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Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications

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Murata

Release time：2024-06-28 11:31 reading：636 Continue reading>>

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Murata Power Solutions MPS Isolated DC-DC Converters

　　Murata Power Solutions MPS Isolated DC-DC Converters transform 36VDC to 75VDC input into an isolated, regulated 12VDC/17A output. These highly efficient 200W devices are fully protected from overcurrent, overtemperature, and overvoltage faults and come with UL, IEC, and other safety approvals. Additional features include optimized thermal performance, high efficiency of up to 95%, remote on/off enable, and output trim adjustment. Murata Power Solutions MPS Isolated DC-DC Converters are RoHS compliant and packaged within an industry-standard sixteenth-brick format with or without a baseplate. Typical applications include power-over-Ethernet (PoE), telecom, industrial, and servers, storage, and networks (SSN). FEATURES　　36V to 75V input voltage range　　Regulated 12VDC/17A output　　Industry-standard sixteenth-brick with baseplate (optional)　　Optimized thermal performance　　High efficiency up to 95%　　Overcurrent, overtemperature, and overvoltage protection　　Remote on/off enable (negative logic)　　Output trim adjustment (-20%, 10%)　　2250VDC isolation (input-to-output)　　RoHS compliant　　Safety approvals　　UL 62368-1 3rd edition　　IEC 62368-1:2018　　CSA-C22.2 No. 62368-1-19　　CE and UKCA approved　　APPLICATIONS　　PoE　　SSN　　Telecom　　Industrial　　ORDERING GUIDE

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Murata

Release time：2024-06-25 14:43 reading：787 Continue reading>>

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novosns：Technical Sharing | The Introduction of Gate Drivers and the Applications

