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AMEYA360:How Smart <span style='color:red'>3D</span> Electrodes Will Power Next-Gen Batteries

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AMEYA360:How Smart 3D Electrodes Will Power Next-Gen Batteries

　　Addionics has developed a novel manufacturing process named smart 3D electrodes, which improves rechargeable batteries’ performance by redesigning their architecture. According to the company, the new technology enables higher capacity and safety, lower charging time and cost, and a longer lifetime.　　The company’s 3D fabrication process differs from currently used architectures in how the battery’s collector is made. Today, most collectors are made with 2D metal foils — a technology that has remained unchanged in the last 30 years.　　“While everyone is using conventional 2D 100% dense metal foils, at Addionics, we are replacing this component with a 3D metal structure that can load more active materials, increase the energy density, reduce the internal resistance, and provide better mechanical adhesion and thermal stability,” said Moshiel Biton, CEO of Addionics in an interview with EE Times.　　Addionics is an English company with subsidiaries in Israel, the United States, and Germany. After raising $40 million in funds to develop its smart 3D architecture, the company is moving towards manufacturing. The transition from R&D to production began with the opening of a new facility in Tel Aviv, the pilot line for producing the Smart 3D Electrodes components.

Key word：

AMEYA360,3D

Release time：2023-04-18 11:09 reading：1913 Continue reading>>

ZEISS:Industrial <span style='color:red'>3D</span> Scanning Technology

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ZEISS:Industrial 3D Scanning Technology

　　The ATOS series of industrial non-contact 3D scanners using structured blue light deliver precise scans with detailed resolution at high speed. ATOS was developed with advanced hardware and intelligent software for repeatable and precise measurements.　　ATOS sensors are designed as flexible 3D scanners for complex measuring and inspection tasks in different industries.　　GOM ScanCobot is an easy-to-use entry-level solution for automated 3D metrology, giving the metrologist more time for data evaluation and problem analysis.　　ATOS Q　　Compact top performer for complex inspections　　The lightweight and flexible 3D scanner ATOS Q is optimal for small to medium-sized parts. The system combines high-tech electronics and optics with robust design and a powerful software, enabling high-precision measuring results.

Key word：

ZEISS

Release time：2023-04-14 11:31 reading：2018 Continue reading>>

Ameya360:UMC and Cadence Partner on <span style='color:red'>3D</span>-IC Hybrid Bonding Reference Flow

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Ameya360:UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow

　　Cadence Design Systems Inc.’s 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for United Microelectronics Corp.’s (UMC) chip stacking technologies, thereby enabling faster time to market for customers.　　UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications. Using UMC’s 40nm low power (40LP) process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation, and system analysis in a single platform.　　“Interest in 3D-IC solutions has increased notably in the past year as our customers seek ways to boost design performance without sacrificing area or cost,” said Osbert Cheng, vice president of device technology development and design support at UMC. “Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.”　　“With increasing design complexity for IoT, AI, and 5G applications, wafer-on-wafer technology automation is increasingly important for chip designers,” said Don Chan, vice president, R&D in the Digital & Signoff Group at Cadence. “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”　　The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database. The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit. Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis. The reference flow also enables system-level layout versus schematic (LVS) checking to connectivity accuracy, electric rule-checking (ERC) for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.　　In addition to the Integrity 3D-IC platform, the Cadence 3D-IC flow also includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Celsius Thermal Solver for system analysis.

Key word：

UMC,3D,IC

Release time：2023-02-22 15:54 reading：1803 Continue reading>>

STMicroelectronics and eYs<span style='color:red'>3D</span> Microelectronics to Highlight <span style='color:red'>3D</span> Stereo-vision Camera at CES 2023

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STMicroelectronics and eYs3D Microelectronics to Highlight 3D Stereo-vision Camera at CES 2023

