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<span style='color:red'>AMEYA360</span>:Abracon PRO-EX External Whip Antennas

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AMEYA360:Abracon PRO-EX External Whip Antennas

　　Abracon PRO-EX External Whip Antennas are highly reliable and sensitive antennas that are easy to install. These antennas are easy to install and RoHS compliant. The PRO-EX external whip antennas operate within the 2400MHz to 2485MHz frequency range. These antennas feature 3dBi peak gain, 50Ω impedance, and -40C to 85C operating temperature range. Typical applications include Wi-Fi/BLUETOOTH/ZigBee, network devices, and Internet of Things (IoT).　　FEATURES　　High reliability and sensitivity　　Easy to install　　Compact design　　RoHS compliant　　3dBi peak gain　　50Ω impedance　　-40°C to 85°C operating temperature range　　APPLICATIONS　　Wi-Fi/Bluetooth/ZigBee　　Network devices　　Internet of Things (IoT)

Key word：

Abracon

Release time：2023-04-28 11:07 reading：2086 Continue reading>>

<span style='color:red'>AMEYA360</span>:Analog Devices Inc. EVAL-CN0566 Evaluation Board

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AMEYA360:Analog Devices Inc. EVAL-CN0566 Evaluation Board

　　Analog Devices Inc. EVAL-CN0566 Evaluation Board is a low-cost, phased-array beamforming antenna demonstration platform. This board offers an opportunity to explore beamforming, beam steering, antenna impairments, Frequency-Modulated Continuous Wave (FMCW) radar, and synthetic aperture imaging. The CN0566 board features an 8-element phased array, 10GHz to 10.5GHZ operating range, 360° phase adjustment with 2.8° resolution, and 31dB gain adjustment with 0.5dB resolution. The CN0566 evaluation board is ideally used for satellite communications, 5G mobile communications, automotive, military, and commercial radars.　　FEATURES　　10GHz to 10.5GHZ (X band) beamforming platform　　8-element phased array antenna　　2.2GHz frequency　　360-degree phase shift w/2.8 degree resolution　　31dB amplitude tuning range w/0.5dB resolution　　Digitized with PlutoSDR　　USB to micro-USB cable　　Attached Raspberry Pi 4 and PlutoSDR　　5V, 3A, USB-C power adapter　　RoHS compliant　　APPLICATIONS　　Satellite communications　　Commercial radar systems　　5G mobile communications　　Military　　Automotive

Key word：

Analog Devices

Release time：2023-04-27 13:09 reading：2702 Continue reading>>

<span style='color:red'>AMEYA360</span>:China, CHIPS and Supply Chain Disruption

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AMEYA360:China, CHIPS and Supply Chain Disruption

　　Sanctions by the U.S. and its allies will, in the long term, limit China’s ability to manufacture leading-edge chips. But in the short term, China’s ability to produce more mature products may be a boon to the nation, said Richard Barnett, CMO of Supplyframe, a supply chain intelligence platform.　　China, CHIPS and Supply Chain Disruption　　A recent update to the U.S. CHIPS Act is discouraging international high-tech investment in China, according to market research firm TrendForce. The act now bans beneficiaries from investing more than $100,000 to expand existing facilities in China, Russia, Iran and North Korea for 10 years from the date of a CHIPS Act award. This move will further reduce the willingness of multinational semiconductor companies to invest in China for the next decade.　　TSMC, for example, has expansion plans in both the U.S. and China. TSMC’s development at its Fab 16 plant in China has so far focused 28nm processes, according to TrendForce. Its plans for 16/12nm and 28/22nm processes at Fab 16 in China are limited for the next decade upon receiving the U.S. subsidies. Furthermore, 85 percent of the output must meet local market demand in China.The U.S. CHIPS Act could impact TSMC's plan to produce chips in China　　Such measures only add uncertainty to an already-stressed supply chain, said Barnett. “Bottom line – constrained supply will linger for select devices in H2.”　　Keeping China in check　　U.S. restrictions on shipments to China of graphics processors and AI accelerators and other sweeping U.S. export controls mean that the expansion of both Chinese foundries and multinational foundries in China will be suppressed to varying degrees — regardless of whether they are advanced or mature processes, said Barnett.　　The impact from restrictions on on fab equipment is still 18 to 36 months out, he added, as it applies to new machines and new facilities. “There’s a lag between new equipment orders and new lines going up,” he said. “For mature, existing equipment it’s likely China is seeking alternative service providers. There’s little visibility into equipment orders and capacity plans that were made a year or more ago.”　　Trade restrictions and sanctions could intensify further, he added, expanding more completely into semiconductor and passive component manufacturing and design intellectual property. This would spur China to seek IP from other Asian countries.　　Chinese IC design companies are already shifting existing and new orders to Taiwanese foundries under pressure from clients, TrendForce reports. Tier-2 and -3 companies such as VIS and PSMC, which mainly focus on mature processes, are capturing orders rerouted from Chinese foundries. TrendForce predicts this shift in orders will ensure recovery for foundries currently impacted by inventory adjustment and low capacity-utilization rates, especially from 2H 2023 until 2024.

