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<span style='color:red'>AMEYA360</span>：Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board

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AMEYA360：Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board

　　Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board is designed to demonstrate the CoolSiC MOSFET module and Silicon-On-Insulator (SOI) gate driver technology for motor drives. This eval board is powered by a 6ED2231S12T 1200V, a three-phase gate driver. The EVAL-6ED2231S12TM1 board features an EasyPACK 1B CoolSiC MOSFET 1200V module, one three-phase SOI gate driver IC, and an M1 connector. This eval board supports over current protection, Fault reporting, automatic Fault clear, and Enable function on the same pin (RFE). Typical applications include ceiling fans, Heating Ventilation and Air Conditioning (HVAC), industrial motor drives and controls, motor control and drives, and residential heat pumps.　　FEATURES　　1200V SOI technology　　5000W maximum motor power　　200V minimum and 800V maximum supply voltage　　Best-in-class minus VS performance　　Withstands negative 100V with repeating 700ns pulse widths　　Integrated, ultra-fast, and low RDSON bootstrap diode　　IO+ 350mA and IO- 650mA output current　　Over current protection (ITRIP ±5% reference)　　Integrated 360ns dead-time　　Independent under-voltage lockout for VCC and VBS　　3.3V, 5V, and 15V input logic compatible　　Fault reporting, automatic Fault clear, and Enable function on same pin (RFE)　　2.5kV HBM ESD and 25V VCC capable　　SOIC-28 with 4 pins removed for high clearance DSO-24 package　　APPLICATIONS　　Ceiling fan - motor control and drive solutions　　Heating Ventilation and Air Conditioning (HVAC)　　Industrial motor drives and controls　　Motor control and drives　　Residential heat pumps

Key word：

Infineon,EVAL-6ED2231S12TM1

Release time：2023-03-28 14:59 reading：1917 Continue reading>>

<span style='color:red'>AMEYA360</span>;STMicroelectronics M95P16 Ultra Low Power 16-Mbit SPI Page EEPROM

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AMEYA360;STMicroelectronics M95P16 Ultra Low Power 16-Mbit SPI Page EEPROM

　　STMicroelectronics M95P16 Ultra Low Power 16-Mbit SPI Page EEPROM is based on Non-Volatile Memory (NVMe) technology. This M95P16 comes with byte flexibility, page alterability, high page cycling performance, and ultra-low power consumption, equivalent to EEPROM technology. The M95P16 EEPROM is organized as 4096 programmable pages of 512 bytes each, accessed through an SPI bus, with high-performance dual-and quad-SPI outputs. This M95P16 EEPROM features ultra-low power consumption, ECC for high memory reliability (DEC, TED), Schmitt trigger inputs for noise filtering, and electronic identification. The M95P16 EEPROM supports up to 80MHz clock frequency, 1.6V to 3.6V supply voltage range, and is ECOPACK2 (RoHS compliant) and halogen-free.　　The M95P16 EEPROM offers two additional (identification) 512-byte pages. The first contains identification data and, upon request, the UID. The second can store sensitive application parameters, which later can be permanently locked in read-only mode. This M95P16 EEPROM accepts page/block/sector/chip erase commands to set the memory to an erased state.　　FEATURES　　ECC for high memory reliability (DEC and TED)　　Schmitt trigger inputs for noise filtering　　Output buffer programmable strength　　Operating status flags for ISO26262　　Software reset　　Write protection by block, with top/bottom option　　Unique ID upon request　　Electronic identification　　Supports SFDP (serial flash discoverable parameters) mode　　JEDEC standard manufacturer identification　　Package:　　ECOPACK2 (RoHS compliant) and halogen-free packages:　　DFN8 2mm x 3mm　　SO8N　　WLCSP8　　SPECIFICATIONS　　Interface:　　Supports Serial Peripheral Interface (SPI) and dual/quad outputs　　1.6V to 3.6V VCC wide voltage range　　Temperature range:　　-40°C to 85°C (industrial)　　-40°C to 105°C (extended)　　Fast read:　　50MHz read single output　　80MHz fast read single/dual/quad output with one dummy byte　　Memory:　　16 Mbit of page EEPROM　　32-Kbyte blocks and 4-Kbyte sectors　　512 bytes page size　　Two identification pages　　500k cycles on full temperature range write endurance　　Data retention:　　100 years　　10 years after 500k cycles　　Ultra-low power consumption:　　0.6μA (typical) in deep power-down mode　　16μA (typical) in standby mode　　800μA (typical) for read single at 10MHz　　1.5mA (typical) for page write　　Current peak control <3mA　　High write/erase performance:　　Fast write/program/erase times:　　2ms (typical) for byte and page write (includes auto-erase and program) for 512 bytes　　1.2ms (typical) for page program (512 bytes)　　1.1ms (typical) for page erase　　1.3ms (typical) for sector erase　　4.0ms (typical) for block erase　　8ms (typical) for chip erase　　Page program with buffer load