　　1) Introduction of the Gate Drivers　　Gate driver is a buffer circuit between the low-voltage controller and the high-power circuit, which is used to amplify the control signals of the controller for more effective turn-on and turn-off of power devices.　　1. The functions of gate driver are as follows　　- Gate driver can convert the low-voltage signal from the controller to higher-voltage drive signal, so as to achieve stable turn-on and turn-off of power devices.　　- Gate driver can provide transient source and sink peak currents, which can improve the switching speed of power devices and reduce the switching loss.　　- Gate driver can effectively isolate the noise of high-power circuits and protect sensitive circuits against interference.　　- Gate driver typically integrates protection functions to effectively prevent damages to power devices.　　It can be seen that gate driver is used to ensure better performance of power devices in the system.　　2. There are four types of common power devices　　- Si-MOSFET devices, which withstand voltage of 20V-650V and are suitable for low-power systems.　　- Si-IGBT devices, which withstand voltage of greater than 650V and provide a strong current endurance capability. This type is suitable for high-voltage and high-power systems.　　--- Both Si-MOSFET and Si-IGBT are Si-based power devices that have been widely used, and their manufacturing technologies are mature and stable.　　- SiC-MOSFET devices, which provide withstand voltage range comparable to IGBT, but feature fast switching speed and low switching loss. They are more suitable for high-voltage and high-power systems.　　- GaN devices, currently constrained by the manufacturing technology, typically have a withstand voltage of less than 650V, but provide obviously advantageous switching performance. This power device type is suitable for high-frequency and high-power systems.　　--- SiC-MOSFET and GaN devices are wide bandgap semiconductors that boast significant performance advantages over Si-based ones, and will have a broad range of applications in the future.　　3. NOVOSENSE gate drivers　　Different power devices have varied requirements for gate drivers. Currently, NOVOSENSE has developed driver products suitable for these four types of power devices.　　4. Switching process of power devices　　How does a gate driver control the turn-on and turn-off of power devices? Below is a detailed explanation of the switching process of power devices. In power devices, there are equivalent parasitic capacitances, such as CGS, CGD and CDS. The switching process of a power device can be equivalent to the charging and discharging process of its parasitic capacitances.　　4.1 Turn-on process　　In the turn-on process, the driver IC connects the output signal to the driver power supply through an internal source current MOS, and charges CGS and discharges CGD through a gate resistor.　　- (t0-t1) stage: The gate current charges CGS, and VGS gradually increases. At this point, the power device is still turned off.　　- (t1-t2) stage: When VGS increases to a value greater than the gate threshold voltage Vth, the power device begins to turn on, and IDS increases with VGS until it reaches the maximum value.　　- (t2-t3) stage: This is the Miller Plateau period, where the gate current mainly discharges CGD, and VDS begins to decrease. The device is fully turned on.　　- (t3-t4) stage: The gate current continues to charge CGS, and VGS gradually increases to the power supply voltage. When the gate current reduces to zero, the turn-on process ends. The turn-on loss of the power device mainly occurs at the t1-t3 stage.　　4.2 Turn-off process　　In the turn-off process, the driver IC connects the output signal to the GND through an internal sink current MOS, and discharges CGS and charges CGD through a gate resistor.　　- (t0-t1) stage: The gate current mainly discharges CGS, and VGS gradually decreases.　　- (t1-t2) stage: This is the Miller Plateau period, where the gate current mainly charges CGD, and VDS begins to increase. When the voltage reaches VDC, the Miller Plateau ends.　　- (t2-t3) stage: IDS begins to decrease. When VGS decreases to Vth, IDS drops to zero, and the power device is completely turned off.　　- (t3-t4) stage: The gate current continues to discharge CGS, and VGS eventually drops to zero. The turn-off process ends. The turn-off loss of the power device mainly occurs at the t1-t3 stage.　　It can be seen from the analysis above that shortening the t1-t3 stage can effectively reduce the switching loss of power devices.　　4.3 Three types of common driver IC　　At present, there are three types of commonly used driver ICs, namely non-isolated low-side drivers, non-isolated half-bridge drivers, and isolated drivers.　　- Non-isolated low-side drivers are only suitable for power devices with a reference to GND, and provide dual-channel or single-channel driving capability. Non-isolated drivers are relatively simple to implement, requiring only single power supply. They are mainly used in low-voltage systems, such as AC/DC converters, electric tools, and low-voltage DC/DC converters. Currently, NOVOSENSE offers non-isolated low-side driver ICs including NSD1026V and NSD1015.　　- Non-isolated half-bridge drivers are used in power systems with a half-bridge configuration. The withstand voltage of the high and low sides is usually achieved through level shifting or isolation, ranging from 200V to 600V. To prevent shoot-through, half-bridge drivers provide an interlock function. When a non-isolated half-bridge driver is used in a system, single power supply plus bootstrap power is typically adopted. This driver IC type is mainly used in low-voltage or high-voltage systems, such as AC/DC converters, motor drives, and on-board DC/DC converters. Currently, the half-bridge driver ICs from NOVOSENSE include NSD1624 and NSD1224.　　- Isolated drivers use an internal isolation barrier to physically isolate high and low voltages. Isolated drivers provide flexibility in application. Single-channel and dual-channel isolated drivers are available for low-side, high-side, or half-bridge applications. To achieve primary and secondary isolation in the system, the high-voltage side requires an isolated power supply, making the power supply system relatively complex. Isolated drivers are mainly used in high-voltage systems, such as electric drives, photovoltaic inverters, and OBCs. Currently, NOVOSENSE offers NSI6602 dual-channel isolated driver IC, NSI6601/NSI6601M single-channel isolated driver IC, NSI6801 opto-compatible isolated single-channel driver IC, and NSI6611/NSI68515 smart isolated driver IC.　　2) Introduction to Isolation Solutions　　In a high-voltage power system, there is usually isolation between high voltage and high voltage, as well as between high voltage and low voltage. Why is isolation driver needed? First, an isolated driver can avoid harm to human body caused by high-voltage electricity, and meet safety standards through isolation. Second, it can protect the control system from damages that can be caused by lightning strikes and high voltage transients. Third, an isolated driver can eliminate ground loops and reduce interference from the high voltage side to the low voltage side. Fourth, it can realize voltage or current change and energy transfer.　　There are three commonly used isolation schemes. The first is optocoupler isolation, which achieves signal transmission through light-emitting diodes and phototransistors. This isolation scheme is low-cost, but provides weak CMTI (Common Mode Transient Immunity), limited temperature range, and short service life. The second isolation scheme is magnetic isolation, where the chip integrates micro-transformer and electronic circuit to achieve signal transmission. The magnetic isolation chips deliver benefits such as long lifetime, wide temperature range, and strong CMTI, but involve complex technology, high cost, and prominent EMI issue. The third isolation scheme is capacitive isolation, which achieves signal transmission through isolation capacitors and electronic circuits. It usually uses silicon dioxide (SiO2) as the insulating material. The capacitive isolation scheme features low cost, long isolation life, wide temperature range, and strong CMTI. NOVOSENSE adopts the capacitive isolation scheme.　　NOVOSENSE isolation solution　　Isolated driver ICs from NOVOSENSE usually have two dies – the primary die on the input side and the secondary die on the output side. There is a physical isolation between the dies. Two isolation capacitors are connected in series on the die to achieve double insulation capability. If one of the dies experiences an EOS failure, the driver IC can still maintain basic insulation capability. The top and bottom substrates of the two isolation capacitors are insulated using SiO2, which can ensure stable material properties, good chip consistency, and long isolation life. The top substrates of the two isolation capacitors are connected by metal wires for signal transmission. NOVOSENSE’s isolated driver ICs can withstand surge voltage up to 12kV and 8kV transient insulation voltage test, far exceeding the insulation requirements of high-voltage systems.　　The communication between the dies adopts the differential OOK modulation scheme, which ensures stable and reliable communication. The input signal is modulated at a high frequency and then transmitted from the primary die to the high-voltage die through the isolation capacitor, with the modulation frequency at a level of over 100 MHz. A proprietary CMTI modular circuit is added at the input side of the differential signal, allowing the IC to achieve a stronger CMTI capability up to 150V/ns. For power systems with a high dv/dt, the IC can still work stably without abnormal wave emission.