Key word：

AMEYA360

Release time：2023-04-26 11:33 reading：1067 Continue reading>>

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AMEYA360:It’s Time for Fresh Look at Stale Date Codes

　　Component date codes are used, among other purposes, to indicate the “freshness” of electronic parts. Products older than two years have widely been considered to have a risk of failure. But improvements in the manufacturing, packaging, storage and warehousing of components have virtually eliminated the defect rate of aging parts.　　The viability of aging components has become a significant issue in the ongoing semiconductor shortage. Master distributor Waldom Electronics Corp., which resells components exclusively to other authorized distributors, is so confident of the slow moving/excess (SM&E) parts it carries it has extended the warrantee of these products from one year to two.　　Component date codes are used to indicate the "freshness" of components　　Source: Autodesk Instructables　　In 2022, Waldom shipped more than 162,000 lines of SM&E devices. Of that, the number of customer complaints resulting from a defective or out-of-spec product was 17, said Waldom’s Director of Quality Dan Heinen.　　Component age does not adversely affect component performance to the manufacturers specification, as evidenced by several reports and conclusions drawn by Electronic Component Industry Association (ECIA). “Component warranties are not affected by the age of components at the time of sale,” the association reported.　　The chip shortage has increased demand for all semiconductors but mature parts, 90 nm or above, are particularly sought by the automotive industry. Vehicle designs often span decades whereas chip designs change frequently. Research conducted by component manufacturers, distributors and other organizations has shown that aged products perform just as well as new.　　However, certain industries restrict the use of older components.　　Battling component ageism　　Electronic components are susceptible to heat, cold and moisture; rough handling; electro-static discharge and other hazards. Aged components are more likely to have been exposed to these conditions simply because they’ve been around awhile.　　“It is not uncommon in the electronics industry to specify a maximum time interval from device manufacture to shipment and receipt by the customer,” Texas Instruments wrote in an application report. “The origins of date code age restrictions are not well documented, but it is probable that limitations of the packing materials for moisture-sensitive components and post-storage solderability of SnPb or Sn finishes contributed to the concerns of customers that led to the shelf-life restrictions.”　　When stored properly, rigorous industry testing methods under harsh and unfavorable conditions have shown that the solderability, packaging and storage integrity of aged products was not been compromised.　　Reselling – rather than returning or scrapping – aged components is a win-win for component suppliers and distributors, Heinen explained. Scrapping components is transaction-intensive and requires materials reporting, traceability and proof of proper disposal. When such parts are resold, suppliers can recoup as much as 50 percent of the sale.

Key word：

AMEYA360

Release time：2023-04-25 11:26 reading：1886 Continue reading>>

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AMEYA360:Arm’s Gambit Could Rattle Relationships

　　In anticipation of one of the biggest IPOs of the year, Arm is changing its licensing model and developing its own mobile processors — moves that are being contested by some of its biggest customers and device makers and will dramatically shift market dynamics and the supply chain.Arm’s Gambit Could Rattle Relationships.　　Almost all smartphone and tablet vendors currently use Arm-based processors for their devices, purchasing them from Qualcomm, MediaTek, Samsung, and HiSilicon. Currently Arm collects a licensing fee for each chip manufactured.　　Instead of licensing its technology to semiconductor companies such as Qualcomm and MediaTek, collecting around 1 percent to 2 percent of the chips’ selling price, Arm wants to collect a percentage of the devices’ average retail value. According to some sources, Softbank and Arm are trying to collect a substantial share of the revenues of mobile device vendors.　　Arm’s clout in the mobile market is considerable. Last month, Arm’s owner Softbank released its 2023 financial report highlighting the increase of Arm’s technology adoption across the entire computing ecosystem, including mobile, gaming, automotive, and billions of microcontrollers.　　At the same time, Softbank’s financial report acknowledged that a principal risk to Arm’s business was the “significant concentration” in its customer base. In 2022, 86 percent of its revenue came from the company’s 20 biggest customers, so “the loss of a small number of key customers could significantly impact the group’s growth.”