　　STMicroelectronics and eYs3D Microelectronics will showcase the results of their collaboration on high-quality machine vision at CES 2023 in Las Vegas on January 5-8. Using live demonstrations, the companies will highlight how stereo video and depth camera made from advanced active-coded infrared technology can enhance capabilities like feature recognition and autonomous guidance at mid-to-long working range.　　“STMicroelectronics’ advanced image sensors, using proprietary process technologies, offer class-leading pixel size while offering both high sensitivity and low crosstalk,” said James Wang, Chief Strategy & Sales Officer, eYs3D Microelectronics. “Such high-performance image sensors at a competitive price point enable us to achieve extremely compact system size while ensuring outstanding machine-vision performance. The strong connection we have established with ST increases our confidence to develop new products that will lead the machine vision market.”　　“The collaboration with eYs3D Microelectronics, through their expertise in capture, perception understanding, and 3D-fusion, offers ST additional business opportunities, use cases, and ecosystems addressing demands for stereo vision in applications such as robots, home-automation, home appliances, and many others,” said David Maucotel, Business Line Manager at ST’s Imaging Sub-Group. “While the reference designs showcased at CES are using monochromatic sensors, we can already foresee exciting enhancements and further use-cases using the RGB and RGB-IR versions of our sensors.”　　The CES demonstrations highlight two jointly developed reference designs, the Ref-B6 and Ref-B3 ASV (Active Stereo Vision) video and depth cameras. Both combine the eYs3D CV processor and eSP876 stereo 3D Depth-Map chipset with ST’s global shutter image sensors that provide enhanced near-infrared (NIR) sensitivity. The embedded eYs3D chipset enhances object edge detection, optimizes depth de-noising, and outputs HD-quality 3D depth data up to 60 fps frame rate. ST’s image sensors enable the cameras to output data streams in various combinations of video/depth resolution and frame rate for the best quality depth sensing and point-cloud creation.　　In addition, optimized lenses, filters and a VCSEL active-IR projector source optimize the infrared optical path and maximize immunity to ambient light noise. A specially developed control algorithm turns the IR projector on and o? alternately to permit capturing artifact-free gray scale images. Leveraging this advanced hardware design, the Ref-B6 stereo-video camera achieves a 6-centimeter baseline and 85deg(H) x 70deg(V) depth field of view.

Key word：

STMicroelectronics

Release time：2023-01-05 13:02 reading：3395 Continue reading>>

Micron Opens Backend Factory in Taichung Aiming <span style='color:red'>3D</span> memory Market

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Micron Opens Backend Factory in Taichung Aiming 3D memory Market

Major memory manufacturer Micron on October 26 held an opening ceremony for their backend packaging and testing plant in Taichung. With the opening of this factory, Micron Taiwan will be the world’s only memory vertical integration production base with both manufacturing and testing, and the main target product will be 3D memory, which is currently in high demand.Micron Executive Vice President of Global Operations Manish Bhatia stated that following the opening of the backend packaging and testing plant in Taichung, Micron will be capable of responding to customer’s needs more rapidly, and the production cycle will be shortened. At the same time, they will also focus on more valuable and advanced products.Currently, the hottest product in the memory market is 3D NAND flash memory, and mass shipments of Micron’s 64-layer products are underway .The latest 96-layer NAND flash memory products will also go into mass production in the second half of this year. As a result, Micron is upgrading their production capacity for related products, and this will be the key for Micron to increase their profitability.Taiwan Micron Vice President Liang Ming-cheng pointed out that 3D memory that utilizes TSV technology has specialized processing specifications, and there is no general-purpose equipment. All of the packaging and testing equipment has been independently developed by Micron; therefore, it cannot be outsourced. In the future after the new packaging and testing center begins to be utilized, it will be of assistance in expanding production capacity for 3D memory.Following the movement from semiconductor manufacturing to 3D architecture, integrated manufacturing and testing of high-end ICs has become the main trend by and large. For instance, TSMC is continually expanding and increasing their technological capabilities in the domain of packaging and testing and Micron has established their own vertical production line which integrates manufacturing with packaging and testing, which is further evidence of this trend.Hence it will be worth paying attention to whether or not this technology will bring about changes in the current semiconductor industry chain.

Key word：

Micron

Release time：2018-11-01 00:00 reading：1162 Continue reading>>

Macronix Plans Low-Cost <span style='color:red'>3D</span> NAND

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Macronix Plans Low-Cost 3D NAND

