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Ameya360:Insights on Innolux-Vedanta LCD Tech Transfer

　　On February 14, 2023, Innolux made a public disclosure that it has reached an agreement to transfer TFT LCD panel and module technology to India’s Vedanta. The disclosure includes few details, but assumptions include:　　• The factory will be India’s first integrated flat panel display factory including both TFT, color filter, and cell frontplane processes as well as module assembly.　　• Although unconfirmed at this point, Vedanta had previously also planned to build its own by-plant glass melting and finishing facility factory with support from its glass-producing subsidiary AvanStrate.　　• The fab will be similar to Innolux’s Fab 8B and is likely to adopt Gen 8.6 or 2250 x 2600 mm substrates. A capacity of 60,000 substrates per month is currently assumed.　　• Vedanta engineers are already involved in on-site training in Taiwan.　　• Innolux presumably will receive a one-time technical transfer payment and then collect ongoing royalty payments per display when mass production begins.　　• Vedanta has ambitious plans. Assuming success with this first factory, it has long-term hopes of expanding production to other regions in India and growing into the role of a leading, global FPD producer.　　The technology transfer is a key milestone for Vedanta, which will facilitate not only a rapid transfer of critical manufacturing technology, but also government approval, financing, supplier support, and improved outcomes for what will undoubtedly be a very big challenge to launch a domestic FPD industry in India.　　The timeline is likely to change as the plan develops, but Omdia’s current expectations are shown in the figure below.　　Bharuch, in the state of Gujarat, has been proposed as a likely factory location. The ancient city is highly industrialized and is home to many chemical and other manufacturing facilities. Bharuch is a port city with a large liquid cargo terminal that makes importing equipment and materials and exporting finished products convenient.　　Manufacturing FPDs in India is appealing for the large available market, which is expected to grow rapidly on the expansion of the middle class and a lower FPD saturation rate than developed regions. Also, it is not just India; surrounding Southern Asian countries are potential markets for made-in-India consumer electronics.　　Since 2014, the government has promoted a “Make in India” policy that targets increasing growth in the manufacturing sector, creating more manufacturing jobs, and growing the manufacturing sector’s contribution to GDP. In parallel, many state governments also launched related local programs. Governmental assistance for the project, including significant central and local government incentives and financial support, is both driving the investment and important in helping to coordinate the complicated effort.　　India is promoting itself as a manufacturing alternative to China and has particular appeal in an era where geopolitical concerns and trade frictions are strongly encouraging sourcing diversification for multinational IT firms.　　For Innolux the agreement is positive news in a very difficult market environment. The company, like the rest of the display industry, continues to struggle to work through severe over-capacity, low prices, and financial losses. The initial technical transfer should include a significant cash payment. This can be used to mitigate current losses and give Innolux some flexibility to consolidate its business while shifting its focus to higher value-added products. Vedanta is not likely to become a direct competitor, rather its long-term success is upside potential in creating a future royalty-based revenue stream for Innolux.　　The technology transfer agreement is a major milestone for Vedanta, but it’s far from the final step. Planning the factory, getting government approval, financing, supplier support, building and ramping up the facilities, as well as many other stages along the way need to be successfully worked through before any panels are actually produced in India. But now, with Innolux’s backing, Vedanta is in the best position it has ever been, in realizing its very long-held dream of becoming India’s first FPD producer and leading the development of a domestic display industry.

Key word：

LCD,Innolux

Release time：2023-02-16 15:50 reading：3199 Continue reading>>

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Ameya360:Novosense automotive-qualified Integrated Absolute Pressure Sensor NSPAS1

