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Ameya360：NXP Semiconductors DSC Multilink Debug Interface

　　NXP Semiconductors DSC Multilink Debug Interface accelerates the debug and flash programming process, saving valuable development time. The Multilink provides access to the debug modes of NXP’s DSC MCUs by allowing communications between the target device and a laptop / PC. The Multilink connects the target’s standard debug header to the laptop / PC’s USB port using a Type A to Type B male-to-male USB cable. A 14-pin ribbon cable is included for connection to DSC target debug headers. The NXP Semiconductors DSC Multilink provides multi-voltage support for targets ranging from 1.8V to 5V.　　FEATURES:　　Multi-voltage support for targets ranging from 1.8V to 5V　　Fast, hassle-free USB 2.0 communications interface　　Type A to Type B male-to-male USB cable connects the interface to the PC　　Debugging via NXP Codewarrior for microcontrollers　　Includes a 14-pin ribbon cable for connection to DSC target debug headers　　Supports Program and Data Flash, Securing and Unsecuring

Key word：

NXP,Ameya360

Release time：2023-02-24 10:45 reading：1766 Continue reading>>

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Ameya360:Renesas SoC Technologies Targeted at In-vehicle Communication Gateways

　　Renesas Electronics Corp. has developed four technologies for system-on-chip (SoC) devices for in-vehicle communication gateways. These SoCs are expected to play a crucial role in defining the next-generation electrical/electronic (E/E) architecture in automotive systems.　　SoCs for automotive gateways must provide both high performance to implement new applications such as cloud services, and low power consumption when they are not in use. They also need to deliver fast CAN response to support instant start-up. Additionally, these SoCs need to provide power-efficient communication technology that enables network functions as a gateway using limited power and security technology to enable safe communication outside the vehicle.　　To meet these requirements, Renesas has developed: (1) an architecture that dynamically changes the circuit operation timing to match the vehicle conditions with optimized performance and power consumption; (2) fast start-up technology by partitioning and powering essential programs only, (3) a network accelerator that achieves a power efficiency of 10Gbps/W; and (4) security technology that prevents communication interference by recognizing and protecting vital in-vehicle communication related to vehicle control.　　Renesas announced these achievements at the International Solid-State Circuits Conference 2023 (ISSCC 2023), February 19 – 23 in San Francisco, California. Details of the new technologies include:　　1. Architecture that optimizes processing performance and power consumption depending on vehicle conditions　　Communication gateway SoCs need to deliver processing performance exceeding 30,000 Dhrystone million instructions per second (DMIPS) when running, while also keeping standby power consumption to 2mW or less in order to maintain battery life. Typically, high-performance SoCs also have high power consumption in standby mode, while low-power SoCs with small standby power consumption have performance issues. To resolve this tradeoff, Renesas combined in a single chip a high-performance application system and a control system optimized for ultralow standby power consumption. The new architecture controls the power supplies of these two subsystems and changes the timing of circuit operation to achieve an optimal balance between performance and power efficiency. This results in higher performance during operation and lower power consumption during standby.　　Fast start-up technology with external flash memory achieving the same fast speed as embedded flash memory　　Since communication gateway SoCs manage processing of critical functions related to vehicle control, they must be able to respond to CAN within 50m of start-up. However, if the SoC uses a process that does not support embedded flash memory, the start-up program must be encrypted and stored in external flash memory. This means that it takes additional time to load program data and decrypt it. To solve this issue, Renesas developed technology that splits the program into sections and initially loads and decrypts only an essential portion for start-up, while continuing to load the rest of the program in parallel. This enables a fast response to CAN (50ms or less), even when using external flash memory.　　Highly efficient network accelerator with 10Gbps/W communication efficiency　　To allow air cooling and heat dissipation for electronic control units (ECUs), communication gateway SoCs must keep power consumption to 7W or less. Since computing processing performance of 30,000 DMIPS or higher requires approximately 6 watts of power, only around 1W can be used for network processing. This presents a challenge as the total communication of 10Gbps must be achieved using 1 watt of power, with a processing efficiency of only around 3Gbps/W when processed by the CPU. To work around this issue, Renesas offloaded processing from the CPU to a custom network accelerator, achieving higher efficiency at 9.4Gbps/W. Additionally, Renesas boosted efficiency to 11.5Gbps/W by switching the routing method from a conventional TCAM approach to a hash table in SRAM.　　Security technology to prevent interference with communication requiring high reliability　　A communication gateway SoC performs a mixed set of tasks such as data processing related to vehicle control that requires a high level of reliability, and large amounts of random data communication with cloud services and others. Since vehicle control is essential to ensuring safety, protecting and separating mission-critical data is important. However, despite the differences in data types, all data is transmitted through the same in-vehicle network, leading to physical intersections and raising security issues. To address this challenge, Renesas developed security technology that analyzes incoming packets to the SoC. It determines whether or not they contain essential data, and assigns them to different pathways and control functions within the network accelerator. This prevents interference with data that requires high reliability and safeguards in-vehicle data communication from a variety of security threats.