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novosns

Release time：2024-06-21 11:23 reading：699 Continue reading>>

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Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched R-Car Open Access (RoX), a development platform for software-defined vehicles (SDVs) that integrates all essential hardware, operating systems (OS), software and tools needed for automotive developers to rapidly develop next-generation vehicles with secure and continuous software updates. Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the SDV platform includes comprehensive tools for the seamless deployment of AI applications. By pre-integrating all fundamental layers required to develop SDVs, RoX drastically reduces the complexities for car OEMs and Tier 1 suppliers, saving time and money.　　The advent of SDVs represents a major step forward in automotive technology – accelerating toward more driving autonomy, electrification and connected experiences. Cars have to be aware of the 360-degree surrounding space with ASIL D levels of sensing, processing and control to deliver safety and autonomy applications. The in-cabin experiences for drivers and passengers are being revolutionized. As a result, modern electrical/electronics (E/E) architecture depends on software to control vehicle functions, manage real-time data networks across different ECU zones, and provide customer differentiation. It has become more difficult to maintain and upgrade these complex software stacks while ensuring the highest levels of safety. Renesas’ customizable solution solves these challenges by offering a cloud-native development environment and a simulation platform, supporting the software-first approach and parallel hardware and software development.　　Out-of-box Platform with Market-Ready Software Stacks　　The flexible RoX SDV platform is available in two versions. “RoX Whitebox” is an open, easily accessible software package that includes royalty-free OS and hypervisor software such as Android Automotive OS, FreeRTOS, Linux, Xen and Zephyr RTOS, as well as reference applications designed for specific domain systems. “RoX Licensed” is based on industry-proven commercial software solutions, such as QNX and Red Hat In-Vehicle Operating System, as well as AUTOSAR-compliant software and SAFERTOS®. It is pre-integrated and tested to run on Renesas’ R-Car SoCs and MCUs and includes pre-validated software stacks from STRADVISION for Advanced Driver Assistance Systems (ADAS) and Candera CGI Studio for in-vehicle infotainment (IVI), to name a few. These software solutions can be easily productized and customized or expanded depending on OEMs’ needs.　　With the RoX SDV platform, automotive system engineers can start building their software immediately using a highly integrated toolchain even before the hardware is available. This is made possible through the cloud environment and the virtual development platform, which let developers design, debug in simulation, and verify their software before deploying on live SoCs and MCUs. The virtual development platform includes the Renesas Fast Simulator (RFS) as well as partner solutions such as ASTC VLAB VDM and Synopsys Virtualizer Development Kit (VDK) to provide broad coverage of simulation speed, features and use cases.　　For seamless end-to-end AI development, RoX offers the AI Workbench to enable developers to validate and optimize their models and test their AI applications all in the cloud, either on the virtual development platform or on Renesas board farms. A wide range of AI models, automated pipelines, as well as a specific hybrid compiler toolchain (HyCo) are available to support the rapid AI deployment on the R-Car heterogeneous compute platform across generations of SoCs.　　AWS Cloud Services Now Available　　The RoX SDV platform now supports Amazon Web Services (AWS) cloud computing services as part of the AI Workbench development environment. With the Renesas R-Car SDK (Software Development Kit) containerized in the AWS cloud environment, developers can innovate and optimize their designs more efficiently. This tight integration allows them to simulate and test hardware and software combinations instantly and deploy AI applications that seamlessly run on R-Car devices.　　Scalable R-Car Gen 5 Family　　The RoX SDV platform is designed for current generation R-Car SoCs, the upcoming R-Car Gen 5 MCU/SoC Family, and future devices. The SDV platform provides car OEMs and Tier1 suppliers the flexibility to design a broad range of scalable compute solutions for ADAS, IVI, gateway and cross-domain fusion systems as well as body control, domain and zone control systems.　　Renesas’ R-Car Gen 5 is currently the only hardware architecture in the industry that can accommodate the full range of processing requirements – from zonal ECUs to high-end central compute, serving from entry-level vehicles to luxury-class models. Thanks to a new unified hardware architecture based on Arm® CPU cores, customers developing with the R-Car Gen 5 devices will be able to reuse the same software and tools across diverse E/E applications that span car models and generations, preserving their engineering investments. Renesas’ high-performance SoC products will offer both domain-specific and cross-domain solutions using application processing, large display capabilities, sensor connectivity, GPU and AI processing.　　“RoX is a significant advancement that will speed up the shift-left approach for software-defined vehicles,” said Vivek Bhan, Senior Vice President and General Manager of High Performance Computing at Renesas. “Today, car OEMs and Tier1 suppliers are heavily investing in software development and maintenance. Renesas understands this challenge and is closely working with them to deliver a flexible, ready-to-deploy development solution that can be maintained throughout the vehicle’s lifespan. The RoX platform empowers our customers to design vehicles that deliver new value and bring improved safety and delightful comfort experiences to drivers and passengers.”　　“At AWS, we’re committed to helping our customers and partners accelerate development and bring innovation to drivers faster than ever before,” said Andrea Ketzer, Director of Technology Strategy, Automotive & Manufacturing at AWS. “With Renesas’ R-Car Gen 5 devices supported by the AI Workbench on AWS, customers will achieve faster and more validated simulations and the ability to develop independently of hardware. This step change in development will drive the industry forward and place software innovation at the forefront of mobility.”　　According to TechInsights, the market shift to domain, zonal and centralized architectures will translate to a growing processor market, incorporating SoCs and MCUs, worth $25.9 billion by 2031. “Being able to maintain and upgrade complex software stacks that incorporate operating systems, hypervisors and other functional software stacks will thus become an increasingly critical element of the supply chain,” said Asif Anwar, Executive Director of Automotive End Market Research at TechInsights. “By also being able to offer cloud-native environments to support a software-first approach to development and testing of the hardware, the Renesas RoX SDV platform offers a ready-built ecosystem that encompasses these elements in support of a scalable portfolio of next generation R-Car Gen 5 processors to address this sizable market.”　　Renesas’ R-Car Open Access Platform is being demonstrated at the AWS Summit Japan in Tokyo from June 20-21.　　RoX SDV Platform Partners:　　Operating System/Hypervisor Partners　　QNX　　Red Hat　　Vector AUTOSAR　　WITTENSTEIN SAFERTOS®　　Software Stack Partners　　Candera CGI Studio　　EPAM AosEdge　　Excelfore eSync　　MM Solutions　　STRADVISION SVNet　　Nullmax　　Development Tools Partners　　ASTC VLAB Works　　Synopsys Virtualizer Development Kit (VDK)　　Cloud Partners　　AWS　　Microsoft Azure　　Availability　　The R-Car Open Access Platform is available today with the option to license. Open-source OS, commercial OS, full application software stacks, virtual development, cloud infrastructure and debugging and emulation tools are available by Renesas or through partners. Additional information about the development platform is available here and information about the R-Car Gen 5 Family can be found here. Please contact your local sales teams for more details.