　　NSPAS1 is a calibrated absolute pressure sensor launched by NOVOSENSE for vehicle intake pressure, NEV vacuum boosting system and motorcycle electronic injection. The product adopts automotive-qualified signal conditioning chip to calibrate and compensate the output of MEMS piezoresistive die, ensuring excellent reliability of the product while integrating the two chips to greatly reduce the package size. At the same time, this product can provide standard output in its operation temperature range without customer calibration, which can accelerate the process of product development and mass production; the product complies with the AEC-Q100 reliability standard.　　Product Features　　Operating temperature range: -40℃~125℃　　High accuracy in full temperature range:　　Better than ±1%F.S. in the range of - 0℃~85℃　　Better than ±1.5%F.S. in the range of -40℃~125℃　　Support -24 v to 28V over voltage and reverse voltage protection　　Fluorinated gel protection, compatible with oil and gas environment　　Faster response time less than 0.8ms　　Support absolute output/ratio-metric output, with output curve customized　　Disconnection detection, output clamping, output alarm function　　Pressure range 10kPa~400kPa, which can be customized　　AEC-Q100 qualified　　Package:SOP-8 (7.3mm x 7.3mm)　　Application　　Automotive: motorcycle three-in-one sensor, vehicle TMAP intake pressure detection, BPS battery pack thermal runaway pressure detection, EGR-TMAP exhaust gas recirculation pressure detection, canister desorption pressure detection, VBS vacuum boosting system sensor, ECU/VCU atmospheric pressure detection, seat air bag pressure detection　　Industrial: pressure transmitter, industrial vacuum degree testing, etc.　　Functional Block Diagram

Key word：

Ameya360,Novosense,NSPAS1

Release time：2023-02-16 15:50 reading：5602 Continue reading>>

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Ameya360:The A-to-Z Guide on Using Stiffener for Flex and Rigid-flex PCBs