Key word：

Renesas,SoC

Release time：2023-02-23 16:10 reading：2112 Continue reading>>

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Ameya360:Ambarella Selects Samsung’s 5nm Technology for Automotive AI Controller

　　Samsung Electronics Co. Ltd’s Foundry business is providing its 5nm process technology to and Ambarella Inc. for its newly announced CV3-AD685 automotive AI central domain controller. This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability.　　The CV3-AD685 is the first production version of Ambarella’s CV3-AD family of automotive AI central domain controllers, with Tier-1 automotive suppliers announcing they will offer solutions using the CV3-AD system-on-chip (SoC) product family. Samsung’s 5nm process technology is optimized for automotive-grade semiconductors, with extremely tight process controls and advanced IP for exceptional reliability and outstanding traceability.　　Ambarella will rely on Samsung’s 5nm process maturity and the technology’s solid track record. This 5nm process is backed by the company’s extensive experience in automotive foundry process, IP, and service package development to enable manufacturers to create cutting-edge innovations in assisted and automated mobility.　　“Ambarella and Samsung Foundry have a rich history of collaboration, and we are excited to bring their world-class 5nm technology to our new CV3-AD685 SoCs,” said Fermi Wang, President and CEO at Ambarella. “Samsung’s proven automotive process technology allows us to bring new levels of AI acceleration, systems integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.”　　The CV3-AD685 integrates Ambarella’s next-generation CVflow AI engine, which includes neural network processing that is 20 times faster than the previous generation of Ambarella’s CV2 SoCs. It also provides general-vector and neural-vector processing capabilities to deliver the overall performance required for full autonomous driving (AD) stack processing, including computer vision, 4D imaging radar, deep sensor fusion and path planning.　　“Samsung brings 5nm EUV FinFET technology to automotive applications for unprecedented ADAS and vision processor performance,” said Sang-Pil Sim, executive vice president and head of Foundry Corporate Planning at Samsung Electronics. “With Tier-1 automotive suppliers already adopting the technology, we believe other automotive companies will also consider using the Ambarella CV3-AD SoC product family manufactured in Samsung’s 5nm process.”　　The CV3-AD685 will be the first in the CV3-AD product family to use Samsung’s 5nm process, and this SoC integrates advanced image processing, a dense stereo and optical flow engine, ARM Cortex A78AE and R52 CPUs, an automotive GPU for visualizations, and a hardware security module (HSM). It features an “algorithm first” architecture that provides support for the entire autonomous-driving software stack.　　The high-performance, power efficient and scalable CV3-AD family, which is built specifically for ADAS, complements a wide range of solutions for assisted driving, while advancing vehicle automation. The integrated CV3-AD685 SoC enables information from various sensors to be fused for robust L2+ to L4 autonomous driving. Samsung Foundry’s industry-leading process technology and advanced 3D-packaging solutions are powering many of the latest mobile, HPC and automotive solutions.　　Samsung’s 5nm process is also backed by the Samsung Advanced Foundry Ecosystem (SAFE) program. The SAFE program ensures close collaboration between Samsung Foundry, ecosystem partners, and customers to deliver robust SoC designs based on certified key design components including Process Design Kits (PDK), reference flows with Design Methodologies (DM), a variety of Intellectual Properties (IP), and on-demand design support.