Key word：

AMEYA360,STM

Release time：2023-03-28 14:48 reading：1602 Continue reading>>

<span style='color:red'>AMEYA360</span>：TE/ AMP Micro CT Connectors

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AMEYA360：TE/ AMP Micro CT Connectors

　　TE Connectivity's / AMP Connectors AMP Micro CT Connectors are designed to provide an economical wire routing solution for power or signal needs. These connectors offer impressive performance in their harness-making capability. The AMP micro CT connectors feature IDC termination, discrete wire interconnects, and AWG 26 to 28 cable sizes. These CT connectors offer an expansive range of configurations, and the circuits range from 2-25 single rows. The AMP micro CT connectors are RoHS compliant and operate within the -30°C to 85°C temperature range. Typical applications include business equipment, industrial machines, printers, PCs, and air conditioners.　　FEATURES　　Small footprint　　Efficiency optimizations　　Expansive range of configurations　　Superior performance　　Cost-effective　　IDC termination　　Discrete wire interconnect　　Circuits range from 2-25 single row　　AWG 26 to 28 cable sizes　　RoHS compliant　　UL/CSA listed: File E28476　　APPLICATIONS　　Business equipment　　Industrial machines　　PC　　Printer　　Fax　　C-TV　　Audio　　Air conditioner　　Anywhere signals and power are routed

Key word：

AMEYA360,AMP

Release time：2023-03-27 11:49 reading：1457 Continue reading>>

<span style='color:red'>AMEYA360</span>:Dioo independently developed DIA2641 through vehicle regulation certification

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AMEYA360:Dioo independently developed DIA2641 through vehicle regulation certification

Key word：

Dioo,DIA2641

Release time：2023-03-27 11:40 reading：2587 Continue reading>>

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Ameya360:NXP Semiconductors GoldBox 3 Vehicle Networking Development Platform

　　NXP Semiconductors GoldBox 3 Vehicle Networking Development Platform is designed for vehicle Service-Oriented Gateways (SoGs), domain control applications, high-performance processing, and safety and security applications. This development platform offers high-performance computing capacity, real-time network performance, multi-Gigabit packet acceleration, security, and rich input/output (I/O).　　These target the central gateway, domain controller, FOTA, secure key management, smart antenna, and high-performance central compute nodes. The GoldBox 3 vehicle networking development platform supports low-power mode, multiple wake-up sources, and two M.2 modules. Typical applications include Firmware Over-the-Air (FOTA), automotive access points, safety processors, service-oriented gateway, vehicle compute, and zonal gateways.　　FEATURES　　Hardware:　　Supports service-oriented gateway and domain controller applications　　Multiple network interfaces featuring 18 CAN/CAN FD and 12 Ethernet ports　　Supports low-power mode and multiple wake-up sources　　Supports two M.2 modules (M-key slot and E-key slot)　　12V AC-DC adapter power supply　　Interfaces:　　LIN, CAN/CAN FD, 100BASE-T1, 1000BASE-T / 2.5GBASE-T, 100BASE-TX, 1000BASE-T, FlexRay, USB, PCIe, JTAG, UART, AURORA, and M.2 slots　　Safety:　　ISO 26262 support by using safety components and architecture　　KIT CONTENTS　　Rugged enclosure with integrated thermal management　　S32G reference design board 3　　Universal AC adapter　　AC/DC 12V 6.67A power supply　　32GB SD card　　DuPont line　　2x USB A-to-micro B cables (UART0/1)　　CAT6A Ethernet cable　　Ethernet loopback cable　　3x Heatsinks　　FAN solution for S32G　　Screws (M.2 slots)　　1.27mm mini jumpers and cables　　APPLICATIONS　　Automotive access point　　Automotive data logger　　Automotive zone controller　　Domain controllers　　Firmware Over-the-Air (FOTA)　　Gateway　　In-vehicle networks　　Safety processors　　Service-oriented gateway　　Vehicle compute　　Zonal gateways