　　Lighter electronics with shrinking packages are a reality today mainly due to the emergence of flexible printed circuits (FPC). They are built on materials that can bend smoothly and improve the product’s resistance to vibration and motion. FPCs reduce interconnection defects by minimizing the connection points on the PCB. Their ability to fit in unusual shapes has largely accelerated the miniaturized designs.　　With all these advantages, the demand for flex and rigid-flex PCBs has amplified in almost all electronics business sectors. But the material agility makes the flex PCBs susceptible to quick breakdown. A supporting mechanism like a stiffener is hence recommended during the assembly of flex and rigid-flex PCBs to improve the board strength and rigidity.　　What stiffeners and why they are needed in flex and figid-flex PCBs　　PCB stiffeners are the mechanical parts used during the assembly process to improve the strength of Flex PCBs. They enhance the durability of the PCB by reinforcing the areas in which components will be mounted. Stiffeners add thickness to the board with an impact on cost and manufacturing time in PCB production. Even Rigid-flex PCBs are benefitted from extra strengthening by adding such stiffeners.　　They are more often required when the components are in the dynamic areas of the Flex PCBs. Stiffeners are used to avoid stress on the flex boards due to heavy components. There can be pressure on the pads if the connectors require frequent plug-in/plug-out. Stiffeners can hold the PCB surface flat and strong to mount SMT parts efficiently in SMT assembly. They provide the mechanical strength to sustain vibration and shock in harsh operating environments.　　Stiffeners facilitate better handling of thin and flexible boards. If there is a requirement for Zero insertion force (ZIF) connectors in the design, they can support the same. Stiffeners improve the bend radius of the PCB and also reduce the stress at flex and rigid circuit junctions. So, they are an integral part of flex and rigid-flex PCBs.　　Choose the PCB stiffeners with the right material　　Based on the functionality different materials are used to make stiffeners. A PCB busbar is a board stiffener that can conduct electricity. It is made using conductive metals like copper, stainless steel, or aluminum. Non-metal stiffeners are made using polyimide or FR4 material.　　FR4 is the common type used for PCB stiffeners in Flex PCB applications. The main purpose of using an FR4 stiffener is to provide the required support for the PCB during the assembly processes like pick-n-place of components and in reflow ovens. They also strengthen the board in areas where connectors and other through-hole parts are mounted. The usual thickness of FR4 stiffeners varies from 0.2mm to 1.5mm. They are more affordable in price compared to other types of stiffeners.　　Metal stiffeners like stainless steel or aluminum are highly recommended in applications requiring rigid-flex PCBs to operate in varied temperature ranges. They are a perfect choice in applications demanding corrosion-resistant FPCs. But they are expensive and have a longer bonding process compared to other stiffener materials. Yet, aluminum is ideal for applications involving high thermal dissipation, and stainless-steel stiffeners offer enough support within smaller spaces. While stainless steel stiffeners are available in the thickness range of 0.1mm to 1.5mm, aluminum stiffeners’ thickness can be between 0.2mm to 1.5mm.　　Polyimide stiffeners are made from high-temperature polymer sheets in thicknesses ranging from 0.05mm to 0.25mm. They provide exceptional solder resistance and added bond strength. Polyimide stiffeners limit the PCB bending in specific areas while preparing the boards for final assembly. They are best suited to increase the ZIF connector thickness with additional support to contact fingers on the circuit board.　　How to mount the stiffeners on flex PCBs　　While assembling the stiffeners on a PCB, there are a few key factors to consider. In boards using through-hole parts, it is recommended to position the stiffener on the same side as the components to provide easy access to the solder pads on the PCB. To relieve the stress, there should be around 0.762 mm of overlap of the stiffener on the exposed coverlay of the flex PCBs. If multiple stiffeners are used, then the same stiffener thickness has to be maintained.　　To ensure proper alignment, FR4 stiffener holes are enlarged by around 0.3mm as compared to flex board holes. FR4 stiffeners are mounted on the array border to ruggedize the assembly array. This can assist in the automated assembly of flex PCBs similar to rigid PCBs. Also, the need for further tooling plates can be eliminated.　　Stiffeners are mounted on the flex PCBs using either pressure-sensitive adhesives or thermally bonded adhesives. Pressure-sensitive adhesives are used in IPC class 2 products while thermally bonded adhesives are preferred in application-critical IPC class 3 products. Thermal bonding adhesives provide strong bonding of stiffeners to the PCB and are expensive. They damage the board significantly if the stiffeners have to be removed. Hence, the application process is quite crucial. On the contrary, pressure-sensitive adhesives are low-cost with medium bond strength. The PCB damages can be avoided with the careful removal of bonded stiffeners while using pressure-sensitive adhesives.　　Can stiffeners improve PCB performance?　　Using stiffeners in Flex and Rigid-flex PCBs offers several advantages in the overall performance of the product. They provide structural support in fragile areas of flex PCBs and minimize mechanical deformities like bending and warping. Also, they avoid any possible electrical shorts in the stacked PCBs of a chassis.　　In harsh environments, stiffeners protect PCBs against pressure and vibration. They can also avoid mounting screws or rivets on PCBs, reducing the cost of such additional fittings. Using busbars can improve the power distribution for the ground circuit of the PCB. They can assist in quick thermal dissipation in high-temperature applications. Thus, stiffeners are remarkable in improving the overall performance and structural integrity of the FPCs.　　Conclusion　　To control the cost and quality of flexible printed circuits, it is important to work with an experienced contract manufacturer (CM). Building stiffener PCBs with optimized quality and reduced cost is possible if your CM has adopted quality management guidelines and is equipped with the latest technologies in the production line. Further, this comprehensive guide on stiffeners will enable you in understanding the right choice of material, adhesive types, key mounting considerations, and their usage in Flex and Rigid-flex PCBs.

Key word：

PCB,FPC

Release time：2023-02-16 15:28 reading：1932 Continue reading>>

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Ameya360:AV Radar Moves to Domain Controller for First Time