Miin Wu believes that he can cut 3D NAND prices by a third. The founder of Macronix is raising funds for a three-year effort that is both ambitious and pragmatic.The NOR and ROM maker seeks funds to expand by a little more than 10% of its current capacity of about 400,000 12-inch equivalent wafers/month. An extra 50,000 wafers/month will initially be in traditional 3D NAND. Once it establishes a customer base, it will ramp a novel architecture that it claims sports 30% lower cost per bit.If all goes well, the company aims to release its first chips in in a little more than two years. Miin Wu was in Silicon Valley recently to discuss with equipment makers details of key etch tools needed to make competitive 3D NAND parts.“Right now, all my R&D money is spent on 3D NAND,” said Miin Wu, noting that he expects to make his own controllers, too. “If I can build a 50,000-wafer capacity, I can compete and make money, but for our full ROI, we need multiples of that, so we will need to expand.”Macronix is not the only wannabe in the burgeoning market for 3D NAND. China’s Yangtze Memory Technology Co. aims to deliver 256-Gbit chips late next year supporting data rates up to 3.0 Gbits/s using a proprietary Xstacking technology. YMTC was founded in 2016 with a whopping $24 billion in funding, leveraging the 12-inch fabs of China’s XMC in Wuhan.YMTC plans to be in volume production of conventional 32-layer NAND chips by October. If all goes well, in a little more than a year, it could be producing chips at a rate of 100,000 wafers/month in the first phase of a new fab with a second phase planned to triple capacity, fueling plans to take 10% to 20% of the worldwide NAND market.It’s a big, risky bet to gain a position in a highly competitive field. Just last month, SK Hynix announced that it will sample before the end of the year a 512-Gbit version of its 96-layer chips and a Tbit version before June. Larger rivals Samsung and Toshiba are already shipping similar parts today. The top vendors, which include Micron, are said to be well on their way to cracking the 100-layer level with plans extending to hundreds of levels.Despite the heady competition, Macronix “has a good opportunity to focus on lower-density parts that major vendors obsolete — in a shortage, that’s a great place to be,” said analyst Jim Handy of Objective Analysis, who estimates that the flash market will hit $58 billion this year, up 23% over 2017.That’s the kind of position in trailing-edge memories that Macronix has traditionally pursued. This time around, however, Miin Wu said that he aims to deliver 3D NAND parts at the same density but lower costs as rivals.Handy said that the goal would challenge the Taiwan company’s business model that, to date, has focused more on high-mix, low-volume products. Success will also depend on the state of NAND ASPs, which have been declining from 27 cents/GByte to 20 cents/GB, noted Handy.“I believe that memory can be the other strength of Taiwan,” said Miin Wu, who founded Macronix in 1989, when TSMC was just two years old.Today, TSMC is producing state-of-the-art SoCs at 7 nm, while Macronix is best-known as a leader in older memory products such as NOR flash and ROMs made in 90- and 35-nm nodes. That said, Macronix has its share of innovations with more than 7,600 patents, said Miin Wu, who helped design the EEPROM while at Intel in the 1970s.Macronix plans a number of stops along the way to its 3D NAND dreams. It plans to sample 4-GByte eMMC NAND by the end of the year. It’s also driving NOR down to 1.2 V for low-power IoT chips with standby power measured in nanoamps.Nintendo remains its largest customer overall. In China, Huawei is its largest customer and likely one of the first to use its eMMC chips in products such as base stations.Macronix described its Single-Gate Vertical Channel architecture for 3D NAND at IEDM. Click to enlarge. (Source: Macronix)

Key word：

Macronix

Release time：2018-09-19 00:00 reading：1093 Continue reading>>

Market for <span style='color:red'>3D</span> printed electronics to reach $3.9bn by 2026

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Market for 3D printed electronics to reach $3.9bn by 2026

The 3D printed electronics market is set to grow globally, says market intelligence company, Transparency Market Research.The worldwide market is expected to reach $3,915 Mn by 2026, according to Transparency and projected to expand at a CAGR of 44.46% between 2018-2026.This market will continue to be influenced by the growing demand for light weight, miniature, and high performance electronic components which find applications where space is a constraint and performance is of pivotal importance, the reports says.Aerospace and defence is expected to hold the highest market share, as the segment demands highly customised, light weight, and high performance electronic components which can be efficiently realised with the help of 3D printing method, as compared to traditional manufacturing methods, the report outlines.While the consumer electronics segment is anticipated to grow at the fastest rate, due to the increasing utilisation of 3D printed electronics technology for the production of electronic components which are deployed in various consumer electronic products including wearables, smartphones, drones, and televisions. The North America region is anticipated to be at the forefront of global demand, with the market growing at a CAGR of above 43.76% through 2026. The growth is mainly due to the increasing adoption of 3D printing technology in the region in various industry verticals – especially aerospace and defence and across countries, namely the US and Canada – says the report.Furthermore, 3D printed electronics are gaining popularity across the Asia Pacific region, especially across economies, with China predicted to hold a significant market share.