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Renesas

Release time：2024-06-20 10:53 reading：1271 Continue reading>>

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ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces the Size of xEV Inverters

　　ROHM has developed four models as part of the TRCDRIVE pack™ series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1x4, two of 1,200V-rated: BSTxxxD12P4A1x1) optimized for xEV (electric vehicles) traction inverters. TRCDRIVE pack™ supports up to 300kW and features high power density and a unique terminal configuration - help solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours.　　As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack™.　　A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack™ reduces size by utilizing a unique structure that maximizes heat dissipation area. On top, ROHM’s 4th Generation SiC MOSFETs with low ON resistance are built in - resulting in an industry-leading power density 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs.　　The modules are also equipped with control signal terminals using press fit pins enabling easy connection by simply pushing the gate driver board from the top, reducing installation time considerably. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.　　Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules. To obtain samples, please contact a sales representative or visit the contact page on ROHM’s website.　　Product LineupTRCDRIVE pack™ is scheduled to be launched by March 2025 with a lineup of 12 models in different package sizes (Small / Large) and mounting patterns (TIM: heat dissipation sheet / Ag sinter). In addition, ROHM is developing a 6-in-1 product with built-in heat sink that is expected to facilitate rapid traction inverter design and model rollout tailored to a variety of design specifications.　　☆: Under Development　　AQG 324 is a qualification standard for automotive power modules established by ECPE (European Center for Power Electronics).　　European automakers are required to comply with this standard when considering adoption.　　Application Examples・ Automotive traction inverters　　Sales InformationAvailability: June 2024 (OEM quantities)　　Pricing: $550/unit (samples, excluding tax)　　Comprehensive Support ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of TRCDRIVE pack™ products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation in similar conditions as practical inverter circuits.　　For details, please contact a sales representative or visit the contact page on ROHM’s website.　　EcoSiC™ BrandEcoSiC™ is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　TerminologyTraction Inverter　　Traction motors in electric cars are driven by 3-phase AC power with a phase shift of 120°. Traction inverters convert direct current supplied from the battery into 3-phase alternating current.　　2-in-1　　To convert DC into 3-phase AC, one high-side and one low-side MOSFET are required per phase for switching. A 2-in-1 configuration combines both of these MOSFETs into a single module.