　　Ambarella demonstrated its radar and camera sensor fusion chip and software at CES 2023.　　At CES 2023, Ambarella demonstrated its centralized architecture for radar processing in autonomous vehicles (AVs), which allows fewer radar sensors to be used in each AV.　　Ambarella’s offering is a combination of its CV3 family of domain controller chips with AI algorithms and software from Oculii, which Ambarella acquired in 2021.　　Compared to existing system configurations that typically use radar modules with edge processing, processing radar data with Ambarella’s central processor setup allows you to achieve higher resolution with standard sensors via AI. The result is an AV perception system that uses fewer radar modules, needs less power, and allows processor resources to be dynamically allocated to appropriate sensors depending on conditions. It’s also easier to perform over-the-air updates to software, and cheaper to replace radar modules if they get damaged, according to Ambarella.　　“Every radar that’s ever been built for automotive is processed at the edge—the entire processing chain lives inside the sensor module,” Steven Hong, former CEO of Oculii, now VP and general manager of radar technology at Ambarella, told EE Times. “The reason is that for a traditional design, you need more antennas to achieve higher resolution. Imaging radars need at least a degree of resolution, and to achieve that, you typically need hundreds if not thousands of antennas. Each antenna generates a lot of data, and because you’re generating so much data, you can’t move it anywhere else.”　　In a typical setup, radars can collect terabytes per second of data, and if higher resolution is required, that means more antennas and more bandwidth. This limits radar processing to what can be performed with a small processor in the sensor module, and increases the sensor module’s power consumption to tens of Watts.　　“With our technology, we don’t need more antennas to achieve higher resolution,” Hong said. “We use an intelligent, adaptive waveform, which is different to traditional radars.”　　Oculii’s AI dynamically adapts the radar waveform generated. This non-constant signal means missing information can be derived rather than measured directly.　　“We change the information we send out in a way that effectively encodes an additional set of information onto what we receive,” Hong said. “So not only are we receiving information about the environment, we’re receiving it in a way which is actively changed and actively controlled by what we’re sending.”　　Encoded in the waveforms sent out are different patterns of timing and phase information.　　“The different patterns allow us to effectively calculate what we’re missing rather than measure it,” Hong said. “This is, in many ways, a computational way of solving what was traditionally a brute force hardware solution for the problem.”　　The result is that similar measurements to traditional radar can be made with only “tens to hundreds” of antennas, according to Hong. This drastically reduces the bandwidth required to transport this data, making it feasible to use a central domain controller/processor.　　The effects of using a larger, more powerful central domain controller for this data, rather than processing at the edge, are many. Ambarella’s setup allows radar data to produce structural integrity information that is “Lidar-like,” with better range and higher sensitivity than Lidar can offer—all with a cheaper radar sensor than the ones in most cars today.　　“Our resolution is below half a degree, we generate tens of thousands of points per frame and we run this at 30 frames per second and up, so we’re generating almost a million points per second,” Hong said. “The sensor itself is actually smaller, thinner, cheaper, and lower power than the existing radars that are already out there in hundreds of millions of vehicles.”　　A central domain controller also allows compute resources to be allocated where they’re needed most; in practice, this could mean more focus on front radars versus back radars when driving on a highway versus in a parking lot, or it could mean dedicating more resources to radar when driving in conditions that cameras struggle with, such as fog.　　Processing camera and radar data in the same chip also brings new opportunities for low-level sensor fusion. Raw camera data and raw radar data can be combined for better analysis.　　“Because we can now move all the radar data to the same central location where you also process all the camera data at the native level, this is the first time you can do very deep, low-level sensor fusion,” Hong said.　　Today, fusing radar and camera data after information is lost from the radar data with edge processing makes AIs rather brittle, according to Hong.　　“They are in many ways overoptimized for certain scenarios and underoptimized for others,” he said, adding that 3D structural information from radar complements camera information well, especially in the case where a camera system comes across an object it hasn’t been trained on—the camera has to know what it is in order to detect it, whereas the radar doesn’t have that constraint.　　“In many ways, this is something that our central computing platform allows: it allows you to have these two raw data sources combine, and it allows you to shift your resources between them depending on what’s actually needed,” Hong said.

Key word：

Ambarella,chip

Release time：2023-02-16 15:26 reading：3290 Continue reading>>

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Ameya360:Panasonic Introduces Intelli-Balance 100 Mirror Energy Recovery Ventilator at the International Builders’ Show 2023

