ROHM at electronica 2024: Empowering Growth, Inspiring Innovation
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ROHM at electronica 2024: Empowering Growth, Inspiring Innovation

　　Willich/Munich, Germany, October 10th, 2024 – ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.　　At booth C3-520, ROHM will showcase its advanced power and analog technologies designed to enhance power density, efficiency, and reliability in both automotive and industrial applications. These advancements are crucial for addressing the increasing demands of modern electronic systems, particularly in the context of sustainability and innovation.　　Under the theme "Empowering Growth, Inspiring Innovation," ROHM will highlight via its various demo application stations in “tree style” how its high-quality semiconductor technologies contribute to solving critical social and ecological challenges. The focus will be on driving sustainability in electronic design and innovation, which aligns with the growing emphasis on creating environmentally responsible solutions within the industry.　　At electronica 2024, the exhibition space has been greatly expanded and the number of items on display has been increased to 30 – more than three times compared to the previous show.　　The latest solutions will be exhibited under the three themes of “for E-Mobility”, “for Automotive”, and “for Industrial”.　　For E-Mobility　　・TRCDRIVE pack™ with 2-in-1 SiC Molded Module to improve the efficiency of traction inverters　　・New EcoIGBT™ products for electric compressors　　・New EcoSiC™ Schottky Barrier Diodes for onboard chargers　　For Automotive　　・New configurable PMIC with supporting functional safety features for application processors, SoCs and FPGAs　　・LED Driver ICs for Exterior Lighting / Head Lamps　　・Advanced solutions on the ADAS cockpit demo　　For Industrial Equipment　　・Industrial AC-DC PWM Controller ICs – support a wide range of power transistors from Si MOSFETs and IGBTs to SiC MOSFETs　　・The EcoGaN™ family of 150V and 650V class GaN HEMTs in several EVKs　　・Latest R&D project on Terahertz　　In addition to product showcases, ROHM is committed to fostering technical exchange and collaboration at electronica 2024. "For us, electronica is more than just a showcase – it’s an opportunity to forge new connections, strengthen existing partnerships, and reunite with industry peers," says Wolfram Harnack, President of ROHM Semiconductor Europe. "We are excited to welcome our guests to Munich as we work together to shape the future of electronics."　　For a sneak peek at which highlights ROHM will present during electronica 2024, visit our event preview page: https://www.rohm.com/electronica　　TRCDRIVE pack™, EcoIGBT™, EcoSiC™ and EcoGaN™ are trademarks or registered trademarks of ROHM Co., Ltd.
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Release time：2024-11-05 15:56 reading：555 Continue reading>>
Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology
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Renesas to Acquire Transphorm to Expand its Power Portfolio with GaN Technology

　　Renesas Electronics Corporation (“Renesas,” TSE: 6723), a premier supplier of advanced semiconductor solutions, and Transphorm, Inc. (“Transphorm,” Nasdaq: TGAN), a global leader in robust gallium nitride (“GaN”) power semiconductors, today announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm’s common stock for $5.10 per share in cash, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months. The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters.　　Demand for highly efficient power systems is increasing as building blocks for carbon neutrality. To address this trend, an industry-wide transition toward wide bandgap (“WBG”) materials, represented by silicon carbide (“SiC”) and GaN, is also being seen. These advanced materials allow a broader range of voltage and switching frequency than conventional silicon-based devices. To build on this momentum, Renesas has announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.　　Renesas now aims to further expand its WBG portfolio with Transphorm’s expertise in GaN, an emerging material that enables higher switching frequency, lower power losses, and smaller form factors. These benefits empower customers’ systems with greater efficiency, smaller and lighter composition, and lower overall cost. As such, demand for GaN is predicted to grow by more than 50 percent annually, according to an industry study. Renesas will implement Transphorm’s auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications.　　“Transphorm is a company uniquely led by a seasoned team rooted in GaN power and with origins from the University of California at Santa Barbara,” said Hidetoshi Shibata, CEO of Renesas. “The addition of Transphorm’s GaN technology builds on our momentum in IGBT and SiC. It will fuel and expand our power portfolio as a key pillar of growth, offering our customers the full ability to choose their optimal power solutions.”　　