Key word：

Ambarella,Samsung,AI

Release time：2023-02-23 16:08 reading：3431 Continue reading>>

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Ameya360:Wireless SoCs Solve Connectivity Challenges

　　Wireless systems-on-chip (SoCs) are favored by IoT system designers for their high functionality, low power consumption and space savings. These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals.　　One of the biggest drivers in wireless SoCs is the growing need for multi-protocol support to meet the requirements of different IoT devices. Chipmakers need to keep up with existing standards that continue to evolve as well as new wireless standards. These include Wi-Fi, Bluetooth LE, Bluetooth classic, 802.15.4, ZigBee, Thread, Z-Wave, Matter, cellular and other proprietary wireless protocols.　　Through this integration and multi-protocol support, wireless SoCs are solving some of the biggest technical challenges around wireless design while simplifying development by providing all of the necessary functionality, along with the connectivity and security in one device. But designers aren’t on their own; SoC makers also provide complete ecosystems and reference designs that can lower design risk and shorten the design cycle.　　“A wireless SoC typically comprises the radio itself—one or more, depending on the application—a MAC/PHY for the Wi-Fi and PHY for Bluetooth, along with a power management unit, memory, various I/O ports, a debug port, possibly an analog-to-digital converter and bus management IP,” said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated. “Interfaces for external power amplifier and low-noise amplifier options, with associated switches, are also good to have.”　　Brandon Bae, senior director, product marketing, wireless connectivity at Synaptics Incorporated.　　Depending on the protocols supported and the end applications, the components in a wireless SoC could be different, said Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs. “Power optimization, longer range, robust connectivity, higher processing power, more peripherals and higher memory will continue to be the driving trends in wireless SoCs, and we will see continuous improvement in these.”　　Wireless SoCs are also packed with security features, making them suited for a range of embedded IoT systems, such as smart homes, smart metering, building automation and fitness devices.　　“Security is increasingly a concern to protect personal data and to protect IP, and many SoCs are adding features to address security at multiple hardware and software levels,” said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Highly integrated wireless SoCs　　As demand grows for wireless SoCs, chipmakers continue to meet requirements for better security and greater interoperability and are adding advanced features for sensors, graphics, artificial intelligence and machine learning. There is also a drive toward multi-protocol connectivity support with options for Wi-Fi, Bluetooth, LoRa, Zigbee, Matter and other protocols.　　“There is always a requirement for a higher level of integration in the wireless SoCs to meet the application use cases, simplify IoT device development and reduce cost,” Sogani said.　　One of the key areas is a higher level of hardware and software integration, which includes the integrated applications processor, integrated networking stacks, cloud connectivity, digital and analog peripherals, additional GPIOs and higher memory, along with support for new protocols like Matter, Amazon Sidewalk and Wi-SUN, he added.　　“Integration of multiple protocols is becoming critical,” Sogani said. These include the combinations of Wi-Fi and BLE and 802.15.4 and BLE, as well as Wi-Fi, BLE, 802.15.4 and even sub-gigahertz integration.　　“Bluetooth classic integration is also needed to support legacy headsets,” he added. “These protocols need to operate concurrently, which needs significant hardware and software work.”　　Dhiraj Sogani, senior director, wireless product marketing, at Silicon Labs.　　In addition, “Matter over Thread and Matter over Wi-Fi is gaining significant momentum, as it enables interoperability of different ecosystems, such as Google, Amazon and Samsung,” Sogani said. “Wi-SUN is becoming more critical for smart-city deployments. Amazon Sidewalk shows significant promise to become a leading protocol for neighborhood connectivity.”　　Vallespin noted that the evolution in standards is also enabling new use cases: “In Bluetooth Low Energy, audio is creating many new use cases to manage new user experiences and is replacing the Bluetooth classic technology. Matter technology, just announced late last year, is a new standard for connected-home applications, and ultra-wideband is increasingly being used for car access control.”　　STMicroelectronics offers a wireless roadmap based on its popular STM32 family of microcontrollers and ecosystem. These include the STM32WB series for Bluetooth LE, Thread, Matter and Zigbee and the STM32WL for LoRa and other sub-gigahertz protocols. “STM32 wireless products add best-in-class IPs to smoothly migrate to wireless platforms,” Vallespin said.　　