　　LAS VEGAS, NV - Panasonic, a leading provider of ventilation and healthy indoor living solutions to the building industry, today announced the new Intelli-Balance 100 Mirror Energy Recovery Ventilator (ERV.) The new model is the company’s latest addition to its suite of ERVs, which help to balance air pressure in homes and buildings, and improve indoor air quality. Ideal for large, multi-family projects, the Mirror ERV is an optimal solution for tight spaces where duplicate floorplans require ventilation on either side of a building.　　As consumer awareness of indoor environmental quality has risen since the start of the pandemic, Panasonic continues to deliver solutions that help provide consumers with healthier homes built to meet energy efficiency standards across the country. The new Intelli-Balance 100 Mirror ERV is a cost-effective, code compliant, and installation-flexible option for builders to add into their projects. Key features include:　　1.Two DC motors with Smart Flow technology to assure optimal CFM (cubic feet per minute) output　　2.Multi-speed selector (50-100 CFM), which provides customizable airflow to create balance, positive or negative pressure within the home　　3.Built-in ASHRAE 62.2 timing function to assure code compliance　　4.MERV 8 filter included, with MERV 8 and optional MERV 13 filters available　　5.Two mounting options on the wall or ceiling　　In addition to debuting the Intelli-Balance 100 Mirror ERV at the International Builders’ Show, Panasonic will also be featuring additional solutions including:　　1.WhisperAir Repair Spot Air Purifier　　2.Swidget Smart Controls　　3.The extended suite of ERVS, including the Intelli-Balance 100, Intelli-Balance 200, and WhisperComfort ERV Balanced Air Solution　　4.Ventilation fans, including the WhisperFit DC Fan, WhisperGreen Select Fan, WhisperWarm Fan/Heater, and WhisperFresh Select Fan

Key word：

Panasonic

Release time：2023-02-15 14:24 reading：2096 Continue reading>>

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Ameya360:ROHM Awarded Silver in the Sustainability Site Awards 2023

　　On January 16, 2023, ROHM Co., Ltd. received a Silver Class rating in the Sustainability Site Awards 2023, which evaluated the corporate and sustainability web content of 4,095 Japanese listed companies and major unlisted companies.　　In order to receive the Silver Class rating, a company must meet the following requirements - the website itself must be exceptionally complete, with all information disclosed in a specific and comprehensive way, and it can serve as a model for other companies' websites in terms of quality.　　The ROHM's sustainability website was recognized as exemplary in terms of the comprehensiveness and accessibility of the disclosed information.　　Sustainability Site Awards 2023　　The Awards is organized by the Association for Sustainability Communication, which conducts surveys and third-party evaluations of sustainability-related information disclosure and ranks corporate websites based on the quality of their information on sustainability. The top 1% of the websites of all listed companies in Japan (as of July 31, 2022) and major non-listed companies of a certain scale are awarded Gold, Silver, and Bronze ratings for their overall excellence. In 2023, out of 4,095 eligible companies, 4 received Gold, 30 received Silver, and 5 received Bronze.

Key word：

ROHM

Release time：2023-02-15 14:06 reading：2204 Continue reading>>

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Ameya360:Renesas Automotive IPD Enables 40% Smaller Footprint

　　Renesas Electronics Corp. has launched a new automotive Intelligent Power Device (IPD) that will safely and flexibly control power distribution within vehicles, addressing the requirements of next-generation E/E (electrical/electronic) architectures.　　The new RAJ2810024H12HPD is available in the small TO-252-7 package and reduces the mounting area by about 40% compared to the conventional TO-263 package product. In addition, the advanced current detection function of the new device allows highly accurate detection of abnormal currents such as overcurrent.　　Since the new IPD detects abnormal currents even at low loads, it allows engineers to design highly safe and precise power control systems that can detect even the smallest abnormalities.　　The new IPD was developed to address the growing requirements as E/E architectures continue to evolve. In a conventional distributed E/E architecture, power supply from the battery is distributed to each Electronic Control Unit (ECU) via long, thick wires from a power box consisting of mechanical relays and fuses. IPDs have a longer life and are maintenance-free compared to mechanical relays, so they can be placed anywhere in the vehicle.　　As the automotive industry moves toward centralized or zone-oriented E/E architectures, IPDs are becoming an ideal choice for building efficient and flexible power supply networks since they use shorter, thinner wires. Renesas’ IPD in particular provides a more efficient, safer and smaller solution for power distribution control.