“Combined with Renesas’ world-wide footprint, breadth of solution offerings and customer relationships, we are excited to pave the way for industry-wide adoption of WBG materials and set the stage for significant growth. This transaction will also allow us to offer further expanded services to our customers and deliver significant immediate cash value to our stockholders,” said Dr. Primit Parikh, Co-founder, President and CEO of Transphorm and Dr. Umesh Mishra, Co-founder and CTO of Transphorm. “Additionally, it will provide a strong platform for our exceptional team to further Transphorm’s leading GaN technology and products.”　　Transaction Details　　The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. Concurrently with the execution of the definitive agreement, KKR Phorm Investors L.P., which holds approximately 38.6% of Transphorm’s outstanding common stock, has entered into a customary voting agreement with Renesas to vote in favor of the transaction.　　The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions.　　(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2024-01-15 15:48 reading：1943 Continue reading>>
Ameya360:Novosense automotive-qualified Integrated Absolute Pressure Sensor <span style='color:red'>NSP</span>AS1
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Ameya360:Novosense automotive-qualified Integrated Absolute Pressure Sensor NSPAS1

　　NSPAS1 is a calibrated absolute pressure sensor launched by NOVOSENSE for vehicle intake pressure, NEV vacuum boosting system and motorcycle electronic injection. The product adopts automotive-qualified signal conditioning chip to calibrate and compensate the output of MEMS piezoresistive die, ensuring excellent reliability of the product while integrating the two chips to greatly reduce the package size.        At the same time, this product can provide standard output in its operation temperature range without customer calibration, which can accelerate the process of product development and mass production; the product complies with the AEC-Q100 reliability standard.　　Product Features　　Operating temperature range: -40℃~125℃　　High accuracy in full temperature range:　　Better than ±1%F.S. in the range of - 0℃~85℃　　Better than ±1.5%F.S. in the range of -40℃~125℃　　Support -24 v to 28V over voltage and reverse voltage protection　　Fluorinated gel protection, compatible with oil and gas environment　　Faster response time less than 0.8ms　　Support absolute output/ratio-metric output, with output curve customized　　Disconnection detection, output clamping, output alarm function　　Pressure range 10kPa~400kPa, which can be customized　　AEC-Q100 qualified　　Package:SOP-8 (7.3mm x 7.3mm)　　Application　　Automotive: motorcycle three-in-one sensor, vehicle TMAP intake pressure detection, BPS battery pack thermal runaway pressure detection, EGR-TMAP exhaust gas recirculation pressure detection, canister desorption pressure detection, VBS vacuum boosting system sensor, ECU/VCU atmospheric pressure detection, seat air bag pressure detection　　Industrial: pressure transmitter, industrial vacuum degree testing, etc.　　Functional Block Diagram
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Release time：2023-02-16 15:50 reading：5595 Continue reading>>
ZEISS：Reliable evaluation software for inline and atline X-ray inspection
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ZEISS：Reliable evaluation software for inline and atline X-ray inspection

　　ZEISSAutomated Defect Detection (ZADD) software allows even the smallest defects in components to be detected reliably, quickly and automatically, so that even small and fuzzy defects to be evaluated.  In doing so, the Automated Defect Detection (ADD) software, also called Automated Defect Recognition (ADR) software, can be used not only for injection molded parts, but also for batteries and printed components (MED/AM).　　ZEISS offers everything from a single source: with the complete ZEISS X-ray portfolio, you can use artificial intelligence (AI) in 3D computed tomography (CT) and 2D X-ray technology both inline and atline. ZEISS Automated Defect Detection software is compatible with all ZEISS computed tomography systems.]　　Reliably detect defects in components　　During the complex manufacturing process of components, different defects can occur. Especially inside, they are invisible to the naked eye and can have a major impact on the stability and functionality of the component. Artificial intelligence combined with industrial computed tomography or 2D X-ray technology makes these hidden problem areas visible, analyzes them and detects them at an early stage. The ZEISS Automated Defect Detection software specializes in the detection of different defects, so that defects can be detected quickly and reliably even in poor image quality with many artifacts.　　Inline defect analysis in just 60 seconds　　In order to be able to sort out defective components at an early stage in a value chain, the 3D data must be evaluated reliably and quickly during an inline inspection. In just 60 seconds, the ZEISS Automated Defect Detection analysis software reliably examines 4 billion voxels (3D pixels) for defects that are only a few voxels in size. Components with critical defects are thus accurately sorted out or, if possible, subjected to rework. Good parts, on the other hand, pass through the further machining process unhindered. The result: a lower reject rate and high component quality. In this way, you achieve a constant increase in efficiency and maximum process reliability with AI in CT.　　