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Ameya360：ROHM Semiconductor BM2P10B1J-EVK-001 Evaluation Board

　　ROHM Semiconductor BM2P10B1J-EVK-001 Evaluation Board is designed to evaluate the performance of BM2P10B1J PWM-type DC-DC converters for AC-DC supplies. This evaluation board features the BM2P10B1J-Z PWM method DC-DC converter IC built-in 730V MOSFET. The BM2P10B1J-EVK-001 eval board also features a built-in low ON resistor of 1Ω. The low ON resistor and high voltage tolerant 730V MOSFET make designs easy. This evaluation board operates within the 90V to 264V input voltage range and -10°C to 65°C temperature range.　　FEATURES　　Outputs an isolated voltage of 12V from an input of 90VAC to 264VAC　　2A maximum output current　　47Hz to 63Hz input frequency range　　24W maximum output power　　86.5% power supply efficiency　　BM2P10B1J-Z PWM method DC/DC converter IC built-in 730V MOSFET　　1Ω built-in the low ON resistor　　BM2P10B1J provides the optimum system for all products with outlets

Key word：

Ameya360,ROHM,BM2P10B1J-EVK-001

Release time：2023-02-28 14:47 reading：1832 Continue reading>>

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Ameya360:Renesas Donates to Aid Relief Efforts in Türkiye and Syria

　　TOKYO, Japan, February 24, 2023 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today made a decision to donate 100,000 USD to support earthquake relief efforts in Türkiye and Syria.　　The funds will be sent to UNHCR, the UN Refugee Agency, with the intent of supporting their humanitarian activities in the affected areas (Note).　　Renesas expresses its heartfelt sympathy to all those affected and extends its sincere wishes for a swift recovery.　　(Note) Donation made via Japan for UNHCR, a national partner of UNHCR in Japan.

Key word：

Renesas

Release time：2023-02-27 16:51 reading：2501 Continue reading>>

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Ameya360:Nidec Machine Tool Launches MV12BxⅡ, a compact, best-in-class, double-column Machining Center that meets “The Machining Needs of All Industries”

　　- High-speed rapid traverse and a powerful spindle to improve productivity significantly　　- Eco-friendly operations that reduce environmental load and running cost　　Nidec Machine Tool Corporation, a Nidec Group company, announced today that it has launched its latest double-column machining center, MV12BxⅡ. Developed based on the concept of meeting “the machining needs of all ndustries,” this high-efficiency machine brings the best-in-class speed of a rapid traverse that significantly reduces non-cutting time, while achieving the highest productivity among all compact double-column machining centers. In addition MV12BxⅡ uses grease to lubricate all of its spindle and feed axes to improve energy efficiency and running cost, as well as featuring an electric power unit that enables ecofriendly operations. Offered as a machine that meets a diverse range of production requirements, such as high-precision surface quality to general parts machining, including light cutting to heavy cutting. MV12BxⅡ will be unveiled to the public at Nidec Machine Tool’s LargeMachine Preview scheduled on Tuesday, February 21 and Wednesday, February 22 at its Main Plant in Ritto, Shiga, Japan.　　Nidec Machine Tool’s double-column Machining Center, MV12BxⅡ　　With the high-speed of the rapid traverse (Ⅹaxis: 48m/min., and Y- & Zaxes: 32m/min.), MV12BxⅡ realizes shorter non-cutting time, while its spindle’s maximum rotating speed has been improved to 7,000min-1, and its motor outpu has been increased to 26kW. Further, with a compact machine-installation space of 3.4 x 5.8m and a maximized range of operation (X-axis stroke: 1.6m, and Y-axis stroke: 1.3m), MV12BxⅡ’s productivity is second to none among double-column machining centers with a BT50 taper spindle in this class.　　With the use of an energy-efficient and low-noise electric power unit to operate its pump only when necessary, MV12BxⅡ consumes much less power than conventional hydraulic units that are always running. In addition, the adoption of the tribology technology that Nidec Machine Tool has long developed and perfected, it enables the use of grease to lubricate MV12BxⅡ’s spindle and feeding axes, helping the machine to use less air and lubricant agent, to reduce running cost and operators’ workload.　　Additionally, MV12BxⅡ has available a variety of user-satisfying options that were jointly developed with Nidec OKK Corporation, whose product lineup includes small- and medium-sized machining centers. The options include an automatic operator door, a coolant shower, and a selectable chip conveyor, is enough to meet various user needs.　　Nidec Machine Tool stays committed to developing technologies for optimum productivity, safety, and environmental performance, and offering products that meet the diverse needs of production sites around the world.