Key word：

AMEYA360,NXP

Release time：2023-03-24 13:44 reading：1883 Continue reading>>

<span style='color:red'>AMEYA360</span>:NXP Semiconductors S32G3 Vehicle Networking Reference Design

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AMEYA360:NXP Semiconductors S32G3 Vehicle Networking Reference Design

　　NXP Semiconductors S32G3 Vehicle Networking Reference Design is designed for vehicle Service-Oriented Gateways (SoGs), domain control applications, high-performance processing, and safety and security applications. This reference design is based on the octal Arm Cortex-A53 cores and quad, dual-core lockstep Arm Cortex-M7 cores. The S32G3 vehicle networking reference design offers high-performance, real-time network performance, multi-gigabit packet acceleration and security, and rich input/output (I/O). Typical applications include Firmware Over-the-Air (FOTA), automotive access points, safety processors, service-oriented gateway, vehicle compute, and zonal gateways.　　FEATURES　　Hardware:　　Supports service-oriented gateway and domain controller applications　　Multiple network interfaces, featuring 18 CAN/CAN FD and 12 Ethernet ports　　Supports low-power mode and multiple wake-up sources　　Supports two M.2 modules (M-key slot, E-key slot)　　ISO 26262 support by using safety components and architecture　　12V AC-DC adapter　　Interfaces:　　LIN, CAN/CAN FD, 100BASE-T1, 1000BASE-T / 2.5GBASE-T, 100BASE-TX, 1000BASE-T, FlexRay, USB, PCIe, JTAG, UART, AURORA, and M.2 slots　　KIT CONTENTS　　S32G Reference Design Board 3　　Universal AC adapter　　AC/DC 12V 6.67A power supply　　32GB SD card　　DuPont line　　2x USB A-to-micro B cables (UART0/1)　　CAT6A Ethernet cable　　Ethernet loopback cable　　3x Heatsinks　　FAN solution for S32G　　Screws (M.2 slots)　　1.27mm mini jumpers and cables　　APPLICATIONS　　Automotive access point　　Automotive data logger　　Automotive zone controller　　Domain controllers　　Firmware Over-the-Air (FOTA)　　Gateway　　In-vehicle networks　　Safety processors　　Service-oriented gateway　　Vehicle compute　　Zonal gateways

Key word：

NXP,S32G3

Release time：2023-03-24 13:41 reading：2126 Continue reading>>

<span style='color:red'>AMEYA360</span>:Nidec Sankyo Develops a New Automatic Open-Close Unit for Toilet Lids and Seats

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AMEYA360:Nidec Sankyo Develops a New Automatic Open-Close Unit for Toilet Lids and Seats

　　Nidec Sankyo Corporation (“Nidec Sankyo”) announced today that it has successfully developed a new, slim-type automatic open-close unit for toilet lids and seats.　　Nidec Sankyo’s new automatic open-close unit for toilet lids and seats　　Year by year, the needs for non-contact products, ranging from faucets to toilet lids, are growing amid the rising necessity to prevent virus infections. The above product, a motor unit that opens and closes toilet lids and seats automatically, will be installed on their hinge parts.　　This latest product by Nidec Sankyo was developed based on a newly revised design of its gear and other structures, to achieve a cubical content 25% less than conventional models while maintaining the same output as theirs. This product, which increases freedom in designing, enables the creation of highly stylish, flat-surface and compact toilets – products popular especially in China – and downsizing of toilets themselves.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Sankyo stays committed to proposing revolutionary solutions that contribute to creating a comfortable society

Key word：

AMEYA360,Nidec

Release time：2023-03-24 13:27 reading：4537 Continue reading>>

<span style='color:red'>AMEYA360</span>:Renesas Entry-Line 200MHz Arm® Cortex®-M33 General Purpose Microcontroller RA6E2

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AMEYA360:Renesas Entry-Line 200MHz Arm® Cortex®-M33 General Purpose Microcontroller RA6E2