Sogani noted two other key trends, including the integration of machine learning for IoT edge devices for simple audio, vision and data applications like keyword spotting, motion detection and glass-break detection, as well as security integration at the hardware and software level for improving IoT device security.　　Synaptics’ Bae agreed that there is a higher degree of integration coming: “We’re looking at advancing to finer nodes to not only shrink the die size, but it also frees up space to integrate more memory for more features for a given package size. The drivers tend to be functionality, size, power and cost, so if we can provide greater functionality for a given footprint while also improving power consumption, our customers like that.　　“It’s not always good to move to a smaller package, even when that’s possible, as that requires board redesigns,” Bae said. “More functionality is often preferred.”　　Similarly, Vallespin said the process node is a key factor in delivering new degrees of integration. “Smaller geometries allow greater integration.”　　Latest advances　　Wireless SoC vendors agreed that new product development is driven by wireless standards and the need for higher functionality, more integration and lower power consumption.　　For example, Silicon Labs’ wireless SoC roadmap focuses on “intelligent wireless connectivity for IoT devices.” The company offers a wide range of wireless solutions, including Wi-Fi, Bluetooth, 802.15.4, ZigBee, Thread, Z-Wave and proprietary wireless.　　Silicon Labs’ latest advances include its 2.4-GHz wireless MG24 SoC for Bluetooth and multiple-protocol operations. The MG24 supports Matter over Thread as a single-chip solution—with a range of up to 200 meters indoors for OpenThread—while also enabling Bluetooth commissioning of new devices on the same chip, Sogani said. “The MG24, combined with the ultra-low–power Silicon Labs RS9116 or Silicon Labs WF200 Wi-Fi products, enables development of Matter over Wi-Fi 4.”　　Silicon Labs also offers the FG25, the company’s new flagship SoC for Wi-SUN, which is one of the world’s first open protocols for smart-city and smart-utility applications. “The EFF01 is the FG25’s corresponding amplifier that boosts signal range by 2× when used together,” Sogani said.　　He said the FG25 “will be the world’s most secure smart-city solution, with long range, the largest memory capacity of any SoC in the Silicon Labs portfolio and the ability to operate for up to 10 years on a coin-cell battery.”　　In addition, Silicon Labs’ first Wi-Fi 6 and Bluetooth LE SoC, the fully integrated SiWx917, is designed to be the lowest-power Wi-Fi 6 and Bluetooth LE SoC in the industry, Sogani said. “The SiWx917 is a single-chip solution that is Matter-ready, includes an integrated applications processor and offers industry-leading energy efficiency, making it ideal for battery-powered or energy-efficient IoT devices with always-on cloud connectivity.”　　Synaptics is focusing on two major industry trends: connecting sensors that are gathering data to the AI systems or devices that are doing the analysis, and making wireless devices easier to use, Bae said.　　“First, we’re simplifying the integration of AI and wireless through KatanaConnect, which combines our Katana low-power edge AI SoC with our SYN430132 1 × 1 Wi-Fi/Bluetooth combo chip on a tiny module measuring 32 × 32 mm,” he said. “Second, our mix of Bluetooth, ULE, Wi-Fi, 802.15.4 and GNSS solutions is unique in the industry. They are proven solutions that simplify the cost-effective and rapid development of IoT connectivity devices. This has clear single-source benefits of both product and design expertise, so we know how to connect IoT devices.”　　However, Bae said there is more to it than having the silicon and track record. “We’re also either already Matter-compliant or are working on it across all our solution stacks so we can ensure users benefit from Matter’s promise of a seamless user experience across platforms and interfaces.”　　A good example of Synaptics’ Matter support and high integration is the SYN4381 Triple Combo SoC, which the company claims as the first to combine Wi-Fi 6/6E (802.11ax with extended 6-GHz operation), Bluetooth 5.2 (BT 5.2) with BLE audio and high-accuracy distance measurement, and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The SoC and its SynFi software simplify product development by providing secure and scalable connectivity between devices across heterogeneous IoT networks, regardless of platform, OEM or brand, the company said. For end users, they get a simplified setup and seamless control across their smart-home devices.　　Key differentiators for Synaptics include its robust connectivity and the ability to balance cost and performance, Bae said. “For example, while many offer Wi-Fi/Bluetooth combo solutions, they haven’t fully controlled the signaling, and that shows up as glitches in both audio and video.”　　To solve the problem, Synaptics has developed a proprietary mechanism, which it calls Smart Coexistence, in the 2.45-GHz band. It “carefully manages the Wi-Fi and Bluetooth transmission and reception to avoid lost packets and the inefficiencies of retransmissions,” Bae said.　　Bae added it is baked into all of its combo chips, including the SYN4381 Triple Combo, as well as the SYN43756 Bluetooth/Wi-Fi combo chip, an IEEE 802.11ax 2 × 2 MAC/baseband/radio IC with integrated Bluetooth 5.2 (with LE Audio).

