Fi/Bluetooth/FM radio module marked Apple/USI 170804 339S00397A chip marked Apple 338S00248,338S00309 PMIC,and S3830028A Toshiba TSBL227VC3759 64-GB NAND flashA Qualcomm WTR5975 Gigabit LTE RF transceiver and PMD9655 PMICA Broadcom 59355 believed to be a wireless charging ICA NXP 1612A1 assumed to be an upgrade of its 1610 Tristar ICA Skyworks 3760 3576 1732 RF Switch and SKY762-21 247296 1734 RF Switch　　Apple was expected to continue to ship separate versions of its handsets using Qualcomm and Intel cellular modems in different geographies despiteongoing legal battleswith Qualcomm over basebands and patents.TechInsightsand othershad speculated that STMicroelectronics was in the running for the NFC slots traditionally held by NXP.　　Romit Shah,a financial analyst with Nomura Instanet,released a report saying that Skyworks may have exceeded his estimate of$7.07 content per handset in the iPhone 8.The teardown showed“what we believe to be an additional Skyworks component sitting near the Qualcomm transceiver”as well as what he believed is a SkyOne Ultra 3.0 power amp,an upgraded version of the device used in the iPhone 7.　　The teardown showed that Broadcom won the socket for wireless charging as expected.However,it did not show the amount of Broadcom content in a connectivity module or details of a separate Avago device that Shah believed“contains high-/mid-band filters,multi/hexaplexer,and a power amplifier in addition to an external multiplexer.”　　TechInsights typically burrows into the details of the modules and chips in its teardowns.However,its de-capping and inspection processes require more time and are not always immediately made public.　　Overall,the iFixit teardown showed that the iPhone 8 was a relatively minor upgrade,with its advances sometimes attributed more to software than hardware.　　For example,the iPhone 8 included a 3.82-V,1,821-mAh battery expected to deliver up to 6.96 Wh of power,down from the 7.45 Wh battery in the iPhone 7.But Apple claims that battery life will be comparable to last year’s unit.　　The iPhone 8 has the same?/1.8,six-element lens on the iPhone 7 with the same 12-Mpixel resolution.However,the new sensor is larger.“This means[that]the individual pixels are larger—letting in more light,improving colors,and decreasing noise…and the handset sports improved imaging software,”said iFixit.　　The new model used the same 4.7-inch IPS multitouch Retina HD display with 1,334×750(326 ppi)resolution as the former handset.However,Apple claims that the display sports advances thanks to its True Tone technology.　　Overall,iFixit gave the handset a six out of 10 score for repair-ability.　　“The durability of the glass back remains to be seen—but replacements are likely to be very difficult…the iPhone’s lower components,once readily removed,now lie trapped under a fussy combination of brackets and delicately folded flex cables,”it said.

Key word：

iPhone 8,Q’Comm, NXP

Release time：2017-09-25 00:00 reading：1848 Continue reading>>

<span style='color:red'>Q’com</span>m Details ARM Server SoCs

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Q’comm Details ARM Server SoCs

　　Qualcomm will describe the custom ARM core inside its first server processor at Hot Chips this week. The Falkor CPU is at the heart of the company’s 10-nm Centriq 2400, a 48-core SoC that will ship later this year, targeting big data centers.　　To date, a handful of companies have tried to gain footholds in servers with ARM-based products. They have generally failed so far because their parts could not match the performance of Intel’s x86-based Xeon. However, earlier this year Microsoft’s data center group announced it is testing SoCs from Qualcomm and rival Cavium.　　It’s still unclear how Qualcomm will fare. The company did not provide any performance, power consumption or price information on its parts.　　The ARM chips debut at a moment of unusually high competition. AMD just started shipping Epyc, its x86 server SoC with up to 32 cores, while Intel just refreshed Xeon with its Skylake architecture. Both are made in 14-nm processes.　　Perhaps the most interesting disclosure about the 64-bit Falkor is it consists of two custom ARMv8 cores. Thus, the 48-core Centriq is actually made up of 24 dual-core processors running at about 1V.b　　The dual-core approach is roughly similar to one used by AMD’s Bulldozer, a 2010 x86 core that struggled to compete with rival Intel. The dual Qualcomm CPUs share an L2 cache and ring interconnect with more than 250 GBytes/second aggregate bandwidth.　　Each out-of-order Falkor core can dispatch up to three instructions and one direct branch per cycle. They use a pipeline that supports 128-bit loads and stores and varies in length depending on the operation.　　The cores and L2 caches can run at independent power states. They are managed by a block head switch or low-dropout regulator from a shared supply rail that acts as a hardware state machine speeding state transitions.　　While the dual cores share one L2 caches in each block, the L3 is a central cache running on the SoC’s ring bus. Qualcomm did not provide sizes of the caches.　　The SoC supports six DDR4 channels at 2,667 MTransfers/s and 32 PCI Express Gen 3 lanes. AMD bests both Qualcomm and Intel providing eight DDR4 channels and 128 PCIe Gen 3 lanes on Epyc.　　The Centriq incudes a south bridge block supporting SATA, USB and other I/Os. The chip fits in a 55mm2 LGA package.　　The SoC supports ARM’s virtualization, TrustZone security and instruction extensions to accelerate crypto operations. In addition, it stores boot load and authentication code in an integrated ROM.