Key word：

Arm

Release time：2023-04-25 11:22 reading：1829 Continue reading>>

<span style='color:red'>AMEYA360</span>:NOVOSENSE NST1002 facilitates accurate CGM measurement with glucose monitoring black technology

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AMEYA360:NOVOSENSE NST1002 facilitates accurate CGM measurement with glucose monitoring black technology

　　Glucose monitoring is a key link in diabetes management. Currently, there are two main methods for self-monitoring of glucose in patients with diabetes, one is the traditional blood glucose Monitoring (BGM), and the other is continuous glucose monitoring (CGM). CGM can provide dynamic, comprehensive and reliable whole-day glucose information to understand the trend of glucose fluctuations, and find hidden hyperglycemia and hypoglycemia, thus becoming a new trend in glucose monitoring.　　Principle and technical difficulties of CGM　　CGM allows real-time monitoring of glucose concentration in subcutaneous tissue fluid by implanting glucose sensors. Sensor is the core component of CGM system with high barriers, which directly determines whether the measurement results of CGM system are accurate. Sensor electrode, film layer, sensing layer and calibration algorithm are also the key to determine the performance.　　The CGM system measures glucose concentration in interstitial fluid. Although there is a high correlation with glucose concentration, the difference between the two is not constant. There are great differences between concentration difference and the time to reach concentration equilibrium in different physiological states such as rest, post-meal, exercise, respiration and hypoxia. In addition, factors such as electrode passivation and exotic reactant coating on the surface of the sensor will also cause the sensitivity of the sensor to change with the change of implantation time. In the actual application, environmental temperature, external pressure and other factors can bring measurement errors.　　The above problems can be solved by the calibration algorithm. In the calibration algorithm model, as an important variable, the ambient temperature or body surface temperature has an important impact on the effectiveness of the algorithm model.　　NST1002 facilitates accurate CGM measurement　　The NOVOSENSE NST1002 is a high-precision, low-power temperature sensor that can sense changes in ambient temperature or body surface temperature in real time and adjust the algorithm accordingly to make glucose monitoring more accurate.　　Structure design and installation position of temperature sensor NST1002 applied in CGM　　In the actual application of CGM products, the structure design and installation position of NST1002 are also very particular. In terms of structure design, NST1002 can be close to the skin of the body surface to achieve accurate collection of body surface temperature, so as to provide more effective data.　　With accumulated rich experience in surface temperature acquisition solutions, NOVOSENSE temperature sensor can help customers quickly complete product structure design and material selection. The flexible probe of the interstitial fluid glucose sensor is less than 0.4 mm in diameter and can be inserted 5 mm below the skin to ensure accurate sensing of glucose concentration in the interstitial fluid outside the cells.

Key word：

NOVOSENSE

Release time：2023-04-24 11:26 reading：3021 Continue reading>>

<span style='color:red'>AMEYA360</span>:Next-Gen EVs Need Battery and Powertrain Innovations

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AMEYA360:Next-Gen EVs Need Battery and Powertrain Innovations