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ROHM

Release time：2024-06-19 14:57 reading：668 Continue reading>>

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Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."

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Fibocom

Release time：2024-06-18 16:12 reading：845 Continue reading>>

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Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence

　　TOKYO, Japan and HYDERABAD, India, June 05, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and the Indian Institute of Technology Hyderabad (IITH) have signed a three-year memorandum of understanding (MOU) for research and collaboration in the field of VLSI and embedded semiconductor systems. The engagement with IITH professors and staff will focus on R&D and academic interactions with a goal to drive innovation in India’s semiconductor industry and advance the nation’s “Make in India” strategy.　　The signing ceremony of the agreement was held on June 3, 2024 at the IITH in Telangana state between Malini Narayanamoorthi, Country Head of India and Senior Director of Engineering, Analog & Connectivity Product Group, Renesas, and Prof. B.S. Murty, Director, IITH.　　The MOU will help the IITH foster talent development in support of India’s ambition to build a self-reliant semiconductor industry while enabling Renesas to add talented employees in India through closer collaboration with the country’s educational institutions to capture huge market opportunities.　　Under the MOU, Renesas this year will begin supporting university course curriculum development, hands-on learning using Renesas development boards and various outreach programs designed to advance lab work and proof-of-concept projects. IITH engineering students will be eligible to apply for six-month Renesas internships and pursue full-time employment with the company.　　“India holds significant importance within our business operations, and we appreciate its dynamic innovation environment and strong potential for growth,” said Julie Pope, Senior Vice President and Chief Human Resources Officer, Renesas. “We are delighted to partner with IITH in its goal to be the cradle for semiconductor innovation in India. We aim to strengthen India's semiconductor product ecosystem, and support the “Make in India” objective of providing increasing semiconductor content for India and the world.”　　“Recognizing the importance of India at the forefront of the semiconductor industry in influencing the future, our collaboration with Renesas will provide a chance for our students to gain exposure and learn directly from Renesas experts about constructing products with cutting-edge technologies. IITH is pioneering several initiatives to foster talent development in Electronic System Design and Manufacturing (ESDM) sector across India. This synergistic collaboration is a booster to that effort. This is also a pathway for R&D collaboration as IITH boasts several expert faculty spanning across several departments who can co develop next generation electronic products with Renesas,” said Prof. B.S. Murty, Director, IITH. “The opportunity for employment at a leading global company is a tremendous additional benefit.”　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　About IIT Hyderabad　　Indian Institute of Technology Hyderabad (IITH) is one of the eight IITs established by the Government of India in 2008. In a short span of 15 years, the institute has become one of the top-ranked institutions in the country and has received global recognition. It has 300+ full-time faculty, 4,700+ students (60% of them being PG+PhD students), 18 Departments + 1 Centre for Interdisciplinary Programs, nearly 500+ state-of-the-art Research Facilities, and five research and entrepreneurship centres. The institute has a strong research focus with approx. Rs. 1,100+ Cr of sanctioned research funding (Rs. 250+ Cr in 2023-24). IITH has more than 10,500+ research publications with 1,60,000+ Citations, 275+ Published Patents, 3,700+ sponsored/consultancy projects with 500+ running projects, and about 190+ startups that have generated 1,100+ jobs and a revenue of Rs. 1,500+ Cr.