Key word：

Wireless,SoC,IoT

Release time：2023-02-23 15:59 reading：1926 Continue reading>>

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Ameya360:UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow

　　Cadence Design Systems Inc.’s 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for United Microelectronics Corp.’s (UMC) chip stacking technologies, thereby enabling faster time to market for customers.　　UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications. Using UMC’s 40nm low power (40LP) process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation, and system analysis in a single platform.　　“Interest in 3D-IC solutions has increased notably in the past year as our customers seek ways to boost design performance without sacrificing area or cost,” said Osbert Cheng, vice president of device technology development and design support at UMC. “Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.”　　“With increasing design complexity for IoT, AI, and 5G applications, wafer-on-wafer technology automation is increasingly important for chip designers,” said Don Chan, vice president, R&D in the Digital & Signoff Group at Cadence. “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”　　The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database. The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit. Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis. The reference flow also enables system-level layout versus schematic (LVS) checking to connectivity accuracy, electric rule-checking (ERC) for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.　　In addition to the Integrity 3D-IC platform, the Cadence 3D-IC flow also includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Celsius Thermal Solver for system analysis.

Key word：

UMC,3D,IC

Release time：2023-02-22 15:54 reading：1817 Continue reading>>

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Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023

　　Renesas Electronics Corp. will showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD at the Mobile World Congress in Barcelona, February 27–March 2.　　Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market. The reference platform will be demonstrated at the AMD booth (#2M61 Hall 2).　　The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.　　The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.　　“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”　　“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”

Key word：

Renesas,AMD,RF,5G,AAS

Release time：2023-02-22 15:52 reading：3478 Continue reading>>

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Ameya360:What are the main types of wireless sensors