Key word：

3D print

Release time：2018-09-05 00:00 reading：1193 Continue reading>>

Novel process to <span style='color:red'>3D</span> print graphene developed

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Novel process to 3D print graphene developed

Researchers from Virginia Tech and Lawrence Livermore National Laboratory have developed an innovative method to 3D print graphene, which until now has only been available in 2D sheets or basic structures.According to engineers at Virginia Tech, they have been able to 3D print graphene objects at a resolution and an order of magnitude greater than ever before, unlocking the ability to, in theory, create any size or shape of graphene.Graphene is extremely strong and has high thermal and electricity conductivity. 3D printed graphene objects would be welcomed by a number of industries, including batteries, aerospace, separation, heat management, sensors, and catalysis.A single layer of carbon atoms organised in a hexagonal lattice, when graphene sheets are neatly stacked on top of each other and formed into a three-dimensional shape, it becomes graphite. Because graphite is simply packed-together graphene, it has fairly poor mechanical properties. But if the graphene sheets are separated with air-filled pores, the three-dimensional structure can maintain its properties. This porous graphene structure is called a graphene aerogel."Now a designer can design three-dimensional topology comprised of interconnected graphene sheets," said Xiaoyu "Rayne" Zheng, assistant professor with the Department of Mechanical Engineering in the College of Engineering and director of the Advanced Manufacturing and Metamaterials Lab. "This new design and manufacturing freedom will lead to optimisation of strength, conductivity, mass transport, strength, and weight density that are not achievable in graphene aerogels."Zheng, also an affiliated faculty member of the Macromolecules Innovation Institute, has received grants to study nanoscale materials and scale them up to lightweight and functional materials for applications in aerospace, automobiles, and batteries.Researchers have printed graphene using an extrusion process, but that technique could only create simple objects."With that technique, there's very limited structures you can create because there's no support and the resolution is quite limited, so you can't get freeform factors," Zheng explained. "What we did was to get these graphene layers to be architected into any shape that you want with high resolution."To create these complex structures graphene oxide sheets, a precursor to graphene, is crosslinked to form a porous hydrogel. Breaking the graphene oxide hydrogel with ultrasound and adding light-sensitive acrylate polymers, micro-stereolithography is used to create a solid 3D structure with the graphene oxide trapped in the long, rigid chains of acrylate polymer. The 3D structure is then placed in a furnace to burn off the polymers and fuse the object together, leaving behind a pure and lightweight graphene aerogel."We've been able to show you can make a complex, three-dimensional architecture of graphene while still preserving some of its intrinsic prime properties," Zheng said. "Usually when you try to 3D print graphene or scale up, you lose most of their lucrative mechanical properties found in its single sheet form."

Key word：

3D print

Release time：2018-08-27 00:00 reading：1289 Continue reading>>

YMTC to Detail <span style='color:red'>3D</span> NAND Chips

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YMTC to Detail 3D NAND Chips

Yangtze Memory Technologies Co., Ltd. (YMTC) will unveil next week its latest 3D NAND chips. The talk by chief executive Simon Yang at the Flash Memory Summit here will mark the first public discussion of an effort from China to produce leading-edge memory chips.YTMC will describe what it calls Xtacking as an approach to 3D NAND that delivers a “speed-up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.” Xtacking “enables parallel processing of the NAND array and periphery … a modular approach [that will] shorten the time-to-market for new generations of 3D NAND and open the possibility for customized NAND flash products,” according to a press statement.The company, described as the pride of China, has long been seen as one of the country’s most likely candidates to deliver a commercially viable mainstream memory chip. It was founded in 2016 with a whopping $24 billion in funding, leveraging the 12-inch fabs of China’s XMC in Wuhan.YMTC announced a 32-layer 3D NAND chip last year and said that it would ship this year a 48-layer version. In February, a Wall Street analyst said that YMTC’s yields on its 32-layer NAND chips were still very low, suggesting that a 48-layer part could still be many months from general availability.If YMTC’s target remains the same, it will be one or two steps behind larger rivals. Intel, Micron, Samsung, and Toshiba/WD have announced or are shipping 96-layer, 4-bit-per-cell devices. Samsung said that its chips have DDR4-like speeds at 1.4 Gbits/second.The YMTC news comes at a time of heightened trade tensions between the U.S. and China, where semiconductors have been a particular flash point.Industry trade groups have long lobbied the U.S. government to help set a level playing field in China. The China government is investing heavily in chips and requiring foreign firms to transfer their technology in exchange for market access, they claim. However, they protested the Trump administration’s recent tariffs as an ineffective and even harmful approach.YMTC said that its Xtacking chips will be used in UFS as well as client and enterprise solid-state drives for use in smartphones, PCs, and data centers. The company claims that it has “help from customers, industry partners, and standard bodies [to enable] a whole new chapter in high-performance NAND solutions.”Ironically, Samsung, which was the first company to announce commercial 3D NAND chips at the Flash Memory Summit, is not participating in the event this year. The gap leaves YMTC an opening to be the talk of the show at which all the other major flash vendors are participating.