　　The RA6E2 entry-line microcontroller is based on the 200 MHz Arm Cortex-M33 core with TrustZone.　　RA6E2 MCUs offer best-in-class performance as an entry-line microcontroller while pursuing cost optimization. Pin and peripheral compatibility with the RA4E2 group make it ideal for applications requiring higher performance, small footprint, and lower pin counts.　　Features:　　200MHz Arm Cortex-M33 with TrustZone　　128KB - 256KB Flash memory and 40KB SRAM　　4KB Data Flash to store data as in EEPROM　　1KB Standby SRAM　　Scalable from 32-pin to 64-pin packages　　USB 2.0 Full Speed　　CAN FD, I3C　　HDMI CEC, SSI　　Quad SPI　　12-bit A/D Converter　　12-bit D/A Converter　　General PWM Timer　　Applications:　　Add-On Voice User Interface (VUI) Solution　　General purpose　　Sensor applications (Medical, Industrial, Wearable)　　Communication/Network module　　Home appliances　　Fingerprint reader module　　Home entertainment (Voice command/recognition)

Key word：

RA6E2,Renesas

Release time：2023-03-24 11:48 reading：3472 Continue reading>>

<span style='color:red'>AMEYA360</span>:Renesas Electronics RZ/G2UL SMARC Kit

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AMEYA360:Renesas Electronics RZ/G2UL SMARC Kit

　　Renesas Electronics RZ/G2UL SMARC Kit evaluates the RZ/G2UL General-Purpose Microprocessors. The Renesas Electronics RZ/G2UL kit includes a module board (SOM) and a carrier board. The carrier board is used with RZ/G2L, RZ/G2LC, and RZ/V2L modules (SOM) and prepared according to the SMARC v2.1 standard. This board allows seamless and flexible evaluation between devices.　　FEATURES：　　Carrier Board Function　　The FFC/FPC connector is mounted as standard for connection to the high-speed serial interface for the camera module　　The Micro-HDMI connector via DSI/HDMI conversion module is mounted as standard for connection to a high-speed serial interface for the digital video module　　The Micro-AB receptacle (ch0: USB2.0 OTG) and A receptacle (ch1: USB2.0 Host) are respectively mounted as standard for connection to the USB interface　　The RJ45 connector is mounted as a software development and evaluation standard using Ethernet　　The audio codec is mounted as a standard for advanced audio system development　　The audio jack is implemented for connection to an audio interface　　The Micro-AB receptacles are implemented for connection to the asynchronous serial port interface　　The microSD card slot and two sockets for PMOD are implemented as an interface for peripheral functions　　For the power supply, a mounted USB Type-C? receptacle supports the USB PD standard　　Device RZ/G2UL (Type-1)　　Arm? Cortex?-A55 Single, Arm Cortex-M33　　BGA361pin, 13mmSq body, 0.5mm pitch　　Module board function　　DDR4 SDRAM 1GB × 1pc　　QSPI flash memory 128Mb × 1pc　　eMMC memory 64GB × 1pc　　The microSD card slot is implemented and used as an eSD for boot　　5-output clock oscillator　　PMIC power supply　　ADDITIONAL RESOURCES：　　RZ/G2UL Power Consumption Measurement　　RZ SMARC Series Carrier Board User's Manual: Hardware　　RZ/G2UL, RZ/A3UL, RZ/Five SMARC Module Board User's Manual: Hardware

Key word：

AMEYA360,Renesas

Release time：2023-03-23 13:48 reading：2631 Continue reading>>

<span style='color:red'>AMEYA360</span>:Renesas Unveils Quick-Connect StudioRenesas Expands RA MCU Family

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AMEYA360:Renesas Unveils Quick-Connect StudioRenesas Expands RA MCU Family