　　The component module of the wireless sensor is packaged in a shell, and it will be provided by the battery or the vibration generator when working, constituting the wireless sensor network node. It is widely used, and the wireless sensor is included in an electronic device everywhere in life. So wireless sensors are no stranger. In order to help you in-depth understanding, this article Ameya360 electronic components purchasing network will summarize the relevant knowledge of wireless sensors. If you're interested in what we're going to cover in this article, read on.　　First, what is wireless sensor Wireless sensors are devices that collect sensory information and detect changes in the local environment. Examples of wireless sensors include proximity sensors, motion sensors, temperature sensors, and liquid sensors. Wireless sensors do not perform heavy data processing locally, they consume so little power that a single battery can last for years with the best wireless technology. In addition, sensors are easy to support on slow networks because they transmit very light data loads.　　Wireless sensors can be grouped to monitor environmental conditions across an area. These wireless sensor networks consist of a number of spatially dispersed sensors that communicate through wireless connections. Sensors in a public network share data through nodes that consolidate information at the gateway or each sensor directly connected to the gateway, assuming it can reach the necessary range. Gateways act as Bridges connecting local sensors to the Internet, acting as both routers and wireless access points.　　Two, the main types of wireless sensors　　1. Vibration sensor　　The maximum sampling rate of each node can be set to 4KHz, and each channel is provided with anti-aliasing low-pass filter. The collected data can be transmitted wirelessly to the computer in real time or stored in the 2M data memory built in the node, ensuring the accuracy of the collected data. The effective outdoor communication distance is up to 300m, the node power consumption is only 30mA, and the built-in rechargeable battery can be used for continuous measurement for 18 hours. If you choose a node with a USB interface, you can not only charge the node through the USB interface, but also quickly download the data in the memory to the computer.　　2. Strain sensor　　The node is compact in structure and compact in size. It is composed of power module, acquisition and processing module and wireless transceiver module. It is encapsulated in PPS plastic shell. Each channel of the node has an independent high-precision 120-1000Ω bridge resistance and amplification and conditioning circuit, which can be easily switched automatically by the software to select 1/4 bridge, half bridge, full bridge measurement mode, compatible with various types of bridge sensors, such as strain, load, torque, displacement, acceleration, pressure, temperature, etc. The node supports both 2-wire and 3-wire input modes, and the bridge is automatically trimmed. It can also be stored in the built-in 2M data storage of the node. Effective outdoor communication distance up to 300 m. It can be measured continuously for more than ten hours.　　3. Torque sensor　　The node is compact in structure, compact in size and encapsulated in a resin shell. Each channel of the node is equipped with a high precision 120-1000Ω bridge resistor and an amplification and conditioning circuit. Automatic bridge trim. The in-air transmission rate of the node can reach 250K BPS, the effective real-time data transmission rate can reach 4K SPS, and the effective indoor communication distance can reach 100 meters. The node is designed with special power management software and hardware. In the case of real-time uninterrupted transmission, the power consumption of the node is only 25mA, and the ordinary 9V battery can be used for continuous measurement for dozens of hours. For long-term monitoring applications, torque values are sent at 5-minute intervals, and battery replacement is not required for several years, greatly improving the system's maintainability.　　In this article, Ameya360 can only give you a preliminary understanding of wireless sensors. I hope it will be of some help to you. At the same time, it needs to be summarized constantly so as to improve your professional skills.

Key word：

Ameya360

Release time：2023-02-22 15:34 reading：1548 Continue reading>>

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Ameya360:Philippine Smartphone Market Recorded Its Biggest Annual Decline Yet

　　The Philippine smartphone market marked its biggest annual decline yet by shipping 16.3 million units in 2022, down by 8.6% year-on-year (YoY), according to the International Data Corp.’s (IDC) Quarterly Mobile Phone Tracker.　　Though the last quarter in 2022 grew by 6.3% quarter-on-quarter (QoQ), it registered a 16.3% decline compared to last year as several vendors focused on clearing out inventories rather than bringing in new shipments during the holiday season due to unfavorable market conditions.　　“Both consumer and vendor confidence have been seriously dampened as inflation progressively soared throughout 2022 ending the year at a 14-year high,” says Angela Medez, Senior Market Analyst at IDC Philippines.　　realme maintained the top spot in 2022 by launching several new smartphones in the narzo series to cater to the price-conscious customer, while Transsion was the only company in the Top 5 rankings that registered growth. Both of its Infinix and Tecno brands upscaled their products in bringing in more models in the higher price range of US$100+, such as Infinix’ Note series and Tecno’s Pova and Camon series, while itel continued to cater to the entry-level segment.　　“Though inventory levels started to normalize towards the end of 2022, IDC is lowering its forecast for 2023 as vendors will remain cautious in their shipments amid the looming economic uncertainties and accelerating inflation,” Medez added.