Key word：

Nidec,MV12BxⅡ

Release time：2023-02-27 16:44 reading：3301 Continue reading>>

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Ameya360:NXP Recognized as 2023 Top 100 Global Innovator

　　Award recognizes the world’s most innovative companies setting the pace for global innovation.　　What’s New:　　NXP Semiconductors has been named one of the Top 100 Global Innovators 2023 by Clarivate? . This marks the sixth time NXP has been included on the annual list, which identifies organizations at the pinnacle of the global innovation landscape by measuring excellence focused on exceptional consistency and scale in innovativeness.　　NXP was selected for its strong patent portfolio, which currently includes more than 9,500 patent families. The impressive volume of patents reflects the magnitude and scope of the innovative products that strengthen NXP’s position in the automotive and industrial markets.　　In 2022, NXP made great strides with its innovative technology, including the extension of its S32 platform family of domain and zonal automotive processors, which enhances security and safety in software-defined vehicles of the future, as well as the introduction of a new MCX portfolio of microcontrollers for emerging industrial and IoT edge applications with 30x faster machine learning performance.　　“At NXP, we know that innovative ideas and solutions are driven by the bright minds and passion of our team members, who share a true commitment to improving people’s lives around the world through technology. Thanks to that passion, we are again proud to be among the Top 100 Global Innovators.”　　Lars Reger, Executive Vice President and Chief Technology Officer　　Why It Matters　　NXP’s inclusion on the list is the result of the continuing efforts of R&D, dedicated engineers and team members around the world who continue to collaborate and innovate during an especially dynamic time in the semiconductor industry.　　This recognition also reaffirms NXP’s commitment to enabling a better, safer, more secure and sustainable world through innovation. NXP is dedicated to continually developing ever-smarter chips that reduce energy consumption and emissions. In addition, the company has established ambitious goals, such as achieving carbon neutrality by 2035 and minimizing our impact on global water to help enable a more sustainable future.　　More Details　　This year’s report marries insights from Clarivate on inventive activity and scientific discovery to better track the flow of modern innovation - to identify the 50 research organizations most often cited by the Top 100 Global Innovators 2023. These are global institutions whose intellect underpins the design of engineered solutions.　　Learn more about Top 100 Global Innovators 2023 on this year’s list .　　Stay up-to-date with NXP’s ESG mission with Sustainability Stories magazine, spotlighting NXP technology, design and solutions that drive innovation to advance global sustainability.

Key word：

NXP

Release time：2023-02-27 16:36 reading：1796 Continue reading>>

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Ameya360:Panasonic EVP-BD 6mm 4N Square Tactile Switch

　　Panasonic EVP-BD 6mm Square Tactile Switch offers an operating force of 4N with 0.7mm travel distance and 200,000 cycles of operation. This switch features a metal dome and rubber dome construction for a sharp tactile feeling with silent operation. The high operating force and long travel distance reduce the chance of unintentional activation. This top-push SMD switch has two J-bent terminals and 6mm x 6mm external dimensions with a 4mm height. Panasonic EVP-BD 6mm Square Tactile Switch ensures operational safety for applications such as audio electronics and automotive equipment. Additional applications include consumer, medical, industrial, and lighting.　　FEATURES　　SMD mounting type　　Snap-action / push-on type SPST　　Top push　　Middle stroke travel　　High click ratio of operating force vs. travel distance offers crisp tactile feel　　Rubber dome provides quiet operation　　High endurance　　High operating force and long travel distance for lower chance of unintentional activation　　J-bent terminal　　With push plate (actuator)　　Reflow applicable soldering　　APPLICATIONS　　Automotive　　Industrial　　Consumer　　Medical　　Audio　　Lighting　　SPECIFICATIONS　　4N operating force　　0.7mm travel　　6mm x 6mm external dimensions　　4mm height　　10ms maximum bouncing (ON, OFF)　　200,000 cycles operating life　　10μA 2VDC to 20mA 15VDC (resistive load) rating　　500MΩ maximum contact resistance　　100MΩ minimum insulation resistance at 100VDC　　250VAC (1 minute) dielectric withstanding voltage　　-40°C to +90°C operating temperature range