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Renesas

Release time：2024-06-12 13:37 reading：1296 Continue reading>>

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Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, IoT to Empower Industry Transformation

　　The wave of intelligence is revolutionizing industries globally, with 5G, AI, and IoT playing key roles in this trend. During Computex 2024, Fibocom CEO - Tiger Ying shared his insights during the tradeshow.　　Fibocom, as China's first stock-listed wireless communication modules and solutions provider (stock code: 300638), has continuously employed innovative thinking and strategic market positioning in recent years. CEO Tiger Ying pointed out that, regardless of the technological or application aspects, in facing the transformative effects brought by these three major technologies, the company is well-prepared and ready to assist clients in seizing vast smart business opportunities.　　Remain Industry-Focused and is Confident to Accelerate 5G Deployment　　In the realm of 5G, this communication standard garnered significant market attention upon its release. The industry believes that 5G'sfeatures such as high speed, low latency, and large-scale connectivity not only enhance user experiences in the consumer sector but also serve as a crucial driver for deepening communication technology applications across industries.　　While the development of 5G has not been as fast as initially expected, communication giant Ericsson predicted in its 2023 report that the golden crossover period between 4G and 5G would be delayed until 2028.However, Tiger Ying pointed out that from the perspective of technical standards' development speed, this delay is still within a normal cycle.　　He mentioned that 5G's current development is focused on Enhanced Mobile Broadband (eMBB), Massive Machine Type Communications (mMTC), and Ultra-Reliable Low Latency Communications (URLLC). However, large-scale commercialization has not been achieved. This trend also highlights the versatility of 5G IoT architecture and applications.　　With the acceleration of 5G Advanced, it will truly replace4G as the mainstream technology for IoT applications and successfully drive market development within five years.　　Fibocom has responded to the trend of 5G development by formulating product strategies and solutions, actively expanding into different market sectors. Tiger Ying stated that the company's primary task is to promote the large-scale commercialization process of eMBB.　　They have already launched a diverse range of product portfolios. This includes the RedCap module, closely following the development of 5G technology and fully advancing the implementation of commercial plans.　　In terms of application areas, Fibocom is focused on industrial intelligence and smart cities, primarily because these two major application scenarios have diverse demands for 5G technology. For instance, in machine vision, which integrates edge computing with 5G's high bandwidth and low latency capabilities, it has been widely used in industrial quality inspection, promoting the development of industrial automation and intelligence.　　In response, Fibocom provides a complete product portfolio, such as the 5G smart module SC171 with computing power up to 12TOPS, to meet specific demands in application scenarios. In addition, endpoint devices with AI capabilities will also become a driving force in accelerating industrial intelligence processes.　　Fibocom has invested significant research and development resources in these products, aiming to integrate 5G and on-device AI technologies, thus strengthening the company's core competitiveness in industrial intelligence and smart city domains.　　Strengthening Edge AI Performance to Optimize Overall Cost-effectiveness　　AI has become a recent global industrial focus, and Fibocom's AI strategy centers on edge computing and the AI endpoint device solutions mentioned above. Since AI computing power can significantly increase the cost of endpoint devices, leading to reluctance from enterprises with implementation needs, cost control is crucial.　　Tiger Ying pointed out that the solution to this problem varies depending on the AI architecture. Devices using an offline AI architecture require precise control of edge computing power to balance cost and effectiveness, while devices using an online AI architecture require strong communication capabilities to avoid affecting user experience due to communication delays.　　Tiger Ying further stated that Fibocom has integrated the above two solutions into one through long-term research and development. The company has invested in smart module development, leveraging the computational efficiency and heterogeneous algorithm capabilities of modules to assist clients in rapidly deploying AI-capable terminal devices and optimizing costs.　　Its product portfolio includes 5G data modems, SoC 5G solutions based on Linux, and Android, and built-in AI computing capabilities. He mentioned that while AI may slightly increase device costs, its excellent performance leads to overall cost optimization considering macroscopic aspects such as user experience and value creation.　　He also mentioned that Fibocom has constructed heterogeneous computing on the network, enabling the scheduling of CPU, GPU, NPU, and DSP processor performance as needed. In addition, Fibocom has developed its toolchain and integrated it with heterogeneous algorithms, RTK, high-precision positioning, and other functions into firmware.　　Its products based on Linux, Android, and Windows architectures can meet the needs of different industry customers. Looking ahead, Fibocom will focus on areas such as robotic lawnmowers, low-speed autonomous vehicles, PCs, and robotic development platforms, providing deeper vertical domain solutions.　　Enhancing π-shaped Capabilities to Meet Three Major IoT Demands　　Regarding IoT, Tiger Ying pointed out that although the IoT architecture and concept have been around for over a decade and have become increasingly widespread in recent years, practical constraints mean that adoption varies across industries. To accelerate IoT adoption, several key factors are necessary.　　First is the ability to apply AI capability to IoT devices, as AI significantly impacts data collection costs and processing quality. IoT leveraging AI will be more readily accepted by enterprises, thus speeding up adoption in specific fields.　　Second is security design, which has become a major focus in IoT in recent years. Only IoT architectures that can ensure data integrity and privacy protection will be able to deploy in vertical markets.　　Lastly, communication technology is crucial. Advanced technologies like 5G-Advanced (5.5G) and Non-terrestrial Networks (NTN) ensure that communication coverage is no longer a weak point, broadening the scope of IoT applications.　　Fibocom has introduced corresponding products to address AI, data privacy, and satellite communications needs. In terms of AI, the company's 5G smart module SC171 and SC151 series are suitable for various 5G smart terminal devices.　　For security, blockchain technology was deployed on 4G networks and commercialized. On the satellite communications front, Fibocom released NTN-supported communication modules in 2023.　　Moving forward, the company plans to integrate these technologies and products, working with ecosystem partners to focus on specific vertical solutions, providing customers with high-quality and high-performance IoT solutions.　　Fibocom consistently prioritizes intelligence in product innovation. Tiger Ying stated that this will continue to be the foundation for future development, with a market-driven approach to introducing cross-domain AI solutions.　　He emphasized that while the market previously demanded "T-shaped" capabilities combining vertical telecommunication expertise to serve the horizontal industries, the AI era requires an additional vertical capability—AI specialization. Through "π-shaped" capabilities, which integrate horizontal and dual vertical expertise, Fibocom aims to create high-performance IoT architectures tailored to customers' needs.　　The company is progressively enhancing these "π-shaped" capabilities. It will continue to collaborate with ecosystem partners, integrating 5G, AI, and IoT technologies to help clients seize smart business opportunities.