Reliable evaluation　　If the ZEISS Automated Defect Detection software detects a defect, the software evaluates it in terms of position, shape, size and type. For example, if pores are close to a surface that will be machined in the further process, they may pose a greater risk than elsewhere inside the component. The software is able to predict whether the defect may cause problems in subsequent machining steps. The component is then automatically rejected at an early stage. This saves you time and money. In addition, you can define in the ZEISS Automated Defect Detection software under which criteria a defect still meets the quality standards and when it is classified as critical. With ZEISS Automated Defect Detection, you get a solution that is tailored precisely to your requirements.　　Clear reporting　　If the ZEISS Automated Defect Detection software finds a critical defect in inline operation, it creates a report using the ZEISS PiWeb data management software. This gives you the opportunity to view and evaluate defects again afterwards in a 3D view. If your manual inspection leads you to the conclusion that the defect was caused by sand residue, for example, you can easily remove this source of defect and avoid unnecessary scrap. This results in high cost savings. The software also enables results to be displayed in tabular form and output in common formats such as csv.
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Release time：2023-01-03 11:10 reading：1573 Continue reading>>
Apple Said to Inspire Intel 5G Chip
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Apple Said to Inspire Intel 5G Chip

Intel announced plans for an integrated 5G modem, targeting 2020, when the market is expected to be in full gear. The news could accelerate work on an integrated chipset from Qualcomm, which is expected to pick up the vast majority of the few sockets for 5G-only modems through 2019.Intel said that its XMM 8160, a 5G modem chipset also supporting LTE and 2G/3G, will ship in the second half of 2019, six months earlier than first planned. It will support data rates up to 6 Gbits/s and come in versions for millimeter-wave and sub-6-GHz bands, supporting standalone and non-standalone 5G modes.An earlier 5G-only modem, the XMM 8060, “is becoming a development platform” rather than a commercial product, said an Intel spokeswoman. Thus, Intel “will miss the 2019 5G launches, but it is targeting large-scale rollouts from customers such as Apple and [partner] Spreadtrum,” said Malik Saadi, vice president of strategic technologies for market watcher ABI Research.The commitment to an integrated part early in the 5G ramp suggests that Intel got backing from Apple, one or more large China handset makers, or both. “Intel could potentially secure at least 300 million-unit shipments for this first commercial 5G chip across its lifetime — not all chipset suppliers could claim such a performance,” said Saadi.ABI expects that as many as 728.7 million 5G devices will ship by the end of 2023. The market will start off slowly next year, with sales of about 18.5 million devices, it estimates.Qualcomm will command most the first year of sales, with the possibility of some sockets going to parts from Samsung and Huawei. By 2020, Samsung and Huawei should have their own 5G modems in play, possibly joined by others such as Mediatek, whose cellular modems has been lagging in time to market, said Saadi.Intel sketched out its plans for integrated 5G modems. Click to enlarge. (Source: Intel)Qualcomm is expected to react swiftly to Intel’s news, accelerating its plans for a modem supporting both 5G and earlier standards. But “integration normally takes time to get the right efficiency, performance, and scale,” said Saadi, noting that “Intel’s partnership with Apple is enabling Intel to be confident to generate scale.”LG has announced that it will ship a 5G handset early next year. Apple is expected to trailwith a handset in 2020.Qualcomm took a lead role in defining the 5G standard and bringing a commercial 5G-only product to market. It announced 19 customers for its Snapdragon X50 in February. But “challengers are closing the gap — mainly Intel, thanks to exclusivity with Apple, as well as Samsung and Huawei as they are increasingly using in-house chips,” said Saadi.Qualcomm aims to leverage its separate RF front-end modules to command business, especially from smaller handset makers. So far, Intel has not announced RFFE chips of its own but is expected to work with third parties such as Broadcom, Qorvo, and Skyworks on 5G RF reference designs.“Large OEMs still want to control the RFFE design since it is strongly correlated with the industrial design,” said Saadi. “Thanks to their scale, they can ask RF suppliers to customize these components for them.”“Smaller OEMs don’t have this privilege, so they have to do with off-the-shelf components,” he added.