　　New RA4E2 and RA6E2 MCUs Deliver High Performance up to 200 MHz in Compact Packages with Rich Peripheral Options　　Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA family of microcontrollers (MCUs) with two new Groups based on the Arm Cortex-M33 core with Arm TrustZone technology. The new 100-MHz RA4E2 Group and 200-MHz RA6E2 Group are optimized to provide best-in-class power efficiency without compromising performance. With 128 Kbyte and 256 Kbyte flash options and 40 Kbytes of SRAM, the new groups integrate abundant connectivity options such as on-chip CAN FD, USB, QSPI, SSI and I3C interfaces and offer an easy upgrade path to other members of the RA Family. They are ideal for applications requiring high performance in small packages such as sensing, gaming, wearables and appliances.　　The RA4E2 and the RA6E2 are the most cost-effective members of the RA family with integrated CAN FD, and are available with small package options including a space saving 4 x 4 mm 36-pin BGA and a 5 x 5 mm 32-pin QFN to satisfy the needs of cost-sensitive and space-constrained applications. In addition, the low power consumption of the new devices saves energy, enabling end products to contribute to a greener environment.　　All RA devices are supported by the Renesas Flexible Software Package (FSP) that includes highly efficient drivers and middleware to ease the implementation of communications and improve functionality of peripherals. The FSP’s GUI simplifies and accelerates the development process. It enables flexible use of legacy code as well as easy compatibility and scalability with other RA family devices. Designers using FSP also have access to the full Arm ecosystem as well as Renesas’ extensive partner network, offering a wide range of tools that help speed time-to-market.　　“Our RA Family continues to exceed expectations by delivering market-leading performance, features, ease-of-design and value,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas. “The new RA4E2 and RA6E2 Groups are exceptional examples of why many customers have adopted the RA family as their MCU family of choice. We’re confident that these parts will hit the sweet spot for a wide range of applications, and that many designers will look to the RA family for future designs as well.”　　“Over 90% of processors shipped are microcontrollers. The applications that use these MCUs are exceptionally varied1,” said Tom Hackenberg, Principal Market and Technology Analyst for Computing and Software at the Yole Group. “By continuing to expand its RA offerings, Renesas can address more customers in more markets with optimized parts for this wide range of specific applications.”　　RA4E2 MCU Group　　The RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4 x 4mm, and 128kB of flash memory along with 40kB of SRAM. The RA4E2 devices offer excellent active power consumption, using 82 A / MHz while executing from Flash at 100 MHz. They have an extended operating temperature range of -40/105°C. The RA4E2 Group is ideal for cost-sensitive applications and other systems requiring an optimal combination of performance, low power consumption and small package size.　　Key Features of the RA4E2 Group　　100 MHz Arm Cortex-M33 CPU core　　Integrated flash memory of 128kB; 40kB RAM　　Support for wide temperature range: Ta = -40/105°C　　Package options from 32- to 64-pin　　Low power operation: 82 A / MHz in active mode while executing at 100 MHz　　Integrated communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, and CAN FD　　System costs reduction with internal oscillator, abundant GPIO, advanced analog, low-voltage detection and internal reset function　　RA6E2 MCU Group　　The RA6E2 Group MCUs deliver 200 MHz performance. The group includes 10 different parts, spanning from 32-pin to 64-pin packages as small as 4mm x 4mm, and from 128kB to 256kB of flash memory along with 40kB of SRAM. The RA6E2 devices offer exceptional power consumption specifications, and extensive peripherals and connectivity options, delivering a unique combination of performance and features.　　Key Features of the RA6E2 Group　　200 MHz Arm Cortex-M33 CPU core　　Integrated flash memory options from 128kB to 256kB; and 40kB RAM　　Package options from 32- to 64-pin　　Low power operation: 80 A / MHz in active mode while executing at 200 MHz　　Integrated communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, QSPI, and CAN FD　　Integrated timer　　Advanced Analog　　Winning Combinations　　Renesas has designed a full Add-on Voice User Interface (VUI) Solution using the RA6E2 MCU and other compatible devices from the Renesas portfolio. This solution is modular and can easily be added to any application needing a Voice User Interface, such as smart thermostats or appliances. The RA6E2 MCU handles all tasks without burdening the host MCU. This is just one of Renesas’ many Winning Combinations, which are technically vetted, full system architectures, optimized to reduce design risk. Renesas offers more than 300 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and quickly bring their products to market. They can be found at renesas.com/win.　　Renesas MCU Leadership　　A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, and is the industry's No. 1 supplier of both 16- and 32-bit MCUs, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 200 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

Key word：

AMEYA360,Renesas

Release time：2023-03-23 13:38 reading：3660 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies

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