Key word：

Ameya360,Panasonic

Release time：2023-02-27 11:44 reading：1816 Continue reading>>

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Ameya360:TE Connectivity/Kemtron Lock nut seal

　　character：　　Shields against RFI and EMI　　Compression molded as one solid piece　　No joined pieces　　Wide variety of shell sizes　　Compliant with MIL-DTL-38999 and MIL-DTL-26482　　Material　　Silicone nickel graphite　　Fluorosilicone nickel graphite　　Silicone silver aluminum　　Fluorosilicone silver aluminum　　standard:　　Inside diameter (ID) tolerance　　<38.1mm ±0.25mm　　38.1mm to 50.8mm ±0.38mm　　Cross-section diameter (CS) tolerance　　1.8mm ±0.1mm　　2.6mm ±0.13mm　　Molded tolerances　　Maximum tooling mismatch: 0.08mm　　Flash and parting line projection　　Maximum thickness: 0.15mm　　Maximum protrusion: 0.15mm　　-55°C to +160°C operating temperature range　　CHOICE OF MATERIAL

Key word：

Ameya360,TE

Release time：2023-02-27 11:40 reading：2065 Continue reading>>

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Ameya360:Wenzhou BYD new energy power battery project started

　　February 27, Zhejiang Provincial Party Committee and provincial government held on February 21, 2023 the first quarter of the province to expand the effective investment of major projects to start work.　　Among them, BYD new energy power battery project is Wenzhou key report site construction project, located in Qiaotou Town, Yongjia County, with a total investment of 6.5 billion yuan, planned production capacity of 20GWh, annual sales is expected to reach 16 billion yuan, providing more than 6,000 jobs.　　Last November, Wenzhou BYD new energy power battery production base project cloud signing ceremony was held. The power battery to be produced by this project adopts one of the battery technologies with great potential at present, which is expected to drive the high quality development of the whole new energy industry chain and link the transformation and upgrading of the existing power battery, automotive electronics, auto and motorcycle parts industries in Wenzhou. The first production line is expected to be put into operation in 2024.　　According to the China Automotive Power Battery Industry Innovation Alliance data, BYD in 2022 domestic power battery load accounted for 23.45%, second only to Ningde Times (48.20%). In January this year, Ningde Times and BYD's domestic power battery load accounted for 44.41% and 34.12% respectively, ranking the top two.

Key word：

BYD,battery

Release time：2023-02-27 11:10 reading：2166 Continue reading>>

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Ameya360:Powering E-Paper Displays with NFC Energy Harvesting