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Release time：2018-11-14 00:00 reading：1022 Continue reading>>
<span style='color:red'>NSP</span> Tops PV Module Shipment Ranking in Taiwan for 1H18
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NSP Tops PV Module Shipment Ranking in Taiwan for 1H18

　　According to the Solar Powering Taiwan: Special Report by EnergyTrend, the Capex of PV power systems has been decreasing, due to the drop in module prices caused by massive PV installations. In 1H18, the system costs of PV projects in Taiwan have been decreasing, approaching the level in Germany, Italy and the Netherlands. EnergyTrend expects the system costs to drop further in the second half of this year, which may motivate companies to make investments.　　EnergyTrend notes that PV power systems involve low and controllable risk, with the capability for the generation of cash flow. The risks can be managed effectively with qualified EPCs and Insurers, who can also help with the maintenance of steady cash flow, via their understanding of system design and effective management of sites. Therefore, finance is also one of the main growth drivers for the development of PV power.　　As for the cost structure, the installations in Taiwan were limited to rooftop PV power systems in the early stages, and it was not until 2017 when ground-mounted PV power plants were permitted at a massive scale. Hence, there have been common standards for the structure and costs of rooftop models after years of usage. For roof-top corrugated aluminum mounting systems, the cost share of modules has declined from 48% to 40% between 2017 and 2018, when the share of inverters has also slipped from 11% to 6% in 2018 as the Chinese inverter brands forayed into the Taiwanese market, causing price competition in the market.　　NSP recorded the highest module shipments in Taiwan for 1H18　　The module shipment volume of NSP topped the Taiwan market, surpassing that of AUO in the first half of this year. With high reputation and wide market recognition, AUO and NSP are now the two foremost suppliers in Taiwan. Going forward to 2019, the market situation remains to be seen, as the existing domestic module makers are scrambling to tap the market’s huge potential. This includes TSMMC, the newly established joint venture, TSEC which has set up a new module fab in Pingtung County, as well as Neo Solar Power, Gintech, and Solartech, which will merge into United Renewable Energy Co., Ltd.in October 2018.　　Delta secures 40% share and tops the inverter market in Taiwan　　While 70% of the issues during the construction of PV power systems is related to foundation, inverter issues contribute to 70% of the problems after the construction. Therefore, how to provide after-sales maintenance and repair service has been a major consideration in the marketing strategy of inverter brands. In Taiwan, Delta, Satcon, and SMA take the first three places in the inverter shipments for 1H18, with long history maintenance and repair centers in Taiwan to make it easier to provide after services. Particularly, 40% of the market share is secured by Taiwan’s leading inverter supplier Delta.