Key word：

Fibocom

Release time：2024-06-06 11:47 reading：1068 Continue reading>>

Trade news

Understanding Force Sensing Resistor (FSR) Technology

　　Force Sensing Resistors (FSRs) represent a critical advancement in sensor technology, offering a versatile and efficient means of measuring force or pressure across a wide range of applications. From consumer electronics to medical devices, automotive systems to robotics, FSRs play a pivotal role in enhancing functionality, safety, and user experience. This article delves into the workings of FSRs, their applications, and the advantages they offer.　　What is a Force Sensing Resistor?　　A Force Sensing Resistor, also known as a pressure sensor or force-sensitive resistor, is an electronic component whose electrical resistance changes in response to applied force or pressure. Essentially, it’s a thin, flexible, polymer-based material that exhibits a decrease in resistance when pressure is applied to its surface. This change in resistance can be measured and calibrated to determine the magnitude of the applied force.　　How do Force Sensing Resistors Work?The fundamental principle behind FSR operation is the conductive polymer material used in its construction. Typically, this material is embedded with conductive particles, and when pressure is applied, the distance between these particles decreases, allowing more current to flow through the sensor. This change in current flow corresponds to a change in resistance, which can be precisely measured.　　What’s the applications of Force Sensing Resistors?Human-Machine Interfaces (HMIs): FSRs are extensively used in touch-sensitive interfaces for consumer electronics like smartphones, tablets, and touch-sensitive buttons in appliances. They enable intuitive interaction by detecting the pressure exerted by a user’s touch.　　Medical Devices: In medical applications, FSRs are employed in devices such as electronic skin, prosthetics, and pressure-sensitive mats for patient monitoring. They help in measuring pressure distribution for applications like orthopedic rehabilitation or monitoring bedridden patients.　　Automotive Systems: FSRs find applications in automotive technologies such as seat occupancy sensors, airbag deployment systems, and touch-sensitive controls in vehicles. They enhance safety by accurately detecting the presence and position of occupants and providing feedback for touch-sensitive controls.　　Robotics: FSRs are used in robotics for force feedback systems, grip force sensing in robotic hands, and collision detection. This allows robots to interact safely and accurately with their environment, objects, and humans.　　Sports Equipment: FSRs are integrated into sports equipment such as smart insoles, golf club grips, and bicycle handlebars to measure pressure distribution, grip force, and impact forces. This data can be used for performance analysis, injury prevention, and technique improvement.　　What’s the advantages of Force Sensing Resistors?Flexibility: FSRs are thin and flexible, making them suitable for applications where space and form factor are constraints.　　Low Power Consumption: They typically require low power to operate, making them suitable for battery-powered devices.　　High Sensitivity: FSRs exhibit high sensitivity to force or pressure changes, enabling precise measurement across a wide range of forces.　　Cost-Effective: Compared to other force sensing technologies like load cells or piezoelectric sensors, FSRs are often more cost-effective, making them a preferred choice for many applications.　　Easy Integration: FSRs can be easily integrated into existing electronic systems due to their simple design and compatibility with standard electronic interfaces.　　What are the components of Force Sensing Resistors FSR?Force Sensing Resistors (FSRs) typically consist of several components that work together to detect and measure force or pressure. These components include:　　Substrate Material: FSRs are usually constructed using a flexible substrate material, often made of polymers like polyethylene or polyvinyl chloride (PVC). This substrate provides the foundation for the sensor and allows it to conform to curved or irregular surfaces.　　Conductive Polymer: The key component of an FSR is the conductive polymer layer. This layer is typically applied to the substrate and contains conductive particles dispersed throughout a polymer matrix. When pressure is applied to the sensor, the distance between these particles decreases, leading to a reduction in electrical resistance.　　Conductive Traces: FSRs often incorporate conductive traces or electrodes on the substrate, which are used to connect the sensor to external circuitry. These traces provide electrical connections for measuring the resistance of the sensor and transmitting data to a microcontroller or other electronic devices.　　Protective Layer: Many FSRs feature a protective layer on top of the conductive polymer to shield it from environmental factors such as moisture, dust, and mechanical damage. This protective layer may be made of materials like silicone rubber or polyimide film.　　Connector: In some cases, FSRs may include a connector or terminal for easy integration into electronic systems. This connector allows for quick and secure electrical connections without the need for soldering.