　　Based on innovative technology, e-paper displays offer significant advantages over traditional displays. Thanks to their unique characteristics, it is not necessary to continuously power the screen; it is sufficient to supply energy when the content of the displayed page is modified. In this way, significant energy savings are obtained, which, in battery-powered applications, translates into greater autonomy.　　Additionally, because power consumption is very low, e-paper displays can be powered through energy-harvesting solutions—for example, by converting the RF energy produced by a near-field communication (NFC) transceiver into electricity. Hence, by combining printed e-paper displays with NFC technology, a new range of battery-less products is enabled.　　In this article, we’ll provide a practical implementation guide on how NFC can be used to power Ynvisible’s e-paper displays.　　Ynvisible e-paper displays　　Ynvisible displays are based on an e-paper technology called Electrochromic Display (ECD), which uses organic electrochromic polymers. Unlike other display technologies that emit light, Ynvisible e-paper devices are categorized as reflective displays, meaning they reflect the ambient light instead of using a backlight. The displays are produced on inexpensive plastic (PET) substrates, making the displays thin and flexible.　　These printed e-paper displays achieve very low power consumption. One square centimeter of active display area requires about 1 mJ to be activated, while the recommended driving voltage is ±1.5 V. That allows Ynvisible’s e-paper displays to achieve the lowest energy consumption on the market for most use cases.　　Additionally, the displays include an image memory (or image retention), which is a crucial component for applications that don’t require batteries. The average image retention duration for Ynvisible’s standard displays is between five and 15 minutes. A brief refresh pulse may be necessary to retain full contrast after this time period, depending on the use case. The displays are manufactured using roll-to-roll screen-printing and lamination processes. They are non-toxic, ITO-free, and mainly comprised of PET plastic. The plastic substrate and roll-to-roll production means thin, flexible, scalable, and highly cost-effective displays.　　Ynvisible also offers a segment e-paper display kit, which allows customers to evaluate the ultra-low–power, thin, and flexible segment e-paper displays. Each e-paper display kit (see below figure) comes with different display designs and includes an e-paper display driver with I2C interface with related user manual.　　Harvesting NFC RF power　　NFC is a short-range data-exchange technology for electronic devices. An inductive pair between two antennas serves as the basis for the communication. NFC does not require that one of the two communicating devices has built-in power, in contrast to many other communication interfaces. Instead, the power transmitted by an NFC reader/writer (such as a smartphone) is harvested to generate power. Contactless payments are NFC’s most typical use case.　　To power an Ynvisible e-paper display with energy harvested from an NFC signal, an antenna and a rectifier diode are required. The power from the antenna will be transferred to the display by inductive coupling between the transceiver and the antenna itself. The signal needs to be rectified with a diode because the display requires direct current. If the display content is intended to fade off quickly after activation, the rectifying diode can be connected in parallel with the display.　　However, if the application requires communicating some data, such as reading an identification code (RFID) or writing data to the device, an NFC chip would be necessary. These chips come in a wide variety of models and vendors, and they each have unique features.　　They fall into three categories:　　1.NFC data storage chips. The transceiver can read and/or write data to the chip　　2.NFC data storage ICs with I2C communication and power output (energy harvesting). These chips can be used to power and/or communicate with an MCU over NFC.　　3.NFC chips with embedded processor. These chips can be thought of as MCUs with NFC capability, which means they have all of the standard MCU functionalities, plus the potential to be powered and/or communicated with via NFC.　　Each of the above IC groups requires a different connection scheme to the display. The following are the most common approaches adopted for implementing the display connection:　　1.Connect in parallel with NFC chip. Following this approach, the NFC chip and the display are connected in parallel. The IC and the display are not directly connected, while the NFC signal powers both the chip and the display. In this scenario, the display will turn on regardless of the transmitted data.　　2.Power output of the NFC chip. If the chip belongs to the second group, the display can be connected directly to the chip’s power output. Similarly to the previous case, the display will turn on regardless of the transmitted data.　　3.MCU in between the NFC chip and the display. Using a host controller in between the chip and the MCU is another method applicable to the second group of chips. Due to the MCU’s ability to read the data from the NFC chip, conditional display driving is made possible. If the user has the authority to read the label, this could be handy when the display needs to be turned on.　　4.Use built-in GPIOs to control the display. This approach is similar to the previous one, but because the MCU capabilities are embedded into the Category 3 NFC chips, no intermediate host controller is needed.　　The power of NFC　　NFC has the potential to replace batteries as the main power source in many applications. From a cost, sustainability, and recyclability perspective, batteries often limit the adoption of electronics and printed intelligence in new applications. Target markets for Ynvisible, its partners, and clients include those for medical technology, smart packaging, smart cards, brand protection, and security gadgets.　　The platform obtained combining NFC and e-paper display technologies can help to create the future of intelligent items, sensors, and other printed electronics.