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Release time：2018-09-20 00:00 reading：950 Continue reading>>
DesignSpark Safety enables embedded safety in equipment development
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DesignSpark Safety enables embedded safety in equipment development

　　RS Components (RS), supported by Schmersal and 3M who are developers of safety products for industry, has launched DesignSpark Safety, the latest tool to be added to the growing DesignSpark portfolio of free-for-download software for product designers and engineers.　　Accessible via the DesignSpark.com community website, DesignSpark Safety is an intuitive risk-assessment tool that enables companies to embed safety into their end-to-end product design process for the development of machinery.　　DesignSpark Safety is an embedded software solution that comes with associated support materials, and provides designers with a risk score for their planned product development. It is intended to aid the provision of CE Mark documentation, as well as helping in the reduction of potential hazards and ensuring compliance with the global ISO 12100 safety-standard, which specifies basic terminology, principles and a methodology for achieving safety in the design of machinery.　　Key users are expected to find significant value in the tool and include industrial machinery designers and integrators, along with industrial engineers tasked with improving safety standards on existing machinery.　　The new tool enables companies and designers of machinery to meet all the relevant regulations, standards and directives, and minimise the risk of injury to those employed in industries such as manufacturing and processing, among many others.　　DesignSpark Safety is also intended to help significantly reduce costs for users by removing the need for potentially costly external consultants to carry out detailed risk assessments. Although spreadsheet templates are commonly used in the industry as a more affordable alternative to consultants, they do not always provide an appropriate level of detail and do not provide the relevant documentation upon completion.　　“DesignSpark Safety is the first powerful and free risk-assessment tool to be made available in the industry,” said Mike Bray, Vice President of DesignSpark at RS. “In addition to expanding the DesignSpark portfolio, the software delivers exceptionally easy access to a professional solution for all engineers by removing the barriers of cost and complexity. Embedding safety into their product development enables the streamlining of designs and the avoidance of costly retrofit solutions.”
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Release time：2017-10-31 00:00 reading：2107 Continue reading>>
GE Venture, Nvidia Bond over Inspection AI
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GE Venture, Nvidia Bond over Inspection AI

　　The movers and shakers in a host of different industrial sectors are awakening to the looming impact of artificial intelligence. Few companies, however, have solid strategies to cope with the way their business will change, nor do most have a clear idea about when and how to implement AI, and with whom to partner to make it happen.　　Avitas Systems, a GE Venture, and Nvidia are taking steps to bring some clarity to the use of AI in the industrial sector. The companies announced Thursday (Sept. 7) a partnership to work together enabling AI in inspection services for the oil, gas and transportation industries.　　Nvidia posted in its latest blog, "How do you send a human being to inspect a petroleum refinery flare stack — one that operates at hundreds of degrees and requires negotiating a high-risk vertical climb? The answer is you don’t."　　Where and how AI is used　　Presumably, drones and crawling robots will do those jobs. But where and how exactly will AI fit into such an inspection process for the industrial market?　　We asked Alex Tepper, founder and head of corporate and business development at Avitas Systems, to break it down. “There are many different spots where AI will be used,” he said.　　First, AI can develop “optimal flight patterns” for drones to collect data in images and video.　　Further, AI can create 3D models of an “asset” — a transmission tower, pipelines or oil refineries. It can then layer “points of interest” on top of such 3D models to enable drones and robots to spot anomalies such as cracks or corrosion, thus automating the defect detection process.　　AI also has powers to “fuse” sets of different sensory data, said Tepper, developing algorithms that will help with risk analysis and predict when the next inspection is necessary, for example.　　Of course, lots of companies are beginning to use drones and robotics to remotely inspect industrial infrastructure. Naturally, AI helps map out optimized “repeatable” paths for drones.　　The key word is “repeatable.” Tepper explained that the repeatability of a drone’s path, for example, can create an opportunity for deep learning. Ultimately, the benefits of AI are in “risk-based data collection” and “development of master algorithms for risk analysis,” he added.　　Division of labor　　As for the collaboration between Nvidia and Avitas Systems, which company does what? How’s this going to work?　　Avitas Systems is tasked with providing subject matter experts and AI data scientists. Nvidia offers DGX-1 and DGX Station systems for AI training — involved in automated defect recognition.　　“We provide tools — AI development frameworks and CUDA platform — which helps unleash the skill set of Avitas’ data scientists,” explained Jim McHugh, General Manager of DGX Systems for Nvidia.　　