Key word：

Smartphone,YoY

Release time：2023-02-21 15:13 reading：1812 Continue reading>>

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Ameya360:Analog Devices to Showcase the Future of Connectivity at MWC 2023

　　Analog Devices Inc. will feature interactive demonstrations and expert discussions at the upcoming Mobile World Congress (MWC) 2023. Visitors to its booth (Hall 2, Booth #2B18) will learn how ADI aims to minimize environmental impact, enable and accelerate breakthrough innovations, and enrich customers’ lives through solutions which reduce energy consumption, shorten design cycles, and enable the future of work.　　ADI’s solutions enable customers to deliver innovative, advanced Radio Units (RUs) faster using conformance tested reference design platforms with commercial grade RU IP. ADI’s experts will be on hand to discuss RAN energy saving solutions and demonstrate platform interoperability. Furthermore, ADI’s Consumer team will demonstrate their latest innovations in connectivity with applications such as mixed reality (MR) headsets and audible wearables.　　Radio unit demonstration highlights include:　　• ADI’s next-generation massive MIMO (mMIMO) Reference Design with 40% power savings: This 32Tx/32Rx mMIMO radio unit reference design is based on the latest ADI RadioVerse ADRV904x system on chip (SoC) with fully integrated digital front end and collaborator’s advanced baseband processor. This design solution provides 40% power savings compared to competing solutions, enabling lighter, smaller radios and faster time to market.　　• Creating more sustainable networks with advanced micro-sleep modes: Since the Radio Access Network (RAN) consumes 70% to 80% of total network energy, energy savings modes are critical to reducing the carbon footprint across 5G networks and lowering OPEX spending. ADI RadioVerse solutions provide the path forward to meeting the upcoming 3GPP Rel. 18 network energy saving (NES) modes for 5G RAN. See how these potential energy savings are realized in an interactive model of micro-sleep and hibernation modes across multiple Open Remote Unit (O-RU) configurations.　　• Next-generation 5G mmWave beamforming platform: Upgrade macro, small cell, and indoor 5G deployments across the entire 24 to 47GHz bands. This 8T8R 400MHz solution highlights ADI’s latest O-RAN 7.2 split compliant mmWave reference platform, with a proven 25% efficiency improvement in analog beamforming based entirely on ADI silicon solutions.　　In a world where virtual connections are increasingly part of everyday life, ADI will present several advancements in consumer technology which enrich the sensory experience with realistic human interactions:　　• MR headset: Enabling the future of work with the Metaverse – Integrating emerging virtual worlds into everyday lives take a huge technological effort: Intelligent Edge devices, 5G/6G infrastructure, and the green energy to power it all. ADI advancements are making this possible.　　• Hearable solutions: Life, exactly how it is supposed to sound – Filtering out, amplifying, or enhancing the sounds of life when appropriate helps people experience perfect sound, every day. Context-aware, hearable solutions change how people work, play, and rest from anywhere.　　• USB-C fast charging, battery insights, and protection: Fast charging your life’s work – Improving charging efficiency puts less wear on batteries and extends the lifespan of devices. USB-C fast charging technology keeps phones, headphones, or gaming devices going at the speed of daily life, with the highest efficiency and safety in the smallest footprint.

Key word：

Analog Devices,MWC,ADI

Release time：2023-02-21 15:10 reading：2007 Continue reading>>

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Ameya360:STMicroelectronics SGT120R65AL e-mode PowerGaN Transistor

　　STMicroelectronics SGT120R65AL e-mode PowerGaN Transistor offers 650V and 15A while combining well-established packaging technology. The SGT120R65AL G-HEMT device features extremely low conduction losses, high current capability, and ultra-fast switching operation. These features allow the STM SGT120R65AL to achieve high power density and unbeatable efficiency.　　FEATURES　　Enhancement mode normally-off transistor　　Very high switching speed　　High power management capability　　Extremely low capacitances　　Kelvin source pad for optimum gate driving　　Zero reverse recovery charge　　APPLICATIONS　　Adapters for tablets, notebooks, and AIO　　USB Type-C PD adapters and quick chargers　　Wireless chargers　　APPLICATION CIRCUIT

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Ameya360,STMicroelectronics,SGT120R65AL

Release time：2023-02-21 11:39 reading：3431 Continue reading>>

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