Key word：

E-Paper,NFC

Release time：2023-02-24 15:56 reading：1708 Continue reading>>

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Ameya360:How to Select Wireless SoCs for Your IoT Designs

　　Selecting a wireless system-on-chip (SoC) for your design isn’t easy. It requires careful consideration around several factors, including power consumption, size and cost. The SoC also needs to support the right wireless protocols for the IoT application and network, which then entails factors like range, latency and throughput.　　Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors.　　One way to ensure that your IoT design is optimized for the application is by carefully considering your choice of wireless SoCs. It also requires a careful evaluation of the key requirements of your design—including battery life, compute and memory resources, and footprint—because there will be performance tradeoffs, depending on the application.　　Designers have many factors to consider when selecting wireless SoCs for their products, said Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors. “There is no right answer in terms of what device or architecture to choose, as this depends on the series of engineering tradeoffs that the product designer is willing to make to satisfy the needs of their end customer.”　　There is also industry agreement that a strong development ecosystem with comprehensive support tools and service is paramount. These product and prototyping tools and services can help designers reduce their time to market and cost.　　So let’s address some of the top-of-mind design issues that engineers should consider when selecting wireless SoCs for their IoT designs, as well as some of the biggest challenges and tradeoffs.　　Use cases dictate design　　Most wireless SoC manufacturers agree that the application requirements determine the selection of the wireless SoC and help narrow down the options for the IoT design. One of the most critical factors is power consumption, they said, followed by a host of other considerations, such as wireless protocols, performance, cost, size, tool support and ease of integration.　　While power consumption is tapped as one of the most critical factors in selecting wireless SoCs, choice of the wireless protocol is governed by the application.　　The end application determines the priorities, said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated.　　He cited a few application examples in which design priorities define the selection of the wireless SoC.　　“For example, if it’s a battery-powered device, such as a wearable with a single Bluetooth connection, they may choose our SYN20703P [single-chip Bluetooth transceiver and baseband processor],” Bae explained. “If it’s a drone, they may need our SYN43400 Wi-Fi SoC, as power consumption and size—and weight—are very important and developers have to make the decision based on their go-to-market strategy.　　“A drone may also need both Wi-Fi and Bluetooth,” he added. “At that point, the number of wireless interfaces required for the application becomes important, and an integrated SoC with both is typically the best approach. Our SYN43756 [single-chip IEEE 802.11ax 2 × 2 MAC/baseband/radio with integrated Bluetooth 5.2] is a good solution for that.”　　Bae also noted that “application dependency can be extrapolated to include aggregation points or gateways for the IoT where multiple heterogeneous wireless networks come together.” This would benefit from a higher level of integration, with Bluetooth, Wi-Fi and Zigbee/Thread (IEEE 802.15.4 PHY), such as that provided by the Triple Combo SYN4381 wireless SoC, he said.　　Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs, agreed: “Every wireless protocol is playing a different role, and the end-application use cases are the most important in deciding one or more of these protocols for an IoT device.”　　Sogani said there are several key factors in selecting a wireless SoC for an IoT device, which vary by the application. His top five considerations, which are important for all kinds of IoT devices, include wireless protocols; security; battery life; hardware and software support, including peripherals, GPIOs, IDE support, cloud support and networking/wireless stack integration; and compute and memory resources available for the application after the OS, networking stacks and the wireless stacks have been integrated into the wireless SoC.　　For wireless protocols, requirements include application throughput, latency, number of network nodes and range, he said. “IoT devices are becoming more complicated every day as more functionality is getting integrated into the devices. Adding wireless to the IoT devices increases the complexity manifold. There are many wireless protocols being used in IoT devices, including Wi-Fi, BT, BLE, Zigbee, Thread, Z-Wave and cellular. The choice of wireless communication protocols for a particular device depends upon the application, size, cost, power and several other factors.”　　Sogani cited several examples in which the application, together with the performance requirements, are key to the decision-making.　　“BLE is a good protocol to use for a home-temperature sensor, as it consumes low power, it is lower in cost than some other protocols and it provides the necessary range in a typical home environment,” he said. “NFC provides the lowest throughput and the shortest range, making it ideal for contactless-payment–like applications. Wi-Fi provides higher application throughput needed for several applications, such as security cameras.”　　Design challenges　　Most chipmakers agree that wireless SoCs can simplify designs by integrating the different wireless protocols and handling the coexistence challenges between multiple protocols. They also deliver space savings, a key concern in many IoT designs. However, there are use cases where discrete solutions could offer the best value in terms of both performance and cost.　　“The benefits of a wireless SoC are many and include the assurance of a proven design, shorter time to market, smaller overall footprint, lower bill of materials [BOM] and lower inventory management costs,” said Synaptics’ Bae. “These advantages apply to mostly all end applications, but there may be instances where a discrete solution may work better if the customer has specific requirements and has the RF design skills and resources to implement in that direction.”　　NXP’s Palumbo said that when determining how to architect an end product that includes wireless connectivity, “one of the first decisions a product designer must make is whether they will use a single, integrated wireless SoC or separate the wireless from the processor. An equally important decision that needs to be made is which operating system will be used. The decision of the operating system will quickly shift designers either to lower-cost, RTOS-based microcontrollers or toward larger, more scalable, Linux-based processors.”　　Integrated wireless SoCs are physically smaller and may be lower-cost due to the integration, enabling the end-product designer to deliver a smaller product or a more innovative form factor, said Palumbo.　　“However, the challenge with an integrated wireless SoC is that the designer lacks flexibility to optimize the compute performance or the wireless performance independently and the capabilities of the wireless SoC itself are invariant, so there is not as much ability to optimize individual components of the product,” he said.　　