Key word：

Q’comm,ARM,SoCs

Release time：2017-08-22 00:00 reading：1198 Continue reading>>

AI Sees New Apps, Chips, says <span style='color:red'>Q’com</span>m

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AI Sees New Apps, Chips, says Q’comm

　　For the first time a team of researchers from Columbia University in the city of New York claims to have reproducibly demonstrated current blockade – the ability to switch a device from the insulating to the conducting state where charge is added and removed one electron at a time – using atomically precise molecular clusters at room temperature.　　According to the research team, this could enable smaller electrical components and improve data storage and computing power.　　To create the transistor, the researchers developed a single cluster of geometrically ordered atoms with an inorganic core made of 14 atoms and positioned linkers that wired the core to two gold electrodes.　　The researchers then used a scanning tunneling microscope technique to make junctions comprising a single cluster connected to the two gold electrodes, which enabled them to characterise its electrical response as they varied the applied bias voltage. The technique is said to allow them to fabricate and measure thousands of junctions with reproducible transport characteristics.　　"We found that these clusters can perform very well as room-temperature nanoscale diodes whose electrical response we can tailor by changing their chemical composition," says Professor Latha Venkataraman.　　"Theoretically, a single atom is the smallest limit, but single-atom devices cannot be fabricated and stabilised at room temperature. With these molecular clusters, we have complete control over their structure with atomic precision and can change the elemental composition and structure in a controllable manner to elicit a certain electrical response."　　"Most of the other studies created single-molecule devices that functioned as single-electron transistors at 4K, but for any real-world application, these devices need to work at room temperature. And ours do," says postdoctoral researcher Giacomo Lovat.　　The team evaluated the performance of the diode through the on/off ratio. At room temperature, they observed an on/off ratio of about 600 in single-cluster junctions, which they claim is higher than any other single-molecule devices measured to date.

Key word：

AI,Apps, Chips, Q’comm

Release time：2017-08-17 00:00 reading：1016 Continue reading>>

<span style='color:red'>Q’com</span>m Reportedly Taps TSMC's 7nm

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Q’comm Reportedly Taps TSMC's 7nm

　　Qualcomm will switch back to TSMC to make its 7nm Snapdragon parts after giving its 10nm business to Samsung, according to a report in ET News, a South Korean publication. If correct, the switch will be a huge boost for TSMC and could cause a significant drop in Samsung’s foundry business in 2018.　　Qualcomm declined to comment on what a spokeswoman characterized as rumors. Samsung and TSMC did not reply to requests for comment.　　The report said Qualcomm started working on its 7nm Snapdragon SoC using TSMC tools in the middle of 2016. It is expected to announce the chip late this year or early next year “after first test wafer is manufactured from TSMC in September and after it is done with designing [its] package and verification process,” the report said.　　Qualcomm announced its Snapdragon 835 made in Samsung’s 10nm process at CES in January. The article estimated the Snapdragon 835 business represents about $1.78 billion or 40 percent of Samsung’s foundry revenue.　　The article suggested Qualcomm is making the switch for two reasons. Samsung is late with its 7nm node, and the Korean giant lacks the chip-stacking technology TSMC is using in Apple’s current iPhone 7 handset SoCs. TSMC released its first 7nm process design kit late last year while Samsung’s first beta 7nm PDK is due in July, it said.　　Initially Samsung said in late 2016 it would use extreme ultraviolet lithography at 7nm. However those systems now are currently expected to take until 2019 to be ready for limited commercial use, according to Globalfoundries and others. More recently, Samsung announced plans for an 8nm node using immersion steppers.　　“TSMC is ahead of Samsung in being in risk production at 7nm. Samsung spent more time developing EUV for 7nm,” said Mike Demler, an analyst for the Linley Group.　　In addition, TSMC uses InFo, a fan-out wafer-level packaging technique with Apple’s smartphone SoCs. Samsung is working on similar technology but it is not expected to be ready for at least a year, the article said.　　Samsung will make its next-generation smartphone SoCs in the 8nm process. A separate SoC for its premium Galaxy Note line will be made in Samsung’s 7nm node, the article added.　　Apple initially made all its iPhone SoCs at Samsung despite an epic patent battle between the companies. Over the last few generations it tested and ultimately moved all that foundry business to TSMC.

Key word：

Q’comm,Qualcomm

Release time：2017-06-14 00:00 reading：1031 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email