Key word：

resistance

Release time：2024-05-29 11:39 reading：915 Continue reading>>

Trade news

Murata Enters Licensing Agreement with Michelin to Integrate RFID Technology into Tires

　　Murata Manufacturing Co., Ltd. is pleased to announce a significant licensing agreement with Michelin, Europe’s premier automobile tire manufacturer. This agreement will allow for the integration of cutting-edge RFID (Radio Frequency Identification) tire tags into automotive tires, helping to further advance tire management, sustainability, security, and traceability until the end of life within the transportation and wider automotive industry.　　For 80 years now, Murata has been a leading company in the electronics market. With a major component for innovation and technology, Murata contributes to the improvement of society. With emerging environmental and societal challenges, Murata is investing more and more in the interconnectivity and traceability of products, giving life to the objects around us, particularly through RFID technology.　　In the future, more and more objects will be connected, in order to better trace their origins and recycling. Europe is already implementing the ESPR (Eco-design for Sustainable Products Regulation) improving the circularity of products, each of them will be issued a digital product passport (DPP) allowing their life cycle to be traced.　　This will also affect tires which must contain an RFID, an essential component to obtain a DPP. This RFID, in addition to guaranteeing compatibility with new European standards, will make it possible to improve all logistical aspects affecting the tire and automobile industry and mobility more generally.　　Michelin and Murata have enjoyed a successful working relationship for many years. This partnership has contributed to advancing RFID tag technology in tires. Thanks to this new agreement, Murata will be able to produce generation 4 RFID tire tags. Through this agreement, Murata will also have the possibility of offering the integration of RFID Tag in tires, patented by Michelin. In the future, tire manufacturers around the world will have access to this cutting-edge solution scheduled to enter mass production.　　In addition to offering innovative RFID tire tags, Murata is committed to helping tire manufacturers evaluate and implement these tags into their products. By leveraging its deep understanding of communications technologies, Murata can provide tailored solutions that improve tire traceability and management for various applications, encompassing high-performance motorsport, passenger vehicles, and networks for global transport. Additionally, to facilitate uniform adoption of RFID technology within the tire industry, Murata will continue to provide tire manufacturers with access to solutions based on Murata's RFID software, id-Bridge.　　“RFID technology is a key element, in improving the efficiency and optimization of tire operations. This RFID tag is the unique way to identify tires, from cradle to grave, in a consistent manner, thus responding to the ecological challenges of our time.　　Through this license, Murata and Michelin, hand in hand, are revolutionizing the tire industry, by allowing stakeholders to benefit from this technology, this agreement will open up new perspectives for the future of mobility.” said Laurent Couturier, RFID system designer at Michelin.　　“Michelin is one of the world’s leading tire manufacturers and this partnership will help to produce solutions capable of overcoming significant challenges that exist within the global tire market, allowing for further advancements in operation efficiency and supply chain reliability,” said Tetsuo Kawakatsu, Director of RFID Business Department at Murata.

Key word：

Murata

Release time：2024-05-23 13:50 reading：872 Continue reading>>

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