Whether using an integrated or discrete solution, power consumption is still a key factor that is influenced by the system architecture and use cases. “This means in some cases, multi-chip solutions involving separate radio and processor chips may be easier to optimize,” said Palumbo. “In other cases, wireless processors may provide all the necessary flexibility needed for specific applications and use cases.”　　Palumbo provided some key examples in which power consumption plays a critical role. “For example, simple end applications like a sensor or actuator that have a low communications duty cycle and do not perform any ancillary networking functionality, such as routing, designers will see the lowest power consumption when using an integrated wireless SoC.” This type of application can be addressed with devices like NXP’s K32W148 wireless microcontroller.　　“However, for more complex devices—a thermostat, for example—where packet routing is an important feature for the overall user experience of the end device and the target ecosystem, a discrete solution may be lower power,” he said. “If a network co-processor [NCP] is included alongside the primary compute SoC, then this allows the networking stacks to be offloaded so that only the co-processor itself is required to wake up to route packets.”　　In this example, an NXP i.MX microprocessor like the i.MX 8M Mini can be used as the compute SoC, the NXP RW612 wireless MCU can be used as an NCP and the IW612 tri-radio solution can be used as a radio co-processor. “This can help reduce the power consumption of the system significantly—especially when an NCP is used with a Linux-based microprocessor as the primary compute platform,” said Palumbo.　　The product designer has to analyze these tradeoffs and select the architecture that makes the most sense for the value they are trying to bring to their customers, he added.　　Design tradeoffs　　Wireless integration can be quite challenging especially as it relates to RF circuitry, according to manufacturers of wireless SoCs, and all tradeoffs are driven by the use cases.　　The challenge is often about the radio-integration part of the solution to deliver good-quality product performance and to meet regulatory and protocol certification requirements, said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Nathalie Vallespin, wireless product line marketing manager, STMicroelectronics.　　“A wireless SoC simplifies the integration phase, as most customers first moving to wireless solutions are not RF experts, so integration simplifies and accelerates their development and production,” she said. “Product sourcing for end customers is also simplified by an integrated solution [SoC] and can be even further simplified using a module, which includes the whole reference design.”　　In addition, Vallespin said that “an SoC also ensures more efficient power and performance levels of the radio protocol and application, while a multi-chip solution creates connection interface constraints and complexity for software management. A discrete/multi-chip approach can also potentially lead to overconsumption to keep both host and radio running to communicate properly.”　　Synaptics’ Bae said there are many challenges with RF, but “they can be addressed through careful consideration of board layout, grounding, relative positioning of other digital ICs in the design to avoid interference, and antenna placement and routing. Aside from layout, the designers or developers need to be cognizant of the impact on the SoC from power-source switching, other sources of electromagnetic interference and materials choice for enclosures.”　　Wireless SoC integration can become challenging, depending on the number of wireless protocols it supports and the use cases, said Silicon Labs’ Sogani.　　He cited several challenges, including hardware integration (antenna placement, RF design, etc.), software development (wireless stacks, networking stacks, cloud connectivity, application development), RF testing (including extreme conditions), interoperability testing (with other devices it is supposed to connect to), wireless coexistence (multiple protocols need to co-exist), production testing (minimizing the test time and yield), regulatory certifications (for countries to be supported), protocol compliance (for protocols integrated in the device), power optimization (based on the battery requirements), system security (to ensure device and data security) and solution cost (based on the target).　　Designers need to make a tradeoff at every step to optimize between various parameters, and all of these tradeoffs are eventually drive by the application use cases, said Sogani.　　“With IoT devices needing to support multiple protocols, wireless SoCs provide an integrated solution that simplifies designs by integrating these protocols and handling the coexistence challenges between multiple protocols on the same ISM band internally, as well as not having to worry about managing and worrying about RF design for multiple devices,” he added. “This helps in faster development cycles and more seamless functionality between the various protocols. End applications do play a role, as it may be possible to use discrete chips for simpler applications, but as applications become complicated, it makes more sense to use integrated solutions.”　　Vallespin said understanding and selecting the right technology that will be the best fit for the application and market demand is a key challenge. Another challenge is understanding the chosen radio protocols and picking the right hardware (antenna, routing, BOM selection) and matching software, which can be specific to each technology, she said.　　The key tradeoffs are balancing price versus features as well as choosing the architecture—a host + co-processor approach or a single application processor, Vallespin added.　　Support and availability　　In addition to performance concerns, development and design support along with supply-chain issues like continued availability are priorities for many IoT designers.　　Key concerns include how effectively the product and its development ecosystem can reduce their time to market and cost, the availability of the product and prototyping tools and the long-term availability of the product, said Vallespin.　　There are also several questions that designers need to ask, such as if there are guarantees that the SoC will be available as long as their product is in the market, what the roadmap of the SoC is and if it aligns with their product development plan, and if there is sufficient support availability, including for documentation, ecosystem and contact to ensure success, she added.　　NXP’s Palumbo believes longevity requirements are part of the tradeoff equation.　　“Once a product has shipped, the hardware itself is unchanging; however, there is an expectation from the end customer that the product will continue to be supported and receive updates for some time after their purchase,” said Palumbo. “Selecting a device—and a product architecture—that enables product designers to provide updates for the lifetime of the product is a criterion that is gaining importance.”　　The software architecture is also another critical consideration when selecting a wireless SoC, said Palumbo. “Regardless of the product architecture—be it integrated wireless SoC or discrete—the software tools and environment for these SoCs are equally important components to the hardware. Whether a device is Linux-based, Android-based, or RTOS-based—even without considering the wrinkle of which RTOS to use from the myriad of solutions available—makes a massive impact on the end product.”