Key word：

Renesas,IPD

Release time：2023-02-15 14:04 reading：1882 Continue reading>>

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Ameya360:Fibocom Showcased Latest Innovations in 5G AIoT at Electronica 2022

　　Fibocom has exhibited at Electronica 2022 from November 15th to 18th 2022, demonstrating embedded wireless communication modules, 5G AIoT solutions as well as wireless solutions for FWA, smart utility, IIoT and more.　　Munich, Germany – November 18th,2022 - Fibocom Wireless Inc., a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, has presented its latest innovations in 5G AIoT at Electronica 2022 from November 15 to 18 at Booth 139 in Hall B5, Munich Trade Fair Center, Germany. Apart from leading-edge wireless communication modules, Fibocom has showcased high-performance connectivity solutions for verticals such as FWA, smart utilities, Industrial IoT (IIoT), etc.　　Connectivity is the key to implement IoT infrastructure worldwide, scenarios that require broader bandwidth and lower latency can certainly benefit from advanced 5G technologies. With its first 5G module launched in 2019, Fibocom has more than 20+ 5G modules being deployed in100+ customer devices in the global market, and keep creating industry value through leading-edge wireless module solutions.　　Utilizing5G FWA to Close the Urban-Rural Deviation　　Wireless broadband service providers constantly face challenges in deploying robust and reliable broadband services in rural areas. Integrated with Fibocom 5G module FG360, Greenpacket outdoor CPE (ODU) O5M’s 2NR CA capability offers up to 4.67 Gbps data rate, it is also equipped with the best-in-class directional antenna, with a peak gain of up to13 dBi. This innovative design enables O5M’s radius coverage distance can be 2X further than the other outdoor CPE. With bridge mode and routing capability, the connected terminal equipment can be remotely managed to create a richvariety of 5G application scenarios for home and business sectors.　　Aetina AN810-XNX, embedded with Fibocom 5G module FM160, is the world's leading platform for high-performance and energy-efficient AI computing. It leverages the 5G network for faster, seamless, and real-time connectivity, creating a new possibility for edge devices.　　LTE and LPWA Technologies Bringing Convenience and Energy-saving to the Utility Sectors　　Fibocom has also demonstrated empowerment in the smart utility field. The electric concentrator, embedded with Fibocom LTE module NL668, can receive, store, analyze and transmit the metering data via 4G network, helping to save resources and improve customer service. Water metering, coming with Fibocom NB-IoT module N510, enables continuous meter reading, immediate fault detection, and remote management.　　Endrich IoT sensor network infrastructure, powered by Fibocom LTE Cat M module MA510, is able to collect data such as vibration, altitude, air pressure, ambient of lights, temperature, then send it to the cloud platform, achieving data visualization.　　Fibocom’s leading-edge wireless module solution is high-efficient, reliable, and scalable for IoT connectivity in various scenarios. Deploying Fibocom high-speed 5G, 4G, smart module solutions, IoT implementers can easily connect any number of IoT devices seamlessly worldwide, further accelerating the digital transformation in industries.

Key word：

Ameya360,Fibocom,5G

Release time：2023-02-14 15:06 reading：2868 Continue reading>>

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Ameya360: Fibocom’s MediaTek-based 5G Module FG370-EAU