Tepper added, “As we collect a massive number of high definition pictures collected by drones, we need a place to store and process data, and run models and algorithms. For that, we need a huge amount of computing power,” which Nvidia provides.　　AI’s benefits to the inspection services industry are clear. AI can bring more accurate data-based risk analysis, compared to traditional time-based inspection practices, which can be expensive and which could miss critical defects that escape the inspection window.　　AI's missing link?　　But what are the limitations of today’s AI? Still missing, according to Tepper, is an AI ability to compute on the very edge device itself.　　The goal, he said, is to run AI algorithms on the edge, inside a drone, for example. The drone, then, could change its behavior in flight — literally on the fly, he explained.　　Avitas Systems does AI training in its data center using Nvidia’s DGX-1. It’s also pushing AI into the field, by using a van-mounted Nvidia DGX Station. “But we want to push it further — really onto the edge,” stressed Tepper. Obviously, the industry is not there yet.　　DGX-1, DGX Station　　No doubt, Avitas Systems is pushing the boundaries of AI and inspection services. Nvidia’s McHugh confirmed that “Avitas Systems is breaking new ground by bringing NVIDIA DGX Station beyond the deskside and into the field for the first time.”　　As McHugh explained, it was Avitas Systems’s Tepper who approached Nvidia, asking if a DGX Station — designed for use in an office — could be ruggedized and used “on location.”　　By “on location,” Tepper meant in the field, in 110-degree heat or on the frozen Nordic Sea. Of course, the DGX Station wouldn’t sit naked in the desert. It would be housed in a van, but still subject to conditions far more severe than an office.　　Using the DGX Station on location is particularly important, because “the industrial sites being inspected are sometimes located near the ‘edge of civilization’” explained Nvidia. Facilities that require inspection are often far removed from a robust networking infrastructure. “The voluminous flow of data returning from field drones and robots is often too large to be fed back to the data center for deep learning inferencing,” Nvidia added.　　Avitas Systems stores deep-learning models in an AI Workbench, a solution that can process inspection data in real-time and retrain models to adapt to new uses. Tepper said the plan is to expand the company’s AI Workbench capabilities using the new NVIDIA DGX Stations with Volta.　　Asked how industrial companies sector are embracing AI today, Tepper said, “There is general excitement,” partly because of cost pressure.　　As companies fly unmanned drones, they make inspection both safer and cheaper. More important, repeatable analytics enable Avitas to know exactly when to inspect and when best to initiate maintenance measures.　　According to Avitas Systems, industrial inspections are, yearly, a $40 billion business. “Some companies can spend $100 million annually on inspections, and five times as much on maintenance,” according to Tepper. He believes his company can lower inspection costs by as much as 25 percent.　　Avitas Systems was one of the new business projects created in GE Venture’s incubator. Fully funded by GE, it is now a 100 percent GE-owned subsidiary.　　The company, however, declined to disclose either the names or number of customers it’s working with.
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Release time：2017-09-11 00:00 reading：1261 Continue reading>>
Wearable Stress Sensor Monitors Transportation Efficiency
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Wearable Stress Sensor Monitors Transportation Efficiency

　　The French research institute CEA-Leti has developed two new tools intended to provide data on modes of transportation. This includes a wearable stress monitor, in the form of a wristband worn by transport users, and a smartphone app which detects which mode of transportation the person is using and estimates the environmental impact of the user’s decisions.　　The stress sensor is the world’s first to be validated both in the laboratory and in real-life experiments, based on proven and reliable experimental protocols, said Stéphanie Riché, head of the Sensors and Systems Lab at CEA-Leti.　　"Stress monitoring project announcements are flourishing this last year, but monitoring stress levels with wearable devices is very challenging," Riché said. "The key point is to setup the experimental protocols in a reliable and reproducible manner."　　The new stress monitor uses a combination of accelerometer, galvanic skin response and heart rate information to estimate how stressed the user is. The CEA-Leti research focused on signal processing (it is sensor hardware agnostic) and on generating new indicators to track stress levels in real life conditions.　　Since acquiring reliable biometrics when someone is on the move is extremely difficult, CEA-Leti also researched the characterization of existing wearable sensors in real usage conditions, in order to exclude erroneous or irrelevant data. The researchers also produced a reference database of signals acquired in the laboratory using the well-known Trier Social Stress Test. Based on this database, machine learning algorithms classify different levels of stress.　　"We have observed that in advanced society, stressful situations are increasing. We wanted to see how our methodology in terms of signal processing could be leveraged to bring technological ways to help to tackle this new societal problem," Riché said.
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Release time：2017-07-19 00:00 reading：1039 Continue reading>>

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