　　At the recent Advanced Automotive Technology Forum 2023, from EE Times, industry experts discussed some of the battery and powertrain innovations needed for the next generation of electric vehicles (EVs), and challenges the industry faces to implement them.　　An all-electric vehicle. (Source: U.S. Department of Energy)　　EVs have been around for well over a decade. But while their adoption is growing, it will take some time before they capture a sizeable share of the market. For example, out of approximately 80.6 million new cars sold globally last year, less than 10% (7.8 million) were electric, according to a slide presented by Patrick Le Fèvre, chief marketing and communications officer at Powerbox.　　Meanwhile, sales of cars are increasing and the number of vehicles on the road is growing, too. If today there are around 1.6 billion vehicles worldwide, by 2035 that number will grow to nearly two billion, according to the slide from Powerbox. In the EU, 2035 will be the year when sales of new cars with internal combustion engines (ICEs) will be banned. So, by that time, most automakers will have introduced top-to-bottom EV lineups.　　There are many reasons why the adoption rate of EVs is relatively slow, and perhaps the best way to speed it up is to make EVs more attractive in general. There are several ways to do so, but many innovations are required.　　For example, batteries and power electronics are among the major challenges. Specifically, as EVs require up to 20× more power compared with traditional automobiles, they present a considerable challenge for power experts in terms of building energy-efficient power conversion solutions, powertrain development and battery technology.　　Converters and inverters need work　　Today, most hybrid/plug-in hybrid electric vehicles (HEV/PHEV), as well as EVs, use converters and DC-AC invertors that comprise of silicon-based insulated gate bipolar transistors (IGBTs). These components are, in many cases, not compact and are not very efficient, yet they are cheap as they have been around for decades, according to a slide demonstrated by Pietro Scalia, director of automotive traction solutions at Onsemi.　　For now, IGBTs may be good enough for most mass market applications. But the HEV/PHEV market will decrease as car manufacturers focus on battery-powered EVs (or BEVs), so higher-performance converters and inverters will get more widespread as EVs tend to feature higher performance traction motors.　　Furthermore, while sedans and crossover EVs will remain the most popular types of vehicles with the highest market shares, SUVs, trucks and sports cars will see increased demand after 2025, which will rise demand for >250kW electric drives, according to Onsemi’s slide. This will increase demand for higher performance, higher efficiency, and smaller converters and invertors.　　EV, HEV, and PHEV market trends and power class segmentation. (Source: Onsemi)　　Building compact and efficient power-conversion solutions requires using wide-bandgap (WBG) semiconductor materials, such as gallium nitride (GaN) and silicon carbide (SiC). When compared with silicon, they offer higher power density (high electron mobility and breakdown voltage allows to build smaller and lighter PSUs), high efficiency (less power loss and lower temperatures, which lead to reduced cooling requirements and lower costs), fast switching speeds (leads to improved power conversion efficiency and reduced electromagnetic interference), and wide temperature ranges (higher reliability and durability).　　While both GaN and SiC offer tangible advantages in power conversion applications, they are not interchangeable in all use cases, and the choice between the two depends on the specific requirements. For example, GaN has a higher electron mobility and can achieve higher power densities, which makes it more suitable for in-vehicle applications and chargers.　　Actually, usage of GaN for in-car electronics like LiDAR, infotainment and headlights has been increasing and will keep increasing in the future. Furthermore, some traction motors now also use GaN converters, said Alex Lidow, CEO and co-founder of EPC, a supplier of GaN-based devices.　　“Today, if you have a LiDAR system on a car, whether it be autonomous or just a level two or level three, that has GaN devices in it,” he said. “We have been on headlights with GaN for almost 10 years, infotainment systems, wireless charging, other than for the car, but wireless charging inside the car, and all sorts of advanced things like augmented reality heads up displays. These are all homes for GaN. As sure as the sun comes up in the morning, [GaN] will replace silicon, and everything that is in the 48-V range. We will see whether or not it moves to the traction [motors], and the onboard charging in the future, as well.”　　Uses of GaN in cards. (Source: EPC)　　On the other hand, SiC can handle higher voltages and offer better thermal performance, making it a suitable choice for high-power and high-temperature applications, such as traction inverters in EVs. Also, SiC technology is more mature and is sometimes cheaper to implement. Some SiC-based inverters may be cheaper than IGBT-based inverters.　　“Finding the sweet spot of the performance versus the cost of the material [is important], I had a sweet spot at 250kW, where I can easily demonstrate that SiC is cheaper than IGBT in terms of area given the delta cost, calculating the extra need the you have to put in place for dissipating, you can have a much cheaper solution with silicon carbide,” Onsemi’s Scalia said.　　It goes without saying that with higher efficiency comes miniaturization and weight loss on components levels, which in turn allows us to build more comfortable cars with longer range or make cheaper cars with sufficient range for everyday needs. Cost-efficient SiC MOSFETs along with innovative packaging opens doors to lower-cost EVs with decent motors.　　“One part of our strategy at Qorvo [is addressing the] explosion of lower powered cars that are going to come,” said Anup Bhalla, chief engineer of power devices at Qorvo.　　There is a persistent need in “getting the cost out of the solution for the people who want to build EV traction inverters and to make the [EV] technology more accessible,” he added.　　Finding the right balance between an inverter or converter cost, efficiency, and reliability is a challenge that makers of SiC and GaN components, as well as EVs, must address whenever they build a new car, converter or inverter.　　“When we tackle an inverter design with a customer, there is a lot of back and forth how they can extract the maximum benefit [as there are] regular tensions between efficiency they want to get the cost they are willing to pay,” Bhalla said. “This cost is always tied in with the reliability impact of trying to go too cheap. This system has to in the end be very reliable. And everybody has their own take on how they need to build the inverter to define their own advantage.”　　Bhalla demonstrated a compact dual side cooled 150kW (12ohm/1200V) inventor comprising of three SiC MOSFETs in a top cool discrete package, as well as another invertor solution featuring top-cooled SiC MOSFETs that could be used for such applications.　　“People will need to put traction inverters designed differently, maybe designed right around the motor, needing different form-factors,” he said. “Then they need different kinds of packaging solutions. The great thing is that these devices have become so efficient, that we can consider putting them into a top-cooled package getting a moderate amount of heat out and then build a traction inverter out of it.”　　Onsemi’s slide claimed that usage of its EliteSiC Powertrain extends range by 8 to 12% due to higher efficiency compared with IGBT-based solutions. Furthermore, for high performance inverters, SiC is preferrable for many reasons, so its adoption is set to grow.