Key word：

YMTC,3D NAND Chips

Release time：2018-08-03 00:00 reading：2567 Continue reading>>

Intel's <span style='color:red'>3D</span> XPoint Plans Clearer Than Micron's

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Intel's 3D XPoint Plans Clearer Than Micron's

Or who you don't talk to. Micron, for its part, isn't offering any more guidance right now beyond what was stated in a joint news release issued earlier this week. "The companies have agreed to complete joint development for the second generation of 3D XPoint technology, which is expected to occur in the first half of 2019," the statement reads. "Technology development beyond the second generation of 3D XPoint technology will be pursued independently by the two companies in order to optimize the technology for their respective product and business needs."Intel is still bullish on the technology. In a telephone interview with EE Times, Bill Leszinske, vice president of Intel's non-volatile memory solutions group, said it makes sense for Intel to continue on its present path."We believe in the technology," Leszinske said. He added that what Intel now calls Optane technology presents opportunities on a DIMM in a server as well as high-performance storage either in a server or a client device.Not surprisingly, Leszinske wouldn't speak on behalf of Micron or speculate on its intentions but did say that Intel believes in the 3D XPoint technology direction the partners had jointly chosen. “Just like in 3D NAND, we believe in the floating gate direction that we've chosen," he said. "In the end, Micron said they have a different direction that they would like to head."The biggest impact of the Intel/Micron partnership wind-down is that each company will have to completely fund its own technology development, said Leszinske. He acknowledged that this is an expensive commitment, one that includes putting Optane on DIMMs — announced by Intel in May. Dubbed Optane DC Persistent Memory, it's being sampled by customers now, he said, and will be in production the second half of this year, followed by broader availability in 2019.So far, 3D Xpoint has only found its way into SSDs. As storage media, it may become what NAND flash was in its early days — an augmentation to spinning disk-based storage for data that needs to be accessed frequently and quickly, with flash taking the place of hard drives. "For us, having Optane and low-cost 3D NAND is our direction," said Leszinske. "We have the ability to go invest in that, and we will."Optane is all about high performance/low latency, he said, while NAND is all about high-density affordable costs so Intel can replace hard drives and reduce customers' operating costs in a data center or make it a better-performing client device. "We will shoot for lower cost even if the performance isn't quite as good because we think bulk replacing of hard drives and building out more tiers of salvaging storage is a better business result for our customers," Leszinske said. Intel's Optane has found its way into real-world use cases. The University of Pisa in Italy, for example, is able to process MRIs in two minutes rather than 40, something that claustrophobic patients appreciate, said Leszinske. "That's been an amazing experience that we never would have envisioned. We know there's more of those things out there," he said. Intel's enthusiasm for 3D XPoint sounds every much like the buzz around the initial announcement that it and Micron were developing an entirely new class of non-volatile memory that claimed dramatically lower latency and exponentially greater endurance than NAND memory. At the time, there was a lot of speculation about 3D XPoint and the expectation that it would turn up in SSDs and DIMMs.It's been nearly three years since 3D XPoint was unveiled. As Jim Handy, principal analyst at Objective Analysis, notes, it didn't take long to figure out that the SSDs weren't going to be able to take advantage of 3D XPoint's speed."And they seem to be in a struggle to get the DIMM out for whatever reason," Handy said, adding that Micron recently said that its Lehi, Utah, facility was idle. "And the only thing that the Lehi plant has been making for the past six months is 3D XPoint memory," Handy said. Objective Analyst notes that Intel's NAND flash business has been underperforming while other plays are doing quite well.Handy said that this would seem to suggest that there's over-inventory of 3D XPoint SSDs and that they aren't selling as well as they could. "The SSDs are not really compelling," Handy said. "They're significantly more expensive and nominally better-performing than a NAND flash SSD."Handy said that it's important to note that Intel is the only one selling anything with 3D XPoint in it. It's also important to remember that Micron and Intel's businesses are different."Micron's in an interesting place because they know exactly what it cost to make 3D XPoint memory and they have chosen not to introduce SSDs," said Handy. "Which, to me, says that they don't want lose money on it like Intel is." Micron would have to answer to investors if they lose money on the technology, but for Intel, losing money is fine as long as 3D XPoint helps with its Xeon sales, Handy said.That being said, Intel's storage unit has been underperforming while everyone else in the NAND flash business "has been reaping in gobs of money," said Handy. And although Intel may optimistic about the opportunities for 3D XPoint, Intel being the only supplier of the technology might put a damper on plans by OEMs such as Dell or HP to build a product line around Optane. "How warm and fuzzy would you feel about your source of supply?"

Key word：

Intel,Micron

Release time：2018-07-20 00:00 reading：1057 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor

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