Key word：

Wireless,SoC,IoT

Release time：2023-02-24 15:30 reading：1807 Continue reading>>

<span style='color:red'>AMEYA360</span>:Onsemi NTH4L028N170M1 Silicon Carbide (SiC) MOSFET

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AMEYA360:Onsemi NTH4L028N170M1 Silicon Carbide (SiC) MOSFET

　　Anson Mae NTH4L028N170M1 Silicon Carbide (SiC) MOSFET optimized for fast switching applications. Anson MOSFET uses planar technology to operate reliably when the grid is at a negative grid voltage drive and turn-off peak. The series provides optimum performance when driven by a 20V grid drive, but can also be used in conjunction with an 18V grid drive.　　At a test condition of 1200V at 40A, the 1700V EliteSiC MOSFET achieves a gate charge (Qg) of 200nC, compared to equivalent competitive devices that are closer to 300nC. A low Qg is critical to achieving high efficiency in fast switching, high-power renewable energy applications.　　The onsemi NTH4L028N170M1 1700V EliteSiC MOSFET is housed in a TO247-4L package with a Kelvin source connection on the fourth pin that improves turn-on power dissipation and gate noise.　　Characteristic　　Typical value RDS(on) = 28mΩ (VGS = 20V)　　Ultra-low grid charge (QG(tot)=200nC)　　High speed switch with low capacitance (Coss=200pF)　　100% avalanche tested　　These devices are lead free and comply with the RoHS directive　　Application　　UPS　　Dc/DC converter　　Boost converter

Key word：

AMEYA360,Onsemi,NTH4L028N170M1

Release time：2023-02-24 10:41 reading：3315 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments

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