Key word：

AMEYA360

Release time：2023-04-23 10:42 reading：2685 Continue reading>>

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AMEYA360:Microchip Technology EV01G21A Curiosity Nano Evaluation Kit

　　Microchip Technology EV01G21A Curiosity Nano Evaluation Kit is a hardware platform to evaluate microcontrollers (MCUs) in the PIC18F Q71 family. This board has the PIC18F56Q71 MCU mounted. Supported by MPLAB? X IDE, the board provides easy access to the features of the PIC18F56Q71 to explore how to integrate the device into a custom design. The Microchip Technology Curiosity Nano series of evaluation boards include an onboard debugger. No external tools are necessary to program and debug the PIC18F56Q71.　　FEATURES　　PIC18F56Q71 microcontroller　　One yellow user LED　　One mechanical user switch　　One 32.768kHz crystal footprint　　Onboard debugger　　Board identification in MPLAB? X IDE　　One green power and status LED　　Programming and debugging　　Virtual serial port (CDC)　　One debug GPIO channel (DGI GPIO)　　USB-powered or externally powered　　Adjustable target voltage　　MIC5353 LDO regulator controlled by the onboard debugger　　1.8-5.1V output voltage (limited by USB input voltage)　　500mA maximum output current (limited by ambient temperature and output voltage)

Key word：

AMEYA360,Microchip

Release time：2023-04-21 14:46 reading：2129 Continue reading>>

<span style='color:red'>AMEYA360</span>:ZEISS Xradia CrystalCT

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AMEYA360:ZEISS Xradia CrystalCT

　　ZEISS Xradia CrystalCT computed tomography platform uniquely augments this powerful imaging technique with the ability to reveal crystallographic grain microstructures, transforming the way polycrystalline materials (such as metals, additive manufacturing, ceramics, pharmaceuticals and others) can be studied, leading to newer and deeper insights for your materials research.　　Advance materials characterization and discovery through groundbreaking diffraction scanning modes Perform non-destructive mapping of grain morphology in 3D Characterize materials such as metals, alloys, and ceramics Map larger volumes and a wider array of sample geometries at higher throughput Achieve superior sample representivity

Key word：

ZEISS,AMEYA360

Release time：2023-04-20 11:15 reading：2197 Continue reading>>

<span style='color:red'>AMEYA360</span>:NXP Semiconductors PCA9451AHN PMIC

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AMEYA360:NXP Semiconductors PCA9451AHN PMIC

　　NXP Semiconductors PCA9451AHN PMIC is a highly integrated power management solution for reliable and efficient application performance. NXP Semiconductors PCA9451AHN are designed to support i.MX 93x family processors. This single-chip PMIC is versatile enough to cater to 1-cell Li-Ion, Li-polymer battery portable applications, and 5V adapter non-portable applications. The PCA9451AHN is packed with features that make it a top choice for engineers looking to design power-efficient solutions.　　FEATURES　　Six high-efficiency step-down regulators　　One 4A dual-phase buck regulator with DVS feature and remote senseOne 2A buck regulator with DVS feature and remote senseOne 3A buck regulator　　One 2A buck regulator　　One 1.5A buck regulator　　Three linear regulators　　One low IQ 10mA LDO　　One 150mA LDO　　One 200mA LDO　　400mA load switch with a built-in active discharge resistor32.768kHz crystal oscillator driver and buffer outputProduct longevity program　　This product is included in the NXP Product Longevity program, with assured supply for a minimum of 15 years after launch APPLICATIONS　　Automotive　　Hue bridge　　Smart home　　Audio sound bar　　Energy grid equipment　　Energy meter　　Environmental control　　Home security hub　　Sensor hub　　Smart doorbell　　Smart lock　　Industrial　　EV charging station　　I/O control　　Industrial gateway　　Industrial HMI　　Machine vision and scanning

Key word：

NXP,PCA9451AHN

Release time：2023-04-19 13:36 reading：2200 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor

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