　　Fibocom FWA-dedicated 5G module FG370-EAU has received CE and GCF certifications successfully. With its high performance and extended capabilities, FG370-EAU is set to empower a various of FWA devices such as:CPE, IDU, ODU, MiFi, UFi, Dongle, etc.　　 Fibocom Wireless Inc., a global leading provider of IoT (Internet ofThings) wireless solutions and wireless communication modules, announces that the FG370-EAU 5G module has received CE and GCF certifications in December 2022. Fibocom FG370-EAU is a FWA-dedicated 5G module designed to provide ultra-reliable connectivity to FWA devices such as: CPE, IDU, ODU, MiFi, UFi, Dongle, etc. It is now fully capable of boosting the global FWA market by receiving both certifications, accelerating the worldwide deployment of FWA devices.　　Compliant with 3GPP Release 16 (R16) standard,Fibocom FG370-EAU based on MediaTek’s T830 chipset platform is designed to empower the 5G FWA market worldwide. By leveraging the powerful quad-core Arm Cortex-A55 CPU, FG370-EAU supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, which improves the utilization of spectrum resources and ensures an extended 5G coverage. Helping customers to improve the device performance and enhance 5G network experience.　　It is worth mentioning that the 5G Sub-6GHz module FG370 supports 8RX (Receive Antennas) and Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), significantly improving data transmission performance up to 7.01Gbps on the downlink and 2.5Gbps on the uplink. With the enhancements, FG370 is featuring to offer three combinations for FWA application scenarios, unleashing the extreme wireless experience and consistent low latency.　　5G Cellular + Tri-band 4×4 Wi-Fi 7 (BE19000) for 5G IDU Solution　　5G Cellular + Dual-band 2×2 Wi-Fi 7 (BE6500) for 5G ODU Solution　　5G Cellular + Ethernet 10Gbps for Wired Solution　　“Obtaining the CE and GCF certifications ensures Fibocom’s commitment to provide the best-in-the-market products and solutions to our customers worldwide,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. “Fibocom FG370-EAU is one of the most selected solution by major FWA device vendors in the global market, with continuous efforts, we believe that we will help customers to achieve great success in future.”　　The engineering sample of FG370-EAU is now ready for international shipping.

Key word：

Ameya360,Fibocom,FG370-EAU

Release time：2023-02-14 15:00 reading：2823 Continue reading>>

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Ameya360:STMicro Adds TinyML Developer Cloud

　　Parallel to its existing offline version, STMicroelectronics has put its STM32Cube.AI machine learning development environment into the cloud, complete with cloud-accessible ST MCU boards for testing.　　Both versions generate optimized C code for STM32 microcontrollers from TensorFlow, PyTorch or ONNX files. The developer cloud version uses the same core tools as the downloadable version, but with added interface with ST’s github model zoo, and the ability to remotely run models on cloud-connected ST boards in order to test performance on different hardware.　　“[We want] to address a new category of users: the AI community, especially data scientists and AI developers that are used to developing on online services and platforms,” Vincent Richard, AI product marketing manager at STMicroelectronics, told EE Times. “That’s our aim with the developer cloud…there is no download for the user, they go straight to the interface and start developing and testing.”　　ST does not expect users to migrate from the offline version to the cloud version, since the downloadable/installable version of STM32Cube.AI is heavily adapted for embedded developers who are already using ST’s development environment for other tasks, such as defining peripherals. Data scientists and many other potential users in the AI community use a “different world” of tools, Richard said.　　“We want them to be closer to the hardware, and the way to do that is to adapt our tools to their way of working,” he added.　　ST’s github model zoo currently includes example models optimized for STM32 MCUs, for human motion sensing, image classification, object detection and audio event detection. Developers can use these models as a starting point to develop their own applications.　　The new board farm allows users to remotely measure the performance of optimized models directly on different STM32 MCUs.　　“No need to buy a bunch of STM32 boards to test AI, they can do it remotely thanks to code that is running physically on our ST board farms,” Richard said. “They can get the real latency and memory footprint measurements for inference on different boards.”　　The board farm will start with 10 boards available for each STM32 part number, which will increase in the coming months, according to Richard. These boards are located in several places, separate from ST infrastructure, to ensure a stable and secure service.　　Optimized code　　Tools in STM32Cube.AI’s toolbox include a graph optimizer, which converts TensorFlow Lite for Microcontrollers, PyTorch or ONNX files to optimize C code based on STM32 libraries. Graphs are rewritten to optimize for memory footprint or latency, or some balance of the two that can be controlled by the user.　　There is also a memory optimizer that shows graphically how much memory (Flash and RAM) each layer is using. Individual layers that are too large for memory may be split into two steps, for example.　　Previous MLPerf Tiny results showed performance advantages for ST’s inference engine, an optimized version of Arm’s CMSIS-NN, versus standard CMSIS-NN scores.　　The STM32CubeAI developer cloud will also support ST’s forthcoming microcontroller with in-house developed NPU, the STM32N6, when it becomes available.提交

Key word：

ST

Release time：2023-02-14 14:51 reading：1982 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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